212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Heatsink structure with an air duct
#31802Heatsink module for electronic device
#31803Heatsink thermal module with noise improvement
#31804Heat sink and heat sink assembly
#31805Overvoltage-protected light-emitting semiconductor device
#31806Selective deposition of embedded transient protection for printed circuit boards
#31807Substantially continuous layer of embedded transient protection for printed circuit boards
#31808Solid state imaging apparatus
#31809Bus system
#31810Thin film resistor with current density enhancing layer (CDEL)
#31811Integrated circuit having integrated inductors
#31812Integrated semiconductor inductor and method therefor
#31813Programmable structured arrays
#31814Tab tape and method of manufacturing the same
#31815Circuit configuration having a load transistor and a current measuring configuration, method for ascertaining the load current in a load transistor, semiconductor component, and measuring configuration
#31816Tamper-resistant semiconductor device
#31817Electronic module, methods of manufacturing and driving the same, and electronic instrument
#31818Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same
#31819Wiring structures for semiconductor devices
#31820Via barrier layers continuous with metal line barrier layers at notched or dielectric mesa portions in metal lines
#31821Heat sink
#31822Dielectric material
#31823Semiconductor device and manufacturing method thereof
#31824Stacked ball grid array package module utilizing one or more interposer layers
#31825Optical device package
#31826Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same
#31827Method and apparatus for increasing the immunity of new generation microprocessors from ESD events
#31828Organo-silsesquioxane polymers for forming low-k dielectrics
#31829Semiconductive chip device having insulating coating layer and method of manfacturing the same
#31830Silicon-based RF system and method of manufacturing the same
#31831Capacitor device with vertically arranged capacitor regions of various kinds
#31832Optical sensor package and method of manufacture
#31833Semiconductor device and method of manufacturing the same
#31834Structure and method for manufacturing strained FINFET
#31835IMAGE SENSOR
#31836Non-volatile semiconductor memory device having nano-dots on a tunnel insulating film
#31837Interchangeable LED bulbs and light string assembly therewith
#31838Light-emitting diode thermal management system
#31839Light-emitting semiconductor chip and method for the manufacture thereof
#31840Stacked-plate gas-expansion cooler assembly, fabrication method, and use
#31841High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
#31842Pump and fan control concepts in a cooling system
#31843Conductor pipe of a temperature conductor
#31844Peltier based heat transfer systems
#31845Method and device for protection of an mram device against tampering
#31846Resistor identification configuration circuitry and associated method
#31847Spectroscopy instrument using broadband modulation and statistical estimation techniques to account for component artifacts
#31848SUPERCRITICAL FLUID-ASSISTED DEPOSITION OF MATERIALS ON SEMICONDUCTOR SUBSTRATES
#31849Methods for selective integration of airgaps and devices made by such methods
#31850Capacitors and methods of manufacture thereof
#31851Atomic layer deposition of CeO/AlOfilms as gate dielectrics
#31852Thin-film transistor including organic semiconductor and inorganic particles, and manufacturing method therefor
#31853Anisotropically conductive connector, production process thereof and application product thereof
#31854Rotating rectifier with strap and diode assembly
#31855Heat sink protecting retention module
#31856Method for manufacturing heat sink for use in heat sink fan
#31857Lock for notebook computer or other personal electronic device
#31858Electronic circuit
#31859Semiconductor integrated circuit
#31860Light emitting device
#31861Semiconductor device and method of manufacturing the same
#31862Wafer level packaging cap and fabrication method thereof
#31863Semiconductor device and method for fabricating the same
#31864Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe
#31865Composition for forming low-dielectric constant film comprising fullerene, low-dielectric constant film formed from the composition and method for forming the low-dielectric constant film
#31866Composition for forming low dielectric thin film including siloxane monomer or siloxane polymer having only one type of stereoisomer and method of producing low dielectric thin film using same
#31867Optimization of NMOS drivers using self-ballasting ESD protection technique in fully silicided CMOS process
#31868Reverse blocking semiconductor component with charge compensation
#31869SRAM devices, and electronic systems comprising SRAM devices
#31870Semiconductor product having a semiconductor substrate and a test structure and method
#31871Power line layouts of a macro cell and combined layouts of a macro cell and a power mesh
#31872Power distribution network of an integrated circuit
#31873Redundant interconnect high current bipolar device and method of forming the device
#31874Electronic power module comprising a rubber seal and corresponding production method
#31875System and method for increasing the surface mounting stability of a lamp
#31876Semiconductor device including wiring connection testing structure
#31877Method for providing additional service based on dual UICC
#31878Substrate with slot
#31879Heat dispensing device
#31880Heat dissipation device
#31881Heat dissipating tube sintered with copper powders
#31882Temperature conductor and method of making same
#31883Heat dispensing device
#31884Foil slot impingement cooler with effective light-trap cavities
#31885Heat dissipation system with an air compressing mechanism
#31886Heat pipe and manufacturing method thereof
#31887System and method for thermal monitoring of IC using sampling periods of invariant duration
#31888Low temperature sintering ceramic composition for high frequency, method of fabricating the same and electronic component
#31889Semiconductor device
#31890Method for reducing stress concentrations on a semiconductor wafer by surface laser treatment
#31891Multi-layer registration and dimensional test mark for scatterometrical measurement
#31892Efficient method of forming and assembling a microelectronic chip including solder bumps
#31893Transistor-level signal cutting method and structure
#31894Fuse region of semiconductor device and method of fabricating the same
#31895Heatsink apparatus
#31896Substantial embedment of metallic debris
#31897Circuit board assembly with a brace surrounding a ball-grid array device
#31898Electronic control unit and method thereof
#31899Heat dissipating apparatus
#31900Heat sink interface insert
#31901Socket adapted for compressive loading
#31902Integrated coolant circuit arrangement, operating method and production method
#31903Multiple metal-insulator-metal capacitors and method of fabricating the same
#31904Solid state image pickup device
#31905Means of mounting for electronic components, arrangement and procedure
#31906Novel method for copper wafer wire bonding
#31907Semiconductor device, electronic device, and method of manufacturing semiconductor device
#31908Semiconductor device
#31909Semiconductor device with multiple interconnect layers and vias
#31910Semiconductor device preventing electrical short and method of manufacturing the same
#31911Dual damascene with via liner
#31912Method and structure for defect monitoring of semiconductor devices using power bus wiring grids
#31913Semiconductor device and method of manufacturing the same
#31914Bump structure of semiconductor device and method of manufacturing the same
#31915Routing design to minimize electromigration damage to solder bumps
#31916Transistor-level signal cutting method and structure
#31917Side view LED package having lead frame structure designed to improve resin flow
#31918Semiconductor device having directly attached heat spreader
#31919Substrate having pattern and method for manufacturing the same, and semiconductor device and method for manufacturing the same
#31920Self-aligned semiconductor contact structures and methods for fabricating the same
#31921Pulse output circuit, shift register, and display device
#31922Semiconductor circuit constructions
#31923Semiconductor device
#31924Planarization of metal container structures
#31925Light emitting device and manufacture method thereof
#31926Light receiving or light emitting modular sheet and process for producing the same
#31927Semiconductor device, electronic device, and method of manufacturing semiconductor device
#31928Two-dimensional image detector
#31929Method for depositing an adhesion-promoting layer on a metallic layer of a chip
#31930Electro-hydrodynamic gas flow cooling system
#31931Methods and apparatus for an integrated fan pump cooling module
#31932Thermally conductive cover directly attached to heat producing component
#31933Radiator for semiconductor
#31934Security-sensitive semiconductor product, particularly a smart-card chip
#31935Integrated circuit having a multi-layer structure and design method thereof
#31936Testing system, a computer implemented testing method and a method for manufacturing electronic devices
#31937Interconnection pattern inspection method, manufacturing method of semiconductor device and inspection apparatus
#31938Corundum for filling in resin and resin composition
#31939Methods of forming low resistivity contact for an integrated circuit device
#31940Semiconductor device and method for manufacturing the same
#31941Interconnection of through-wafer vias using bridge structures
#31942Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
#31943Apparatus for depositing seed layers
#31944Computer implemented method for designing a semiconductor integrated circuit and a semiconductor integrated circuit
#31945Semiconductor device fabrication method
#31946Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures
#31947Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor
#31948Electronic assembly with integrated IO and power contacts
#31949Off-grid decoupling of ball grid array (BGA) devices and method
#31950Semiconductor substrate having reference semiconductor chip and method of assembling semiconductor chip using the same
#31951Mold cavity identification markings for IC packages
#31952Chemical planarization performance for copper/low-k interconnect structures
#31953Structures, systems and methods for joining articles and materials and uses therefor
#31954Optical sensor
#31955Modular surface light guide
#31956Heat radiation structure for secondary battery module, and switching board and secondary battery module having the same
#31957Heat dissipation module
#31958Cooling system for computer hardware
#31959Apparatus for controlling thermal interface between cold plate and integrated circuit chip
#31960Cooling assembly comprising micro-jets
#31961Laminated polymer with integrated lighting, sensors and electronics
#31962Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator
#31963Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof
#31964Assembly including a circuit and an encapsulation frame, and method of making the same
#31965Barrier structure for semiconductor devices
#31966Printable electrical conductors
#31967Method for manufacturing a thin film semiconductor device
#31968Semiconductor component with passivation layer
#31969Semiconductor device and method for production thereof
#31970Interconnections for integrated circuits
#31971Interconnections having double capping layer and method for forming the same
#31972Damascene process at semiconductor substrate level
#31973Fuse structure and method for making the same
#31974Copper interconnect systems
#31975Wiring board and production method thereof
#31976Semiconductor device
#31977Chip-scale monolithic load switch for portable applications
#31978Scribe-line structures and methods of forming the same
#31979Semiconductor wafer, semiconductor device manufacturing method, and semiconductor device
#31980Inductors for integrated circuits
#31981Semiconductor device having spiral-shaped inductor
#31982Inductive and capacitive elements for semiconductor technologies with minimum pattern density requirements
#31983Semiconductor device having reduced die-warpage and method of manufacturing the same
#31984Multiple layer structure for substrate noise isolation
#31985Thermo-mechanical cleavable structure
#31986Semiconductor device and manufacturing process thereof
#31987Monolithic MOSFET and schottky diode for mobile phone boost converter
#31988Semiconductor component
#31989MOS semiconductor device isolated by a device isolation film
#31990Method of fabricating metal-insulator-metal capacitor and metal-insulator-metal capacitor manufactured by the method
#31991Photonic crystal light emitting device
#31992Method for preparing ball grid array substrates via use of a laser
#31993Camera apparatus with infrared night vision charge coupled device
#31994Image sensor module
#31995Apparatus for direct plating on resistive liners
#31996Liquid cooled thermosiphon for electronic components
#31997Liquid cooled thermosiphon with flexible partition
#31998Blower, cooling device including the blower, and electronic apparatus including the cooling device
#31999Structure of radiator
#32000Structure of liquid cooled waterblock with thermal conductivities
#32001Liquid cooled thermosiphon with flexible coolant tubes
#32002Heat dissipating apparatus
#32003Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof
#32004Cooling electronics via two-phase tangential jet impingement in a semi-toroidal channel
#32005Chip-based CPU cooler and cooling method thereof
#32006Testing system, a computer implemented testing method and a method for manufacturing electronic devices
#32007Method and apparatus for personalization of semiconductor
#32008Semiconductor devices having amorphous silicon-carbon dielectric and conducting layers
#32009Methods for selective integration of airgaps and devices made by such methods
#32010Metal interconnect layer of semiconductor device and method for forming a metal interconnect layer
#32011On-chip Cu interconnection using 1 to 5 nm thick metal cap
#32012Interconnect structures with encasing cap and methods of making thereof
#32013Method of fabricating a capacitor by using a metallic deposit in an interconnection dielectric layer of an integrated circuit
#32014Semiconductor device manufacturing method, wiring and semiconductor device
#32015Method of manufacturing a superjunction device with conventional terminations
#32016Single mask MIM capacitor and resistor with in trench copper drift barrier
#32017Stacked semiconductor module
#32018Method and apparatus for avoiding dicing chip-outs in integrated circuit die
#32019Semiconductor sensor having a front-side contact zone
#32020Power semiconductor module with reduced parasitic inductance
#32021Power supply and fixing structure of heatsink and circuit board applicable to the same
#32022Thermal management system and method for electronic assemblies
#32023Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module
#32024Heat dissipation device with a heat pipe
#32025Active liquid metal thermal spreader
#32026Power core devices and methods of making thereof
#32027Digital camera having parallel processing controller
#32028Inductor and method of forming the same
#32029High frequency and wide band impedance matching via
#32030Testing using independently controllable voltage islands
#32031Fluorescent material having two layer structure and light emitting apparatus employing the same
#32032Method for producing a composite material
#32033Topographically indexed support substrates
#32034Epoxy resin composition and semiconductor device
#32035Semiconductor constructions
#32036Structure for cooling a surface
#32037Metal capped copper interconnect
#32038Semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thickness formed thereon, and method for manufacturing the same
#32039Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same
#32040Semiconductor device and method for manufacturing the same
#32041Semiconductor device and manufacturing method thereof
#32042Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure
#32043Miniature silicon condenser microphone
#32044Re-assembly process for MEMS structures
#32045Multi-path printed circuit board having heterogeneous layers and power delivery system including the same
#32046EFUSE STRUCTURE
#32047Circuit structures and methods of forming circuit structures with minimal dielectric constant layers
#32048Conductive channel pseudo block process and circuit to inhibit reverse engineering
#32049Semiconductor device and method for manufacturing same
#32050Structure and method to optimize strain in CMOSFETs
#32051ESD protection device
#32052Semiconductor device and manufacturing method of the same
#32053System and method for contact module processing
#32054Metal-to-metal capacitor
#32055Dynamic random access memory circuitry and integrated circuitry
#32056Semiconductor device with epitaxial C49-titanium silicide (TiSi) layer and method for fabricating the same
#32057Semiconductor integrated circuit, layout method, layout apparatus and layout program
#32058Radiation hardened bipolar junction transistor
#32059Test structure for integrated electronic circuits
#32060Methods of forming semiconductor constructions and integrated circuits
#32061Wafer-level hermetic micro-device packages
#32062Microchannel heat exchanger fabricated by wire electro-discharge machining
#32063Miniature fan for high energy consuming circuit board devices
#32064Cooling apparatus
#32065Cooling device of thin plate type for preventing dry-out
#32066High turbulence heat exchanger
#32067Heat sink with combined parallel fins and the method for assembling the same
#32068Heterogeneous thermal interface for cooling
#32069Heat sink
#32070Micro-scale cooling element
#32071Semiconductor device and method of manufacturing the same
#32072Method for fabricating interconnection line in semiconductor device
#32073Semiconductor device and a method of fabricating a semiconductor device
#32074Wiring patterns formed by selective metal plating
#32075Method of forming wiring
#32076Method of fabricating a capacitor for a semiconductor device
#32077Methods of fabrication for flip-chip image sensor packages
#32078Tile-based routing method of a multi-layer circuit board and related structure
#32079Systems and methods for removing operating heat from a light emitting diode
#32080Preparation of heat transfer member and heat-dissipating structure
#32081Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics
#32082Epoxy resin composition and semiconductor device
#32083Multi-stage blower
#32084Power semiconductor module with auxiliary connection
#32085Uniform illumination system
#32086Heat dissipation assembly for computing devices
#32087Radiation body and a device cooling a heating element using the radiation body
#32088ESD protection unit with ability to enhance trigger-on speed of low voltage triggered PNP
#32089Method of preparing electronically connected optoelectronic devices, and optoelectronic devices
#32090Double sided optical inspection of thin film disks or wafers
#32091Identification code drawing method, substrate, and display module
#32092Heat sink for integrated circuit devices
#32093Semiconductor integrated circuit with electrically programmable fuse
#32094Light emission device and method utilizing multiple emitters and multiple phosphors
#32095Overlay measurement target
#32096Manufacturing method of a semiconductor device
#32097Interconnection structure having double diffusion barrier layer and method of fabricating the same
#32098Semiconductor device having a reductant layer and manufacturing method thereof
#32099Semiconductor device and method of manufacturing the same
#32100Insulating film material containing organic silane or organic siloxane compound, method for producing same, and semiconductor device