212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Nearly isothermal heat pipe heat sink
#32702Liquid cold plate heat exchanger
#32703Heat exchanger
#32704Methods and apparatuses to generate a shielding mesh for integrated circuit devices
#32705Structures and methods for proximity communication using bridge chips
#32706Epoxy resin composition and semiconductor device
#32707Process for manufacturing optical and semiconductor elements
#32708Process for manufacturing a light emitting array
#32709Cyclic olefin polymers and catalyst for semiconductor applications
#32710Multi-layer film stack for extinction of substrate reflections during patterning
#32711Methods of fabricating metal wiring in semiconductor devices
#32712Device and method for determining an edge coverage during coating processes
#32713Method of creating a tapered via using a receding mask and resulting structure
#32714Pattern design method and program of a semiconductor device including dummy patterns
#32715Nanoparticles and method for making the same
#32716Semiconductor device and method of manufacturing the same
#32717Semiconductor integrated device for preventing breakdown and degradation of a gate oxide film caused by charge-up in manufacturing steps thereof, design method thereof, designing apparatus method thereof, and maunfacturing apparatus thereof
#32718Method of enhancing connection strength for suspended membrane leads and substrate contacts
#32719Method of manufacturing ceramic LED packages
#32720Light emitting module
#32721Heat conducting mounting fixture for solid-state lamp
#32722Illuminating apparatus and display apparatus using the same
#32723Staggered fin array
#32724Cooling system with submerged fan
#32725Heat dissipation device
#32726Electrostatic discharge protection for power amplifier in radio frequency integrated circuit
#32727Conducting liquid crystal polymer nature comprising carbon nanotubes, use thereof and method of fabrication
#32728Printhead integrated circuit with planar actuators
#32729Ceramic antenna module and methods of manufacture thereof
#32730Semiconductor integrated circuit device
#32731Semiconductor integrated circuit device
#32732Copper alloy thin films, copper alloy sputtering targets and flat panel displays
#32733Light emitting device with a thermal insulating and refractive index matching material
#32734Interdigitated multi-pixel arrays for the fabrication of light-emitting devices with very low series-resistances and improved heat-sinking
#32735Hardmask for reliability of silicon based dielectrics
#32736Semiconductor device and its manufacturing method
#32737Refractory metal substrate with improved thermal conductivity
#32738Semiconductor device with suppressed copper migration
#32739Flexible wiring board for tape carrier package having improved flame resistance
#32740Substrate provided with a thin film pattern, method of manufacturing a device, electro-optic device, and electronic instrument
#32741Layer system
#32742Wiring board and manufacturing method therefor
#32743Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion
#32744Multi-row substrate strip and method for manufacturing the same
#32745Carbonaceous composite heat spreader and associated methods
#32746Lead frame having a lead with a non-uniform width
#32747High voltage lateral diffused MOSFET device
#32748Lateral double diffused MOS transistors
#32749Process for producing a contact pad on a region of an integrated circuit, in particular on the electrodes of a transistor
#32750Integrated circuit including sub-lithographic structures
#32751Semiconductor device
#32752Light emitting diode having an electrode buffer layer
#32753High power LED package with universal bonding pads and interconnect arrangement
#32754LED package with structure and materials for high heat dissipation
#32755Polarized LED
#32756Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
#32757Method for reflowing a metal plating layer of a contact and contact formed thereby
#32758Venting device for tamper resistant electronic modules
#32759Heat-exchange type cooler
#32760Liquid-cooled heat radiator kit
#32761Thin film evaporation heat dissipation device that prevents bubble formation
#32762Immersion cooling apparatus
#32763Method and apparatus for removing heat
#32764Methods of and apparatuses for controlling process profiles
#32765In situ deposition of a low K dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application
#32766Localized use of high-K dielectric for high performance capacitor structures
#32767Metal barrier cap fabrication by polymer lift-off
#32768Wafer packaging and singulation method
#32769Method of singulating electronic devices
#32770Semiconductor device with an air gap between lower interconnections and a connection portion to the lower interconnections not formed adjacent to the air gap
#32771Early detection of metal wiring reliability using a noise spectrum
#32772Curable thick film compositions for use in moisture control
#32773Heat sink fastening assembly
#32774Heat sink assembly
#32775Heat-transfer devices
#32776Semiconductor integrated circuit
#32777Photo-detector filter
#32778Structure and method for adjusting integrated circuit resistor value
#32779Method and system for measurement of sidewall damage in etched dielectric structures using a near field microwave probe
#32780Integrated circuit configuration for triggering power semiconductor switches
#32781Desiccant film in top-emitting OLED
#32782Organic electroluminescence light-emitting device
#32783Semiconductor device
#32784UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE
#32785Assembly and method
#32786Image sensor assembly and method for fabricating the same
#32787Multi-layer integrated semiconductor structure having an electrical shielding portion
#32788Bolster plate assembly for processor module assembly
#32789Semiconductor device including metal-insulator-metal capacitor arrangement
#32790Semiconductor device
#32791Programmable electronic fuse
#32792Semiconductor devices with reduced impact from alien particles
#32793Semiconductor device and manufacturing method thereof
#32794Semiconductor device including a capacitor element
#32795Capacitor device and method of manufacturing the same
#32796Wire structure, semiconductor device, MRAM, and manufacturing method of semiconductor device
#32797Multi-layer film stack for extinction of substrate reflections during patterning
#32798Semiconductor structure and method of making same
#32799Light emitting diode covered with a reflective layer and method for fabricating the same
#32800Energy-efficient, laser-based method and system for processing target material
#32801Sandwiched thermal solution
#32802Twin fin arrayed cooling device with liquid chamber
#32803Heat pipe structure and method for fabricating the same
#32804Light receiving or light emitting device and itsd production method
#32805Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
#32806Filled epoxy resin compositions
#32807Integrated structure of inductances with shared values on a semiconductor substrate
#32808Anisotropic conductive sheet, its manufacturing method, and its application
#32809Systems, methods and slurries for chemical mechanical polishing
#32810Low-k dielectric process for multilevel interconnection using mircocavity engineering during electric circuit manufacture
#32811Interconnect layout method
#32812Method for fabricating packaged die
#32813Wafer Level Process for Manufacturing Leadframes and Device from the Same
#32814Characterizing the integrity of interconnects
#32815Dielectric material and dielectric sintered body, and wiring board using the same
#32816Thermal interface incorporating nanotubes
#32817Wiring apparatus, protecting cap for device package using the same, and a method for manufacturing them
#32818Semiconductor package with getter formed over an irregular structure
#32819Leadframe-based module DC bus design to reduce module inductance
#32820Heat dissipation system for multiple integrated circuits mounted on a printed circuit board
#32821Heat radiating apparatus
#32822System and method for heat dissipation in an information handling system
#32823Alternator in connection with a remotely-cooled rectifier
#32824Fool-proof device on heatsink thermal module for the notebook computer
#32825Solder reflux method for holding cryogenically aligned parts
#32826Process for obtaining a thin, insulating, soft magnetic film of high magnetization
#32827Method of preparing a lens-less LED
#32828Leadframe and method for reducing mold compound adhesion problems
#32829Method of dicing a semiconductor device into plural chips
#32830Methods of forming in package integrated capacitors and structures formed thereby
#32831Assembly with a ring and bonding pads formed of a same material on a substrate
#32832Semiconductor device with a fluorinated silicate glass film as an interlayer metal dielectric film, and manufacturing method thereof
#32833Computer automated design system, a computer automated design method, and a semiconductor integrated circuit
#32834Circuit structure of package substrate
#32835Shapes-based migration of aluminum designs to copper damascene
#32836Semiconductor device
#32837Modified via bottom structure for reliability enhancement
#32838III-nitride power semiconductor device with a current sense electrode
#32839Power grid layout techniques on integrated circuits
#32840Microelectronic devices and methods
#32841SIGNAL TRANSFER METHODS FOR INTEGRATED CIRCUITS
#32842Plasma treatment of an etch stop layer
#32843Integrated capacitor on packaging substrate
#32844Poly-silicon stringer fuse
#32845Semiconductor storage device, its manufacturing method and operating method, and portable electronic apparatus
#32846Electrostatic discharge protection device with complementary dual drain implant
#32847Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantation
#32848Electronic memory component with protection against light attack
#32849Semiconductor device and manufacturing method therefor
#32850On-chip capacitor
#32851Light-emitting diode
#32852Monitor pattern of semiconductor device and method of manufacturing semiconductor device
#32853Air gaps between conductive lines for reduced RC delay of integrated circuits
#32854High-frequency heating device, semiconductor manufacturing device, and light source device
#32855Tamper-resistant packaging and approach
#32856Heat dissipation apparatus and manufacturing method thereof
#32857Radiation module
#32858Spray cooling system for narrow gap transverse evaporative spray cooling
#32859RTV heat conductive silicone rubber compositions
#32860Heat curable resin composition having a low elastic modulus, heat curable film using same, and cured products
#32861Frame device of a fan
#32862Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
#32863Manufacturing method for a thin film transistor that uses a pulse oscillation laser crystallize an amorphous semiconductor film
#32864Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices
#32865Transfer base substrate and method of semiconductor device
#32866Method for measuring overlay and overlay mark used therefor
#32867Metal nitride carbide deposition by ALD
#32868Semiconductor laser device and optical pickup device having the device
#32869Memory circuit arrangement with a cell array substrate and a logic circuit substrate and method for the production thereof
#32870Heat sink fixing device
#32871Adaptive interface using flexible fingers
#32872Cooling device for cooling a heat-generating component, and electronic apparatus having the cooling device
#32873Reliability circuit for applying an AC stress signal or DC measurement to a transistor device
#32874Encapsulation cap having a getter and display device using the same
#32875Electroacoustic component and method for the production thereof
#32876Semiconductor devices including damascene trenches with conductive structures
#32877Semiconductor device having improved contact hole structure and method for fabricating the same
#32878Post passivation interconnection schemes on top of the IC chips
#32879Advanced copper damascene structure
#32880SEMICONDUCTOR PACKAGE SUBSTRATE FOR FLIP CHIP PACKAGING
#32881Resist sidewall spacer for C4 BLM undercut control
#32882Semiconductor device having projection on surface thereof, and method of identifying semiconductor package
#32883Deterministic generation of an integrated circuit identification number
#32884Fin-type antifuse
#32885Semiconductor device including a laser light blocking layer which overlaps fuses
#32886Semiconductor device
#32887Semiconductor device having polycide wiring layer, and manufacturing method of the same
#32888Light-emitting diode arrangement and motor vehicle headlamp
#32889Light emitting device and optical device using the same
#32890Semiconductor device and manufacturing method thereof
#32891Method and apparatus for a photodetector responsive over a selectable wavelength range
#32892Chip card and chip card security device
#32893Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
#32894Barrier enhancement process for copper interconnects
#32895Hollow wire and method for making the same
#32896Heat collector
#32897Heat sink
#32898Copper alloy containing cobalt, nickel and silicon
#32899Temperature measuring device using a matrix switch, a semiconductor package and a cooling system
#32900Verifying heat dissipation apparatus in a data processing system
#32901Sensor device and method
#32902Semiconductor device and manufacturing method thereof
#32903Gas dielectric structure forming methods
#32904Diamond substrate formation for electronic assemblies
#32905Image sensor packaging method and structure thereof
#32906Mechanically robust interconnect for low-k dielectric material using post treatment
#32907Thermal interface material and method for manufacturing same
#32908Methods and systems for determining a presence of macro and micro defects on a specimen
#32909High density memory card assembly
#32910Integrated circuit including a heat dissipation structure
#32911Heat-dissipating device with heat conductive tubes
#32912Methods of forming a layer utilizing a liquid-phase lanthanum precursor and methods of manufacturing a capacitor using the same
#32913Device and method for reducing dishing of critical on-chip interconnect lines
#32914Data card reader
#32915Pattern forming structure, pattern forming method, device, electro-optical device, and electronic apparatus
#32916Semiconductor device with temperature sensor
#32917Integrated circuit chip with high area utilization rate
#32918Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits
#32919Structure and method for fabricating a bond pad structure
#32920Semiconductor device and semiconductor device unit
#32921Wiring connection structure and method for forming the same
#32922Semiconductor device with a peeling prevention layer
#32923Semiconductor device using multi-layer unleaded metal plating, and method of manufacturing the same
#32924Power LED package
#32925Semiconductor substrate structure
#32926Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
#32927Method for processing a thin film substrate
#32928Three-dimensional stack manufacture for integrated circuit devices and method of manufacture
#32929Silicon rich dielectric antireflective coating
#32930Polysilicon memory element
#32931Device with integrated capacitance structure
#32932RF passive circuit and RF amplifier with via-holes
#32933Easily crack checkable semiconductor device
#32934Integrated circuit and method for manufacturing
#32935Semiconductor diode, electronic component and voltage source inverter
#32936Apparatus and method for breakdown protection of a source follower circuit
#32937Power semiconductor device
#32938Metal I/O ring structure providing on-chip decoupling capacitance
#32939Power module
#32940Integrated circuit
#32941Nitride semiconductor substrate and method of producing same
#32942Contact and omnidirectional reflective mirror for flip chipped light emitting devices
#32943System and method for active array temperature sensing and cooling
#32944Semiconductor optical sensor device and range finding method using the same
#32945Doped polysilicon via connecting polysilicon layers
#32946Method for manufacturing a bump-attached wiring circuit board
#32947Fluidized bed cooler for electronic components
#32948Heat dissipating device with heat conductive tubes
#32949Heat riser
#32950Method and system for binding halide-based contaminants
#32951UV-curable solvent free compositions and use thereof in ceramic chip defect repair
#32952Heat sink for clipping protecting cover of central processing unit socket
#32953Barrier layer and fabrication method thereof
#32954Semiconductor substrate thinning method for manufacturing thinned die
#32955Structure with through hole, production method thereof, and liquid discharge head
#32956Molded stiffener for thin substrates
#32957Method of detecting un-annealed ion implants
#32958Composite material used for manufacturing heat exchanger fins with high thermal conductivity
#32959Electrically and thermally conductive carbon nanotube or nanofiber array dry adhesive
#32960Electronic devices with molecular sieve layers
#32961Film carrier tape for mounting electronic devices thereon and flexible substrate
#32962Combinatorial discovery of nanomaterials
#32963Fuse memory cell comprising a diode, the diode serving as the fuse element
#32964Semiconductor device and method of manufacture thereof
#32965Heat sink module
#32966Heat dissipating module
#32967Memory module assembly including heat sink attached to integrated circuits by adhesive
#32968Locking device for heat dissipating device
#32969Liquid cooling system
#32970Lateral airflow fan-sink for electronic devices
#32971Method and apparatus for side-type heat dissipation
#32972Cooling system with integrated passive and active components
#32973Integrated ultracapacitor as energy source
#32974De-coupling capacitors produced by utilizing dummy conductive structures integrated circuits
#32975Thermal switch, methods of use and manufacturing methods for same
#32976High frequency power amplifier
#32977Voltage tolerant structure for I/O cells
#32978Capacitive monitors for detecting metal extrusion during electromigration
#32979Electronic apparatus, double-sided display panel and method of manufacturing the double-sided display panel
#32980Emission device, surface light source device, display and light flux control member
#32981Substrate edge scribe
#32982Semiconductor device with varying dummy via-hole plug density
#32983Semiconductor device and manufacturing method thereof
#32984Radiating fin and method for manufacturing the same
#32985Multi-terminal device and printed wiring board
#32986Semiconductor die with protective layer and related method of processing a semiconductor wafer
#32987Multi-doped semiconductor e-fuse
#32988Semiconductor device
#32989Pattern formed structure, method of forming pattern, device, electrooptical device and electronic equipment
#32990Zener zap diode structure compatible with tungsten plug technology
#32991Periodic patterns and technique to control misalignment between two layers
#32992Self-actuating and regulating heat exchange system
#32993Method and system for detecting leak in electronic devices
#32994Iso/nested cascading trim control with model feedback updates
#32995Semiconductor device and semiconductor production management system
#32996Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices
#32997Deposition and patterning of boron nitride nanotube ILD
#32998Top layers of metal for integrated circuits
#32999Methods for creating electrophoretically insulated vias in semiconductive substrates
#33000Integrated barrier and seed layer for copper interconnect technology