Stacked Mounting Structure and Method of Manufacturing Stacked Mounting Structure

Electric control unit having a housing part and a cooling part

Semiconductor device and display device

Termination circuit for on-die termination

Semiconductor device and defect analysis method for a semiconductor device

Detecting asymmetrical transistor leakage defects

Electric power conversion apparatus and manufacturing method for the apparatus

Carbon/epoxy resin composition and method of producing a carbon-epoxy dielectric film using the same

Packaging Systems Incorporating Thin Film Liquid Crystal Polymer (LCP) and Methods of Manufacture

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME

Semiconductor device having decreased contact resistance and method for manufacturing the same

Structural feature formation within an integrated circuit

Semiconductor device and method of manufacturing the same

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

High current capacity inner leads for semiconductor device

Method of producing a porous dielectric element and corresponding dielectric element

THRU SILICON ENABLED DIE STACKING SCHEME

Deep trench crackstops under contacts

Pedestal guard ring having continuous M1 metal barrier connected to crack stop

On-chip heater and methods for fabrication thereof and use thereof

Semiconductor device and fabrication method thereof

Die seal ring

Photodetector for imaging system

Semiconductor device

Configuration of gate to drain (GD) clamp and ESD protection circuit for power device breakdown protection

Wavelength-converted semiconductor light emitting device

Multi-chip light emitting diode and method for fabricating the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Thermal interface materials and methods for making thereof

Composition for electromagnetic wave suppression and heat radiation and method for manufacturing composition for electromagnetic wave suppression and heat radiation

Device for controlling temperature of an optical element

Electronic interface apparatus and method and system for manufacturing same

Large substrate structural vias

Electronic circuit device for compressor

HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIELECTRIC SHEET AND PRODUCTION METHODS THEREOF

INSULATION PASTE FOR A METAL CORE SUBSTRATE AND ELECTRONIC DEVICE

Printed circuit board unit and socket

Additives for grain fragmentation in Pb-free Sn-based solder

Hermetic electrical ports in liquid crystal polymer packages

Heat Sink Assembly

HEAT-TRANSPORT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE

Heat Pipe with Nanostructured Wick

LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD

MANUFACTURING METHOD OF IMAGE PICK-UP DEVICE, IMAGE PICK-UP DEVICE AND OPTICAL ELEMENT

Integrated circuit having obscured state change circuitry

Adhesive for electronic component

THERMALLY CONDUCTIVE GREASE

Ceramic substrate, process for producing the same, and dielectric-porcelain composition

Method for manufacturing a semiconductor device with metal-containing cap layers

Method of forming a metallization system of a semiconductor device by using a hard mask for defining the via size

Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow

Semiconductor embedded resistor generation

Semiconductor integrated circuit device and process for manufacturing the same

METHODS OF FABRICATING SEMICONDUCTOR DEVICES WITH METAL-SEMICONDUCTOR COMPOUND SOURCE/DRAIN CONTACT REGIONS

Silicon-based RF system and method of manufacturing the same

Method of manufacturing a micro-electrical-mechanical system with thermally isolated active elements

Structure and method for fabricating cladded conductive lines in magnetic memories

Graphite film and graphite composite film

Thermal interface material

Stacked-die memory systems and methods for training stacked-die memory systems

Electronic device and frequency converter of motor

Image reading apparatus, and its manufacturing method

LIGHT/ELECTRIC POWER CONVERTER AND SOLID STATE IMAGING DEVICE

Digital camera having interconnected image processing units

Display driving semiconductor device

Inductive Electrical Device

Semiconductor device

Light-emitting diode cluster lamp

Substrate with check mark and method of inspecting position accuracy of conductive glue dispensed on the substrate

Micro pin grid array with pin motion isolation

Semiconductor device and method for producing the same

Multi-layer metal wiring of semiconductor device preventing mutual metal diffusion between metal wirings and method for forming the same

Plasma-enhanced atomic layers deposition of conductive material over dielectric layers

Barrier structures and methods for through substrate vias

Semiconductor device and method for manufacturing same

Integrated circuit die containing particale-filled through-silicon metal vias with reduced thermal expansion

WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO

Reinforced structure for a stack of layers in a semiconductor component

Semiconductor device having anti-warping sheet

Wafer level package and method of manufacturing the same

Method of forming openings in a semiconductor device and semiconductor device

Embedded scribe lane crack arrest structure for improved IC package reliability of plastic flip chip devices

Techniques for placement of active and passive devices within a chip

INTEGRATED CIRCUIT INDUCTOR WITH DOPED SUBSTRATE

Semiconductor device including fuse

Semiconductor device

Silicided semiconductor structure and method of forming the same

Semiconductor device with strain

Light emitting diode structure, LED packaging structure using the same and method of forming the same

Semiconductor multilayer structure on an off-cut semiconductor substrate

Semiconductor device

Circuit board and display device

Semiconductor device with driver circuit and memory element

Structures for measuring misalignment of patterns

ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME

Solid-state radiation detector with improved sensitivity

METHOD FOR EDGE SEALING BARRIER FILMS

Structure comprising a getter layer and an adjusting sublayer and fabrication process

Heat sink apparatus with extendable pin fins

Heat sinks and method of formation

HEAT DISSIPATION DEVICE

Cooling fan rack

Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same

Memory devices and methods for managing error regions

Method of processing resist, semiconductor device, and method of producing the same

Method of manufacturing semiconductor device

METHOD OF FORMING CONNECTION TERMINAL

Self aligned silicided contacts

Methods of forming electrical contacts to structures that are at different heights over a substrate relative to one another

Method of forming a MEMS topped integrated circuit with a stress relief layer

Cavity closure process for at least one microelectronic device

METHODS FOR CONTROLLING WAFER AND PACKAGE WARPAGE DURING ASSEMBLY OF VERY THIN DIE

Semiconductor image sensor and method for fabricating the same

METHOD OF FABRICATING A COMPOSITE STRUCTURE WITH A STABLE BONDING LAYER OF OXIDE

Light emitter

METHOD FOR ASSEMBLING MEMORY MODULE WITH HEAT DISSIPATING SHEET AND APPARATUS THEREOF

HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME

Heat dissipation device

Memory cooling device

Radiator For Computer Memory

Electrostatic discharge protection circuit

Image pickup lens, image pickup apparatus, mobile terminal, and manufacturing method of image pickup lens

Light source apparatus and head-up display apparatus incorporating the light source apparatus

Surface inspection method and surface inspection apparatus

System and method for inspecting a wafer

Narrowbody coil isolator

WIDE BAND FILTER STRUCTURE

SEAL BARRIER FOR A MICRO COMPONENT AND METHOD FOR PRODUCING SUCH A BARRIER

Semiconductor integrated circuit device having a dummy metal wiring line

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method for manufacturing a semiconductor component

Through-Silicon Via Sidewall Isolation Structure

Diffusion barrier layers

Semiconductor chips including passivation layer trench structure

System and method for 3D integrated circuit stacking

Heat radiator

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

LEAD FRAME AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Integral metal structure with conductive post portions

Insulated gate semiconductor device

ANTI-FUSE CELL AND ITS MANUFACTURING PROCESS

METHOD TO INCREASE STRAIN ENHANCEMENT WITH SPACERLESS FET AND DUAL LINER PROCESS

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with gate contact position, alignment, and offset specifications

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with gate contact position and offset specifications

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with at least two gate electrodes electrically connected to each other through another transistor forming gate level feature

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with outer positioned gate contacts

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with gate level feature layout channel including single transistor

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with gate contact position specifications

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with serially connected transistors

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with four inside positioned gate contacts having offset and aligned relationships

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with four inside positioned gate contacts and electrical connection of transistor gates through linear interconnect conductors in single interconnect layer

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with shared diffusion regions on opposite sides of two-transistor-forming gate level feature

Integrated circuit including cross-coupled transistors with two transistors of different type formed by same gate level structure and two transistors of different type formed by separate gate level structures

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with four inside positioned gate contacts having offset and aligned relationships and electrical connection of transistor gates through linear interconnect conductors in single interconnect layer

Integrated circuit including cross-coupled trasistors having gate electrodes formed within gate level feature layout channels with four inside positioned gate contacts having offset relationships and electrical connection of cross-coupled transistors through same interconnect layer

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with two inside positioned gate contacts and two outside positioned gate contacts and electrical connection of cross-coupled transistors through same interconnect layer

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with electrical connection of cross-coupled transistors through same interconnect layer

Integrated circuit including cross-coupled transistors having gate electrodes formed within at least twelve gate level feature layout channels

Integrated circuit including cross-coupled transistors having gate electrodes formed within at least nine gate level feature layout channels

Integrated circuit including cross-coupled transistors having two complementary pairs of co-aligned gate electrodes with offset contacting structures positioned between transistors of different type

Semiconductor device

Method of processing resist, semiconductor device, and method of producing the same

Memory cell for modification of revision identifier in an integrated circuit chip

Semiconductor device

Light emitting device, method of manufacturing the same and monolithic light emitting diode array

Thin film transistor array panel for a liquid crystal display

Guard ring extension to prevent reliability failures

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Implementing tamper evident and resistant detection through modulation of capacitance

Photoelectric conversion device and manufacturing method thereof

Method of fabricating a circuit board structure

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device

Thermosetting resin composition

ATTACHING STRUCTURE OF COMPONENT FOR MOUNTING HEATING ELEMENT

HEAT TRANSFER SHEET AND HEAT DISSIPATION STRUCTURE

HEAT DISPERSING MODULE

LOOP HEAT PIPE TYPE HEAT TRANSFER DEVICE

Thermal module

HEAT EXCHANGE UNIT

Three dimensional chip fabrication

Superconducting element joint, a process for providing a superconducting element joint and a superconducting cable system

Method for fabricating a 3-D integrated circuit using a hard mask of silicon-oxynitride on amorphous carbon

Method and apparatus for forming an integrated circuit electrode having a reduced contact area

Process for producing semiconductor device

PROCESS FOR MANUFACTURING ELECTRONIC DEVICE

Inverter-integrated electric compressor

LINEAR LIGHT-EMITTING DEVICE

Circuit board and semiconductor device

Heat sink including extended surfaces

Semiconductor element cooling structure

Method of operating transistors and structures thereof for improved reliability and lifetime

Liquid crystal display device and electronic device including the same

Methods and apparatus for reducing coupling in a MOS device

Semiconductor Component with Annularly-Closed Contacting

PROGRAMMING AND CIRCUIT TOPOLOGIES FOR PROGRAMMABLE VIAS

Heat sink with helical fins and electrostatic augmentation

Heat dissipating module

METHOD FOR REDUCING SUPPLY VOLTAGE DROP IN DIGITAL CIRCUIT BLOCK AND RELATED LAYOUT ARCHITECTURE

Radiation Arrangement

Integrated clock and power distribution

Via definition for semiconductor die

Semiconductor device and manufacturing method thereof

Structure with self aligned resist layer on an interconnect surface and method of making same

Structure with self aligned resist layer on an insulating surface and method of making same

Electrical contacts for CMOS devices and III-V devices formed on a silicon substrate

Method for fabricating semiconductor device and semiconductor device

Methods of manufacturing semiconductor devices

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package

Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device

Method of manufacturing semiconductor device having MIM capacitor

eFuse with partial SiGe layer and design structure therefor

Wafer-level flip chip package with RF passive element/ package signal connection overlay

Method of forming an isolation structure

Solid-state image pickup device and method of manufacturing the same

Direct contact between high-κ/metal gate and wiring process flow

Semiconductor device and manufacturing method of the same

Data storage device having self-powered semiconductor device

Methods for forming programmable transistor array comprising basic transistor units

LED chip package

LASER LIFT-OFF WITH IMPROVED LIGHT EXTRACTION

Radiation-emitting semiconductor chip

Integrated circuits on a wafer and methods for manufacturing integrated circuits

Semiconductor device and method of manufacturing the same

RADIATION DETECTOR

Near-infrared imaging sensor

Data holding circuit

RFID transponder chip module with connecting means for an antenna, textile tag with an RFID transponder chip

PACKAGE FOR ELECTRON ELEMENT AND ELECTRONIC COMPONENT

HEAT RADIATOR OF SEMICONDUCTOR PACKAGE

Stress equalized heat sink unit with tightening device

Flow distributor assembly and a cooling unit with a flow distributor assembly

Porous media cold plate

Heat-Dissipating Fin, Heat-Dissipating Device, And Method For Enhancing Heat Dissipation Effect Of A Heat-Dissipating Fin

FINS-TYPE HEAT SINK AND METHOD FOR ASSEMBLING THE SAME

Ring heat dissipating device formed by punching and riveting through a shaping mold

Method for making arrangement for energy conditioning

Generating cutting forms along current flow direction in a circuit layout

Analyte Monitoring Device and Methods of Use

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

Socket assembly incorporated with rotationally mounted pressing member

High-yield method of exposing and contacting through-silicon vias

Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device

Method of fabricating semiconductor device

SEMICONDUCTOR DEVICE AND FUSE BLOWOUT METHOD

Method of fabricating an epitaxially grown layer on a composite structure

Minimum cost method for forming high density passive capacitors for replacement of discrete board capacitors using a minimum cost 3D wafer-to-wafer modular integration scheme

Methods and applications of non-planar imaging arrays

Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package

Structure comprising a getter layer and an adjusting sublayer and fabrication process

LASER DEVICE AND HEAT SINK WITH CORE TO MANAGE STRESS DUE TO THERMAL EXPANSION

Silicide-silicon oxide-semiconductor antifuse device and method of making

Memory circuits and routing of conductive layers thereof

LED illuminating device and lamp unit thereof

Electronic device comprising a visible electronic element connected to an internal module and manufacturing process of such a device

Fixing apparatus for heat sink

HEAT SINK

Heat sink protective cover

Heat exchanger device and method for heat removal or transfer

Adjustable retention load plate of electrical connector assembly

Interdigital capacitor with Self-Canceling Inductance

Method and system for object reconstruction

Fuse of semiconductor device

Semiconductor device and test method

Measuring apparatus and method for measuring a surface capacitance of an insulating film

System for analyzing sensitivity of parasitic capacitance to variation of semiconductor design parameters

Display device with multiple OLEDS

Light output device

Galvanic isolator

Structure and method for back end of the line integration

Semiconductor device with a line and method of fabrication thereof

Thermoelectric 3D cooling

Material for forming exposure light-blocking film, multilayer interconnection structure and manufacturing method thereof, and semiconductor device

FUSE ELEMENT AND SEMICONDUCTOR INTEGRATED CIRCUIT WITH THE SAME

Semiconductor device and method for manufacturing the same

PROBE, PROBE CARD, AND METHOD OF PRODUCTION OF PROBE

Compositions and methods for the selective removal of silicon nitride

Gateless switch with capacitively-coupled contacts

MILLICHANNEL HEAT SINK, AND STACK AND APPARATUS USING THE SAME

Multi-component cooling element

Cooling manifold assembly

Modular absorption heat sink devices for passive cooling of servers and other electronics

Integrated circuit structure incorporating an inductor, an associated design method and an associated design system

Hand held breast pump

Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same

THIN FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE THIN FILM

Examination method, examination apparatus and examination program

LED illuminating device and light engine thereof

LED illumination device and lamp unit thereof

SURFACE MOUNTING COMPONENT

Heatsink assembly

Heatsink assembly

Heat dissipation device and power module

Heat dissipation device

Solderless heatsink anchor

Metal clad fiber optics for enhanced heat dissipation

Cooling device for cooling a heat-generating component, and electronic apparatus having the cooling device

Heat dissipation device

Heat dissipation module and electronic device having the same