Attaching heat sinks to printed circuit boards using preloaded spring assemblies

Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages

Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages

Heat exchange apparatus with parallel flow

Push-pull dual fan fansink

Dual fan heat sink with flow directors

Dual fan heat sink

Hermetically sealed image sensor module and method of fabricating same

Seal cover structure comprising a nickel-tin (Ni—Sn) alloy barrier layer formed between a nickel (Ni) plating layer and a gold-tin (Au—Sn) brazing layer having Sn content of 20.65 to 25 WT % formed on the seal cover main body

Method for manufacturing a semiconductor device

Technique for forming a dielectric interlayer above a structure including closely spaced lines

Semiconductor device

Semiconductor device having isolated pockets of insulation in conductive seal ring

Electrical contact for high dielectric constant capacitors and method for fabricating the same

Semiconductor device packages including leads with substantially planar exposed portions extending from bottom edges of the packages, and assemblies including the packages

Electronic apparatus with deposited dielectric layers

Alignment devices for securing semiconductor devices to carrier substrates, and assemblies including the alignment devices

Packaged substrate having variable width conductors and a variably spaced reference plane

Scribe street structure for backend interconnect semiconductor wafer integration

Optical sub-assembly for a transceiver

Memory device power distribution in memory assemblies

Semiconductor device and method for manufacturing the same

Semiconductor device having STI with nitride liner and UV light shielding film

Interconnect structure in integrated circuits

Method for simulating electrostatic discharge protective circuit

Reverse-connect protection circuit with a low voltage drop

Use of voids between elements in semiconductor structures for isolation

Forming high-k dielectric layers on smooth substrates

Power delivery using an integrated heat spreader

Light emitting element and method of making same

RGB light emitting diode package with improved color mixing properties

Cosmic ray detectors for integrated circuit chips

System and method for encapsulation and protection of components

Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units

Multilayer printed wiring board and a process of producing same

Micro-castellated interposer

Method for making a circuit plate

Metal matrix composite structure and method

Advanced microelectronic heat dissipation package and method for its manufacture

Heat dissipating device

Flexible loop thermosyphon

Fluid-containing cooling plate for an electronic component

Thermoelectric module

Method and system for dynamic modeling and recipe optimization of semiconductor etch processes

Dielectric ceramic composition and multilayer ceramic part

Dielectric ceramic composition, method for manufacture thereof and multilayer ceramic part

Low-temperature co-fired ceramics material and multilayer wiring board using the same

Method of sealing low-k dielectrics and devices made thereby

Low dielectric constant group II-VI insulator

Semiconductor device having a metal wiring structure

Multilayer interconnection structure and method for forming the same

Contact structure

Diffusion barrier process for routing polysilicon contacts to a metallization layer

Manufacturing method of nanowire array

Interconnect junction providing reduced current crowding and method of manufacturing same

Radiation hardened bipolar junction transistor

Method of manufacture of semiconductor device

Electronic device package

Leadframe alteration to direct compound flow into package

Multi-chip semiconductor connector assembly method

Optical microsystem and method for making same

Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin

Thermal transient suppression material and method of production

Method and apparatus for molding a semiconductor device

Sealing apparatus for an electrical fan

Optical subassembly with a heat-radiating fin and an optical transceiver installing the same

Three-dimensional semiconductor device provided with interchip interconnection selection means for electrically isolating interconnections other than selected interchip interconnections

Backlight for display device, light source for display device, and light emitting diode used therefor

Radiator structure

Heat sink

Heat sink with step fin

Apparatuses and methods for cooling electronic devices in computer systems

Modular heat-dissipation assembly structure for a PCB

Cooling integrated circuits using a cold plate with two phase thin film evaporation

Heat-generating component cooling structure

Elongated features for improved alignment process integration

Power conversion from piezoelectric source

Semiconductor integrated circuit and designing method for same

Frequency-independent voltage divider

Angled elongated features for improved alignment process integration

Tray for semiconductor device and semiconductor device

Copper alloy sputtering target and semiconductor element wiring

Semiconductor wafer device having separated conductive patterns in peripheral area and its manufacture method

Capacitors in semiconductor devices and methods of fabricating the same

Substantially void free interconnect formation

Interconnect alloys and methods and apparatus using same

Frame scale package using contact lines through the elements

High density package with wrap around interconnect

Thermal management arrangement with channels structurally adapted for varying heat flux areas

Integrated circuit packages, systems, and methods

Leadframe alteration to direct compound flow into package

Dual stage modular optical devices with insert digital diagnostics component

Multi-chip semiconductor connector and method

Semiconductor device and method of manufacturing the same

Parallel capacitor of semiconductor device

Fuse element with adjustable resistance

Fuse structure

New fuse structure

Packaging of electronic chips with air-bridge structures

Integrated circuit chip that supports through-chip electromagnetic communication

Device for electrostatic discharge protection comprising triple-diffused drain structure

High voltage device and high voltage device for electrostatic discharge protection circuit

Persistent p-type group II-IV semiconductors

Semiconductor device with strain

LIGHT EMITTING DIODE HAVING AN ADHESIVE LAYER AND MANUFACTURING METHOD THEREOF

Micro or below scale multi-layered heterostructure

Dynamic p-n junction growth

Method of reworking structures incorporating low-k dielectric materials

Scanning electron microscope and CD measurement calibration standard specimen

Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure

Advanced microelectronic heat dissipation package and method for its manufacture

Geometrically reoriented low-profile phase plane heat pipes

Apparatus for reducing evaporator resistance in a heat pipe

Heat pipe cooling system

Cooling device for electric circuit

Heatsink for power devices

Aluminum extruded fin set with noise reduction functionality

Reducing cooling tube bursts in electronic devices

Method for construction of rigid photovoltaic modules

Detent means for a heat sink

Silicone epoxy formulations

CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines

Micro-etching method to replicate alignment marks for semiconductor wafer photolithography

Systems for forming insulative coatings for via holes in semiconductor devices

Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer

Method of making a semiconductor device having improved contacts

Method of making a semiconductor device having improved contacts

Radiation-emitting semiconductor element and method for producing the same

Semiconductor device and a method of manufacture therefor

Semiconductor wafer and manufacturing process for semiconductor device

Semiconductor apparatus with improved ESD withstanding voltage

Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure

Semiconductor element and display device using the same

Light emission device, method of manufacturing same, electro-optical device and electronic device

Method and structure for defect monitoring of semiconductor devices using power bus wiring grids

Composition for forming coating film comprising carbosilane based polymer and coating film obtained from the composition

Electrically anisotropically conductive hotmelt adhesive for implanting electrical modules in a card body

Metallic material for electric or electronic parts

Hybrid fluid-dynamic apparatus

Method of designing semiconductor integrated circuit device and semiconductor integrated circuit device

Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling

Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset

Electronic circuit apparatus and method for stacking electronic circuit units

Mirror image electrical packages and system for using same

Heat sink and chip sandwich system

Thermal dissipation structure and method employing segmented heat sink surface coupling to an electronic component

Wire form heat sink retention module

Power component cooling device with a heat sink and one or more cooling fins

Heat dissipating device with enhanced boiling/condensation structure

Electronic component cooling apparatus

Apparatus, method, and control program for cooling electronic devices

Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins

Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods

Fast mountable screw assembly for CPU heat sink

Method and apparatus for cooling a portable computer

Semiconductor wafer having identification unit and method of identifying the semiconductor wafer using the identification unit

Transmission line and semiconductor integrated circuit device

Computer implemented method for designing a semiconductor device, an automated design system and a semiconductor device

Conductor geometry for electronic circuits fabricated on flexible substrates

Wired circuit forming board, wired circuit board, and thin metal layer forming method

Interlayer connector for preventing delamination of semiconductor device

Semiconductor device

Thermal apparatus for engaging electronic device

Packaging for enhanced thermal and structural performance of electronic chip modules

Multi-frequency noise suppression capacitor set

Flip chip in leaded molded package and method of manufacture thereof

Semiconductor device

Methods of manufacturing metal-silicide features

Semiconductor device capable of threshold voltage adjustment by applying an external voltage

Modulated trigger device

Laterally diffused MOS transistor having source capacitor and gate shield

Metal-poly integrated capacitor structure

FUSE OF A SEMICONDUCTOR MEMORY DEVICE AND REPAIR PROCESS FOR THE SAME

Semiconductor integrated circuit device

Image sensor with optical guard ring and fabrication method thereof

Semiconductor device, manufacturing method and apparatus for the same

Semiconductor structure processing using multiple laser beam spots

Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset

Hidden radiating fin structure

Bubble generator

Fan duct

Systems and methods for nanowire growth and manufacturing

Thermoelectric module

Large scale simultaneous circuit encapsulating apparatus

Optoelectronic apparatus with a shielding cage, and methods for production of an optoelectronic apparatus with a shielding cage.

Test structure for automatic dynamic negative-bias temperature instability testing

Nested design approach

System and method for testing and configuring semiconductor functional circuits

Memory metal springs for heatsink attachments

Advanced low dielectric constant barrier layers

Adhesion of copper and etch stop layer for copper alloy

Contact etching utilizing multi-layer hard mask

Method for manufacturing a semiconductor device

Manufacturing method of semiconductor wafer having lid part and manufacturing method of semiconductor device

Diode junction poly fuse

Process for producing a chip arrangement provided with a molding compound

Chip packaging structure and method of making wafer level packaging

Sequential unique marking

Ultra low k (ULK) SiCOH film and method

Bidirectional emitting and receiving module

LED illumination system

Memory module cooling

Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels

Cascaded gate-driven ESD clamp

RF generator with commutation inductor

Thermal management system and method for thin membrane type antennas

Microfabricated system for magnetic field generation and focusing

RF generator with reduced size and weight

High power MCM package with improved planarity and heat dissipation

Contact etching utilizing partially recessed hard mask

Semiconductor device with a line and method of fabrication thereof

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

Semiconductor device and method for fabricating the same

Contact etching utilizing multi-layer hard mask

Integrated circuit arrangement with intermediate materials and associated components

Semiconductor device with low contact resistance and method for fabricating the same

Chip-component-mounted device and semiconductor device

Arrangement for reducing the electrical crosstalk on a chip

Wafer-level hermetic micro-device packages

High frequency multilayer integrated circuit

Semiconductor apparatus and method of manufacturing same, and method of detecting defects in semiconductor apparatus

Electrostatic discharge mitigation structure and methods thereof using a dissipative capacitor with voltage dependent resistive material

Method and structures for indexing dice

Semiconductor bare chip, method of recording ID information thereon, and method of identifying the same

MOS type semiconductor device having electrostatic discharge protection arrangement

Reduced finger end MOSFET breakdown voltage (BV) for electrostatic discharge (ESD) protection

ESD protection for integrated circuits

Semiconductor device and method of manufacturing same

Metal-insulator-metal (MIM) capacitor and method of fabricating the same

Integrated circuit and method of manufacturing same

Whole chip ESD protection

Integrated test circuit arrangement and test method

Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme

Electronic unit with a substrate where an electronic circuit is fabricated

Fuse and write method for fuse

Shielding for electromagnetic interference

Imaging and electronic apparatus

Heating apparatus and method for semiconductor devices

Method of barrier layer surface treatment to enable direct copper plating on barrier metal

Cooling element

Heat dissipation assembly with air guide device

Boiling cooler

Heatsink assembly and method of manufacturing the same

Manufacturing method for base piece made to adhere to adhesive sheet, manufacturing method for semiconductor wafer and manufacturing method for semiconductor device

Photovoltaic module architecture

Reactor for producing reactive intermediates for low dielectric constant polymer thin films

Heat pipe connection system and method

Method for increasing a production rate of printed wiring boards

Semiconductor device having buffer layer pattern and method of forming same

Resin composition for sealing light emitting device

Curable organopolysiloxane composition

Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby

Mounting element

Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method

Device structure having enhanced surface adhesion and failure mode analysis

Method of manufacturing a semiconductor device and semiconductor device

Semiconductor device and fabricating method thereof

Method for alloy-electroplating group IB metals with refractory metals for interconnections

Method of forming self-aligned contact and method of manufacturing semiconductor memory device by using the same

Low-k dielectric structure and method

Integrated capacitor for RF applications with Ta adhesion layer

Method for forming interconnects on thin wafers

Method of fabricating trench-constrained isolation diffusion for semiconductor devices

Method for dicing substrate

Method of reducing alignment measurement errors between device layers

Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask

Method of making a semiconductor device, and semiconductor device made thereby

Trench-constrained isolation diffusion for integrated circuit die

Process for producing a flat panel radiation detector and a flat panel radiation detector

Method for testing contact open in semicoductor device

Alignment mark, alignment apparatus and method, exposure apparatus, and device manufacturing method

Interleaved power converter

Electronic substrate for a three-dimensional electronic module

Thermally improved placement of power-dissipating components onto a circuit board

Insulating structure having combined insulating and heat spreading capabilities

Integration of planar transformer and/or planar inductor with power switches in power converter

Compliant thermal interface for electronic equipment

Cooling module for electronic devices

Semi-compliant joining mechanism for semiconductor cooling applications

Large-area planar heat dissipation structure

Heat-dissipating structure inside the computer mainframe

Image pickup device with a three-dimensional circuit board and device assembly method

Coding information in integrated circuits

RF generator with voltage regulator

RF generator with phase controlled MOSFETs

Active phase cancellation for inductor/capacitor networks

Semiconductor device

Short detection circuit and short detection method

Semiconductor device including interconnection structure in which lines having different widths are connected with each other

Semiconductor device

Interconnect structure including tungsten nitride and a method of manufacture therefor

Metal interconnects for integrated circuit die comprising non-oxidizing portions extending outside seal ring

PE-ALD of TaN diffusion barrier region on low-k materials

Semiconductor device and method capable of scribing chips with high yield

Semiconductor device with slanting side surface for external connection

Counter flow micro heat exchanger for optimal performance

Apparatus for forming modular sockets using flexible interconnects and resulting structures

System-in-package (SIP) structure and fabrication thereof

Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same

Semiconductor device and fabrication method thereof