Semiconductor device and method of manufacture thereof

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package

Fabrication of semiconductor integrated circuit chips

Thermal interconnect systems methods of production and uses thereof

Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink

Printed circuit boards and the like with improved signal integrity for differential signal pairs

Component packaging and assembly

Electrostatic discharge protection device for digital circuits and for applications with input/output bipolar voltage much higher than the core circuit power supply

Light emitting diode with thermo-electric cooler

Semiconductor device and method of fabricating the same

Semiconductor integrated circuit device

Augmented photo-detector filter

Multi-chip devices, circuits, methods, and computer program products for reading programmed device information therein

Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof

Heat dissipation system

Electronic component cooling apparatus

Phase-change heat reservoir device for transient thermal management

Method of forming an alignment mark and manufacturing a semiconductor device using the same

Method for forming patterns aligned on either side of a thin film

Metal etching method for an interconnect structure and metal interconnect structure obtained by such method

Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods

Semiconductor device with a metal line and method of forming the same

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Methods for manufacturing porous dielectric substrates including patterned electrodes

Damascene MIM capacitor structure with self-aligned oxidation fabrication process

Method for manufacturing printed wiring board

Process for producing a thin film with MEMS probe circuits

Wafer repair method using direct-writing

On-chip signal transformer for ground noise isolation

Method and apparatus for completely or partly covering at least one electronic component with a compound

Hardware security device for magnetic memory cells

Plastic light emitting band

Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses

Bottom side heat sink attachment for console

Heat exchanger for memory modules

Cooling device capable of reducing thickness of electronic apparatus

HEAT DISSIPATION MODULE

Scatterometry method with characteristic signatures matching

IC tag and IC tag attachment structure

High frequency conductors for packages of integrated circuits

Semiconductor device using metal nitride as insulating film

Semiconductor device and method for fabricating the same

Power semiconductor component having a topmost metallization layer

Thin film with MEMS probe circuits and MEMS thin film probe head using the same

Memory module with different types of multi chip packages

Heat sink

Semiconductor device reducing warping due to heat production

Semiconductor device with a cooling element

NANO IC packaging

Semiconductor package security features using thermochromatic inks and three-dimensional identification coding

Embedded heat spreader

Line component and semiconductor circuit using line component

Composition for forming low dielectric thin film comprising porous nanoparticles and method of preparing low dielectric thin film using the same

Forming a porous dielectric layer and structures formed thereby

Forming a porous dielectric layer and structures formed thereby

Impurity doped UV protection layer

Coating composition for electronic devices

Semiconductor chip and semiconductor device

Semiconductor device and method for fabricating the same

Antifuse having uniform dielectric thickness and method for fabricating the same

Structure and programming of laser fuse

Semiconductor device having a capping layer including cobalt and method of fabricating the same

Tunable ESD device for multi-power application

Distributed capacitor array

Method of manufacturing a semiconductor device having a photon absorption layer to prevent plasma damage

Fill plated structure of inner via hole and manufacturing method thereof

Chemically compatible, lightweight heat pipe

Cooling device and electronic device

Heat dissipating device

Isothermal plate assembly with predetermined shape and method for manufacturing the same

Systems for low cost liquid cooling

Systems for improved heat exchanger

Systems for integrated pump and cold plate

Pulsating heat transfer apparatus

Heat dissipation devices and fabrication methods thereof

Method for manufacturing heat-dissipating device with isothermal plate assembly of predetermined shape

Clip assembly structure for heat dissipating fins

Heat dissipating device

Fan-driven heat dissipating device with enhanced air blowing efficiency

Screen printing method and apparatus thereof

Printed circuit board structure for mobile terminal

Radio frequency circuit with integrated on-chip radio frequency signal coupler

Forming of trenches or wells having different destinations in a semiconductor substrate

Method for forming an aluminum contact

Manufacturing method of semiconductor device

Metal wiring pattern for memory devices

Method of manufacturing wiring board

Interlocking via for package via integrity

Method for producing an electrical component

System and method of forming a bonded substrate and a bonded substrate product

Planar magnetic tunnel junction substrate having recessed alignment marks

Capacitors having a horizontally folded dielectric layer and methods for manufacturing the same

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

METHOD OF MANUFACTURING HEAT SPREADER HAVING VAPOR CHAMBER DEFINED THEREIN

Integrated circuit device having reduced bow and method for making same

Repair and restoration of damaged dielectric materials and films

Siloxane-based resin containing germanium and an interlayer insulating film for a semiconductor device using the same

Packaging of organic light-emitting diodes using reactive polyurethane

Length-adjustable fan duct device

Processing a memory link with a set of at least two laser pulses

Heat spreader

Fastening device II

Electronic apparatus and television receiver

Spring adapted to hold electronic device in a frame

Self-locking fastener adapted to secure a heat sink to a frame

Method of forming electronic package having fluid-conducting channel

Cooling device for an electronic equipment

Cooling fan assembly

Integrated circuit cooling system including heat pipes and external heat sink

Arrangement for energy conditioning

Inductance variable device

Semiconductor device and adjusting method for semiconductor device

Semiconductor device

Field programmable structured arrays

Light emitting diode assembly using alternating current as the power source

Electroluminescent devices and methods of making electroluminescent devices including an optical spacer

Piezoelectric fan for an integrated circuit chip

Substrate provided with an alignment mark in a substantially transmissive process layer, mask for exposing said mark, device manufacturing method, and device manufactured thereby

Semiconductor device and method for manufacturing the same

Semiconductor device and fabrication method thereof

Method of forming copper line in semiconductor device

Semiconductor devices and methods for manufacturing the same

Passivation structure for semiconductor devices

Method for forming an intermetal dielectric layer in a semiconductor device using HDP-CVD, and a semiconductor device manufactured thereby

Method for forming an intermetal dielectric layer using low-k dielectric material and a semiconductor device manufactured thereby

Mechanically robust dielectric film and stack

Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures

Agglomeration control using early transition metal alloys

Carbon nanotube interconnects in porous diamond interlayer dielectrics

Solder for device package

Native incorporation of RF ID technology for the tracking of electronic circuitry

Low cost electromechanical devices manufactured from conductively doped resin-based materials

Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card

Method for determining the arrangement of contact areas on the active top side of a semiconductor chip

Package for semiconductor components and method for producing the same

Method for wafer stacking using copper structures of substantially uniform height

Deposition of hafnium oxide and/or zirconium oxide and fabrication of passivated electronic structures

Semiconductor members having a halogenated polymeric coating and methods for their formation

Localized slots for stress relieve in copper

Semiconductor structures utilizing thin film resistors and tungsten plug connectors and methods for making the same

Semiconductor device and method of manufacturing the same

MIM capacitor of semiconductor device and manufacturing method thereof

Method of forming on-chip decoupling capacitor with bottom electrode layer having surface roughness

Method of forming a fuse part

Semiconductor device and manufacturing method thereof

Dielectric isolation type semiconductor device and method for manufacturing the same

Power metal oxide semiconductor transistor layout with lower output resistance and high current limit

Reduced finger end MOSFET breakdown voltage (BV) for electrostatic discharge (ESD) protection

Vertical-type capacitor structure

Semiconductor device including light shieled structures

Tensile strained substrate

Semiconductor device and fabricating method thereof

Insulating gate AlGaN/GaN HEMT

Multiple component solid state white light

Organic light emitting display and method of fabricating the same

Semiconductor wafer with a test structure, and method

Methods and systems for lithography process control

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Liquid cooling device

Heat dissipating device with metal foam

Heat dissipation device

Microelectronic assembly including built-in thermoelectric cooler and method of fabricating same

Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder

Cooling apparatus having low profile extrusion and method of manufacture therefor

Method of testing using compliant contact structures, contactor cards and test system

Self-tuned millimeter wave RF transceiver module

Electronic circuit device and production method of the same

Manufacturing method of semiconductor device

Methods of manufacturing a metal-insulator-metal capacitor

Methods of manufacturing a metal-insulator-metal capacitor

Semiconductor memory device and method for fabricating the same

Processing a memory link with a set of at least two laser pulses

Ferromagnetic capacitor

Electronic apparatus and display apparatus equipped with the electric apparatus

Cooling device, substrate, and electronic equipment

Heat spreader with multiple stacked printed circuit boards

Electronic module for system board with pass-thru holes

Fluid cooled integrated circuit module

Retaining device for heat sink

Circuit adjustable after packaging having a voltage limiter and method of adjusting same

Periodic patterns and technique to control misalignment between two layers

Light emitting module and method of driving the same, and optical sensor

Transformer for varying inductance value

Transistor integrated circuit device and manufacturing method thereof

Multiple circuit blocks with interblock control and power conservation

Power supply device

Package elements and methods for securing a getter

Plasma process for removing excess molding material from a substrate

Anchored non-solder mask defined ball pad

Semiconductor device and having trench interconnection

Materials and methods for forming hybrid organic-inorganic dielectric materials for integrated circuit applications

Semiconductor device including a discontinuous film and method for manufacturing the same

Protection of seedlayer for electroplating

Method and apparatus for providing a BGA connection having improved drop test performance

Semiconductor device and method of arranging pad thereof

Method and apparatus for chip cooling using a liquid metal thermal interface

Semiconductor package having connecting bumps

Package and method for saving space required by I/O of chip

Advanced cavity structure for wafer level chip scale package

Transmission lines for CMOS integrated circuits

Flexible electronic circuit articles and methods of making thereof

Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them

High-gain bipolar junction transistor compatible with complementary metal-oxide-semiconductor (CMOS) process and method for fabricating the same

Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect

Fuse box of semiconductor device and fabrication method thereof

Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film

Semiconductor devices and methods of forming interconnection lines therein

Systems and methods for electrically coupling wires and conductors

Methods and systems for improved current sharing between parallel power semiconductors in power converters

Semiconductor device

Formation of deep trench airgaps and related applications

Semiconductor device

Wiring structure of a semiconductor device

Illumination assembly and method of making same

STRUCTURE OF SEMICONDUCTOR SUBSTRATE INCLUDING TEST ELEMENT GROUP WIRING

Semiconductor device having overlay measurement mark and method of fabricating the same

Electronic device and manufacturing method thereof

Optical integrated circuit package

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Flexible printed wiring board

Heat dissipating assembly for a heat element

Boiling and cooling device

Heat-dissipating module

Heat sink having a high thermal conductivity

Illumination devices and methods of making the same

Ultrasonic atomizing cooling apparatus

Circuit module turbulence enhancement systems and methods

Power-saving device for notebook computer

Interface for bridging out-of-band information and preventing false presence detection of terminating devices

Lanthanum hafnium oxide dielectrics

Semiconductor device fabrication method

Semiconductor device fabrication method

Self-patterning of photo-active dielectric materials for interconnect isolation

Method of fabricating electrically conducting vias in a silicon wafer

Semiconductor device and method for fabricating the same

Integrated circuit chip utilizing dielectric layer having oriented cylindrical voids formed from carbon nanotubes

Systems and methods for solder bonding

Method for forming a titanium nitride layer and method for forming a lower electrode of a MIM capacitor using the titanium nitride layer

Wafer bonded MOS decoupling capacitor

Multiple-wavelength laser micromachining of semiconductor devices

Method of protecting fuses in an integrated circuit die

Flexible carrier and release method for high volume electronic package fabrication

Misalignment test structure and method thereof

Fabrication of a ferromagnetic inductor core and capacitor electrode in a single photo mask step

Metal photoetching product and production method thereof

Process and apparatus for preparing a diamond substance

Organic silicate polymer and insulation film comprising the same

Multi-layer ceramic substrate and method for manufacture thereof

Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks

LED light source assembly

AC/AC multiple-phase power converter configured to be mounted on a substrate

Heat sink

Heat dissipating device

Locking device for heat sink

Processor module with thermal dissipation device

Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules

Systems to cool multiple electrical components

Electronic equipment including an apparatus for cooling interior of housing

Thin film capacitor for reducing power supply noise

Semiconductor device employing fuse circuit and method for selecting fuse circuit system

Semiconductor device employing fuse circuit and method for selecting fuse circuit system

Adjustable and programmable temperature coefficient-proportional to absolute temperature (APTC-PTAT) circuit

Output circuit

Compliant contact structure

Method of fabricating polycrystalline silicon

Method for solder bumping, and solder-bumping structures produced thereby

Zinc-aluminum solder alloy

Back end of line integration scheme

Semiconductor device, semiconductor substrate and fabrication process of a semiconductor device

Method of manufacturing semiconductor device, and semiconductor device

High density integrated circuit package architecture

Connection structure of flexible wiring substrate and connection method using same

Heat dissipation structure and method thereof

Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module

Semiconductor device which prevents light from entering therein

Integration of micro-electro mechanical systems and active circuitry

Method of connecting internal silver traces to external gold to produce a gold external side metal for an LTCC package

Board or substrate for an organic electronic device and use thereof

Semiconductor wafer with protection structure against damage during a die separation process

Semiconductor circuitry constructions

Integrated inductor and method of fabricating the same

Semiconductor device including overcurrent protection element

Methods of forming SRAM constructions

Electrostatic discharge protection circuit using triple welled silicon controlled rectifier

ESD protection for high voltage applications

High voltage power MOSFET having low on-resistance

Methods of forming in package integrated capacitors and structures formed thereby

Stacked capacitor-type semiconductor storage device and manufacturing method thereof

Cross-fill pattern for metal fill levels, power supply filtering, and analog circuit shielding