212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Variable integrated inductor
#33302Low noise, hybrid tuned wideband voltage controlled oscillator
#33303Semiconductor integrated circuit having noise detect circuits detecting noise on power supply nets
#33304Getter material
#33305Mixed-color light emitting diode apparatus, and method for making same
#33306Diffusion barrier process for routing polysilicon contacts to a metallization layer
#33307Semiconductor cooling system and process for manufacturing the same
#33308Shielded structures to protect semiconductor devices
#33309Semiconductor package, printed board mounted with the same, and electronic apparatus having the printed board
#33310Vertically mountable and alignable semiconductor device packages and assemblies including the same
#33311Broken die detect sensor
#33312Integrated circuit chip packaging assembly
#33313Buried conductors
#33314Low-density, high-resistivity titanium nitride layer for use as a contact for low-leakage dielectric layers and method of making
#33315Versatile system for charge dissipation in the formation of semiconductor device structures
#33316I/O and power ESD protection circuits by enhancing substrate-bias in deep-submicron CMOS process
#33317Field effect transistor and application device thereof
#33318Semiconductor device and method of manufacturing the same
#33319Method for fabrication of semiconductor device
#33320Interconnect line selectively isolated from an underlying contact plug
#33321Light-emitting diode and method for its production
#33322Surface position detection apparatus and method, and exposure apparatus and device manufacturing method using the exposure apparatus
#33323Connection structures for microelectronic devices and methods for forming such structures
#33324Burn-in apparatus
#33325Thermal assembly and method for fabricating the same
#33326Heat-radiating device with a guide cap
#33327Heat sink electronic components
#33328Compound heat-dissipating device
#33329Integrated circuit heat pipe heat spreader with through mounting holes
#33330Semiconductor device cooling apparatus
#33331Cooling fin assembly
#33332Micro-chimney and thermosiphon die-level cooling
#33333Solution processed pentacene-acceptor heterojunctions in diodes, photodiodes, and photovoltaic cells and method of making same
#33334Determining maximum cooling for a component by retrieving an offset value
#33335Optimization algorithm to optimize within substrate uniformities
#33336Low voiding no flow fluxing underfill for electronic devices
#33337Micro-bumps to enhance LGA interconnections
#33338Method to avoid threshold voltage shift in thicker dielectric films
#33339Apparatus configurations for affecting movement of fluids within a microelectric topography processing chamber
#33340Apparatus and method for manufacturing semiconductor device incorporating fuse elements
#33341Method of fabricating integrated circuitry
#33342Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
#33343Semiconductor power device having a top-side drain using a sinker trench
#33344Structure and method of liner air gap formation
#33345Laser separation of encapsulated submount
#33346Integrated circuit devices including a dummy gate structure below a passive electronic element
#33347Semiconductor device and method for fabricating the same
#33348Removable flash integrated memory module card and method of manufacture
#33349Methods of fabricating integrated circuitry
#33350Substrate comprising a plurality of integrated circuitry die, and a substrate
#33351Methods for securing packaged semiconductor devices to carrier substrates
#33352Packaging method for manufacturing substrates
#33353Apparatus and method for testing defects
#33354Apparatus and method for testing defects
#33355Methods for forming a barrier layer with periodic concentrations of elements and structures resulting therefrom
#33356Resin composition, method of its composition, and cured formulation
#33357Circuitized substrate with conductive polymer and seed material adhesion layer
#33358Method of producing an electronic unit having a polydimethylsiloxane substrate and circuit lines
#33359Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes
#33360Silver island anti-fuse
#33361Leadframe-based module DC bus design to reduce module inductance
#33362Multiple integrated circuit package module
#33363Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member
#33364Heat-radiating device assembly
#33365Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
#33366Exposure apparatus and exposure method
#33367Method and apparatus for disabling an integrated circuit (IC) when an attempt is made to bypass security on the IC
#33368Integrated circuit having a predefined dielectric strength
#33369Test pads for IC chip
#33370Narrow and wide copper interconnections composed of (111), (200) and (511) surfaces
#33371Copper alloy via bottom liner
#33372Semiconductor integrated circuit device
#33373Semiconductor device, semiconductor substrate and fabrication process of a semiconductor device
#33374High performance metallization cap layer
#33375Semiconductor assemblies having electrophoretically insulated vias
#33376Connecting substrate, connecting structure. connection method and electronic apparatus
#333773-D stackable semiconductor package
#33378Exclusive memory structure applicable for multi media card and secure digital card
#33379Biosensor with smart card configuration
#33380Semiconductor device
#33381Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantation
#33382Semiconductor integrated circuit device
#33383Side structure of a bare LED and backlight module thereof
#33384Semiconductor device including semiconductor thin film, which is subjected to heat treatment to have alignment mark, crystallizing method for the semiconductor thin film, and crystallizing apparatus for the semiconductor thin film
#33385Semiconductor relay device
#33386Identification document with integrated circuit and antenna in a layered document structure
#33387Spray cooling system for transverse thin-film evaporative spray cooling
#33388Spray cooling system for transverse thin-film evaporative spray cooling
#33389Designing scan chains with specific parameter sensitivities to identify process defects
#33390Process controller for semiconductor manufacturing
#33391Compositions containing oxetane compounds for use in semiconductor packaging
#33392Semiconductor encapsulating epoxy resin composition and semiconductor device
#33393Method and systems for providing information to a home system regarding a wireless unit roaming in a visited system
#33394Polishing composition for noble metals
#33395Methods for forming contact hole, for manufacturing circuit board and for manufacturing electro-optical device
#33396Method for filling a contact hole and integrated circuit arrangement with contact hole
#33397Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks
#33398Deep alignment marks on edge chips for subsequent alignment of opaque layers
#33399Method of relieving wafer stress
#33400Method for positioning dicing line of wafer
#33401Metal capacitor stacked with a MOS capacitor to provide increased capacitance density
#33402Metal insulator metal (MIM) capacitor fabrication with sidewall spacers and aluminum cap (ALCAP) top electrode
#33403Method of manufacturing lateral MOSFET structure of an integrated circuit having separated device regions
#33404Semiconductor integrated circuit device and process for manufacturing the same
#33405Temperature sensor for high power very large scale integration circuits
#33406Test structures and methods for monitoring or controlling a semiconductor fabrication process
#33407Vacuum heat insulator
#33408Electronic component cooling apparatus
#33409Cooling apparatus
#33410Expandable heat sink
#33411Multi-functional energy conditioner
#33412Mounting method of flexible printed circuit and manufacturing method of electric optical device
#33413Method to improve inductance with a high-permeability slotted plate core in an integrated circuit
#33414Surface acoustic wave device
#33415Circuit and method for monitoring defects
#33416Test structures and method for interconnect impedance property extraction
#33417Low dielectric constant film material, film and semiconductor device using such material
#33418Power module and electric transportation apparatus incorporating the same
#33419Integrated circuit and methods of redistributing bondpad locations
#33420Method of sealing low-k dielectrics and devices made thereby
#33421Method for driving a semiconductor switching element in a half-bridge and circuit arrangement having a half-bridge
#33422Layer arrangement
#33423Very thick metal interconnection scheme in IC chips
#33424Semiconductor device and method for manufacturing the same
#33425Solder ball opening protrusion for semiconductor assembly
#33426CPU clamp
#33427Porous silicon heat sinks and heat exchangers and related methods
#33428Enhanced PGA interconnection
#33429Airtight package, piezoelectric device, and piezoelectric oscillator
#33430Packaged biomedical electrode unit and method of inspecting quality thereof
#33431High frequency via
#33432Self correcting multiple-link fuse
#33433Evaluation method and manufacturing method of semiconductor device
#33434Interfacial layer for use with high k dielectric materials
#33435Semiconductor device having a lateral MOSFET and combined IC using the same
#33436Semiconductor device which includes a capacitor and an interconnection film coupled to each other and a manufacturing method thereof
#33437Semiconductor memory device having capacitor using dielectric film, and method of fabricating the same
#33438Reduced area imaging device incorporated within wireless endoscopic devices
#33439Integrated circuit chip utilizing oriented carbon nanotube conductive layers
#33440Technique for evaluating local electrical characteristics in semiconductor devices
#33441SCRIBE LINE STRUCTURE
#33442Liquid cooling structure for electronic device
#33443Fan module for a heat dissipating device
#33444Vacuum condenser heat sink
#33445Liquid cooling device
#33446Pin type heat sink for channeling air flow
#33447Integrated cooler for electronic devices
#33448Heat sink and heat spreader bonding structure
#33449Fan module for a heat dissipating device
#33450Adhesive injection apparatus
#33451Cooling apparatus
#33452Film for copper diffusion barrier
#33453Air gap interconnect structure and method thereof
#33454Systems and methods for nanowire growth and harvesting
#33455Image sensor fabrication method and structure
#33456Method of detecting a defect in a semiconductor device
#33457Wiring structure to minimize stress induced void formation
#33458Low thermal budget silicon nitride formation for advance transistor fabrication
#33459Liquid circulation system and liquid cooling system therewith
#33460High brightness LED apparatus with an integrated heat sink
#33461Heat dissipation device
#33462Heat dissipating device
#33463Diode chip for ESD/EOS protection for multiple element device
#33464Manufacturing of optical units for semiconductor packages with optical sensors
#33465Optical element
#33466Dual-sided display
#33467Semiconductor-sealing-purpose epoxy resin compound producing method
#33468Alignment of MTJ stack to conductive lines in the absence of topography
#33469Wiring structure for a pad section in a semiconductor device
#33470Collars, support structures, and forms for protruding conductive structures
#33471Semiconductor devices to reduce stress on a metal interconnect
#33472Semiconductor device
#33473Robust fluorine containing Silica Glass (FSG) Film with less free fluorine
#33474Semiconductor device
#33475Semiconductor device and manufacturing method of the same
#33476Power supply wiring structure
#33477Semiconductor device and method for manufacturing same
#33478Method and apparatus for using capacitively coupled communication within stacks of laminated chips
#33479Flashless lead frame with horizontal singulation
#33480Layout method of decoupling capacitors
#33481Semiconductor device and method of fabricating the same
#33482Semiconductor device and method of manufacturing the same utilizing permittivity of an insulating layer to provide a desired cross conductive layer capacitance property
#33483Construction of LED circuit board
#33484Microstructured infrared sensor and method for its manufacture
#33485Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same
#33486Heat pipe having wick structure
#33487[HIGH-PERFORMANCE TWO-PHASE FLOW EVAPORATOR]
#33488Formula-based run-to-run control
#33489Production method for wiring structure of semiconductor device
#33490Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry
#33491Stacked via-stud with improved reliability in copper metallurgy
#33492Layer assembly and method for producing a layer assembly
#33493Semiconductor device and semiconductor wafer and a method for manufacturing the same
#33494Metal-insulator-metal capacitor and method of fabricating same
#33495Double-gated silicon-on-insulator (SOI) transistors with corner rounding
#33496Method of assembling a semiconductor component and apparatus therefor
#33497Thermal interface material with fluid
#33498Procedure for arranging chips of a first substrate on a second substrate
#33499Low cost high density rectifier matrix memory
#33500Led lighting system with reflective board
#33501Light emitting diode and backlight module having light emitting diode
#33502Heat-dissipating fin assembly for heat sink
#33503Heat sink and retaining clip assembly
#33504Heat dissipation device
#33505Duct for cooling multiple components in a processor-based device
#33506Electrooptical device, mounting structure, and electronic apparatus having wiring formed on and protruding from a base material to directly under an input bump on a semiconductor device
#33507Fuse structure
#33508Output circuit
#33509Hybrid electroluminescent devices
#33510Dual damascene wiring and method
#33511Computer-readable recording medium storing semiconductor designing program for improving both integration and connection of via-contact and metal
#33512Semiconductor device having copper wiring
#33513Plating method
#33514Semiconductor device
#33515Method of manufacturing a data carrier
#33516Method of manufacturing semiconductor device with crack prevention ring
#33517Capacitors integrated with inductive components
#33518Seal ring for mixed circuitry semiconductor devices
#33519Junction interconnection structures
#33520Strained semiconductor device structures
#33521Semiconductor constructions and integrated circuits
#33522Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
#33523Radiation-emitting semiconductor element and method for producing the same
#33524Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device
#33525High density electronic cooling triangular shaped microchannel device
#33526Vibration-flow-type heating-body cooling device
#33527Heat dissipating device
#33528Heat pipe heat sink with holeless fin module
#33529Micro-channel heat sink
#33530WOUND, LOUVERED FIN HEAT SINK DEVICE
#33531Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip
#33532Configurable voltage regulator
#33533Semiconductor device and method of manufacturing the same
#33534Method for fabricating electrical contact buttons
#33535Low-k dielectric film with good mechanical strength that varies in local porosity depending on location on substrate—therein
#33536Novel barrier integration scheme for high-reliability vias
#33537Wafer level through-hole plugging using mechanical forming technique
#33538Semiconductor integrated circuit device and a method of manufacturing the same
#33539Process monitor and system for producing semiconductor
#33540Method and apparatus for the improvement of material/voltage contrast
#33541Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures
#33542Heat sink clip assembly
#33543Heat dissipation apparatus
#33544Integrated liquid cooling device with immersed electronic components
#33545Integrated liquid cooling device for electronic components
#33546Fan holder
#33547Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
#33548Apparatus and method for improving drive-strength and leakage of deep submicron MOS transistors
#33549Process for resurf diffusion for high voltage MOSFET
#33550Vertical structure semiconductor devices with improved light output
#33551Semiconductor device
#33552Semiconductor device and method for manufacturing the same
#33553Extreme low-K interconnect structure and method
#33554Flip-chip without bumps and polymer for board assembly
#33555Semiconductor device and manufacturing method therefor
#33556Audio sound quality enhancement apparatus and method
#33557LIGHT EMITTING DIODE HAVING AN ADHESIVE LAYER FORMED WITH HEAT PATHS
#33558Hydrogen diffusion hybrid port and method of making
#33559Multilayer leadframe module with embedded passive component and method of fabricating the same
#33560Insulative coatings for apertures of semiconductor device components and semiconductor device components including insulative coatings
#33561Interdigitaded capacitors
#33562Electrically programmable polysilicon fuse with multiple level resistance and programming
#33563Method and structure for reducing resistance of a semiconductor device feature
#33564MOS field-effect transistor
#33565Electrical passivation of silicon-containing surfaces using organic layers
#33566Submount substrate for mounting light emitting device and method of fabricating the same
#33567Semiconductor wafer and manufacturing method thereof
#33568III-nitride device passivation and method
#33569Method for producing a package for an electronic circuit and a substrate for a package
#33570Light emitting diode package and light source comprising the same
#33571Strongly textured atomic ridge nanowindows
#33572Infrared radiation detecting device
#33573Copper conductor
#33574Liquid cooling device
#33575Heat dissipating apparatus having micro-structure layer and method of fabricating the same
#33576Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device
#33577Structure of heat conductive plate
#33578Method and apparatus for dissipating heat from an electronic device
#33579Arrangement and method for increasing heat transfer
#33580Cooling module
#33581Method and apparatus for producing large, single-crystals of aluminum nitride
#33582Cooling structure for electronic equipment
#33583Method of forming printed circuit card
#33584Fixing tool for quickly setting up a secure device
#33585System and method for remotely configuring semiconductor functional circuits
#33586Interposer structure and method
#33587Gradient low k material
#33588Semiconductor structures
#33589Method for improving a semiconductor device delamination resistance
#33590Methods and apparatuses for semiconductor fabrication utilizing through-wafer interconnects
#33591Method of separating layers of material
#33592Marker for alignment of non-transparent gate layer, method for manufacturing such a marker, and use of such a marker in a lithographic apparatus
#33593Dual gate stack CMOS structure with different dielectrics
#33594Epitaxial SiObarrier/insulation layer
#33595Order receiving process for manufacturing a semiconductor display device
#33596Die identification systems and methods
#33597Method and apparatus to implement a temperature control mechanism on a memory device
#33598Phosphor based illumination system having a light guide and an interference reflector
#33599Micro heat spreader
#33600Heat sink modules for light and thin electronic equipment