ClassID:

212006

H01L2924/0002 - page 109 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#32401
20060124957
2006-06-15

Single-phase converter module

#32402
20060124955
2006-06-15

Method of manufacturing surface-emitting backlight, by molding contact member integrally with molded case

#32403
20060124947
2006-06-15

Phosphor converted light emitting device

#32404
20060124946
2006-06-15

Optical transmitter

#32405
20060124945
2006-06-15

Radiation-emitting semiconductor component and method for the production thereof

#32406
20060124928
2006-06-15

Integrated circuit disabling

#32407
20060124750
2006-06-15

Data carrier and production method

#32408
20060124703
2006-06-15

Method of packaging flip chip and method of forming pre-solders on substrate thereof

#32409
20060124350
2006-06-15

Electronic module comprising an element exposed on one surface and method for making same

#32410
20060124281
2006-06-15

Heat transfer device and method of making same

#32411
20060124280
2006-06-15

Flat plate heat transferring apparatus and manufacturing method thereof

#32412
20060124278
2006-06-15

Heat dissipation device

#32413
20060124046
2006-06-15

Using thin film, thermal batteries to provide security protection for electronic systems

#32414
20060123365
2006-06-08

Power managers for an integrated circuit

#32415
20060122740
2006-06-08

Methods and apparatus for replacing cooling systems in operating computers

#32416
20060122351
2006-06-08

Ultraviolet transmissive polyhedral silsesquioxane polymers

#32417
20060121732
2006-06-08

Circuit package and method of plating the same

#32418
20060121723
2006-06-08

SEMICONDUCTOR PROCESS AND METHOD OF FABRICATING INTER-LAYER DIELECTRIC

#32419
20060121720
2006-06-08

Low stress semiconductor device coating and method of forming thereof

#32420
20060121717
2006-06-08

Bonding structure and fabrication thereof

#32421
20060121710
2006-06-08

Thermal conducting trench in a semiconductor structure

#32422
20060121703
2006-06-08

Assembly structure of electronic element and heat sink

#32423
20060121697
2006-06-08

Substrate dividing method

#32424
20060121693
2006-06-08

Method and device for wafer scale packaging of optical devices using a scribe and break process

#32425
20060121690
2006-06-08

Three-dimensional device fabrication method

#32426
20060121686
2006-06-08

Airdome enclosure for components

#32427
20060121671
2006-06-08

Process for manufacturing a semiconductor device comprising a metal-compound film

#32428
20060121670
2006-06-08

Memory device having a semiconducting polymer film

#32429
20060121654
2006-06-08

Transistor assembly and method of its fabrication

#32430
20060121631
2006-06-08

Method of producing semiconductor elements using a test structure

#32431
20060121257
2006-06-08

Method for producing a rewiring printed circuit board

#32432
20060120060
2006-06-08

Electronic system and method

#32433
20060120055
2006-06-08

Locking device for heat sink

#32434
20060120053
2006-06-08

Universal locking device for heat sink

#32435
20060120052
2006-06-08

Combined chip/heat-dissipating metal plate and method for manufacturing the same

#32436
20060120050
2006-06-08

Closed loop heat dissipation apparatus

#32437
20060120046
2006-06-08

Heat dissipation device

#32438
20060120044
2006-06-08

Heat dissipating apparatus

#32439
20060120042
2006-06-08

Fluid moving device with a radiation module

#32440
20060120039
2006-06-08

Integral heat-dissipation system for electronic boards

#32441
20060120035
2006-06-08

Computer component protection

#32442
20060120019
2006-06-08

Method of forming a capacitor

#32443
20060119512
2006-06-08

Power semiconductor device

#32444
20060119415
2006-06-08

Semiconductor memory device

#32445
20060119382
2006-06-08

Apparatus and methods for adjusting performance characteristics of programmable logic devices

#32446
20060119374
2006-06-08

Contactor having conductive particles in a hole as a contact electrode

#32447
20060119263
2006-06-08

Double-side display device and method of making same

#32448
20060118974
2006-06-08

Structure provided on an overlay region, overlay mark having the structure, and method of forming the overlay mark

#32449
20060118968
2006-06-08

Alloyed underlayer for microelectronic interconnects

#32450
20060118967
2006-06-08

Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor

#32451
20060118966
2006-06-08

Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor

#32452
20060118962
2006-06-08

Damascene interconnect structure with cap layer

#32453
20060118961
2006-06-08

Method for dual damascene integration of ultra low dielectric constant porous materials

#32454
20060118960
2006-06-08

Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics

#32455
20060118956
2006-06-08

System and method for manufacturing semiconductor devices using an anti-reflective coating layer

#32456
20060118955
2006-06-08

Robust copper interconnection structure and fabrication method thereof

#32457
20060118954
2006-06-08

Bit line barrier metal layer for semiconductor device and process for preparing the same

#32458
20060118951
2006-06-08

Switching element, antenna switch circuit and radio frequency module using the same

#32459
20060118948
2006-06-08

Elevated heat dissipating device

#32460
20060118945
2006-06-08

Low cost hermetic ceramic microcircuit package

#32461
20060118936
2006-06-08

Circuit module component mounting system and method

#32462
20060118921
2006-06-08

Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip

#32463
20060118920
2006-06-08

Method of wet etching vias and articles formed thereby

#32464
20060118916
2006-06-08

Semiconductor wafer and a method for manufacturing a semiconductor wafer

#32465
20060118907
2006-06-08

Semiconductor device and method for manufacturing the same

#32466
20060118906
2006-06-08

High power radio frequency integrated circuit capable of impeding parasitic current loss

#32467
20060118904
2006-06-08

Fuse structure with charge protection circuit

#32468
20060118903
2006-06-08

Molecular controlled semiconductor device

#32469
20060118882
2006-06-08

Semiconductor device, and semiconductor manufacturing method

#32470
20060118879
2006-06-08

CMOS transistor and method of manufacture thereof

#32471
20060118870
2006-06-08

Structure of strained silicon on insulator and method of manufacturing the same

#32472
20060118834
2006-06-08

Semiconductor device and method of manufacturing the same

#32473
20060118832
2006-06-08

Fast switching power insulated gate semiconductor device

#32474
20060118827
2006-06-08

Electron-emitting apparatus

#32475
20060118826
2006-06-08

Multi-layered metal routing technique

#32476
20060118805
2006-06-08

Light emitting devices with improved light extraction efficiency

#32477
20060118798
2006-06-08

Semiconductor light emitting device and method of manufacturing the same

#32478
20060118792
2006-06-08

Edge termination structures for silicon carbide devices

#32479
20060118791
2006-06-08

Thermal interface with silver-filled carbon nanotubes

#32480
20060118457
2006-06-08

Film carrier tape for mounting electronic component

#32481
20060118280
2006-06-08

Cooling device incorporating boiling chamber

#32482
20060118279
2006-06-08

Water cooling system for computer components

#32483
20060118278
2006-06-08

Cooling device

#32484
20060118276
2006-06-08

Heat sink

#32485
20060118275
2006-06-08

Radiation module capable of resisting reverse flow of hot fluid

#32486
20060118239
2006-06-08

Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate

#32487
20060117782
2006-06-08

Method and apparatus for high heat flux heat transfer

#32488
20060117550
2006-06-08

Producing method of producing a solid pickup device

#32489
20060117293
2006-06-01

Method for designing an overlay mark

#32490
20060116180
2006-06-01

Acoustic transducer module

#32491
20060116004
2006-06-01

Normally closed zero insertion force connector

#32492
20060116000
2006-06-01

Manufacturing method of insulating film and semiconductor device

#32493
20060115982
2006-06-01

Method for manufacturing semiconductor device

#32494
20060115981
2006-06-01

Forming a dual damascene structure without ashing-damaged ultra-low-k intermetal dielectric

#32495
20060115979
2006-06-01

Plasma etch process for multilayer vias having an organic layer with vertical sidewalls

#32496
20060115966
2006-06-01

Method and apparatus for the improvement of material/voltage contrast

#32497
20060115963
2006-06-01

Semiconductor device and method of manufacturing the same

#32498
20060115911
2006-06-01

Layout verification method and method for designing semiconductor integrated circuit device using the same

#32499
20060115751
2006-06-01

Automated overlay metrology system

#32500
20060114659
2006-06-01

Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board

#32501
20060114658
2006-06-01

Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board

#32502
20060114657
2006-06-01

Thermal management apparatus

#32503
20060114629
2006-06-01

Input/output devices with robustness of ESD protection

#32504
20060114434
2006-06-01

Apparatus to easily measure reticle blind positioning with an exposure apparatus

#32505
20060114077
2006-06-01

Electronic device and method of manufacturing the same

#32506
20060114052
2006-06-01

Semiconductor integrated circuit

#32507
20060114047
2006-06-01

Semiconductor unit

#32508
20060114013
2006-06-01

Miniature fluid-cooled heat sink with integral heater

#32509
20060113894
2006-06-01

Semiconductor device, display device and method for manufacturing thereof, and television device

#32510
20060113685
2006-06-01

Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device

#32511
20060113682
2006-06-01

Semiconductor component having plate and stacked dice

#32512
20060113678
2006-06-01

CSP chip stack with flex circuit

#32513
20060113676
2006-06-01

Semiconductor device and method of manufacture thereof

#32514
20060113675
2006-06-01

Barrier material and process for Cu interconnect

#32515
20060113674
2006-06-01

Semiconductor device and manufacturing method of semiconductor device

#32516
20060113673
2006-06-01

Semiconductor device and fabrication method thereof

#32517
20060113672
2006-06-01

HDP-based ILD capping layer

#32518
20060113670
2006-06-01

Multi-layer wiring, method of manufacturing the same and thin film transistor having the same

#32519
20060113662
2006-06-01

Micro heat pipe with wedge capillaries

#32520
20060113661
2006-06-01

Cooling system of power semiconductor module

#32521
20060113658
2006-06-01

Substrate core

#32522
20060113657
2006-06-01

Designated MOSFET and driver design to achieve lowest parasitics in discrete circuits

#32523
20060113652
2006-06-01

Battery mounted integrated circuit device having diffusion layers that prevent cations serving to charge and discharge battery from diffusing into the integrated circuit region

#32524
20060113651
2006-06-01

IC card

#32525
20060113637
2006-06-01

Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor

#32526
20060113632
2006-06-01

Semiconductor device and voltage regulator

#32527
20060113613
2006-06-01

Semiconductor device and junction termination structure

#32528
20060113604
2006-06-01

Methods for reduced circuit area and improved gate length control

#32529
20060113597
2006-06-01

Semiconductor device and manufacturing method thereof

#32530
20060113581
2006-06-01

Semiconductor memory device

#32531
20060113576
2006-06-01

Sacrificial self-aligned interconnect structure

#32532
20060113559
2006-06-01

Notched compound semiconductor wafer

#32533
20060113558
2006-06-01

Notched compound semiconductor wafer

#32534
20060113553
2006-06-01

White light emitting phosphor blend for LED devices

#32535
20060113547
2006-06-01

Methods of fabricating memory devices including fuses and load resistors in a peripheral circuit region

#32536
20060113546
2006-06-01

Diamond composite heat spreaders having low thermal mismatch stress and associated methods

#32537
20060113537
2006-06-01

Electronic unit integrated into a flexible polymer body

#32538
20060113533
2006-06-01

Semiconductor device and layout design method for the same

#32539
20060113525
2006-06-01

Organic electroluminescent device

#32540
20060113473
2006-06-01

Method and apparatus for measuring the physical properties of micro region

#32541
20060113291
2006-06-01

Method for preparing ball grid array substrates via use of a laser

#32542
20060113289
2006-06-01

Method and apparatus for laser marking by ablation

#32543
20060113184
2006-06-01

Lead frame plating apparatus

#32544
20060113065
2006-06-01

Heat sink made from a singly extruded heatpipe

#32545
20060113064
2006-06-01

Heat pipe remote heat exchanger (RHE) with graphite block

#32546
20060113062
2006-06-01

Radiating fin assembly

#32547
20060112466
2006-05-25

Nanostructure, electronic device and method of manufacturing the same

#32548
20060110941
2006-05-25

Method of improving via filling uniformity in isolated and dense via-pattern regions

#32549
20060110920
2006-05-25

Low temperature nitride used as Cu barrier layer

#32550
20060110915
2006-05-25

Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof

#32551
20060110886
2006-05-25

MOSFET structure and method of fabricating the same

#32552
20060110851
2006-05-25

Methods for forming co-planar wafer-scale chip packages

#32553
20060110848
2006-05-25

Off-width pitch for improved circuit card routing

#32554
20060110837
2006-05-25

Method and system for topography-aware reticle enhancement

#32555
20060110602
2006-05-25

Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure

#32556
20060110586
2006-05-25

Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure

#32557
20060110545
2006-05-25

Method of forming conductive pattern

#32558
20060110299
2006-05-25

Integrated multi-purpose getter for radio-frequency (RF) circuit modules

#32559
20060109631
2006-05-25

Method and apparatus for connecting circuit cards employing a cooling technique to achieve desired temperature thresholds and card alignment

#32560
20060109629
2006-05-25

Multi-chip module with power system

#32561
20060109628
2006-05-25

Cooling apparatus for electronic devices

#32562
20060109625
2006-05-25

Redundant power for processor circuit board

#32563
20060109623
2006-05-25

Apparatus and method for multiprocessor circuit board

#32564
20060109606
2006-05-25

Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure

#32565
20060109368
2006-05-25

Image pick-up module and method for assembly of an image pick-up module

#32566
20060109366
2006-05-25

Compact lens turret assembly

#32567
20060109132
2006-05-25

RF tag holding structure

#32568
20060109022
2006-05-25

Test structure design for reliability test

#32569
20060109018
2006-05-25

Arrangement for contacting an integrated circuit in a package

#32570
20060108699
2006-05-25

Electronic part having reinforcing member

#32571
20060108696
2006-05-25

Structure for reducing stress-induced voiding in an interconnect of integrated circuits

#32572
20060108694
2006-05-25

Circuit layout structure and method

#32573
20060108690
2006-05-25

Circuit board with reduced simultaneous switching noise

#32574
20060108688
2006-05-25

Large grained polycrystalline silicon and method of making same

#32575
20060108687
2006-05-25

Using zeolites to improve the mechanical strength of low-k interlayer dielectrics

#32576
20060108683
2006-05-25

Semiconductor device, radiographic imaging apparatus, and method for manufacturing the same

#32577
20060108679
2006-05-25

Integrated circuit with offset pins

#32578
20060108678
2006-05-25

Probe arrays and method for making

#32579
20060108668
2006-05-25

Tamper resistant packaging and approach

#32580
20060108662
2006-05-25

Electrically programmable fuse for silicon-on-insulator (SOI) technology

#32581
20060108652
2006-05-25

Microelectromechanical systems, and devices having thin film encapsulated mechanical structures

#32582
20060108609
2006-05-25

Barrier dielectric stack for seam protection

#32583
20060108606
2006-05-25

Transistors having buried n-type and p-type regions beneath the source region

#32584
20060108588
2006-05-25

Display device and electronic device

#32585
20060108526
2006-05-25

Apparatus for measuring a three-dimensional shape

#32586
20060108518
2006-05-25

Structure for calibrating packaging of electric micro-optic modules

#32587
20060108337
2006-05-25

Method and system for laser soft marking

#32588
20060108320
2006-05-25

Molecular self-assembly in substrate processing

#32589
20060108105
2006-05-25

Modularized cooler

#32590
20060108104
2006-05-25

Heat-dissipating fin set in combination with thermal pipe

#32591
20060108103
2006-05-25

Heat pipe and wick structure thereof

#32592
20060108099
2006-05-25

Liquid-cooled pipe

#32593
20060108049
2006-05-25

Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure

#32594
20060107988
2006-05-25

Densely packed thermoelectric cooler

#32595
20060107987
2006-05-25

Computer with heat-recycling function

#32596
20060107986
2006-05-25

Peltier cooling systems with high aspect ratio

#32597
20060107521
2006-05-25

Attaching device

#32598
20060107518
2006-05-25

Producing method of solid state pickup device, and attaching method and device for the same

#32599
20060105570
2006-05-18

Copper interconnect wiring and method of forming thereof

#32600
20060105564
2006-05-18

Method and system for reducing inter-layer capacitance in integrated circuits

#32601
20060105563
2006-05-18

Method of forming a semiconductor device

#32602
20060105560
2006-05-18

Method for forming solder bumps of increased height

#32603
20060105547
2006-05-18

Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking

#32604
20060105497
2006-05-18

Forming a stress compensation layer and structures formed thereby

#32605
20060105482
2006-05-18

Array of light emitting devices to produce a white light source

#32606
20060105478
2006-05-18

Bonding an optical element to a light emitting device

#32607
20060105475
2006-05-18

Fast localization of electrical failures on an integrated circuit system and method

#32608
20060105181
2006-05-18

Patternable low dielectric constant materials and their use in ULSI interconnection

#32609
20060105106
2006-05-18

Tensile and compressive stressed materials for semiconductors

#32610
20060104563
2006-05-18

Optical semiconductor bare chip, printed wiring board, lighting unit and lighting device

#32611
20060104060
2006-05-18

Light-emitting diode arrangement comprising a reflector

#32612
20060104036
2006-05-18

Heat dissipating device

#32613
20060104033
2006-05-18

Connection structure of thermal tube and heat dissipation fins

#32614
20060104032
2006-05-18

Heat dissipation device

#32615
20060103953
2006-05-18

Electrical micro-optic module with improved joint structures

#32616
20060103449
2006-05-18

Semiconductor integrated circuit device and a contactless electronic device

#32617
20060103402
2006-05-18

Semiconductor apparatus

#32618
20060103035
2006-05-18

Method of aligning an electron beam apparatus and semiconductor substrate utilizing an alignment mark

#32619
20060103034
2006-05-18

Overlay mark for a non-critical layer of critical dimensions

#32620
20060103033
2006-05-18

Marker structure and method for controlling alignment of layers of a multi-layered substrate

#32621
20060103027
2006-05-18

Electronic component including reinforcing member

#32622
20060103025
2006-05-18

Semiconductor device including sealing ring

#32623
20060103024
2006-05-18

Tiled construction of layered materials

#32624
20060103023
2006-05-18

Methods for incorporating high k dielectric materials for enhanced SRAM operation and structures produced thereby

#32625
20060103022
2006-05-18

Semiconductor device with superimposed poly-silicon plugs

#32626
20060103017
2006-05-18

Semiconductor device

#32627
20060103013
2006-05-18

Techniques for cooling a circuit board component within an environment with little or no forced convection airflow

#32628
20060103012
2006-05-18

Solid-state semiconductor light emitting device

#32629
20060103001
2006-05-18

Configuration terminal for integrated devices and method for configuring an integrated device

#32630
20060102984
2006-05-18

Passivation structure with voltage equalizing loops

#32631
20060102982
2006-05-18

Antifuse structure having an integrated heating element

#32632
20060102980
2006-05-18

Semiconductor device

#32633
20060102966
2006-05-18

Printable non-volatile passive memory element and method of making thereof

#32634
20060102960
2006-05-18

Systems and methods for voltage distribution via epitaxial layers

#32635
20060102945
2006-05-18

Structure and method for accurate deep trench resistance measurement

#32636
20060102935
2006-05-18

Transistor-based biosensors having gate electrodes coated with receptor molecules

#32637
20060102934
2006-05-18

Semiconductor integrated circuit device

#32638
20060102933
2006-05-18

III-V group compound semiconductor light emitting device and manufacturing method thereof

#32639
20060102895
2006-05-18

Precursor compositions for forming tantalum-containing films, and tantalum-containing barrier films and copper-metallized semiconductor device structures

#32640
20060102873
2006-05-18

Getter

#32641
20060102485
2006-05-18

Electroless plating method, electroless plating device, and production method and production device of semiconductor device

#32642
20060102382
2006-05-18

Manufacturing method of electronic part and wiring substrate

#32643
20060102326
2006-05-18

Cooling device of electronic device

#32644
20060102325
2006-05-18

Guiding fin heat sink

#32645
20060102324
2006-05-18

Cooling device using multiple fans and heat sinks

#32646
20060102323
2006-05-18

Radially shaped heat pipe

#32647
20060102320
2006-05-18

Heat sink

#32648
20060102319
2006-05-18

Heat dissipation enhancing device

#32649
20060101829
2006-05-18

Self-cooled vertical electronic component

#32650
20060100397
2006-05-11

Transparent liquid resin material for SMT-enabled LED-applications at higher temperatures and higher luminosities

#32651
20060100336
2006-05-11

Heat conductive silicone composition

#32652
20060100314
2006-05-11

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

#32653
20060100299
2006-05-11

Transformable pressure sensitive adhesive tape and use thereof in display screens

#32654
20060099832
2006-05-11

System and method for determining line widths of free-standing structures resulting from a semiconductor manufacturing process

#32655
20060099801
2006-05-11

Method and structure to wire electronic devices

#32656
20060099794
2006-05-11

Interconnect structure to reduce stress induced voiding effect

#32657
20060099793
2006-05-11

Structure for strained channel field effect transistor pair having a member and a contact via

#32658
20060099775
2006-05-11

Crack stop for low K dielectrics

#32659
20060099740
2006-05-11

High density direct connect loc assembly

#32660
20060099738
2006-05-11

Semiconductor device and method for manufacturing the same, and electric appliance

#32661
20060099725
2006-05-11

Semiconductor device and process for producing the same

#32662
20060099406
2006-05-11

Heat spreader for printed circuit boards

#32663
20060098469
2006-05-11

Circuit wiring layout in semiconductor memory device and layout method

#32664
20060098416
2006-05-11

Electronic assembly with a heat sink in particular for a discharge lamp control module for motor vehicle headlights

#32665
20060098414
2006-05-11

Heat sink

#32666
20060098411
2006-05-11

Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating same

#32667
20060098410
2006-05-11

Thermal management system and method for electronic equipment mounted on coldplates

#32668
20060098408
2006-05-11

Heat dissipating device

#32669
20060098398
2006-05-11

Plasma display panel assembly having a short circuit preventive unit

#32670
20060098372
2006-05-11

Integrated circuit with protection against electrostatic damage

#32671
20060097836
2006-05-11

Semiconductor device and method for manufacturing same

#32672
20060097401
2006-05-11

Method for designing wiring connecting section and semiconductor device

#32673
20060097395
2006-05-11

Integrated circuit design for routing an electrical connection

#32674
20060097394
2006-05-11

Detection of residual liner materials after polishing in damascene process

#32675
20060097390
2006-05-11

Semiconductor devices having a trench in a side portion of a conducting line pattern and methods of forming the same

#32676
20060097384
2006-05-11

Method for thermal characterization under non-uniform heat load

#32677
20060097382
2006-05-11

High frequency module

#32678
20060097376
2006-05-11

Electronic product, a body and a method of manufacturing

#32679
20060097364
2006-05-11

Electro-optical device and electronic apparatus

#32680
20060097362
2006-05-11

Method and apparatus for fabricating and connecting a semiconductor power switching device

#32681
20060097360
2006-05-11

Dielectric materials for electronic devices

#32682
20060097359
2006-05-11

Low-k dielectric layer formed from aluminosilicate precursors

#32683
20060097356
2006-05-11

Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device

#32684
20060097355
2006-05-11

Method and apparatus for leveling a semiconductor wafer, and semiconductor wafer with improved flatness

#32685
20060097348
2006-05-11

Structures having an electrode formed from a transition metal or a conductive metal-oxide

#32686
20060097346
2006-05-11

Structure for high quality factor inductor operation

#32687
20060097345
2006-05-11

Gate dielectric antifuse circuits and methods for operating same

#32688
20060097344
2006-05-11

Integrated thin film capacitor/inductor/interconnect system and method

#32689
20060097332
2006-05-11

Semiconductor device, carrier, card reader, methods of initializing and checking authenticity

#32690
20060097324
2006-05-11

Semiconductor integrated circuit and method for designing the same

#32691
20060097323
2006-05-11

Method and apparatus for preventing microcircuit thermo-mechanical damage during an ESD event

#32692
20060097321
2006-05-11

Electrostatic discharge protection device

#32693
20060097315
2006-05-11

Structure for strained channel field effect transistor pair having underlapped dual liners

#32694
20060097309
2006-05-11

Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration

#32695
20060097290
2006-05-11

Semiconductor structure for imaging detectors

#32696
20060097256
2006-05-11

Electro-optical device and electronic device

#32697
20060097059
2006-05-11

IC card

#32698
20060096743
2006-05-11

Liquid cooling device

#32699
20060096742
2006-05-11

Cooling assembly with sucessively contracting and expanding coolant flow

#32700
20060096741
2006-05-11

Twin fin arrayed cooling device with heat spreader