ClassID:

212006

H01L2924/0002 - page 111 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#33001
20060063363
2006-03-23

Semiconductor structures

#33002
20060063325
2006-03-23

Embedded capacitor structure in circuit board and method for fabricating the same

#33003
20060063319
2006-03-23

Semiconductor device

#33004
20060063302
2006-03-23

Apparatus and method for high density multi-chip structures

#33005
20060063286
2006-03-23

Using a time invariant statistical process variable of a semiconductor chip as the chip identifier

#33006
20060063285
2006-03-23

Methods for measuring die temperature

#33007
20060063028
2006-03-23

Two sided light emitting device

#33008
20060063024
2006-03-23

Metallized substrate

#33009
20060063021
2006-03-23

Prespray processing method and prespray processed engine cylinder block

#33010
20060063018
2006-03-23

Sandwiched finstock

#33011
20060063017
2006-03-23

Thermally conductive sheet and method for producing the same

#33012
20060061975
2006-03-23

Protecting device of a memory module

#33013
20060061972
2006-03-23

Simplified mounting configuration that applies pressure force to one central location

#33014
20060061970
2006-03-23

Heatsink

#33015
20060061966
2006-03-23

Method and apparatus for dissipating heat from an electronic device

#33016
20060061889
2006-03-23

Electronic module with light-blocking features

#33017
20060061350
2006-03-23

Inverted magnetic isolator

#33018
20060061019
2006-03-23

Method of producing ceramic multilayer substrates, and green composite laminate

#33019
20060060986
2006-03-23

Semiconductor memory device and power line arrangement method thereof

#33020
20060060978
2006-03-23

Methods for fabricating a metal layer pattern

#33021
20060060977
2006-03-23

Semiconductor device

#33022
20060060976
2006-03-23

Process for forming integrated circuit comprising copper lines

#33023
20060060975
2006-03-23

Semiconductor device and method for manufacturing same

#33024
20060060972
2006-03-23

Semiconductor device having metal-insulator-metal capacitor and method for fabricating the same

#33025
20060060971
2006-03-23

Method of forming a via structure dual damascene structure for the manufacture of semiconductor integrated circuit devices

#33026
20060060970
2006-03-23

Interconnection structure of integrated circuit chip

#33027
20060060964
2006-03-23

Method and apparatus for high temperature operation of electronics

#33028
20060060946
2006-03-23

Method of forming copper layers

#33029
20060060945
2006-03-23

Method of fabricating semiconductor device having alignment key and semiconductor device fabricated thereby

#33030
20060060944
2006-03-23

Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus

#33031
20060060940
2006-03-23

Rectifying charge storage element

#33032
20060060939
2006-03-23

Semiconductor apparatus having a built-in electric coil and a method of making the semiconductor apparatus

#33033
20060060938
2006-03-23

Resettable fuse device and method of fabricating the same

#33034
20060060932
2006-03-23

Low-noise semiconductor photodetectors

#33035
20060060885
2006-03-23

Electronic device having coalesced metal nanoparticles

#33036
20060060883
2006-03-23

Notched compound semiconductor wafer

#33037
20060060861
2006-03-23

Semiconductor device and method of fabricating same

#33038
20060060639
2006-03-23

Doped contact formations

#33039
20060060367
2006-03-23

Multi-dimensional compliant thermal cap for an electronic device

#33040
20060060333
2006-03-23

Methods and apparatuses for electronics cooling

#33041
20060060332
2006-03-23

Heat dissipating device

#33042
20060060331
2006-03-23

Apparatus and method for enhanced heat transfer

#33043
20060060330
2006-03-23

Vapor augmented heatsink with multi-wick structure

#33044
20060060328
2006-03-23

Heat-transfer devices

#33045
20060060086
2006-03-23

Desiccant having a reactive salt

#33046
20060059705
2006-03-23

Lewis acid organometallic desiccant

#33047
20060059684
2006-03-23

Method of manufacturing a heat dissipating device

#33048
20060059445
2006-03-16

Method of designing wiring structure of semiconductor device and wiring structure designed accordingly

#33049
20060058487
2006-03-16

Polyorganosiloxane dielectric materials

#33050
20060058473
2006-03-16

Epoxy resin composition for sealing optical semiconductor

#33051
20060057902
2006-03-16

Method of retaining a solder mass on an article

#33052
20060057850
2006-03-16

Method of manufacturing carrier wafer and resulting carrier wafer structures

#33053
20060057840
2006-03-16

Guard ring for improved matching

#33054
20060057836
2006-03-16

Method of stacking thin substrates by transfer bonding

#33055
20060057835
2006-03-16

Air-gap insulated interconnections

#33056
20060057818
2006-03-16

Package structure and method for optoelectric products

#33057
20060057815
2006-03-16

Method of manufacturing a semiconductor device

#33058
20060057801
2006-03-16

Thin films and methods for the preparation thereof

#33059
20060057797
2006-03-16

Method for avoiding oxide undercut during pre-silicide clean for thin spacer FETs

#33060
20060057783
2006-03-16

Methods of forming fuses using selective etching of capping layers

#33061
20060057781
2006-03-16

Plastic leadframe and compliant fastener

#33062
20060057764
2006-03-16

Image sensor and fabricating method thereof

#33063
20060057762
2006-03-16

Method of building electronic label for electronic device

#33064
20060057404
2006-03-16

Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction

#33065
20060057364
2006-03-16

Thermal interface materials

#33066
20060056994
2006-03-16

Cooling devices and systems

#33067
20060056964
2006-03-16

Centrifugal Fan, Cooling Mechanism, and Apparatus Furnished with the Cooling Mechanism

#33068
20060056728
2006-03-16

User interface for an image transformation device

#33069
20060056248
2006-03-16

Multi-chip semiconductor packages and methods of operating the same

#33070
20060056219
2006-03-16

Method for designing semiconductor device and semiconductor device

#33071
20060056160
2006-03-16

Memory heat-dissipating device

#33072
20060056159
2006-03-16

Locking device for heat sink

#33073
20060056157
2006-03-16

Integral heat spreader

#33074
20060056156
2006-03-16

Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip

#33075
20060056154
2006-03-16

Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board

#33076
20060056152
2006-03-16

Fan holder

#33077
20060056128
2006-03-16

Power network reconfiguration using MEM switches

#33078
20060056113
2006-03-16

Electronic device and wiring with a current induced cooling effect, and an electronic device capable of converting a temperature difference into voltage

#33079
20060055063
2006-03-16

Leadframe designs for plastic overmold packages

#33080
20060055049
2006-03-16

Routing vias in a substrate from bypass capacitor pads

#33081
20060055048
2006-03-16

Method of wet etching vias and articles formed thereby

#33082
20060055046
2006-03-16

Semiconductor device having a multilayer wiring structure

#33083
20060055045
2006-03-16

Semiconductor memory device and arrangement method thereof

#33084
20060055044
2006-03-16

Semiconductor device

#33085
20060055043
2006-03-16

Connection structure for semiconductor devices

#33086
20060055042
2006-03-16

Method and device for the detection of at least one luminescent substance

#33087
20060055039
2006-03-16

Stackable layer containing ball grid array package

#33088
20060055025
2006-03-16

Method of forming a low capacitance semiconductor device and structure therefor

#33089
20060055024
2006-03-16

Adapted leaded integrated circuit module

#33090
20060055022
2006-03-16

Routing power and ground vias in a substrate

#33091
20060055020
2006-03-16

Stackable ball grid array

#33092
20060055008
2006-03-16

Electronic devices with edge connectors and methods of using the same

#33093
20060055007
2006-03-16

Seal ring structure for integrated circuit chips

#33094
20060055005
2006-03-16

Semiconductor device with seal ring

#33095
20060055004
2006-03-16

Low K and ultra low K SiCOH dielectric films and methods to form the same

#33096
20060055002
2006-03-16

Methods for enhancing die saw and packaging reliability

#33097
20060054999
2006-03-16

Semiconductor device for protecting a circuit formed on a semiconductor chip from destruction caused by an electrostatic discharge

#33098
20060054997
2006-03-16

Techniques for forming passive devices during semiconductor back-end processing

#33099
20060054994
2006-03-16

Interdigitated capacitors

#33100
20060054993
2006-03-16

Semiconductor device having fuse with protection capacitor

#33101
20060054992
2006-03-16

Semiconductor device having fuse area surrounded by protection means

#33102
20060054990
2006-03-16

Insulating tube, semiconductor device employing the tube, and method of manufacturing the same

#33103
20060054960
2006-03-16

Semiconductor device and method for fabricating the same

#33104
20060054937
2006-03-16

Semiconductor devices having an interfacial dielectric layer and related methods

#33105
20060054936
2006-03-16

Nanosensors

#33106
20060054925
2006-03-16

Compound semiconductor device and method for fabricating the same

#33107
20060054922
2006-03-16

Optically controlled electrical switching device based on wide bandgap semiconductors

#33108
20060054914
2006-03-16

Composite heat conductive structure for a LED package

#33109
20060054904
2006-03-16

Light emitting diode and fabrication method thereof

#33110
20060054787
2006-03-16

Apparatus for multiple camera devices and method of operating same

#33111
20060054782
2006-03-16

Apparatus for multiple camera devices and method of operating same

#33112
20060054608
2006-03-16

Method and system for calibrating a laser processing system and laser marking system utilizing same

#33113
20060054369
2006-03-16

Support frame device with locating function

#33114
20060054353
2006-03-16

Method and device for protection of a component or module

#33115
20060054349
2006-03-16

Cof film carrier tape and its manufacturing method

#33116
20060054311
2006-03-16

Heat sink device with independent parts

#33117
20060054307
2006-03-16

Heat sink

#33118
20060054210
2006-03-16

Photovoltaic module with an electronic device in the laminated stack

#33119
20060053345
2006-03-09

Thin module system and method

#33120
20060052566
2006-03-09

Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts

#33121
20060051966
2006-03-09

In-situ chamber clean process to remove by-product deposits from chemical vapor etch chamber

#33122
20060051901
2006-03-09

Method of producing LED bodies with the aid of a cross-sectional constriction

#33123
20060051900
2006-03-09

Method of manufacturing a semiconductor device

#33124
20060051896
2006-03-09

Stacking circuit elements

#33125
20060051887
2006-03-09

Manufacturing method and joining device for solid-state imaging devices

#33126
20060051884
2006-03-09

Systems and methods for thin film thermal diagnostics with scanning thermal microstructures

#33127
20060051883
2006-03-09

Apparatus and system for suspending a chip-scale device and related methods

#33128
20060051610
2006-03-09

Tin plating

#33129
20060051536
2006-03-09

Heat pipe

#33130
20060051203
2006-03-09

High volume fan device for removing heat from heat sources

#33131
20060050498
2006-03-09

Die module system

#33132
20060050496
2006-03-09

Thin module system and method

#33133
20060050493
2006-03-09

LSI package with interface module, transmission line package, and ribbon optical transmission line

#33134
20060050492
2006-03-09

Thin module system and method

#33135
20060050489
2006-03-09

Optimized mounting area circuit module system and method

#33136
20060050483
2006-03-09

Liquid cooled heat sink with cold plate retention mechanism

#33137
20060050108
2006-03-09

Ink jet printhead chip with predetermined micro-electromechanical systems height

#33138
20060049885
2006-03-09

MEMS-based, computer systems, clock generation and oscillator circuits and LC-tank apparatus for use therein

#33139
20060049838
2006-03-09

Pattern evaluation method, manufacturing method of semiconductor device, correction method of mask pattern and manufacturing method of exposure mask

#33140
20060049802
2006-03-09

Terminal box and a method of providing it

#33141
20060049773
2006-03-09

Fault protection scheme for CCFL integrated circuits

#33142
20060049766
2006-03-09

Magnetron cooling fin

#33143
20060049516
2006-03-09

Nickel/gold pad structure of semiconductor package and fabrication method thereof

#33144
20060049502
2006-03-09

Module thermal management system and method

#33145
20060049497
2006-03-09

Physical quantity sensor

#33146
20060049496
2006-03-09

System and method for providing scalability in an integrated circuit

#33147
20060049492
2006-03-09

Reduced foot print lead-less package with tolerance for thermal and mechanical stresses and method thereof

#33148
20060049490
2006-03-09

Displaying apparatus

#33149
20060049487
2006-03-09

Method of manufacturing a semiconductor device by forming separation regions which do not extend to the peripherals of a substrate, and structures thereof

#33150
20060049486
2006-03-09

Method of self-assembling electronic circuitry and circuits formed thereby

#33151
20060049481
2006-03-09

Planar inductive component and an integrated circuit comprising a planar inductive component

#33152
20060049479
2006-03-09

Capacitor placement for integrated circuit packages

#33153
20060049468
2006-03-09

Interconnection architecture and method of assessing interconnection architecture

#33154
20060049466
2006-03-09

Semiconductor device having fuse and protection circuit

#33155
20060049454
2006-03-09

ACCUFET with schottky source contact

#33156
20060049446
2006-03-09

Method of forming a contact hole in a semiconductor device

#33157
20060049400
2006-03-09

Semiconductor device

#33158
20060049396
2006-03-09

Sealing of electronic device using absorbing layer for glue line

#33159
20060049151
2006-03-09

Plasma display apparatus including electrode pad

#33160
20060048932
2006-03-09

Configurable heat sink

#33161
20060048918
2006-03-09

Cooling device for heat source

#33162
20060048385
2006-03-09

Minimized profile circuit module systems and methods

#33163
20060048348
2006-03-09

CPU clamp

#33164
20060046517
2006-03-02

Methods for forming an enriched metal oxide surface for use in a semiconductor device

#33165
20060046485
2006-03-02

Method of manufacturing package substrate with fine circuit pattern using anodic oxidation

#33166
20060046479
2006-03-02

Adhesion improvement for low k dielectrics to conductive materials

#33167
20060046475
2006-03-02

Sloped vias in a substrate, spring-like contacts, and methods of making

#33168
20060046445
2006-03-02

Conductive line for a semiconductor device using a carbon nanotube including a memory thin film and semiconductor device manufactured

#33169
20060046432
2006-03-02

Method of forming through-wafer interconnects for vertical wafer level packaging

#33170
20060046398
2006-03-02

Low resistance peripheral local interconnect contacts with selective wet strip of titanium

#33171
20060046389
2006-03-02

Manufacturing process and structure of integrated circuit

#33172
20060046377
2006-03-02

Thin-film capacitor including an opening therein

#33173
20060046356
2006-03-02

Method for forming a circuit package having a thin substrate

#33174
20060046354
2006-03-02

Recessed gate dielectric antifuse

#33175
20060046353
2006-03-02

Optimizing dynamic power characteristics of an integrated circuit chip

#33176
20060046349
2006-03-02

Semiconductor device manufacturing method and apparatus used in the semiconductor device manufacturing method

#33177
20060046345
2006-03-02

Method for fabricating a silicon carbide interconnect for semiconductor components using heating

#33178
20060046322
2006-03-02

Integrated circuit cooling and insulating device and method

#33179
20060046314
2006-03-02

Method for manufacturing ferroelectric memory

#33180
20060046201
2006-03-02

Method to align mask patterns

#33181
20060046040
2006-03-02

Composite laminate and method for manufacturing the same

#33182
20060046037
2006-03-02

Multilayered polymeric structure

#33183
20060045755
2006-03-02

Information handling system including AC electromagnetic pump cooling apparatus

#33184
20060045744
2006-03-02

Fan frame and fan utilizing the same

#33185
20060044864
2006-03-02

Structure of AC light-emitting diode dies

#33186
20060044815
2006-03-02

Light emitting diode and light emitting control system using same

#33187
20060044764
2006-03-02

Auxiliary supporting structure of circuit board and assembling method for the same

#33188
20060044763
2006-03-02

Thermal managed interconnect system for a circuit board

#33189
20060044759
2006-03-02

Electroosmotic pump apparatus that generates low amount of hydrogen gas

#33190
20060044714
2006-03-02

Substrate-triggered ESD circuit by using triple-well

#33191
20060044450
2006-03-02

Camera device, method of manufacturing a camera device, wafer scale package

#33192
20060044138
2006-03-02

Die anti-tampering sensor

#33193
20060044049
2006-03-02

Low voltage programmable eFuse with differential sensing scheme

#33194
20060044038
2006-03-02

Semiconductor device having a power supply capacitor

#33195
20060043983
2006-03-02

Anisotropic conductive connector, probe member, wafer inspecting device, and wafer inspecting method

#33196
20060043601
2006-03-02

Encapsulated component and method for the production thereof

#33197
20060043596
2006-03-02

Semiconductor structure implementing sacrificial material and methods for making and implementing the same

#33198
20060043595
2006-03-02

Memory device and method of production and method of use of same and semiconductor device and method of production of same

#33199
20060043590
2006-03-02

Maintaining uniform CMP hard mask thickness

#33200
20060043589
2006-03-02

Electronic device and method for fabricating the same

#33201
20060043588
2006-03-02

Semiconductor device including a low-k metallization layer stack for enhanced resistance against electromigration

#33202
20060043586
2006-03-02

Board level solder joint support for BGA packages under heatsink compression

#33203
20060043574
2006-03-02

Aluminum/ceramic bonding substrate

#33204
20060043565
2006-03-02

Laser removal of plating tails for high speed packages

#33205
20060043563
2006-03-02

Stacked microelectronic layer and module with three-axis channel T-connects

#33206
20060043558
2006-03-02

Stacked integrated circuit cascade signaling system and method

#33207
20060043551
2006-03-02

Heat dissipation structure accommodated in electronic control device

#33208
20060043543
2006-03-02

Solder composition, connecting process with soldering, and connection structure with soldering

#33209
20060043541
2006-03-02

Method and apparatus for implementing a co-axial wire in a semiconductor chip

#33210
20060043537
2006-03-02

Routing differential signal lines in a substrate

#33211
20060043535
2006-03-02

Pass through via technology for use during the manufacture of a semiconductor device

#33212
20060043496
2006-03-02

Semiconductor device and method for fabricating the same

#33213
20060043495
2006-03-02

Semiconductor device

#33214
20060043488
2006-03-02

Method and system for a programmable electrostatic discharge (ESD) protection circuit

#33215
20060043487
2006-03-02

Bi-directional ESD protection circuit

#33216
20060043477
2006-03-02

Interposers for chip-scale packages and intermediates thereof

#33217
20060043438
2006-03-02

Integrated photoserver for CMOS imagers

#33218
20060043426
2006-03-02

Method and apparatus for calculating wiring capacitance, and computer product

#33219
20060043390
2006-03-02

Light-receiving panel or light-emitting panel, and manufacturing method thereof

#33220
20060043380
2006-03-02

Light-emitting device of field-effect transistor type

#33221
20060043367
2006-03-02

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING A LOW TEMPERATURE POLY-SILICON LAYER

#33222
20060043297
2006-03-02

Electromagnetic radiation detection device with integrated housing comprising two superposed detectors

#33223
20060042828
2006-03-02

Transmission circuit board

#33224
20060042787
2006-03-02

Heat dissipation device having cap for protecting thermal interface material thereon

#33225
20060042786
2006-03-02

Heat pipe

#33226
20060042784
2006-03-02

Heat dissipation apparatus and method

#33227
20060042783
2006-03-02

Heat sink for electronic device

#33228
20060042782
2006-03-02

Heat sink structure

#33229
20060042291
2006-03-02

Method and apparatus for increasing natural convection efficiency in long heat sinks

#33230
20060042289
2006-03-02

Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack

#33231
20060042054
2006-03-02

Securing lids to semiconductor packages

#33232
20060040522
2006-02-23

Method for making a microelectronic interposer

#33233
20060040511
2006-02-23

[METHOD OF FABRICATING SHALLOW TRENCH ISOLATION STRUCTURE FOR REDUCING WAFER SCRATCH]

#33234
20060040491
2006-02-23

Slot designs in wide metal lines

#33235
20060040487
2006-02-23

Semiconductor device, method for manufacturing the same, and plating solution

#33236
20060040422
2006-02-23

Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies

#33237
20060040202
2006-02-23

Positive working photosensitive composition

#33238
20060040112
2006-02-23

Thermal interconnect and interface systems, methods of production and uses thereof

#33239
20060040104
2006-02-23

Heat spreader

#33240
20060039551
2006-02-23

Crosstalk noise reduction circuit and method

#33241
20060039208
2006-02-23

Metal-poly integrated capacitor structure

#33242
20060039119
2006-02-23

Holding fixture, component mounting method, electronic circuit unit and electronic apparatus

#33243
20060039117
2006-02-23

Heat dissipation device

#33244
20060039115
2006-02-23

Pre-fastened heat sink clip

#33245
20060039114
2006-02-23

Method and system for measuring temperature and power distribution of a device

#33246
20060039113
2006-02-23

Heat dissipating device with dust-collecting mechanism

#33247
20060039111
2006-02-23

[HIGH-PERFORMANCE TWO-PHASE FLOW EVAPORATOR FOR HEAT DISSIPATION]

#33248
20060039110
2006-02-23

Coaxial air ducts and fans for cooling and electronic component

#33249
20060038639
2006-02-23

Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias

#33250
20060038630
2006-02-23

Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same

#33251
20060038621
2006-02-23

Semiconductor devices with inductors

#33252
20060038553
2006-02-23

Method for detecting epitaxial (EPI) induced buried layer shifts in semiconductor devices

#33253
20060038324
2006-02-23

Molding method for curable poly(arylene ether) composition and article thereby

#33254
20060038299
2006-02-23

Carbon nanotube device, method of manufacturing the same, and carbon nanotube transfer body

#33255
20060038298
2006-02-23

Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package

#33256
20060038297
2006-02-23

Semiconductor device

#33257
20060038296
2006-02-23

Integrated low-k hard mask

#33258
20060038295
2006-02-23

Selectively encased surface metal structures in a semiconductor device

#33259
20060038294
2006-02-23

Metallization performance in electronic devices

#33260
20060038293
2006-02-23

Inter-metal dielectric fill

#33261
20060038292
2006-02-23

Semiconductor device having wires that vary in wiring pitch

#33262
20060038291
2006-02-23

Electrode structure of a semiconductor device and method of manufacturing the same

#33263
20060038288
2006-02-23

Substrate with many via contact means disposed therein

#33264
20060038286
2006-02-23

Package, method for producing a package and a device for producing a package

#33265
20060038285
2006-02-23

Electronic apparatus

#33266
20060038270
2006-02-23

Board having alternating rows of processors and memories

#33267
20060038268
2006-02-23

Semiconductor module

#33268
20060038264
2006-02-23

Printed circuit board

#33269
20060038263
2006-02-23

Semiconductor chip arrangement

#33270
20060038257
2006-02-23

Semiconductor device which includes an inductor therein and a manufacturing method thereof

#33271
20060038256
2006-02-23

Arrangements of fuse-type constructions

#33272
20060038255
2006-02-23

MOS electric fuse, its programming method, and semiconductor device using the same

#33273
20060038250
2006-02-23

Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment

#33274
20060038226
2006-02-23

Field effect transistor and application device thereof

#33275
20060038204
2006-02-23

Solid-state imaging device and method for manufacturing the same

#33276
20060038194
2006-02-23

Short-wavelength light-emitting element arranged in a container with a window having a window board formed of a calcium fluoride crystals

#33277
20060038189
2006-02-23

Hermetically sealed packages and their method of manufacture

#33278
20060038183
2006-02-23

Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers

#33279
20060038172
2006-02-23

Apparatus and methods for wafer-level testing of the chip-scale semiconductor device packages

#33280
20060038169
2006-02-23

Polymer memory device with variable period of retention time

#33281
20060038168
2006-02-23

Terahertz interconnect system and applications

#33282
20060038022
2006-02-23

Smartcard and method for production of a smartcard

#33283
20060037739
2006-02-23

Circulation-type liquid cooling apparatus and electronic device containing same

#33284
20060037738
2006-02-23

Heat-dissipating device with heat pipe

#33285
20060037737
2006-02-23

Heat dissipation apparatus and vapor chamber thereof

#33286
20060037735
2006-02-23

Bi-level heat sink

#33287
20060037334
2006-02-23

Method for auto-regulating fan speed

#33288
20060037182
2006-02-23

Method and apparatus for the improvement of material/voltage contrast

#33289
20060035460
2006-02-16

Wiring structure for integrated circuit with reduced intralevel capacitance

#33290
20060035456
2006-02-16

Method and apparatus for deep sub-micron design of integrated circuits

#33291
20060035455
2006-02-16

Interconnect dielectric tuning

#33292
20060035453
2006-02-16

Method of forming a solder ball on a board and the board

#33293
20060035426
2006-02-16

Method and apparatus for polysilicon resistor formation

#33294
20060035158
2006-02-16

Process control method, a method for forming monitor marks, a mask for process control, and a semiconductor device manufacturing method

#33295
20060035085
2006-02-16

High thermal conductivite element, method for manufacturing same, and heat radiating system

#33296
20060035069
2006-02-16

Thermal sheet having higher flexibility and higher heat conductivity

#33297
20060034060
2006-02-16

Compliant thermal cap for an electronic device

#33298
20060034058
2006-02-16

Heat dissipating device and method for manufacturing it

#33299
20060034057
2006-02-16

Clamper for mounting a heatsink

#33300
20060034054
2006-02-16

Power converter cooling