Electronic device having adapter and connection method thereof

Process for making air gap containing semiconducting devices and resulting semiconducting device

Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same

Dynamic random access memory circuitry comprising insulative collars

Method of forming copper interconnections for semiconductor integrated circuits on a substrate

Advanced seed layery for metallic interconnects

Method for fabricating semiconductor device

Transposed split of ion cut materials

Method of forming an inductor with continuous metal deposition

Semiconductor device and method of manufacturing the same

Integrated circuit with two phase fuse material and method of using and making same

SRAM device having high aspect ratio cell boundary

Method for manufacturing semiconductor device utilizing monitor wafers

Method of adjusting deviation of critical dimension of patterns

Method and apparatus for measuring the relative position of a first and a second alignment mark

Thermosetting resin composition and photo-semiconductor encapsulant

Enhancement of underfill physical properties by the addition of thermotropic cellulose

Method and apparatus for attaching a processor and corresponding heat sink to a circuit board

Enhanced flow channel for component cooling in computer systems

Interlocking heat sink

Fan stand structure for central processing unit

Optical scanning device, image forming apparatus, and optical scanning method

Overlay metrology method and apparatus using more than one grating per measurement direction

Portable camera with inbuilt printer device

Apparatus and method for electronic fuse with improved ESD tolerance

Power amplifier module for wireless communication devices

Level conversion circuit and semiconductor integrated circuit device employing the level conversion circuit

Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto

Tape circuit substrate with reduced size of base film

Semiconductor constructions

Crossed power strapped layout for full CMOS circuit design

Semiconductor device having via connecting between interconnects

Semiconductor device including multi-layered interconnection and method of manufacturing the device

Optimization of critical dimensions and pitch of patterned features in and above a substrate

Programmable structured arrays

Semiconductor device manufactured by the damascene process having improved stress migration resistance

Semiconductor device and method for manufacturing the same

Semiconductor device and its manufacturing method

Semiconductor device mounting structure having zigzagging part

Structure of semiconductor element and its manufacturing process

Device and system for heat spreader with controlled thermal expansion

Electrical circuit apparatus and methods for assembling same

Capacitor and method for manufacturing the same

Wafer-level electronic modules with integral connector contacts

Semiconductor module

Methods of fabricating integrated circuit conductive contact structures including grooves

Semiconductor package assembly and method for electrically isolating modules

Carbon and halogen doped silicate glass dielectric layer and method for fabricating the same

Microelectronic device having disposable spacer

High density MIM capacitor structure and fabrication process

Memory cell comprising a semiconductor junction diode crystallized adjacent to a silicide

Semiconductor device including junction diode contacting contact-antifuse unit comprising silicide

Method of making an electronic fuse with improved ESD tolerance

Semiconductor device and method of fabricating the same

Modulated trigger device

Superlattice nitride semiconductor LD device

UV curable protective encapsulant

Method of manufacturing an electronic device

Analyte monitoring device and methods of use

Copper alloy sputtering target and method for manufacturing the target

Use of graphite foam materials in pumped liquid, two phase cooling, cold plates

Radiation tube structure

Structurally sealed heat sink

Stacked type cooler

Composite heatsink for cooling of heat-generating element

Cooling and electricity generation apparatus, a portable terminal adopting the same, and a method of operating the portable terminal

Method and apparatus for performing power routing on a voltage island within an integrated circuit chip

Semiconductor test data analysis system

Testing system, a computer implemented testing method and a method for manufacturing electronic devices

Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts

Semiconductor device and method of manufacturing the same

Aluminum alloy film for wiring and sputter target material for forming the film

ALD deposition of ruthenium

Method of fabricating semiconductor integrated circuit device

Building metal pillars in a chip for structure support

Method of filling structures for forming via-first dual damascene interconnects

REMOTE PLASMA DEPOSITION OF THIN FILMS

Method for forming alignment pattern of semiconductor device

Metal-insulator-metal (MIM) capacitor and fabrication method for making the same

Semiconductor device precursor structures to a double-sided capacitor or a contact

Method for preparing gas-tight terminal

Pattern for improved visual inspection of semiconductor devices

Functionally improved battery and method of making same

[FAN MODULE]

Device manufacturing method, orientation determination method and lithographic apparatus

Switch matrix circuit, logical operation circuit, and switch circuit

Reflector device and method of manufacturing same

Hybrid illuminator

Light emitting device

Electronic apparatus

Heat dissipating device assembly

Integrated heat sink assembly

Heat radiation device for memory module

Module structure and module comprising it

Cooling device and an electronic apparatus including the same

Computer component protection

Electronic device

Organic electroluminescent device and driving apparatus

Aerosol method and apparatus, particulate products, and electronic devices made therefrom

Method of fabricating anti-warp package

Titanium underlayer for lines in semiconductor devices

Backend metallization method and device obtained therefrom

Semiconductor device and method of manufacturing the same

Transparent substrate with invisible electrodes and device incorporating the same

Device interconnection

Nano-composite materials for thermal management applications

Semiconductor device and semiconductor device manufacturing method

Inductor for a system-on-a-chip and method for manufacturing the same

Semiconductor device having a fuse and a low heat conductive section for blowout of fuse

Semiconductor device and method for manufacturing the same

Arrangement for protecting a chip and checking its authenticity

Method of fabricating a metal oxynitride thin film that includes a first annealing of a metal oxide film in a nitrogen-containing atmosphere to form a metal oxynitride film and a second annealing of the metal oxynitride film in an oxidizing atmosphere

Super-junction voltage sustaining layer with alternating semiconductor and High-K dielectric regions

Metal-insulator-metal (MIM) capacitor and fabrication method for making the same

Method of producing insulator thin film, insulator thin film, method of manufacturing semiconductor device, and semiconductor device

Field effect transister structures

Circuit board having test coupon and method for evaluating the circuit board

Shielding leadframe for semiconductors for optical coupling and electronic apparatus including same

Laser-based method and system for memory link processing with picosecond lasers

Laser-based method and system for memory link processing with picosecond lasers

Multilayered power supply line for semiconductor integrated circuit and layout method thereof

Fin assembly of heat sink

Structure of heat sink

On-wafer monitoring system

System and method for cooling multiple logic modules

Airflow guide structure and manufacture thereof

Partial inter-locking metal contact structure for semiconductor devices and method of manufacture

Sealing method for electronic devices formed on a common semiconductor substrate and corresponding circuit structure

Multilevel copper interconnect with double passivation

Semiconductor device and manufacturing method thereof

Semiconductor device having an interconnect that increases in impurity concentration as width increases

Back end interconnect with a shaped interface

Method for fabricating semiconductor device

Crystallographic modification of hard mask properties

Vertical integrated circuits

Method for forming inductor of semiconductor device

MIM capacitor structure and method of fabrication

Silicide-silicon oxide-semiconductor antifuse device and method of making

Auto-boating process

Semiconductor device and method of fabricating the same

Encapsulation method for SBGA

Device package and methods for the fabrication and testing thereof

Package substrate for integrated circuit and method of making the substrate

Heat dissipation assembly

Fastening structure of heat sink

Heat dissipation mechanism for electronic apparatus

Heat radiating system and method for a mobile communication terminal

Clip for heat sink

Heat sink mounting apparatus

Locking device for heat dissipating device

Heat dissipating device having improved fastening structure

Thermal solution for electronic devices

Thermal management device for an integrated circuit

Decoupling circuit for co-packaged semiconductor devices

Damping of LC ringing in IC (integrated circuit) power distribution systems

Contactor having conductive particles in a hole as a contact electrode

Stacked integrated circuit device including multiple substrates and method of manufacturing the same

Device package and method for the fabrication and testing thereof

Copper interconnects

Semiconductor device and PLL circuit

Fuse-structure

Method for forming a multi-layer seed layer for improved Cu ECP

Interconnect structure diffusion barrier with high nitrogen content

Diffusion barriers formed by low temperature deposition

High Speed Electrical On-Chip Interconnects and Method of Manufacturing

Vertical wafer stacking using an interposer

Semiconductor integrated circuit wiring design method and semiconductor integrated circuit

Wafer level package having a side package

System and method for improved auto-boating

Scribe line structure of wafer

Integrated circuit chip having a seal ring, a ground ring and a guard ring

Scribe seal providing enhanced substrate noise isolation

Anti-fuse structure employing metal silicide/doped polysilicon laminate

Semiconductor device

Electronic heat pump device, laser component, optical pickup and electronic equipment

CMOS silicon-control-rectifier (SCR) structure for electrostatic discharge (ESD) protection

Semiconductor device with capacitor and fuse and its manufacture method

Semiconductor integrated circuit device including dummy patterns located to reduce dishing

Method and structure for reducing resistance of a semiconductor device feature

Semiconductor sensing device

Electro-optical device, manufacturing method of the same, and electronic apparatus

Overlay mark for measuring and correcting alignment errors

Tape substrate and method for fabricating the same

Connecting a solenoid to a lead frame

Fastening structure of heat sink

Apparatus and method for coupling a thermal dissipation device to an electronic substrate

Zeolite-carbon doped oxide composite low k dielectric

Integrated switchless programmable attenuator and low noise amplifier

Interposer with electrical contact button and method

Semiconductor device and method for fabricating same

Method for fabricating a semiconductor component using contact printing

Air gap interconnect structure and method

MOSFET structure and method of fabricating the same

Methods of forming a double-sided capacitor or a contact using a sacrificial structure

Method for manufacturing a housing for a chip with a micromechanical structure

Test pattern for reliability measurement of copper interconnection line having moisture window and method for manufacturing the same

Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics

Photoimaged dielectric polymer and film, and circuit package containing the same

Mask, exposure method, line width measuring method, and method for manufacturing semiconductor devices

Thick film conductor case compositions for LTCC tape

Alumina insulation for coating implantable components and other microminiature devices

Power unit comprising a heat sink, and assembly method

Universal heat sink retention module frame

Method for reducing the thermal resistance of a heat dissipating base and a heat dissipating base using the same

Panel module for an LCD module having inter-substrate flexible wires

Multiple circuit blocks with interblock control and power conservation

Super-thin OLED and method for manufacturing the same

Thermionic vacuum diode device with adjustable electrodes

Calibration method in a chip mounting device

Semiconductor device having align key and method of fabricating the same

High frequency circuit chip and method of producing the same

Flexible metal stacked body

Mounting structure in integrated circuit module

Duplexer

Electronic module

Vacuum diode-type electronic heat pump device and electronic equipment having the same

Post passivation interconnection schemes on top of the IC chips

Semiconductor wafer with information protection function

COMPACT, HIGH Q INDUCTOR FOR INTEGRATED CIRCUIT

Tri-metal and dual-metal stacked inductors

Diode structure and integral power switching arrangement

Solid-state imaging device and method of manufacturing solid-state imaging device background of the invention

Semiconductor integrated circuit device

Radiation-hardened transistor fabricated by modified CMOS process

Solid-state display with improved color-mixing

Localized annealing of metal-silicon carbide ohmic contacts and devices so formed

Sub-nanoscale electronic devices and processes

Thick film conductor case compositions for LTCC tape

Use of paraffin-containing powders as phase-change materials (pcm) in polymer composites in cooling devices

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

Method of fabricating the routing of electrical signals

Enhanced heat exchanger

Heat dissipating assembly with heat pipes

Integrated liquid cooling system for electrical components

Heat dissipation device

Heat pipe fin stack with extruded base

Cold plate

Heat sink

Process for joining members of a heat transfer assembly and assembly formed thereby

Fabrication of chopper for particle beam instrument

Process for making encapsulant for opto-electronic devices

Methods for forming protective layers on semiconductor device substrates

Copper interconnect structure having stuffed diffusion barrier

Semiconductor device with multi-layered wiring arrangement including reinforcing patterns, and production method for manufacturing such semiconductor device

Method for fabricating a triple damascene fuse

Method for manufacturing semiconductor device

Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode

Composite material, wafer holding member and method for manufacturing the same

Microchip controller board manufacturing method

Power amplifier having high heat dissipation

Process for manufacturing a through insulated interconnection in a body of semiconductor material

Method of forming a through-substrate interconnect

Aerogel/PTFE composite insulating material

Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto

Aerosol method and apparatus, coated particulate products, and electronic devices made therefrom

Fan guide hood structure

Method for measuring three dimensional shape of a fine pattern

Heat source having thermoelectric element, optical pickup assembly employing the same, and method of reducing temperature therein

Method of breaking down a fuse in a semiconductor device

Three-dimensional memory

Light-emitting device

Substrate with stacked vias and fine circuits thereon, and method for fabricating the same

Heat sink integrated retention system

Locking heatsink apparatus

Passive thermal switch

Pumped liquid cooling for computer systems using liquid metal coolant

Semiconductor chip cooling module with fin-fan-fin configuration

Semiconductor device with electrically coupled spiral inductors

Semi-conductor component testing system with a reduced number of test channels

Systems and methods for determining whether a heat sink is installed

Structure and method of forming an enlarged head on a plug to eliminate the enclosure requirement

Generation of metal holes by via mutation

Liner with improved electromigration redundancy for damascene interconnects

Integration film scheme for copper / low-k interconnect

Diamond metal-filled patterns achieving low parasitic coupling capacitance

Semiconductor device and the fabricating method thereof

Semiconductor device and method for fabricating the same

Semiconductor device and method of manufacturing the same

Semiconductor device

Organic electronic device provided with a metallic heat sink structure

Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material

Ceramic multilayer substrate and method for manufacturing the same

Teardrop shaped lead frames

MIS-type semiconductor device

MOSFET formed on a silicon-on-insulator substrate having a SOI layer and method of manufacturing

Semiconductor device including a protection circuit

Bit line contact structure and fabrication method thereof

Semiconductor device having fuses

Semiconductor integrated circuit device in which terminal capacitance is adjustable

Preparation of fullerenol having nanolayer or nanowire structure

Electroluminescent phosphor powders, methods for making phosphor powders, and devices incorporating same

Flat-panel detector utilizing electrically interconnecting tiled photosensor arrays

Method of forming a conductive line

Clamping apparatus

Method and apparatus for maintaining a multi-chip module at a temperature above downhole temperature

Integrated liquid cooling system for electronic components

Heat dissipating device with uniform heat points

Coated nickel-containing powders, methods and apparatus for producing such powders and devices fabricated from same

Method for fabricating a heat-dissipating tube by use of heating process for air expulsion

Apparatus for mounting semiconductor chips