Prevention of tampering in electronic devices

Semiconductor device

System and method for ESD protection

MOS type semiconductor device having electrostatic discharge protection arrangement

SOI single crystalline chip structure

Light-emitting apparatus and illuminating apparatus

Solid-state imaging device and method of manufacturing the same

Reliable semiconductor structure and method for fabricating

Device for photoelectric detection and in particular of x or y radiation

Novel ECP method for preventing the formation of voids and contamination in vias

High surface area heat sink

Device and method for fastener-free connection via a heat-shrinkable insert

Use of models in integrated circuit fabrication

System and method for controlling manufacturing processes, and method for manufacturing a semiconductor device

Semiconductor device having a contact window including a lower with a wider to provide a lower contact resistance

Alignment pattern for a semiconductor device manufacturing process

Capacitance reduction by tunnel formation for use with a semiconductor device

Method for fabricating semiconductor device

Dual damascene structure formed of low-k dielectric materials

Method of laser marking, laser marking apparatus and method and apparatus for detecting a mark

Method of manufacturing semiconductor device

Method of etching a semiconductor device

Methods of fabrication for flip-chip image sensor packages

CMOS image sensor

Structure and method for providing precision passive elements

Alumina insulation for coating implantable components and other microminiature devices

Laminated glass and structural glass with integrated lighting, sensors and electronics

Ceramic composite

Electronic module assembly

Cooling apparatus for heat generating devices

Cooling device for electronic apparatus

Electronic apparatus and method of cooling the electronic apparatus

Thermal dissipating capacitor and electrical component comprising same

Wafer pre-alignment apparatus and method

Member to be recognized for alignment; head unit and electronic device provided therewith; method of manufacturing LCD, organic EL device, electron emission device, PDP device, electrophoretic display device, color filter, and organic EL; method of forming spacer, metallic wire, lens, resist, and light diffusion member, each of said methods using said head unit

Integrated passive devices fabricated utilizing multi-layer, organic laminates

Threshold voltage detector for process effect compensation

Light-emitting device

Portable telephone

Flip-chip image sensor packages

Semiconductor wafer, semiconductor chip and method for manufacturing the same

Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same

Semiconductor component with coreless transformer

Method of forming air gaps in a dielectric material using a sacrificial film

Three-level unitary interconnect structure

Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer

NANO IC packaging

Interconnect alloys and methods and apparatus using same

Semiconductor packaging substrate and method of producing the same

Electronic component

Tape carrier for TAB

Magnetic shield member, magnetic shield structure, and magnetic memory device

Semiconductor device having a measuring pattern and a method of measuring the semiconductor device using the measuring pattern

Semiconductor device having a refractory metal containing film and method for manufacturing the same

Low temperature texturing layer to enhance adhesion of subsequent layers

Optical semiconductor package with compressible adjustment means

Semiconductor device

Static random access memory using thin film transistors

Semiconductor device and method of manufacturing the same

[CIRCUIT CONNECTING STRUCTURE AND FABRICATING METHOD THEREOF]

Methods of drilling through-holes in homogenous and non-homogenous substrates

Methods of making, positioning and orienting nanostructures, nanostructure arrays and nanostructure devices

In-situ dry clean chamber for front end of line fabrication

Water-cooling heat dissipation system

Water-cooler radiator module

Heat dissipation device and manufacturing method thereof

Thermal dissipating capacitor and electrical component comprising same

Test pad for reducing die sawing damage

Heat sink fins processing installation

Method for forming an inductor in a ceramic substrate

Less-secure processors, integrated circuits, wireless communications apparatus, methods and processes of making

Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture

Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the resin, sealant containing the composition, molding material containing the composition, and laminate containing the composition

Low loss interconnect structure for use in microelectronic circuits

Processing system and method for treating a substrate

Low dielectric semiconductor device and process for fabricating the same

Method for fabricating a semiconductor device

Semiconductor device and method of manufacture thereof

Method of separating layers of material

Semiconductor device and method of manufacturing same

Water-absorbing agent for organic EL device and organic EL device

Resin-impregnated flexible graphite articles

Manufacture of porous diamond films

Arrangement for determining a temperature loading of an integrated circuit and method

Integrated thermal sensor for optoelectronic modules

Magnetic memory device

LED with series-connected monolithically integrated mesas

Connecting device for contacting a semiconductor component

Method for improved high current component interconnections

Locking device for heat sink

Universal mountable heat sink with integral spring clip

Means for securing a cooling device

Heat dissipation module

Plug-in cooling device

Centrifugal fan type cooling module

Heat sink fan

Cold plate

Capacitor design in ESD circuits for eliminating current leakage

Tunable ESD trigger and power clamp circuit

Printhead having common actuator for inkjet nozzles

Deep submicron CMOS compatible suspending inductor

Integrated circuit and associated packaged integrated circuit having an integrated marking apparatus

Method and system for non-contact measurement of microwave capacitance of miniature structures of integrated circuits

Method of embedding passive component within via

Stable metal structure with tungsten plug

VIA configurable architecture for customization of analog circuitry in a semiconductor device

Semiconductor processing methods for forming electrical contacts

Electronic component mounting method and apparatus

Circuit device and method of manufacturing the circuit device

Three dimensional six surface conformal die coating

Integrated circuit adapted for ECO and FIB debug

Semiconductor device with a plurality of ground planes

Method of producing electronic circuit and electronic circuit

Polymer dielectrics for memory element array interconnect

Semiconductor integrated circuit device, method of enerating pattern thereof, method of manufacturing the same, and pattern generating apparatus for the same

Circuit and method for enhanced low frequency switching noise suppression in multilayer printed circuit boards using a chip capacitor lattice

Semiconductor integrated circuit having polysilicon fuse, method of forming the same, and method of adjusting circuit parameter thereof

LOW TRIGGER VOLTAGE ESD NMOSFET TRIPLE-WELL CMOS DEVICES

Via recess in underlying conductive line

Metal heater for in situ heating and crystallization of ferroelectric polymer memory film

Light-emitting diode array having an adhesive layer

Semiconductor package security features using thermochromatic inks and three-dimensional identification coding

Circuits associated with fusible elements for establishing and detecting of the states of those elements

Method and apparatus for repairing shape, and method for manufacturing semiconductor device using those

Interlayer member used for producing multilayer wiring board and method of producing the same

Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same

Heat dissipating assembly

Multiple evaporator heat pipe assisted heat sink

End surface structure of a heat pipe for contact with a heat source

Diffusion bonded wire mesh heat sink

Low chlorine content epoxy resin

Thermally conductive coating compositions, methods of production and uses thereof

Integrated radio frequency circuits

MICRO-BUMPS TO ENHANCE LGA INTERCONNECTIONS

Wiring structure of a semiconductor integrated circuit and a method of forming the wiring structure

Method and apparatus of stress relief in semiconductor structures

Interconnect structure for an integrated circuit and method of fabrication

Method of manufacturing a semiconductor device having damascene structures with air gaps

Wafer stacking using interconnect structures of substantially uniform height

Integrated circuit device, method of manufacturing the same and method of forming vanadium oxide film

High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature

Embedded capacitors using conductor filled vias

Back end IC wiring with improved electro-migration resistance

Substrate support for in-situ dry clean chamber for front end of line fabrication

Use of DAR coating to modulate the efficiency of laser fuse blows

Semiconductor device capable of preventing moisture-absorption of fuse area thereof and method for manufacturing the fuse area

Plastic packaging with high heat dissipation and method for the same

Self-coplanarity bumping shape for flip-chip

Method of controlling trimming of a gate electrode structure

Packaging for dilute hypochlorite

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

Method for stabilizing or offsetting voltage in an integrated circuit

System and method for one-time programmed memory through direct-tunneling oxide breakdown

Electrical circuit device

ATCA integrated heatsink and core power distribution mechanism

Retaining device for heat sink

Locking device for heat sink

Circuit cooling

Fan and heat sink arrangement

Clearing of vapor lock in a microchannel cooling subsystem

Heat dissipation module

Adjustable heat sink shroud

Switching device for configurable interconnect and method for preparing the same

Integrated ultracapacitor as energy source

Semiconductor component with integrated capacitance structure having a plurality of metallization planes

System and method for extracting energy from an ultracapacitor

System and method for ESD protection on high voltage I/O circuits triggered by a diode string

Electronic card with protection against aerial discharge

Electrostatic discharge protection device and method using depletion switch

Alignment method, exposure apparatus and device fabrication method

Semiconductor integrated circuit

Semiconductor wafer and semiconductor device manufacturing method using the same

Method to include delta-I noise on chip using lossy transmission line representation for the power mesh

Voltage measuring apparatus

Organic electroluminescence device and manufacturing method thereof

Lighting device

Resin-impregnated flexible graphite articles

Semiconductor device for preventing defective filling of interconnection and cracking of insulating film

Integrated circuit with metal layer having carbon nanotubes and methods of making same

Electronic circuit with embedded memory

Semiconductor device and manufacturing method for the same

Semiconductor device with a barrier film which contains manganese

Self-coplanarity bumping shape for flip chip

Mounting structure of ball grid array

Lid assembly for front end of line fabrication

Non-magnetic, hermetically-sealed micro device package

FILLED CAVITIES SEMICONDUCTOR DEVICES

Multilayer wiring board incorporating carbon fibers and glass fibers

Integrated circuits having a multi-layer structure with a seal ring

Method for manufacturing wiring substrate

Semiconductor device

Fuse and seal ring

Integrated process for fuse opening and passivation process for Cu/Low-K IMD

Low power fuse structure and method of making the same

Use of DAR coating to modulate the efficiency of laser fuse blows

Integrated circuit including a temperature monitor element and thermal conducting layer

Integrated circuit device with temperature monitor members

Integrated CMOS porous sensor

Semiconductor integrated circuit device and production method thereof

Device for detecting an attack against an integrated circuit chip

Method of reading out the sensor elements of a sensor, and a sensor

Cooled photodetector

Vehicle vision based systems having improved light source distinguishing features

Method for reading out a surface detector

Document having an encoded data structure

Method and system for adjusting a chemical oxide removal process using partial pressure

Low-profile thermosyphon-based cooling system for computers and other electronic devices

Integrated circuit heat pipe heat spreader with through mounting holes

Heat dissipating sheet and heat dissipating module made of the heat dissipating sheet

Cooling element for an electronic device

Aluminum bonding member and method for producing same

Tape automated bonding with strip carrier frame assembly

Method and apparatus for routing differential signals across a semiconductor chip

Complete mold system

Method and system for correcting a fault in a semiconductor manufacturing system

Composition for film formation, coating solution containing the same and electronic device having insulating film obtained by using the coating solution

Sheet-form connector and production method and application therefor

Method and system for treating a dielectric film

Combination insulator and organic semiconductor formed from self-assembling block co-polymers

System and methods for etching a silicon wafer using HF and ozone

Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materials

Semiconductor device and method of manufacturing the same

Method of forming MIM capacitor electrodes

Method and structure for buried circuits and devices

Method of fabricating an electrical fuse for silicon-on-insulator devices

Semiconductor package and method for manufacturing the same

Method of fabricating the planar encapsulated surface

Light active sheet and methods for making the same

Semiconductor thin film manufacturing method

Very large scale immobilized polymer synthesis

Circuit board, method of producing same, and power module

Multi-layer ceramic substrate and manufacturing method thereof

Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device

Method and system of recognizing ID marks appended on base materials, and method of manufacturing products by base materials with the ID marks

Semiconductor device and method of forming the same

Light source unit and projector

Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support

Cooler, electronic apparatus, and method for fabricating cooler

Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel

Two-dimensional image detector with disturbance-blocking buffer

Methods and systems for processing a device, methods and systems for modeling same and the device

Embedded toroidal transformers in ceramic substrates

System and method for measuring time dependent dielectric breakdown with a ring oscillator

System and method for measuring negative bias thermal instability with a ring oscillator

Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix

Semiconductor light emitting devices including flexible film having therein an optical element

Adhesion by plasma conditioning of semiconductor chip surfaces

Method for fabricating a seed layer

Semiconductor device having a multilayer interconnection structure and fabrication method thereof

Multi-layer wiring structure with dummy patterns for improving surface flatness

Interconnect structure with dielectric barrier and fabrication method thereof

Device for cooling hot spot in micro system

IC die with directly bonded liquid cooling device

Electronic assembly with integrated IO and power contacts

Incorporation of nitrogen into high k dielectric film

Chip packaging structure and method of making wafer level packaging

Microcap wafer bonding apparatus

Structure for containing desiccant

Conducting polymer composite and solid electrolytic capacitor using the same

Semiconductor device and apparatus for fabricating the same

Wafer, semiconductor chip, and semiconductor device

Integrated circuit

Semiconductor device and method for manufacturing it

Fuse region of a semiconductor region

Diode junction poly fuse

Semiconductor element and manufacturing method thereof

Solid state imaging device

Light collector for an LED array

Semiconductor device and manufacturing method thereof

Device for electrostatic discharge protection and method of manufacturing the same

Conductive lines buried in insulating areas

On-chip integrated detector for analyzing fluids

Horizontal MOS transistor

Light active sheet material

Light-emitting apparatus and illuminating apparatus

Mask, method of manufacturing the same, method of forming thin film pattern, method of manufacturing electro-optical device and electronic equipment

Device for detecting stress migration properties

IC package, inspection method of IC package mounting body, repairing method of IC package mounting body, and inspection pin for IC package mounting body

Device for maintaining an object under vacuum and methods for making same, use in non-cooled infrared sensors

Method of creating solder bar connections on electronic packages

Laser processing

Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device

Heat dissipation module

Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device

Interwoven manifolds for pressure drop reduction in microchannel heat exchangers

Heat sink with fins and a method for manufacturing the same

Remedies to prevent cracking in a liquid system

Heat sink

Separate thermal and electrical throttling limits in processors

System and method for predicting a parameter for a lithography overlay first lot

Method and apparatus for controlling the strategy of compounding pharmaceutical admixtures

Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product

Variable-gain low noise amplifier for digital terrestrial applications

High frequency power amplifier module, and wireless communication system

System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power delivery

Crackstop with release layer for crack control in semiconductors

Method of depositing a tantalum nitride/tantalum diffusion barrier layer system

Interconnects with a dielectric sealant layer

Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures

Dual-damascene interconnects without an etch stop layer by alternating ILDs