Method and structure for forming relatively dense conductive layers

Electrical fuses as programmable data storage

Three dimensional integrated circuits

Lateral super junction field effect transistor

Method for forming a high-k dielectric stack

Semiconductor device

Method for manufacturing an electrooptical device

Complementary analog bipolar transistors with trench-constrained isolation diffusion

Luminescent ceramic for a light emitting device

Light-emitting device using nano size needle

Heat pipe having a wick structure containing phase change materials

Apparatus and method of efficient fluid delivery for cooling a heat producing device

Heat dissipation device assembly with fan cover

Flexible Photovoltaic cells, systems and methods

Photoelectric conversion device

Solar cell module connector and method of producing solar cell module panel

Semiconductor integrated circuit, method for designing semiconductor integrated circuit and system for designing semiconductor integrated circuit

Air scoop cooler

Method of manufacturing semiconductor device and semiconductor device

Wafer-level thick film standing-wave clocking

Reduced electromigration and stressed induced migration of copper wires by surface coating

Structure and method of forming metal buffering layer

High density MIMCAP with a unit repeatable structure

Semiconductor device with flowable insulation layer formed on capacitor and method for fabricating the same

Boron incorporated diffusion barrier material

Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method

Optoelectronic component and method of fabricating same

Low loss glass-ceramic materials, method of making same and electronic packages including same

Glass-ceramic materials and electronic packages including same

Cooling system and projection-type image display apparatus using the same

Heat sink assembly with fixing devices

Heat sink attachment

Heat sink assembly

Method and apparatus for providing distributed fluid flows in a thermal management arrangement

Heat sink

ESD protection module triggered by BJT punch-through

Electrostatic discharge protective circuit and semiconductor integrated circuit using the same

LED package and backlight assembly for LCD comprising the same

Integrated MMIC modules for millimeter and submillimeter wave system applications

Integrated power amplifier module with power sensor

Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method

Substrate for organic EL display devices and organic EL display devices

White light emitting diode light source and method for manufacturing the same

Semiconductor integrated circuit device

Structure of dummy pattern in semiconductor device

Method for pattern metalization of substrates

SEMICONDUCTOR DEVICE FORMED BY IN-SITU MODIFICATION OF DIELECTRIC LAYER AND RELATED METHODS

Semiconductor device having silicon carbide and conductive pathway interface

Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device

Patterned structure for a thermal interface

Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit

High density 3-D integrated circuit package

Method for fabricating a dual damascene contact in an insulating film having density gradually varying in the thickness direction

Integrated stress relief pattern and registration structure

Semiconductor device and method for fabricating the same

Partial replacement silicide gate

Semiconductor memory device

Inspection substrate for display device

Semiconductor device with floating conducting region placed between device elements

Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure

Electroformed microchannel cooler and methods of making same

Heat dissipation module with noise reduction

Cooling apparatus and method for manufacturing the same

Heat sink mounting device

Photovoltaic module architecture

Photovoltaic module architecture

Photovoltaic module architecture

Nickel powders, methods for producing powders and devices fabricated from same

Integrated circuit configuration system and method

Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the same

Method for evaluating semiconductor substrate

Low-carbon-doped silicon oxide film and damascene structure using same

Final passivation scheme for integrated circuits

Method of manufacturing semiconductor device

Motion detector and method of producing the same

Organic light emitting diode, method for the production thereof and uses thereof

Structure and method for extraction of parasitic junction capacitance in deep submicron technology

Method for determining the relative positional accuracy of two structure elements on a wafer

Diamond-like carbon films with low dielectric constant and high mechanical strength

Wired circuit board

Heat dissipation device assembly

Power stack

Plasma display device

Processor heat sink retention module and assembly

Extended fin array

Thermal management system and method for electronic equipment mounted on coldplates

Capacitive integrated circuit structure

On chip heating for electrical trimming of polysilicon and polysilicon-silicon-germanium resistors and electrically programmable fuses for integrated circuits

System and method for linearizing a CMOS differential pair

Method for testing a chip with a package and for mounting the package on a board

Circuit property measurement method

Stacked dies having shared access to memory

Semiconductor interconnect structure utilizing a porous dielectric material as an etch stop layer between adjacent non-porous dielectric materials

Semiconductor device and manufacturing method thereof

Semiconductor device

Selectively configurable circuit board

Arrangement for receiving an electronic component capable of high power operation

Heat dissipation module for an electronic device

Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same

Embedded stressed nitride liners for CMOS performance improvement

Microfabricated miniature grids

Thin-film resistor and method of manufacturing the same

Topographically elevated microelectronic capacitor structure

Semiconductor device with inductors

Spiral inductor with electrically controllable resistivity of silicon substrate layer

Arrangement and process for protecting fuses/anti-fuses

Mixed implantation on polysilicon fuse for CMOS technology

Fuse structure for a semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device and method for fabricating the same

Integrated circuit including a high voltage bipolar device and low voltage devices

Thin layer semi-conductor structure comprising a heat distribution layer

Power composite integrated semiconductor device and manufacturing method thereof

Anti-fuse device

Capacitor and light emitting display using the same

Nitride semiconductor device and method for fabricating the same that minimizes cracking

Dielectric passivation for semiconductor devices

Image sensor with protective package structure for sensing area

Information recording member resin-enclosed tag and its manufacturing method

Heat dissipating device

Thermal transfer devices with fluid-porous thermally conductive core

Heat conductive pipe

Cooling device

Skived-fin annular heat sink

Heat sink with fins fitted and bonded thereto by applying conductive glue

Micro blade assembly

Porous materials

Methods of forming semiconductor constructions

Method of processing resist, semiconductor device, and method of producing the same

Hardening of copper to improve copper CMP performance

Configuring a performance state of an integrated circuit die on wafer

METHOD OF FORMING A METAL-INSULATOR-METAL CAPACITOR

Semiconductor device

Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method

Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment

Radiation-emitting and/or -receiving semiconductor component and method for the patterned application of a contact to a semiconductor body

Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts

Hygroscopic molding

Fastener for heat sink

Electronic apparatus with heat-dissipating structure

Use of thermally conductive vias to extract heat from microelectronic chips and method of manufacturing

Cooling apparatus and method

Air flow direction neutral heat transfer device

Surface-mountable component and method for the production thereof

On-the-fly laser beam path error correction for specimen target location processing

Heat-emitting element cooling apparatus

Semiconductor apparatus

Method and structure for improving adhesion between intermetal dielectric layer and cap layer

Semiconductor device and method for manufacturing the same

Wiring substrate and process for manufacturing the same

Integrated passive devices

Direct cooling of LEDs

Heat sink and method for processing surfaces thereof

Multi-layered complementary wire structure and manufacturing method thereof

Semiconductor chip, semiconductor device and electronic equipment including warpage control film, and manufacturing method of same

Semiconductor package with encapsulated passive component

Semiconductor integrated circuit including metal mesh structure

Integrated circuit including a high voltage LDMOS device and low voltage devices

Semiconductor device having high dielectric constant layers of different thicknesses

Optoelectronic semiconductor chip and method for forming a contact structure for making electrical contact with an optoelectronic semiconductor chip

Integrated heat dissipation apparatus

Leadless lower temperature co-crystal phase transition metal heat conductive device

Heat-exchanging device

Finned heat dissipation module with smooth guiding structure

Heat dissipation device having thermally conductive cover board

Finned heat dissipation module having flow guide

Radiation fin having an airflow guiding front edge

CPU heat dissipating unit

Heat sink and method for making same

RFID label technique

Sputtering target, Al wiring film and electronic component

System and method for configuring semiconductor functional circuits

System and method for increasing die yield

Copper interconnection and the method for fabricating the same

Semiconductor device using low-K material as interlayer insulating film and its manufacture method

Low ohmic layout technique for MOS transistors

Methods for forming backside alignment markers useable in semiconductor lithography

Methods for clearing alignment markers useable in semiconductor lithography

Capacitance process by using passivation film scheme

Apparatus and methods for integrated circuit with devices with body contact and devices with electrostatic discharge protection

Over-passivation process of forming polymer layer over IC chip

Diamond composite heat spreader having thermal conductivity gradients and associated methods

Method of making an electronic package

Manufacturing tool for wafer level package and method of placing dies

Snap-fit optical element for optical coupling between a light source and target element using surface mount technology

Thermal interface for electronic equipment

Heat spreader with filtering function and electrical apparatus

Heat sink assembly with rotatable fins

Notebook computer locking base

Substrate-triggered bipolar junction transistor and ESD protection circuit

Compact lens turret assembly

Space charge dosimeters for extremely low power measurements of radiation in shipping containers

Method for producing a spiral inductance on a substrate, and a device fabricated according to such a method

Semiconductor device power interconnect striping

Flip-chip package substrate with a high-density layout

Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof

Semiconductor device having a dummy conductive via and a method of manufacture therefor

Semiconductor device and manufacturing method of the same

Semiconductor device with pins and method of assembling the semiconductor device

RF seal ring structure

Power delivery system for integrated circuits

Circuit board with high density power semiconductors

Multi-mode integrated circuit structure

Multi-mode integrated circuit structure

Mounting structure, electro-optical device, substrate for electro-optical device, and electronic apparatus

Semiconductor package and system module

Method for producing a conductor path on a substrate, and a component having a conductor path fabricated in accordance with such a method

Semiconductor device

Metal contact fuse element

ESD protection structure with SiGe BJT devices

Integrated circuit devices including a capacitor

Semiconductor arrangement

High density LED array

Heat dissipating device

Heat dissipating device

Manufacturing tool for wafer level package and method of placing dies

Thermal interface material and method for manufacturing same

Method for manufacturing a wiring over a substrate

Filling high aspect ratio openings by enhanced electrochemical deposition (ECD)

Dual damascene interconnect structures having different materials for line and via conductors

Methods of forming solder bumps on exposed metal pads

Semiconductor device and method for manufacturing the same

Method of forming suspended transmission line structures in back end of line processing

Wafer edge ring structures and methods of formation

Method for manufacturing wiring substrate and method for manufacturing electronic device

PC adapter cards and method of manufacturing the same

Pump and electronic apparatus having this pump

Liquid loop with multiple pump assembly

Methods for writing and reading highly resolved domains for high density data storage

Highly compact Eprom and flash EEprom devices

Optical manifold for light-emitting diodes

Captive socket actuator

Expandable bracing apparatus and method

Aligning socket load plates to integral heat spreaders

Pump and electronic device having the pump

Method and apparatus for cooling heat-generating structure

Heat-receiving apparatus and electronic equipment

Apparatus for enhancing heat transfer efficiency of endothermic/exothermic article

Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit

Overlay key, method of manufacturing the same and method of measuring an overlay degree using the same

Integrated circuit having a strengthened passivation structure

Electronic part and surface treatment method of the same

Improved metal wiring pattern for memory devices

METHOD AND STRUCTURE FOR CONNECTING GROUND/POWER NETWORKS TO PREVENT CHARGE DAMAGE IN SILICON ON INSULATOR

Integrated electronic circuit comprising a capacitor and a planar interference inhibiting metallic screen

Method and apparatus for supporting microelectronic substrates

Semiconductor device including a hybrid metallization layer stack for enhanced mechanical strength during and after packaging

Multi-level semiconductor device with capping layer for improved adhesion

Integrated circuit package with improved electro-static discharge protection

Low-k interlevel dielectric layer (ILD)

Method of manufacturing semiconductor integrated circuit device having capacitor element

Misalignment-tolerant multiplexing/demultiplexing architectures

Semiconductor device and its manufacture method

MOSFET with electrostatic discharge protection structure and method of fabrication

Semiconductor device

Very fine-grain voltage island integrated circuit

Method of forming a MOS-controllable power semiconductor device for use in an integrated circuit

Semiconductor device and method of forming a semiconductor device

Thin-film electronic device, in particular power device, and method for making same

White light apparatus with adjustable color temperature and method of producing white light thereof

Switching device for reconfigurable interconnect and method for making the same

Heat spreader with controlled Z-axis conductivity

Multiple-pass heat exchanger with gaps between fins of adjacent tube segments

Pump, cooling system, and electronic apparatus

Heat dissipation device

Radiator plate rapid cooling apparatus

Liquid cooling device

Lightweight heat sink

Twin fin arrayed cooling device

Bonding method of flexible film and display bonded thereby

Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module

Pump, electronic apparatus, and cooling system

Multidirectional wiring on a single metal layer

Method of switching a power supply of voltage domains of a semiconductor circuit, and corresponding semiconductor circuit

WIRING STRUCTURE FOR INTEGRATED CIRCUIT WITH REDUCED INTRALEVEL CAPACITANCE

Method of manufacturing semiconductor device

Integrated circuits including spacers that extend beneath a conductive line

Method for manufacturing an interconnect

Protective metal structure and method to protect low-K dielectric layer during fuse blow process

Architecture to monitor isolation integrity between floating gate and source line

Recording head unit and method of producing the same

Nano-powder-based coating and ink compositions

Method for adhering getter material to a surface for use in electronic devices

Injection casting system for encapsulating semiconductor devices and method of use

Optical semiconductor device

Thin film transistor array panel for a liquid crystal display

System with meshed power and signal buses on cell array

Retainer for heat sink

Heat dissipating device

Fan-shaped heat-dissipating device

High voltage ESD protection circuit with low voltage transistors

Bottom and top emission OLED pixel structure

Method of reducing film stress on overlay mark

Heat dissipation structure and method thereof

Semiconductor device

Substrate contact and method of forming the same

Method of fabricating chips and an associated support

Siloxane epoxy polymers for low-k dielectric applications

Silicon oxycarbide and silicon carbonitride based materials for MOS devices

Fuse regions of a semiconductor memory device and methods of fabricating the same