Semiconductor device

Method and structure for receiving a micro device

Semiconductor package and method of forming the same

Semiconductor light-emitting device having matrix-arranged light-emitting elements and transparent plates

Ultra-small LED electrode assembly and method for manufacturing same

Semiconductor packages and fabrication method thereof

Semiconductor chip for sensing temperature and semiconductor system including the same

Method for forming interconnect structure that avoids via recess

Semiconductor device having reduced contact resistance

Electronic component and method for producing the same

Low-k dielectric pore sealant and metal-diffusion barrier formed by doping and method for forming the same

Method and structure to contact tight pitch conductive layers with guided vias

Nanoscale interconnect structure

Method of forming through-hole in silicon substrate, method of forming electrical connection element penetrating silicon substrate and semiconductor device manufactured thereby

Packaging device and manufacturing method thereof

Voltage contrast characterization structures and methods for within chip process variation characterization

Vias and methods of formation thereof

Set of stepped surfaces formation for a multilevel interconnect structure

Low ohmic loss radial superlattice conductors

Address-remapped memory chip, memory module and memory system including the same

Connector for a computing assembly

Semiconductor device having network-on-chip structure and routing method thereof

Semiconductor package and semiconductor system including the same

Light emitting diode module with three part color matching

Microelectromechanical device with signal routing through a protective cap

Light-emitting diode apparatus

Vehicular power conversion device

Composite heat sink structures

Printed wiring board, semiconductor device and printed circuit board

Monolithic LED chip in an integrated control module with active circuitry

RF bus controller

Integrated device package and/or system comprising configurable directional optical transmitter

Baluns for RF signal conversion and impedance matching

Process for forming ultra-micro LEDS

Optoelectronic device with light-emitting diodes

Interlayer dielectric layer with two tensile dielectric layers

Method for manufacturing a semiconductor device

Vertical semiconductor device

Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same

Display device and electronic device

Method to match SOI transistors using a local heater element

One-time programmable memory cell capable of reducing leakage current and preventing slow bit response, and method for programming a memory array comprising the same

Integrated thinfilm resistor and MIM capacitor with a low serial resistance

Method of fabricating multi-substrate semiconductor devices

Light emitting device

Arrangement and method for generating mixed light

Semiconductor device and structure

Multi-chip semiconductor device

Methods of forming alignment marks and overlay marks on integrated circuit products employing FinFET devices and the resulting alignment/overlay mark

Die attach pick error detection

Semiconductor devices

Semiconductor device and method for fabricating the same

Field-effect transistor, method of manufacturing the same, and radio-frequency device

Printed circuit board assembly with image sensor mounted thereon

Method of manufacturing heat conductive sheet

Electronic device and method of manufacturing the same

Wafer dicing using femtosecond-based laser and plasma etch

Method of making semiconductor structure having contact plug

Cobalt selectivity improvement in selective cobalt process sequence

High speed electroplating metallic conductors

Component arrangement

Dual output high voltage active probe with output clamping and associated methods

Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Composite heat sink structures

Thermal conduction principle and device for intercrossed structure having different thermal characteristics

Printed circuit board and semiconductor package

Output discharge techniques for load switches

Radio-frequency devices with gate node voltage compensation

Monolithic integration of plenoptic lenses on photosensor substrates

Metal-oxide-semiconductor field-effect transistor with metal-insulator-semiconductor contact structure to reduce schottky barrier

Light emitting device and method of manufacturing the same

Display device having narrower wiring regions

Semiconductor memory devices including asymmetric word line pads

SRAM cells with vertical gate-all-round MOSFETs

Methods, structures, and designs for self-aligning local interconnects used in integrated circuits

Methods, structures, and designs for self-aligning local interconnects used in integrated circuits

LED module with LED chips

Light emitting device

Light emitting diode (LED) components and methods

Semiconductor system

Packages with thermal management features for reduced thermal crosstalk and methods of forming same

Device for detecting a laser attack in an integrated circuit chip

Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus

Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects

Air gap semiconductor structure with selective cap bilayer

Microstructure of metal interconnect layer

Integrated circuits including magnetic core inductors and methods for fabricating the same

Semiconductor device with damascene bit line and method for fabricating the same

Methods for thermally forming a selective cobalt layer

Dual sided circuit for surface mounting

Capacitors with barrier dielectric layers, and methods of formation thereof

Power module

Wiring board and method for manufacturing the same

Double-sided chip on film packaging structure and manufacturing method thereof

Method of making a semiconductor device package with dummy gate

Semiconductor devices having through-electrodes

Phase changing on-chip thermal heat sink

Multi-layer packaging scheme for implant electronics

Silicon package having electrical functionality by embedded passive components

Method for forming semiconductor device with through silicon via

Mechanisms of forming damascene interconnect structures

Method of forming an air gap semiconductor structure with selective cap bilayer

Isolation structure integrated with semiconductor device and manufacturing method thereof

Stack semiconductor device and memory device with driving circuits connected to through-silicon-vias (TSV) in different substrates in a staggered manner

Method of manufacturing cards that include an electronic module and intermediate products

Hybrid photonic and electronic integrated circuits

Heat sink and mounting bracket arrangement

Evaporator with simplified assembly for diphasic loop

Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Resin-impregnated boron nitride sintered body and use for same

Interlayer chip cooling apparatus

Method for orienting solder balls on a BGA device

Bottom-up electrolytic via plating method

Electronic component mounting substrate, motor, air-conditioning apparatus, and method for manufacturing the electronic component mounting substrate

Light-emitting device and manufacturing method therefor

Apparatus for mixed signal interface circuitry and associated methods

Integrated magnetic field sensor-controlled switch devices

Antenna impedance matching and aperture tuning circuitry

Optoelectronic devices made using layers detached from inherently lamellar semiconductor donors

Light emitting device and adaptive driving beam headlamp system

Light emitting diode laminated with a phosphor sheet and manufacturing method thereof

Light emitting, photovoltaic or other electronic apparatus and system

Chip substrate and chip package module

Segmented power transistor

Method for producing image pickup apparatus and method for producing semiconductor apparatus

Integrated circuits with resistor structures formed from MIM capacitor material and methods for fabricating same

Semiconductor device with temperature-detecting diode

Light-emitting device

Light-emitting diode module

Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer

Non-magnetic package and method of manufacture

Method of fabricating a tungsten plug in a semiconductor device

Methods of forming an improved via to contact interface by selective formation of a conductive capping layer

Semiconductor arrangement and formation thereof

Semiconductor device

Method for manufacturing copper layer

Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects

Electrically conductive interconnect including via having increased contact surface area

Dummy patterns

Integrated circuitry

Via structure for optimizing signal porosity

Buried etch stop layer for damascene bit line formation

Memory cell having multi-level word line

Packaged assembly for high density power applications

Interposer for multi-chip electronics packaging

Integrated circuit heat dissipation using nanostructures

Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry

Methods of forming an improved via to contact interface by selective formation of a metal silicide capping layer

Wafer aligner

Singulation apparatus and method

System and method for damage reduction in light-assisted processes

Semiconductor device, display driver integrated circuit including the device, and display device including the device

Contactless damage inspection of perimeter region of semiconductor device

Integrated capacitance sensing module and associated system

High efficiency chip-on-board light-emitting diode

Epoxy resin composition, cured product, heat radiating material, and electronic member

Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Planar heat cup with confined reservoir for electronic power component

Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board

System and method for calibrating chips in a 3D chip stack architecture

Transformer of the balanced-unbalanced type

Mounting layer for cooling structure

Cooling device for cooling a laser arrangement and laser system comprising cooling devices

Interface between a semiconductor die and a waveguide, where the interface is covered by a molding compound

Wafer level photonic devices dies structure and method of making the same

Light-emitting device with near full spectrum light output

Heterojunction semiconductor device having integrated clamping device

Corner layout for high voltage semiconductor devices

Metal-insulator-metal back end of line capacitor structures

Method of manufacturing an image sensor by joining a pixel circuit substrate and a logic circuit substrate and thereafter thinning the pixel circuit substrate

Structure and method for FinFET SRAM

Self-aligned contact metallization for reduced contact resistance

Semiconductor device

Cascode semiconductor device structure and method therefor

Display device

Interconnect arrangement with stress-reducing structure and method of fabricating the same

Strain detection structures for bonded wafers and chips

Semiconductor device and method

Low temperature tungsten film deposition for small critical dimension contacts and interconnects

Oversized contacts and vias in layout defined by linearly constrained topology

Fuse structure and method of blowing the same

Precut metal lines

Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related method

Semiconductor device structure with conductive pillar and conductive line and method for forming the same

Two step metallization formation

Interconnect structure and method of forming the same

Repairing line structure and circuit repairing method using same

Package substrate and flip-chip package circuit including the same

Microprocessor assembly adapted for fluid cooling

Heat sink coupling using flexible heat pipes for multi-surface components

Interlevel conductor pre-fill utilizing selective barrier deposition

Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device

Carrier and a method for processing a carrier

Systems and method for ohmic contacts in silicon carbide devices

Method for manufacturing silicon carbide semiconductor device

Die stack address bus having a programmable width

Axial flow heat exchanger devices and methods for heat transfer using axial flow devices

Bond head cooling apparatus

Light-emitting device

Multi-lens LED-array optic system

Electronic apparatus and electromagnetic radiation suppression method

Cooling device for electronic components using liquid coolant

Cooling device for electronic components using liquid coolant

Surface-mount technology devices and related methods

Large dynamic range cameras

Integrated circuit with electromagnetic energy anomaly detection and processing

RF/microwave high power switching combiner unit

Combined high power rf/microwave amplifier with multiple power amplifier units and automatic failure protection

T-shaped power amplifier cooling plate

Methods of post-process dispensation of plasma induced damage protection component

Methods and devices for controlling thermal conductivity and thermoelectric power of semiconductor nanowires

Encapsulated flexible electronic device, and corresponding manufacturing method

Threshold adjustment for quantum dot array devices with metal source and drain

Semiconductor film with adhesion layer and method for forming the same

Nonvolatile memory device and method for fabricating the same

Semiconductor device

Avalanche diode having an enhanced defect concentration level and method of making the same

Multilevel template assisted wafer bonding

Method for integrating a light emitting device

Methods of forming 3-D circuits with integrated passive devices

Illumination assembly, method of manufacturing the Illumination assembly, and backlight module including the illumination assembly

Method of using aluminum layer as etching stop layer for patterning a platinum layer

Low energy etch process for nitrogen-containing dielectric layer

Low capacitance interconnect structures and associated systems and methods

Semiconductor structures and fabrication method thereof

Power semiconductor module and method for manufacturing the same

Semiconductor structure and manufacturing method of the same

Semiconductor device with metal think film and via

Chip package structure

Semiconductor device

Dielectric cover for a through silicon via

Solution for TSV substrate leakage

Semiconductor device and method for manufacturing the same

Substrate dividing method

Fabrication method of interconnect structure

Multilevel mask circuit fabrication and multilayer circuit

Device and method for reducing contact resistance of a metal

Electrically controllable integrated switch

Electrical feedthrough assembly

Ganged shielding cage with thermal passages

Power supply module, package for the power supply module, method of manufacturing the power supply module and wireless sensor module

Method for installing integrated circuit devices on a substrate

Integrated floating diode structure and method therefor

Silicon carbide device and a method for forming a silicon carbide device

Semiconductor structure having integrated snubber resistance

Optoelectronic device and method for manufacturing same

Integrated imaging device for infrared radiation and method of production

Non-volatile memory

Self aligned active trench contact

Semiconductor device including ESD protection circuit

Method for making an optical proximity sensor by attaching an optical element to a package top plate and forming a package body to define an optical transmit cavity and an optical receive cavity

Techniques for tiling arrays of pixel elements and fabricating hybridized tiles

Transfer-bonding method for the light emitting device and light emitting device array

Display device

Improving the strength of micro-bump joints

Crack stop barrier and method of manufacturing thereof

Methods of forming substrate microvias with anchor structures

Semiconductor device having a gate cutting region and a cross-coupling pattern between gate structures

Self aligned via fuse

Interconnects through dielecric vias

Semiconductor devices including bit line contact plug and peripheral transistor

Semiconductor structure

Pedestal surface for MOSFET module

Thermally conductive sheet, method for producing same, and semiconductor device

Semiconductor device and semiconductor module having cooling fins

Electronic component housing package and electronic device

Substrate storage container with handling members

Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects

Method for forming contact holes in a semiconductor device

Semiconductor structure including a layer of a first metal between a diffusion barrier layer and a second metal and method for the formation thereof

Semiconductor device and method of manufacturing the same

Ag alloy film for reflecting electrode or wiring electrode, reflecting electrode or wiring electrode, and Ag alloy sputtering target

Display device comprising plural panels

Direct-type backlight module and manufacturing method thereof

Method of improving getter efficiency by increasing superficial area

Aluminum EMI/RF shield with fins

Packaging for high-power microwave module

Housing for encasing a mobile computing device

High voltage double-diffused MOS (DMOS) device and method of manufacture

Semiconductor device and method of manufacturing the same

Semiconductor device comprising contact structures with protection layers formed on sidewalls of contact etch stop layers

Semiconductor wafer including a monocrystalline semiconductor layer spaced apart from a poly template layer

Structure of integrated inductor

Solid-state imaging device and camera system

Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same

Semiconductor device with anti-fuse memory element

Heterogeneous annealing method and device

Line layout and method of spacer self-aligned quadruple patterning for the same

Semiconductor device structure and method for forming the same

Memory device and manufacturing method thereof

Methods of forming an interconnect structure using a self-ending anodic oxidation

Dimension-controlled via formation processing

Methods of forming a stack of electrodes and three-dimensional semiconductor devices fabricated thereby

Semiconductor wafer device and manufacturing method thereof

Planar cavity MEMS and related structures, methods of manufacture and design structures

Thermosiphon systems for electronic devices

Planar cavity MEMS and related structures, methods of manufacture and design structures

Electronic package design that facilitates shipping the electronic package

Devices and methods to reduce stress in an electronic device