Method, apparatus, and computer program of searching for clustering faults in semiconductor device manufacturing

Tunable alignment geometry

Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto

Semiconductor devices having contact plugs including polysilicon doped with an impurity having a lesser diffusion coefficient than phosphorus

Method of fabricating a stacked local interconnect structure

Semiconductor device and manufacturing method thereof

Method for improving reliability of copper interconnects

Structure and method for forming a dielectric chamber and electronic device including the dielectric chamber

Method for fabricating semiconductor integrated circuit device

Method for manufacturing semiconductor device

Alignment mark structure

Lower electrode contact structure and method of forming the same

Capacitor integration at top-metal level with a protection layer for the copper surface

Method of doping a conductive layer near a via

Method for evaluating solution for a coating film for semiconductors

Optical targets

Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating

Method of noncontact dispensing of viscous material

Method of conformal coating using noncontact dispensing

Integrated thermal sensor for microwave transistors

Integrated interface electronics for reconfigurable sensor array

LED light source mimicking a filamented lamp

Light source structure

Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate

Heat dissipation device assembly incorporating retention member

Heat sink assembly incorporating spring clip

Integrated heat dissipating device with curved fins

Method and apparatus for cooling heat-generating structure

Electronic device and module structure thereof

Matching circuits on optoelectronic devices

Coil on a semiconductor substrate and method for its production

Three-dimensional inductive micro components

Apparatus and method for reducing propagation delay in a conductor system selectable to carry a single signal or independent signals

Method of processing a substrate

Composite white light source and method for fabricating

Full-color light-emitting diode (LED) formed by overlaying red, green, and blue LED diode dies

Arrangement for improving the reliability of semiconductor modules

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Multiple copper vias for integrated circuit metallization

Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers

Semiconductor device

Semiconductor device and method for fabricating the same

Stress-relief layer for semiconductor applications

Self-patterning of photo-active dielectric materials for interconnect isolation

Electronic device and method of fabricating the same

Semiconductor apparatus and method of fabricating the same

Barrier layer including a titanium nitride liner for a copper metallization layer including a low-k dielectric

Heat spreader, heat sink, heat exchanger and PDP chassis base

Surface mount package for a high power light emitting diode

Semiconductor device for reducing photovolatic current

Insulating layer having decreased dielectric constant and increased hardness

Methods of making thin dielectric layers on substrates

Capacitor integration at top-metal level with a protective cladding for copper surface protection

Structure and programming of laser fuse

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Lateral high-voltage junction device

Semiconductor device using partial SOI substrate and manufacturing method thereof

One mask high density capacitor for integrated circuits

Mounting member of semiconductor device, mounting configuration of semiconductor device, and drive unit of semiconductor device

Methods and apparatus for the detection of damaged regions on dielectric film or other portions of a die

Radiation detection device, method of producing the same, and radiation image pick-up system

Information card with fault tolerant printing of encoded information

Integrated circuit having an active shield

Laser-based method and system for memory link processing with picosecond lasers

Bath and method for high rate copper deposition

Metal foam heat sink

Water tray of liquid based cooling device

Heat-transport device, method for manufacturing the same, and electronic device

Dual-layer heat dissipating structure

Heat sink with carbon nanotubes and method for manufacturing same

Multi-heatsink integrated cooler

Self-encapsulated silver alloys for interconnects

Cooling of surface temperature of a device

Cooling system for an electronic component

Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers

Test circuit, semiconductor product wafer having the test circuit, and method of monitoring manufacturing process using the test circuit

Intra-clip power and test signal generation for use with test structures on wafers

Crosslinkable elastomer composition and molded article produced from same

Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts

Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers

Method for making a semiconductor device having increased conductive material reliability

Advanced barrier liner formation for vias

Fabricating semiconductor chips

Epoxy resin compositions and semiconductor devices

System and apparatus for using test structures inside of a chip during the fabrication of the chip

System and method for developing production nano-material

System and method for measuring overlay errors

Method for manufacturing thin film semiconductor device and method for forming resist pattern thereof

Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction

Coated fullerenes, composites and dielectrics made therefrom

Optoelectronic components with multi-layer feedthrough structure

Stacked multi-component integrated circuit microprocessor

Electrical card having heatsink device

Heat sink with integrated electronics

VARIABLE DENSITY GRAPHITE FOAM HEAT SINK

Power electronic system with passive cooling

Heat dissipation device

Liquid cooling system

Heat dissipating device with fan holder

Complimentary metal oxide semiconductor capacitor and method for making same

Electrostatic discharge protection circuit

Structure of a CMOS image sensor and method for fabricating the same

Semiconductor device

Method and apparatus for improving defective solder joint detection using x-ray inspection of printed assemblies

Multi function package

Semiconductor device

Interconnect structures incorporating low-k dielectric barrier films

Method of forming gas dielectric with support structure

Semiconductor device and method of manufacturing the same

Wiring structure of semiconductor device and method of manufacturing the same

Wiring structure of semiconductor device and production method of the device

Semiconductor device and method of forming the same

Multi-chip press-connected type semiconductor device

Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts

Semiconductor device and method of manufacturing the same

Semiconductor packages and leadframe assemblies

Method of forming metal-insulator-metal (MIM) capacitors at copper process

Semiconductor device and method of manufacturing the same

Electrically programmable polysilicon fuse with multiple level resistance and programming

Structure of a CMOS image sensor and method for fabricating the same

LED array

Adhesion between carbon doped oxide and etch stop layers

Heat dissipation module with a pair of fans

Supporting structure for planar heat pipe

Heat sinks

Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor

Aluminum heat sink for a solid state relay having ultrasonically welded copper foil

Method for manufacturing a power bus on a chip

Back end of line clone test vehicle

Spectroscopy instrument using broadband modulation and statistical estimation techniques to account for component artifacts

Contactless technique for evaluating a fabrication of a wafer

Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compound

Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connection

Method of fabricating copper metallization on backside of gallium arsenide devices

Method of processing a semiconductor substrate

Method and apparatus for thermo-electric cooling

Method of activating a getter structure

Device having a getter structure and a photomask

Technique for evaluating a fabrication of a die and wafer

Method of using foamed insulators in three dimensional multichip structures

Semiconductor substrate for build-up packages

Mask for exposing an alignment mark, and method and computer program for designing the mask

Metal/ceramic bonding substrate and method for producing same

Semiconductor storage device and method of fabricating the same

Packaging structure of a driving circuit for a liquid crystal display device and packaging method of driving circuit for a liquid crystal display device

Mounting device for heat sink

Latch means for socket connector assembly

Heat dissipating module of an integrated circuit of a portable computer

Methods and apparatuses for transferring heat from microelectronic device modules

Central processing unit

ESD protection circuit between different voltage sources

Display device having a plurality of leads connected to a single common line

Three-phase ac generator for vehicle

Image processing alignment method and method of manufacturing semiconductor device

Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same

Semiconductor element with improved adhesion characteristics of the non-metallic surfaces

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Method to form selective cap layers on metal features with narrow spaces

Interconnect structure for integrated circuits

Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor

Semiconductor apparatus, led head, and image forming apparatus

Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same

Rewiring substrate strip with a number of semiconductor component positions

Liquid cooling device

Semiconductor assembly and spring member therefor

Integrated circuit housing

Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces

Flexible and elastic dielectric integrated circuit

Semiconductor device and method for fabricating the same

Semiconductor fuse box and method for fabricating the same

Membrane 3D IC fabrication

Multi-finger transistor

Electrostatic discharge protection structure for deep sub-micron gate oxide

High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture

Low K dielectric integrated circuit interconnect structure

Compact capacitor structure having high unit capacitance

Semiconductor device and manufacturing method of the same

Superjunction device with improved ruggedness

Mask and method for using the mask in lithographic processing

Interconnect, interconnect forming method, thin film transistor, and display device

Sprayable adhesive material for laser marking semiconductor wafers and dies

Device and method for providing shielding in radio frequency integrated circuits to reduce noise coupling

CTE-matched heat pipe

Heat-dissipating structure and method of manufacturing the same

Heat dissipation device

Integrated liquid cooling system for electrical components

Porous media cold plate

Heat dissipating apparatus

Radiator with airflow guiding structure

Chemical-mechanical planarization slurries and powders and methods for using same

Apparatus comprising electronic and/or optoelectronic circuitry and method for realizing said circuitry

Cooling device and electronic apparatus building in the same

Computer cooling apparatus

Embedded capacitor structure in circuit board and method for fabricating the same

Interconnect structures with engineered dielectrics with nanocolumnar porosity

Interconnection substrate and fabrication method thereof

Strip conductor arrangement and method for producing a strip conductor arrangement

Contact structure and manufacturing method thereof

Methods for exposing device features on a semiconductor device

Method of manufacturing an accelerometer

Method for improved alignment of magnetic tunnel junction elements

Method of fabricating multi layer devices on buried oxide layer substrates

Variable rotational assignment of interconnect levels in integrated circuit fabrication

Methods for epoxy loc die attachment

Heat spreader for emissive display device

Aerosol method and apparatus, particulate products, and electronic devices made therefrom

Metal/ceramic bonding substrate and method for producing same

Heat spreader for emissive display device

Easy-to-unseal packaging bag

Backside of chip implementation of redundancy fuses and contact pads

Blindmate heat sink assembly

Method and apparatus for improving power efficiencies of computer systems

Substrate for a semiconductor device

Electrostatic discharge protection circuit and method of operation

Optical assemblies for transmitting and manipulating optical beams

Method of in-situ monitoring of crystallization state

Process independent alignment marks

Tiled electronic display structure

Symmetric planar inductor

Compliant contract structures, contactor cards and test system including same

Photoresist ash process with reduced inter-level dielectric ( ILD) damage

Dual damascene structure and method

Copper wiring with high temperature superconductor (HTS) layer

Active phase cancellation for power delivery

Heat sinks

Semiconductor device heat sink package and method

Ball grid array package with external leads

Circuit package and method of plating the same

Process for making an organic electronic device having a roughened surface heat sink

Method for treating a dielectric film

Method, structure and process flow to reduce line-line capacitance with low-K material

Semiconductor device with polysilicon fuse and method for trimming the same

Wiring protection element for laser deleted tungsten fuse

Embedded MIM capacitor and zigzag inductor scheme

Semiconductor device

Metal-over-metal devices and the method for manufacturing same

Arrangement for reducing current density in transistor in an IC

ESD protection device

Methods of fabricating integrated circuit ferroelectric memory devices including plate lines directly on ferroelectric capacitors

Method of fabricating a metal oxide semiconductor field effect transistor and a metal oxide semiconductor field effect transistor

Integrated circuit arrangement

Methods to improve resolution of cross sectioned features created using an ion beam

Robust high density substrate design for thermal cycling reliability

Cooling system

Transport line with grooved microchannels for two-phase heat dissipation on devices

Liquid cooling jacket

Cooler with blower comprising heat-exchanging elements

Card connector having a heat radiation member without inhibiting insertion and removal of a card

Local multilayered metallization

Methods for selective integration of airgaps and devices made by such methods

Methods for selective integration of airgaps and devices made by such methods

Overlay mark and method of fabricating the same

Electrodeposited layer

Dual fully-silicided gate MOSFETs

Inductors in semiconductor devices and methods of manufacturing the same

Valveless micro air delivery device

High thermal conductivity metal matrix composites

Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink

Imaging apparatus

Magnetically enhanced convection heat sink

Heat dissipating device for electronic component

Structure and method of making a capacitor having low equivalent series resistance

Metal-insulator-metal capacitor structure

Dual sided lithographic substrate imaging

Multi-layered complementary wire structure and manufacturing method thereof

Device and method for identifying a component surrounded by an outer package

EL display device, driving method thereof, and electronic equipment provided with the EL display device

EL display device, driving method thereof, and electronic equipment provided with the EL display device

Semiconductor devices having a capacitor and methods of manufacturing the same

Semiconductor device having dummy wiring layers and a method for manufacturing the same

Semiconductor integrated circuit device and manufacturing method thereof

BGA package and printed circuit board for supporting the package

Plastic packaging with high heat dissipation and method for the same

Package for semiconductor chip

Nitride semiconductor substrate and method of producing same

Spiral inductor and transformer

Integrated semiconductor circuit with an electrically programmable switching element

Electronically programmable antifuse and circuits made therewith

Electrostatic discharge protection networks for triple well semiconductor devices

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and driving circuit for semiconductor device

Wiring substrate and method of manufacturing thereof, and thin film transistor and method of manufacturing thereof

Semiconductor device protection cover, and semiconductor device unit including the cover

Fabrication of nanowires

Connection site coating method and solder joints

Heat sink structure

Heat transport device, semiconductor apparatus using the heat transport device and extra-atmospheric mobile unit using the heat transport device

Heat sink assembly and connecting device

Heat-conductive structure

Heat sink clip mechanism

Heat sink fastening device

Aluminum/ceramic bonding substrate and method for producing same

Thermal interface material

Thermoelectrics utilizing thermal isolation

System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process

System and method for using first-principles simulation to characterize a semiconductor manufacturing process

Thermosetting resin composition, process for producing the same, and suspension-form mixture