212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Thermal blocker for mobile device skin hot spot management
#8102Circuit board system comprising a spring fastened element
#8103Assembled circuit and electronic component
#8104Circuit device and method of manufacturing the same
#8105Heat dissipating substrate, and element equipped with same
#8106ELECTRONIC DEVICE WITH HEAT SINK
#8107Integrated circuit device and method of enabling thermal regulation within an integrated circuit device
#8108CONTACT LENS HAVING A CHIP INTEGRATED INTO A POLYMER SUBSTRATE AND METHOD OF MANUFACTURE
#8109Transparent electrode for electronic displays
#8110Varying inductance
#8111Transmit/receive switch with series, doubly-floating device and switched bias voltage
#8112Test vehicles for evaluating resistance of thin layers
#8113Light emitting device
#8114RF power amplifier splitter
#8115Multi-chip semiconductor device
#8116Encapsulated damascene interconnect structure for integrated circuits
#8117Integrated circuit formed using spacer-like copper deposition
#8118Method for forming a vertical electrical connection in a layered semiconductor structure
#8119Interconnect structures comprising flexible buffer layers
#8120Method of semiconductor integrated circuit fabrication
#8121Direct multiple substrate die assembly
#8122Semiconductor housing with rear-side structuring
#8123Semiconductor package and semiconductor devices with the same
#8124Substrate member and method of manufacturing chip
#8125Vertical meander inductor for small core voltage regulators
#8126Semiconductor structure with integrated passive structures
#8127Methods of forming 3-D semiconductor devices using a replacement gate technique and a novel 3-D device
#8128System and method for an integrated circuit having transistor segments
#8129Semiconductor device and fabricating method thereof
#8130ESD clamp in integrated circuits
#8131Contact structure of semiconductor device
#8132Ultraviolet light emitting device
#8133Semiconductor device comprising a graphene wire
#8134Threshold adjustment for quantum dot array devices with metal source and drain
#8135Wafer level photonic device die structure and method of making the same
#8136Non-planar semiconductor device having channel region with low band-gap cladding layer
#8137Heat radiation arrangement
#8138Printed wiring board and method for manufacturing printed wiring board
#8139Method for manufacturing printed circuit board
#8140Electronic component package, electronic component, and electronic component package manufacturing method
#8141Heat radiating plate with supporting members and protrusion members
#8142HEAT SINK
#8143Implementing microscale thermoacoustic heat and power control for processors and 3D chipstacks
#8144Method of manufacturing a wiring substrate
#8145Method of selective growth without catalyst on a semiconducting structure
#8146Method for producing a semiconductor body
#8147Multilevel mixed valence oxide (MVO) memory
#8148Method for manufacturing display device
#8149Method for manufacturing semiconductor light emitting device
#8150METHOD AND APPARATUS FOR PRE-EMPTIVE POWER SEMICONDUCTOR MODULE FAULT INDICATION
#8151Light emitting device package and headlight for vehicle having the same
#8152High voltage LED with improved heat dissipation and light extraction
#8153Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly
#8154INLINE METROLOGY FOR ATTAINING FULL WAFER MAP OF UNIFORMITY AND SURFACE CHARGE
#8155Array substrate and manufacturing method thereof and display device
#8156Cascode cell having DC blocking capacitor
#8157Control device and motor unit including the control device
#8158Apparatus and method for high density multi-chip structures
#81593D IC and 3D CIS structure
#8160Bit cell with double patterned metal layer structures
#8161Semiconductor structure and method for making same
#8162Method and system for pre-migration of metal ions in a semiconductor package
#8163Integrated circuit and seal ring
#8164Semiconductor device having a fuse element
#8165Electronic fuse vias in interconnect structures
#8166Scribe lines in wafers
#8167Lateral/vertical semiconductor device
#8168Encapsulation of closely spaced gate electrode structures
#8169Trench metal oxide semiconductor field effect transistor with embedded schottky rectifier using reduced masks process
#8170Semiconductor device and manufacturing method of the same
#8171Distributed heating transistor devices providing reduced self-heating
#8172Gateless switch with capacitively-coupled contacts
#8173Chip edge sealing
#8174Semiconductor device and method for manufacturing the same
#8175Light-emitting device and the manufacturing method thereof
#8176Semiconductor light emitting apparatus
#8177Semiconductor device
#8178Device layout for reference and sensor circuits
#8179In-series electrical connection of light-emitting nanowires
#8180Imagers with stacked integrated circuit dies
#8181DEVICES, SYSTEMS, AND METHODS FOR COOLING ELECTRONIC DEVICE HEAT SPREADERS
#8182Thermoelectric module
#8183Linking multiple independent control systems to distribute response
#8184Resin composition, prepreg and resin sheet and metal foil-clad laminate
#81853-D integration using multi stage vias
#8186Forming nickel—platinum alloy self-aligned silicide contacts
#8187Method for producing a controllable semiconductor component
#8188Manufacturing method of semiconductor device
#8189Etching method using hydrogen peroxide solution containing tungsten
#8190Substrate bonding apparatus, substrate holding apparatus, substrate bonding method, substrate holding method, multilayered semiconductor device, and multilayered substrate
#8191Circuits, systems and methods for integrating sensing and heating functions
#8192Defect classification method, and defect classification system
#8193Systems and methods for controlling airflow into an electronic device
#8194E-fuse array circuit
#8195One-time programmable memory cell
#8196Aspherical LED lens and light emitting device including the same
#8197Integrated circuit retention mechanism with retractable cover
#8198Thermal dissipating module
#8199Cooling circuit with a sufficiently accurately measured heat exchanger
#8200Cooling unit and electronic equipment
#8201Radiator, electronic apparatus and cooling apparatus
#8202Electronic apparatus and cooling module mounted in that electronic apparatus
#8203Capacitors in integrated circuits and methods of fabrication thereof
#8204Semiconductor device
#8205Timing calibration for on-chip interconnect
#8206TFT-LCD array substrate having a connecting device for testing twice and test method for the same
#8207Device for detecting the thinning down of the substrate of an integrated circuit chip
#8208Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures
#8209Platinum-containing constructions
#8210Semiconductor device having barrier metal layer
#8211Guard ring structure and method for forming the same
#8212Semiconductor device
#8213Electrochemically deposited indium composites
#8214Semiconductor structure
#8215Electronic anti-fuse
#8216E-fuse structures and methods of manufacture
#8217Electronic device including thermal sensor and peltier cooler and related methods
#8218Methods and apparatus for sensor module
#8219Integrated electronic device with transceiving antenna and magnetic interconnection
#8220Through silicon via including multi-material fill
#8221Integrated circuit including an environmental sensor
#8222Semiconductor device and method of manufacturing the same
#8223Active area shaping of III-nitride devices utilizing a source-side field plate and a wider drain-side field plate
#8224Active area shaping of III-nitride devices utilizing multiple dielectric materials
#8225Semiconductor device
#8226Methods for discretized processing and process sequence integration of regions of a substrate
#8227Light emitting device and method for manufacturing the same
#8228Light emitting diode
#8229HEAT DISSIPAION DEVICE AND THERMAL MODULE USING SAME
#8230Heat dissipater for main heat generating device with peripheral heat generating devices
#8231Cooling system for high performance solar concentrators
#8232Lead frame package for solar concentrators
#8233Electronic apparatus, method of optimizing de-coupling capacitor and computer-readable recording medium
#8234PRODUCT RELIABILITY ESTIMATION
#8235Enhanced FinFET process overlay mark
#8236Methods of forming patterns, and methods of forming integrated circuitry
#8237Pattern structures in semiconductor devices and methods of forming pattern structures in semiconductor devices
#8238Method of semiconductor integrated circuit fabrication
#8239High performance on-chip vertical coaxial cable, method of manufacture and design structure
#8240Size-filtered multimetal structures
#8241In-line metrology system
#8242Implant-induced damage control in ion implantation
#8243Method for manufacturing electronic devices and electronic devices thereof
#8244Semiconductor device
#8245Stacked DRAM device and method of manufacture
#8246LIGHT EMITTING STRUCTURE AND LIGHTING UNITS THEREOF
#8247Off-plane conductive line interconnects in microelectronic devices
#8248Cooling structure for electronic circuit component and inverter apparatus using the same
#8249Electronic device with heat dissipation assembly
#8250Communication module-cooling structure and communication device
#8251Adjustable heat sink assembly
#8252Power-rail electro-static discharge (ESD) clamp circuit
#8253Via structure and method thereof
#8254Etching time detection means and method for etching device
#8255Liquid crystal display device and method of manufacturing the same
#8256Organic light emitting display
#8257Semiconductor transformer device and method for manufacturing the same
#8258Mechanical layout for half-bridge power module that is optimized for low inductance
#8259Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device
#8260Heterogeneous annealing method and device
#8261Chip stack structure and manufacturing method thereof
#8262Heterogeneous annealing method and device
#8263Semiconductor device and method of manufacturing the same
#8264Semiconductor devices having bit line contact plugs and methods of manufacturing the same
#8265Semiconductor device
#8266Semiconductor device including fluorine-free tungsten barrier layer and method for fabricating the same
#8267Overlay-tolerant via mask and reactive ion etch (RIE) technique
#8268Semiconductor device and manufacturing method thereof
#8269Semiconductor devices including supporting patterns in gap regions between conductive patterns
#8270Semiconductor device and fabricating method thereof
#8271Semiconductor device with low resistance wiring and manufacturing method for the device
#8272Doping of copper wiring structures in back end of line processing
#8273Aluminum interconnection apparatus
#8274Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture
#8275Use of a protection layer to protect a passivation while etching a wafer
#8276Method for depositing one or more polycrystalline silicon layers on substrate
#8277Semiconductor device with conductive pillar unit between shield and silicon substrate
#8278CAPACITOR STRUCTURE AND FABRICATING METHOD THEREOF
#8279Plated lamination structures for integrated magnetic devices
#8280Unbalanced parallel circuit protection fuse device
#8281Metal-via fuse
#8282Schottky isolated NMOS for latch-up prevention
#8283Semiconductor device and manufacturing method thereof
#8284Semiconductor device and method of manufacturing the same
#8285Semiconductor device with a passivation layer
#8286Wafer level LED package and method of fabricating the same
#8287Light-emitting device
#8288Optoelectronic semiconductor chip
#8289Optoelectronic semiconductor chip
#8290LED based lighting system
#8291Method for extreme ultraviolet electrostatic chuck with reduced clamp effect
#8292Field-effect semiconductor device and manufacturing method therefor
#8293Metrology test structures in test dies
#8294Light emitting diode
#8295Imaging device, inspection apparatus, and method of manufacturing electronic device
#8296Radio IC device
#8297Package substrate and electronic device
#8298Heat dissipation device having fastener
#8299HEAT SINK, MANUFACTURING METHOD THEREOF AND TESTING METHOD OF HEAT-DISSIPATING CAPABILITY
#8300Heat transfer apparatus and method
#8301Inorganic multilayer stack and methods and compositions relating thereto
#8302Sealing structure and antenna apparatus
#8303Through silicon via process
#8304Method for fusing a laser fuse and method for processing a wafer
#8305High voltage resistor
#8306Modular printhead for OLED printing
#8307Methods for forming interconnection line using screen printing technique
#8308Metal/ceramic bonding substrate and method for producing same
#8309Ceramic electronic component and manufacturing method thereof
#8310Light emitting device package
#8311Circuit module
#8312High-frequency circuit module
#8313Fastener
#8314Heat pipe structure, and thermal module and electronic device using same
#8315Space imaging overlay inspection method and array substrate
#8316Semiconductor light-emitting device
#8317Multi-segment LED components and LED lighting apparatus including the same
#8318Compound barrier layer, method for forming the same and package structure using the same
#8319Sensor packages and method of packaging dies of differing sizes
#8320Chip on film (COF) substrate, COF package and display device including the same
#8321Method for producing three-dimensional integrated circuit structure
#8322Multi-level vertical plug formation with stop layers of increasing thicknesses
#8323Methods of forming a stack of electrodes and three-dimensional semiconductor devices fabricated thereby
#8324Integrated circuit connector access region
#8325Semiconductor having a high aspect ratio via
#8326Semiconductor devices including metal-silicon-nitride patterns
#8327Methods of forming semiconductor device structures
#8328Scribe line structure for wafer dicing and method of making the same
#8329Semiconductor device
#8330Resistance structure, integrated circuit, and method of fabricating resistance structure
#8331Isolated through silicon vias in RF technologies
#8332Semiconductor structures provided within a cavity and related design structures
#8333Method of producing semiconductor wafer, semiconductor wafer, method of producing semiconductor device and semiconductor device
#8334Stacked and tunable power fuse
#8335Arrays comprising vertically-oriented transistors, integrated circuitry comprising a conductive line buried in silicon-comprising semiconductor material, methods of forming a plurality of conductive lines buried in silicon-comprising semiconductor material, and methods of forming an array comprising vertically-oriented transistors
#8336Electrostatic discharge protection device
#8337Carrier for an optoelectronic structure comprising a structured electronically conductive layer at the top side of main body, and optoelectronic semiconductor chip comprising such a carrier
#8338Substrate, light-emitting device, and lighting apparatus having a largest gap between two lines at light-emitting element mounting position
#8339Semiconductor light-emitting device
#8340Vertical light emitting diodes
#8341Light emitting package having a guiding member guiding an optical member
#8342Method and apparatus for fabricating phosphor-coated LED dies
#8343Compound semiconductor integrated circuit
#8344Semiconductor device having improved heat dissipation
#8345Flexible semiconductor devices and methods of manufacturing the same
#8346Semiconductor light emitting device
#8347Display device
#8348Light emitting device
#8349Self-aligned interconnection for integrated circuits
#8350Inspection device, bonding system and inspection method
#8351Printed wiring board and method for manufacturing the same
#8352Forging method
#8353Method for fabricating a heat sink, and a heat sink
#8354Method for permanently bonding wafers
#8355Growth of multi-layer group III-nitride buffers on large-area silicon substrates and other substrates
#8356Multichip electronic packages and methods of manufacture
#8357LED-based photolithographic illuminator with high collection efficiency
#8358Multi-function synthetic jet and method of manufacturing same
#8359Large dynamic range cameras
#8360Three-dimensional high voltage gate driver integrated circuit
#8361Semiconductor memory device including alignment key structures
#8362Nonvolatile memory device and a method for fabricating the same
#8363Semiconductor constructions, methods of forming conductive structures and methods of forming DRAM cells
#8364Semiconductor device and method for fabricating the same
#8365Method to improve fine Cu line reliability in an integrated circuit device
#8366Encapsulated arrays of electronic switching devices
#8367Semiconductor device with selective planished leadframe
#8368Substrate structure and method for manufacturing same
#8369Semiconductor substrate assembly
#8370Semiconductor device comprising contact trenches
#8371Integrated circuit combination of a target integrated circuit, photovoltaic cells and light sensitive diodes connected to enable a self-sufficient light detector device
#8372Display apparatus and method of manufacturing the same
#8373Light blocking member and display panel including the same
#8374Light emitting diodes including current spreading layer and barrier sublayers
#8375Light emitting device with improved extraction efficiency
#8376Optoelectronic component and method for operating an optoelectronic component
#8377HEAT SINK ASSEMBLY
#8378Through silicon via keep out zone formation method and system
#8379Self-aligned barrier and capping layers for interconnects
#8380Method of fabricating an interconnection structure in a CMOS comprising a step of forming a dummy electrode
#8381Semiconductor integrated circuit device and process for manufacturing the same
#8382Warpage control in a package-on-package structure
#8383Using spectra to determine polishing endpoints
#8384Semiconductor device
#8385Light emitting diode luminaire
#8386Illumination device with an envelope enclosing a light source
#8387Compliable units and compliable network having the same
#8388Device module and method of manufacturing the same
#8389Thermal buffering element
#8390Electronic device cooling with autonomous fluid routing and method of assembly
#8391Heat dissipation in computing device
#8392Optimized flip-flop device with standard and high threshold voltage MOS devices
#8393Semiconductor structure and manufacturing method and operating method of the same
#8394Semiconductor device
#8395Integrated chip with heating element and reference circuit
#8396Conductive line of semiconductor device
#8397Middle-of-the-line constructs using diffusion contact structures
#8398Dummy patterns and method for generating dummy patterns
#8399Dummy patterns and method for generating dummy patterns
#8400Semiconductor device