ClassID:

212006 ⎘

H01L2924/0002 - page 62 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#18301
20100237464
2010-09-23

Chip inductor with frequency dependent inductance

#18302
20100237460
2010-09-23

Methods and systems involving electrically programmable fuses

#18303
20100237438
2010-09-23

Semiconductor device having a protection pattern with two element separation regions

#18304
20100237430
2010-09-23

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with shared diffusion regions on opposite sides of two-transistor-forming gate level feature and electrical connection of transistor gates through linear interconnect conductors in single interconnect layer

#18305
20100237429
2010-09-23

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with at least two gate electrodes electrically connected to each other through gate level feature

#18306
20100237428
2010-09-23

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with at least two different gate level features inner extensions beyond gate electrode

#18307
20100237427
2010-09-23

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with at least two different gate level feature extensions beyond contact

#18308
20100237426
2010-09-23

Semiconductor device including cross-coupled transistors formed from linear-shaped gate level features

#18309
20100237415
2010-09-23

Semiconductor power device having a top-side drain using a sinker trench

#18310
20100237393
2010-09-23

Solid-state image pick-up device and imaging system using the same

#18311
20100237379
2010-09-23

LIGHT EMITTING DEVICE

#18312
20100237373
2010-09-23

Lighting device

#18313
20100237368
2010-09-23

Semiconductor light emitting device and method for manufacturing same

#18314
20100237360
2010-09-23

LIGHT EMITTING DIODE AND BACK LIGHT MODULE THEREOF

#18315
20100237358
2010-09-23

LIGHT-EMITTING DEVICE AND LIGHT-EMITTING MODULE

#18316
20100237247
2010-09-23

IR sensing device

#18317
20100237037
2010-09-23

Ceramic substrate metalization process

#18318
20100236765
2010-09-23

FAN ASSEMBLY AND HEAT DISSIPATION DEVICE HAVING THE SAME

#18319
20100236764
2010-09-23

HEAT DISSIPATION DEVICE

#18320
20100236761
2010-09-23

Liquid cooled heat sink for multiple separated heat generating devices

#18321
20100236756
2010-09-23

THERMAL MODULE

#18322
20100236755
2010-09-23

Heat dissipation device

#18323
20100236754
2010-09-23

Airflow guider for use in heat sink

#18324
20100234975
2010-09-16

Advanced process control for gate profile control

#18325
20100234709
2010-09-16

Analyte monitoring device and methods of use

#18326
20100233876
2010-09-16

FILM FORMING APPARATUS, FILM FORMING METHOD, COMPUTER PROGRAM AND STORAGE MEDIUM

#18327
20100233863
2010-09-16

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#18328
20100233850
2010-09-16

Method for bonding wafers to produce stacked integrated circuits

#18329
20100233843
2010-09-16

Formation of stretchable photovoltaic devices and carriers

#18330
20100233362
2010-09-16

Method of Resisting Dust and Dirt with Nanotechnology

#18331
20100233011
2010-09-16

METHOD FOR FORMING A COPPER WIRING PATTERN, AND COPPER OXIDE PARTICLE DISPERSED SLURRY USED THEREIN

#18332
20100232800
2010-09-16

Parallel optical transceiver module having a heat dissipation system that dissipates heat and protects components of the module from particulates and handling

#18333
20100232480
2010-09-16

Capacitance Compensation System

#18334
20100232203
2010-09-16

Electrical anti-fuse and related applications

#18335
20100232120
2010-09-16

Electrical component

#18336
20100232119
2010-09-16

Method for producing an electronic module

#18337
20100232113
2010-09-16

Heat dissipation device with fastener

#18338
20100232112
2010-09-16

Semiconductor module

#18339
20100232110
2010-09-16

Cooling apparatus and power converter

#18340
20100232109
2010-09-16

Heat dissipation device

#18341
20100232108
2010-09-16

Heat dissipation structure

#18342
20100232106
2010-09-16

Arrangement for a motor controller

#18343
20100232085
2010-09-16

ELECTRONIC DEVICES WITH FLOATING METAL RINGS

#18344
20100232084
2010-09-16

Electric element and electric circuit

#18345
20100232077
2010-09-16

Gated diode having at least one lightly-doped drain (LDD) implant blocked and circuits and methods employing same

#18346
20100231928
2010-09-16

Alignment apparatus, substrates stacking apparatus, stacked substrates manufacturing apparatus, exposure apparatus and alignment method

#18347
20100231638
2010-09-16

Method for the printing of homogeneous electronic material with a multi-ejector print head

#18348
20100231637
2010-09-16

Method for the printing of homogeneous electronic material with a multi-ejector print head

#18349
20100231636
2010-09-16

Method for the printing of homogeneous electronic material with a multi-ejector print head

#18350
20100230841
2010-09-16

AEROSOL METHOD AND APPARATUS, PARTICULATE PRODUCTS, AND ELECTRONIC DEVICES MADE THEREFROM

#18351
20100230824
2010-09-16

Metal interconnect of semiconductor device

#18352
20100230820
2010-09-16

Method for fabricating semiconductor device and semiconductor device

#18353
20100230818
2010-09-16

Through substrate via semiconductor components

#18354
20100230817
2010-09-16

Using unstable nitrides to form semiconductor structures

#18355
20100230816
2010-09-16

Semiconductor device and method for forming the same

#18356
20100230815
2010-09-16

SEMICONDUCTOR DEVICE

#18357
20100230814
2010-09-16

Nanoscale, spatially-controlled Ga doping of undoped transparent conducting oxide films

#18358
20100230794
2010-09-16

Method for fabricating semiconductor components using maskless back side alignment to conductive vias

#18359
20100230788
2010-09-16

Process of fabricating chip

#18360
20100230781
2010-09-16

Trench anti-fuse structures for a programmable integrated circuit

#18361
20100230780
2010-09-16

Semiconductor device having a fuse element

#18362
20100230773
2010-09-16

Solid-state image pickup device and a method of manufacturing the same

#18363
20100230772
2010-09-16

Array of alpha particle sensors

#18364
20100230750
2010-09-16

Power semiconductor device

#18365
20100230737
2010-09-16

Semiconductor device and method for manufacturing the same

#18366
20100230731
2010-09-16

Circuitry and method

#18367
20100230730
2010-09-16

SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS

#18368
20100230727
2010-09-16

Electric circuit with vertical contacts

#18369
20100230725
2010-09-16

Semiconductor integrated circuit

#18370
20100230719
2010-09-16

ESD protection element

#18371
20100230697
2010-09-16

Opto-electronic semiconductor module and method for the production thereof

#18372
20100230689
2010-09-16

Metal core multi-LED SMD package and method of producing the same

#18373
20100230673
2010-09-16

Semiconductor Fuse Structure and a Method of Manufacturing a Semiconductor Fuse Structure

#18374
20100230654
2010-09-16

Resistive memory cell fabrication methods and devices

#18375
20100230595
2010-09-16

Infrared sensor

#18376
20100230581
2010-09-16

LIGHT SENSOR

#18377
20100230496
2010-09-16

ELECTRONIC CARD AND METHOD FOR FABRICATING THEREOF

#18378
20100230381
2010-09-16

Method of manufacturing LC circuit and LC circuit

#18379
20100230150
2010-09-16

MOTHERBOARD

#18380
20100230132
2010-09-16

Non-metallic, integrated sensor-interconnect device, manufacturing process, and related applications

#18381
20100230087
2010-09-16

Cooling using micro-plasma excited on transmission lines structure

#18382
20100230079
2010-09-16

Cooling manifold

#18383
20100230077
2010-09-16

Fastener and heat dissipation device using the same

#18384
20100230074
2010-09-16

HEAT DISSIPATION APPARATUS

#18385
20100229923
2010-09-16

Stretchable photovoltaic devices and carriers

#18386
20100229135
2010-09-09

Method and apparatus for inserting metal fill in an integrated circuit (β€œIC”) layout

#18387
20100227473
2010-09-09

Methods of forming metal patterns in openings in semiconductor devices

#18388
20100227461
2010-09-09

METHOD FOR THE FABRICATION OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

#18389
20100227451
2010-09-09

Method for manufacturing semiconductor device

#18390
20100227383
2010-09-09

Genetic detection and determination apparatus and method, gene reactor, and incubator

#18391
20100227114
2010-09-09

Composite material, especially multilayer material, and adhesive or bonding material

#18392
20100227046
2010-09-09

FILM DEPOSITION APPARATUS, FILM DEPOSITION METHOD, AND COMPUTER READABLE STORAGE MEDIUM

#18393
20100226404
2010-09-09

SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING IN-PLANE LIGHT EMITTING LAYERS

#18394
20100226195
2010-09-09

Integrated circuit self aligned 3D memory array and manufacturing method

#18395
20100226107
2010-09-09

Method and semifinished product for producing an inlay

#18396
20100226097
2010-09-09

Double bonded heat dissipation

#18397
20100226096
2010-09-09

Clamping part for pressing power components against a cooling surface

#18398
20100225906
2010-09-09

Surface inspection apparatus and surface inspection method

#18399
20100225905
2010-09-09

INSPECTION METHOD AND INSPECTION APPARATUS FOR SEMICONDUCTOR SUBSTRATE

#18400
20100225799
2010-09-09

IMAGE PICKUP UNIT, METHOD OF MANUFACTURING IMAGE PICKUP UNIT AND ELECTRONIC APPARATUS PROVIDED WITH IMAGE PICKUP UNIT

#18401
20100225626
2010-09-09

Liquid crystal display

#18402
20100225557
2010-09-09

Method and system for an on-chip and/or an on-package transmit/receive switch and antenna

#18403
20100225435
2010-09-09

Magnetic film enhanced inductor

#18404
20100225425
2010-09-09

HIGH PERFORMANCE COUPLED COPLANAR WAVEGUIDES WITH SLOW-WAVE FEATURES

#18405
20100225422
2010-09-09

Method and system for a configurable finite impulse response filter using a transmission line as a delay line

#18406
20100225404
2010-09-09

Electronic pulse generator and oscillator

#18407
20100225381
2010-09-09

Fuse for use in high-integrated semiconductor device

#18408
20100225364
2010-09-09

Stacked semiconductor devices and signal distribution methods thereof

#18409
20100225231
2010-09-09

Hermetic seal

#18410
20100225219
2010-09-09

LED lamp system utilizing a hollow liquid-cooled device

#18411
20100225217
2010-09-09

LED illuminating device and light engine thereof

#18412
20100225011
2010-09-09

System and Method for Integrated Circuit Fabrication

#18413
20100225010
2010-09-09

Composition for thermosetting silicone resin

#18414
20100225002
2010-09-09

Three-dimensional system-in-package architecture

#18415
20100224998
2010-09-09

Integrated Circuit with Ribtan Interconnects

#18416
20100224996
2010-09-09

METHODS OF MANUFACTURING COPPER INTERCONNECT SYSTEMS

#18417
20100224995
2010-09-09

Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method

#18418
20100224977
2010-09-09

Semiconductor device and method for fabricating the same

#18419
20100224973
2010-09-09

Semiconductor memory device and method of fabricating the same

#18420
20100224962
2010-09-09

Integrated circuit resistive devices including multiple interconnected resistance layers

#18421
20100224961
2010-09-09

Passivation of integrated circuits containing ferroelectric capacitors and hydrogen barriers

#18422
20100224960
2010-09-09

EMBEDDED CAPACITOR DEVICE AND METHODS OF FABRICATION

#18423
20100224956
2010-09-09

E-fuse structure of semiconductor device

#18424
20100224955
2010-09-09

FUSES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

#18425
20100224951
2010-09-09

Solid-state imaging device, method for producing the same, and electronic apparatus

#18426
20100224933
2010-09-09

Semiconductor device

#18427
20100224919
2010-09-09

Ferroic sensor having tini-film field-effect transistor and ferroic layer applied to substrate

#18428
20100224876
2010-09-09

Two-sided semiconductor structure

#18429
20100224874
2010-09-09

TCP-type semiconductor device

#18430
20100224588
2010-09-09

Methods of forming metal-insulator-metal (MIM) capacitors with passivation layers on dielectric layers

#18431
20100224352
2010-09-09

Thermal controller for electronic devices

#18432
20100224344
2010-09-09

Vibration Proof Structure Of Fan

#18433
20100223021
2010-09-02

Analyte Monitoring Device and Methods of Use

#18434
20100222660
2010-09-02

Analyte Monitoring Device and Methods of Use

#18435
20100222659
2010-09-02

Analyte Monitoring Device and Methods of Use

#18436
20100221923
2010-09-02

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

#18437
20100221920
2010-09-02

Spacer process for on pitch contacts and related structures

#18438
20100221919
2010-09-02

Method of forming patterns for semiconductor device

#18439
20100221907
2010-09-02

Method of Fabricating a Fuse for Use in a Semiconductor Device

#18440
20100221849
2010-09-02

Method and system for controlling an implantation process

#18441
20100221576
2010-09-02

COPPER ALLOY STRIP MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENTS

#18442
20100221433
2010-09-02

Process for manufacturing hydrophobized microporous film

#18443
20100221414
2010-09-02

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

#18444
20100220839
2010-09-02

Imaging device

#18445
20100220755
2010-09-02

SPECTRALLY TUNABLER LASER MODULE

#18446
20100220511
2010-09-02

Low power antifuse sensing scheme with improved reliability

#18447
20100220510
2010-09-02

Optimized selection of memory chips in multi-chips memory devices

#18448
20100220447
2010-09-02

Heat dissipation device

#18449
20100220444
2010-09-02

CONTROL UNIT

#18450
20100220440
2010-09-02

HEAT SINK AND MOTHERBOARD ASSEMBLY UTILIZING THE HEAT SINK

#18451
20100220439
2010-09-02

Flat heat pipe radiator and application thereof

#18452
20100220274
2010-09-02

Porous silica precursor composition and method for preparing the precursor composition, porous silica film and method for preparing the porous silica film, semiconductor element, apparatus for displaying an image, as well as liquid crystal display

#18453
20100220186
2010-09-02

Method and system for detecting micro-cracks in wafers

#18454
20100219550
2010-09-02

Method for making thermal interface material

#18455
20100219534
2010-09-02

Microstructure device including a metallization structure with self-aligned air gaps and refilled air gap exclusion zones

#18456
20100219533
2010-09-02

Multilayered wiring structure, and method for manufacturing multilayered wiring

#18457
20100219530
2010-09-02

Contact structure of a semiconductor device

#18458
20100219529
2010-09-02

Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects

#18459
20100219526
2010-09-02

FLEXIBLE MICROELECTRONICS ADHESIVE

#18460
20100219514
2010-09-02

SEMICONDUCTOR DEVICE

#18461
20100219513
2010-09-02

Integrated circuit structure and a method of forming the same

#18462
20100219512
2010-09-02

Method for forming porous insulating film and semiconductor device

#18463
20100219511
2010-09-02

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

#18464
20100219508
2010-09-02

Semiconductor device

#18465
20100219486
2010-09-02

Method for containing a silicided gate within a sidewall spacer in integrated circuit technology

#18466
20100219443
2010-09-02

LED packaging structure with blind hole welding device

#18467
20100219441
2010-09-02

LIGHT EMITTING DIODE PACKAGE STRUCTURE

#18468
20100219431
2010-09-02

Light sources with serially connected LED segments including current blocking diodes

#18469
20100219423
2010-09-02

Light receiving or light emitting semiconductor module

#18470
20100219421
2010-09-02

Method and system for electrically coupling a chip to chip package

#18471
20100219420
2010-09-02

FK module and method for the production thereof

#18472
20100218981
2010-09-02

Solar cell lead, method of manufacturing the same, and solar cell using the same

#18473
20100218977
2010-09-02

Packaged device and producing method thereof

#18474
20100218932
2010-09-02

THERMALLY CONDUCTING FOAM INTERFACE MATERIALS

#18475
20100218929
2010-09-02

Heat sink

#18476
20100218915
2010-09-02

Structure of LED Radiator

#18477
20100218913
2010-09-02

Heat dissipating device and bracket thereof

#18478
20100218805
2010-09-02

SUBSTRATE, AN ASSEMBLY PROCESS, AND AN ASSEMBLY APPARATUS

#18479
20100218692
2010-09-02

Temperature control unit for electronic component and handler apparatus

#18480
20100218511
2010-09-02

Liquid refrigerant composite cooling system

#18481
20100218371
2010-09-02

Apparatus for forming a wireless communication device

#18482
20100218364
2010-09-02

Packaging substrate having pattern-matched metal layers

#18483
20100216307
2010-08-26

Simplified pitch doubling process flow

#18484
20100216305
2010-08-26

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

#18485
20100216303
2010-08-26

Semiconductor device having reinforced low-k insulating film and its manufacture method

#18486
20100216260
2010-08-26

Plasma etching method and apparatus, and method of manufacturing liquid ejection head

#18487
20100215906
2010-08-26

Manufacturing method of glass-sealed package, and glass substrate

#18488
20100215317
2010-08-26

OPTICALLY ENABLED INTEGRATED CIRCUIT PACKAGE

#18489
20100214833
2010-08-26

Semiconductor device

#18490
20100214817
2010-08-26

Semiconductor storage device and storage system

#18491
20100214814
2010-08-26

Semiconductor memory device, memory device support and memory module

#18492
20100214747
2010-08-26

Modular electric system

#18493
20100214745
2010-08-26

HEAT SINK ANCHOR ASSEMBLED ON A PRINTED CIRCUIT BOARD

#18494
20100214740
2010-08-26

Phase-Separated Evaporator, Blade-Thru Condenser and Heat Dissipation System Thereof

#18495
20100214736
2010-08-26

Cooling system for computer, cooling apparatus and cooling method

#18496
20100214728
2010-08-26

Mounting board and display device

#18497
20100214710
2010-08-26

SEMICONDUCTOR DEVICE MEASURING VOLTAGE APPLIED TO SEMICONDUCTOR SWITCH ELEMENT

#18498
20100214569
2010-08-26

Semiconductor apparatus including alignment tool

#18499
20100214519
2010-08-26

Tape carrier package and liquid crystal display device having the same

#18500
20100214041
2010-08-26

Coupled microstrip lines with ground planes having ground strip shields and ground conductor extensions

#18501
20100213951
2010-08-26

Method and system for detection of tampering related to reverse engineering

#18502
20100213878
2010-08-26

METHOD AND APPARATUS FOR REDUCING OPTICAL EMISSIONS IN AN INTEGRATED CIRCUIT

#18503
20100213869
2010-08-26

ILLUMINATION DEVICE

#18504
20100213811
2010-08-26

PACKAGE FOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING SAME

#18505
20100213810
2010-08-26

Light emitting device package

#18506
20100213808
2010-08-26

Heat sink base for LEDS

#18507
20100213806
2010-08-26

TRICHROMATIC LIGHT EMITTING DEVICE

#18508
20100213615
2010-08-26

Semiconductor device

#18509
20100213608
2010-08-26

Solder bump UBM structure

#18510
20100213606
2010-08-26

Dielectric enhancements to chip-to-chip capacitive proximity communication

#18511
20100213597
2010-08-26

Semiconductor element mounting board

#18512
20100213581
2010-08-26

Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin

#18513
20100213578
2010-08-26

Methods of forming integrated circuits using donor and acceptor substrates

#18514
20100213573
2010-08-26

Semiconductor decoupling capacitor device

#18515
20100213572
2010-08-26

Dual-dielectric MIM capacitors for system-on-chip applications

#18516
20100213570
2010-08-26

Antifuses with curved breakdown regions

#18517
20100213569
2010-08-26

INTEGRATED CIRCUITS HAVING FUSES AND SYSTEMS THEREOF

#18518
20100213568
2010-08-26

Micro-electro-mechanical-system device with guard ring and method for making same

#18519
20100213551
2010-08-26

E-fuse and associated control circuit

#18520
20100213526
2010-08-26

Nonvolatile semiconductor memory device and method of manufacturing the same

#18521
20100213518
2010-08-26

Impurity doped UV protection layer

#18522
20100213505
2010-08-26

Semiconductor device having means for diverting short circuit current arranged in trench and method for producing same

#18523
20100213503
2010-08-26

Bidirectional switch

#18524
20100213497
2010-08-26

Light emitting device package having light emitting device on inclined side surface and lighting system including the same

#18525
20100213486
2010-08-26

Method for cooling light-emitting diode

#18526
20100213483
2010-08-26

ILLUMINATION DEVICE

#18527
20100213476
2010-08-26

GROUP-III NITRIDE COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD OF MANUFACTURING GROUP-III NITRIDE COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND LAMP

#18528
20100213469
2010-08-26

Illumination device

#18529
20100212949
2010-08-26

Interconnect structure

#18530
20100212877
2010-08-26

Airflow guiding and heat dissipating assembly for electronic device

#18531
20100212871
2010-08-26

HEAT PIPE AND MANUFACTURING METHOD THEREOF

#18532
20100212870
2010-08-26

FLAT HEAT PIPE

#18533
20100212869
2010-08-26

HEAT DISSIPATION DEVICE

#18534
20100212865
2010-08-26

HEAT DISSIPATING DEVICE USING HEAT PIPE

#18535
20100212864
2010-08-26

Packaged heat dissipating assembly for an intermediate bus converter

#18536
20100212863
2010-08-26

Heat dissipation device having a fan holder

#18537
20100212341
2010-08-26

METHODS AND SYSTEMS FOR CONTROLLING A COOLING SYSTEM USING ONE DIGITAL SIGNAL

#18538
20100210793
2010-08-19

One liquid type cyanate-epoxy composite resin composition, its hardened material, manufacturing method thereof, and materials for sealing and adhesive agents using the same

#18539
20100210107
2010-08-19

Semiconductor device and manufacturing method thereof

#18540
20100210106
2010-08-19

SEMICONDUCTOR DEVICE HAVING A INTERLAYER INSULATION FILM WITH LOW DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH

#18541
20100210103
2010-08-19

Method of manufacturing semiconductor device

#18542
20100210102
2010-08-19

Method of manufacturing a semiconductor device

#18543
20100210089
2010-08-19

Substrate having thin film of GaN joined thereon and method of fabricating the same, and a GaN-based semiconductor device and method of fabricating the same

#18544
20100210076
2010-08-19

Memory circuit arrangement and method for the production thereof

#18545
20100210058
2010-08-19

Method of manufacturing semiconductor light emitting device

#18546
20100210045
2010-08-19

Opto-electronic device package with a semiconductor-based sub-mount having SMD metal contacts

#18547
20100209602
2010-08-19

LUMINESCENT DEVICE

#18548
20100208763
2010-08-19

Semiconductor chip and method for manufacturing a semiconductor chip

#18549
20100208441
2010-08-19

Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same

#18550
20100208431
2010-08-19

Patterned Composite Structures and Methods of Making the Same

#18551
20100208427
2010-08-19

Semiconductor power module, inverter, and method of manufacturing a power module

#18552
20100208100
2010-08-19

Digital camera with multiple pipeline signal processors

#18553
20100207839
2010-08-19

Method for Producing a Transmission Module and Transmission Module

#18554
20100207696
2010-08-19

PIEZOELECTRIC VIBRATOR, METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATOR, AND OSCILLATOR

#18555
20100207648
2010-08-19

Contact resistance test structure and method suitable for three-dimensional integrated circuits

#18556
20100207573
2010-08-19

Thermoelectric feedback circuit

#18557
20100207489
2010-08-19

MEMS ultrasonic device having a PZT and cMUT

#18558
20100207284
2010-08-19

Method for providing rotationally symmetric alignment marks for an alignment system that requires asymmetric geometric layout

#18559
20100207282
2010-08-19

Primer resin for semiconductor device and semiconductor device

#18560
20100207276
2010-08-19

Spin-on antireflective coating for integration of patternable dielectric materials and interconnect structures

#18561
20100207274
2010-08-19

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

#18562
20100207271
2010-08-19

SEMICONDUCTOR DEVICE

#18563
20100207268
2010-08-19

Semiconductor packaging substrate improving capability of electrostatic dissipation

#18564
20100207256
2010-08-19

Security chip

#18565
20100207255
2010-08-19

Shield for an intergrated circuit

#18566
20100207250
2010-08-19

Semiconductor chip with protective scribe structure

#18567
20100207242
2010-08-19

Designing method of capacitive element in multilayer wirings for integrated circuit devices based on statistical process

#18568
20100207241
2010-08-19

Semiconductor device including contact plug and associated methods

#18569
20100207239
2010-08-19

Semiconductor device and manufacturing method thereof

#18570
20100207237
2010-08-19

Fabricating method for crack stop structure enhancement of integrated circuit seal ring

#18571
20100207205
2010-08-19

Trench-shielded semiconductor device

#18572
20100207181
2010-08-19

Conductive layers for hafnium silicon oxynitride films

#18573
20100207177
2010-08-19

METHOD FOR PRODUCING A COPPER CONTACT

#18574
20100207161
2010-08-19

Device and method for coupling first and second device portions

#18575
20100207160
2010-08-19

Semiconductor light emitting device

#18576
20100207159
2010-08-19

Semiconductor light emitting device

#18577
20100207158
2010-08-19

Semiconductor light emitting device

#18578
20100207148
2010-08-19

Radiation-emitting component

#18579
20100207143
2010-08-19

Light emitting device with transparent plate

#18580
20100207140
2010-08-19

COMPACT MOLDED LED MODULE

#18581
20100207135
2010-08-19

Light emitting diode device preventing short circuiting between adjacent light emitting diode chips

#18582
20100207134
2010-08-19

LED lighting device

#18583
20100207128
2010-08-19

Semiconductor light emitting device having an isolation layer formed of a conductive transmissive material

#18584
20100207121
2010-08-19

Thin film transistor substrate including source-drain electrodes formed from a nitrogen-containing layer or an oxygen/nitrogen-containing layer

#18585
20100207055
2010-08-19

Metal-graphite composite material having high thermal conductivity and production method therefor

#18586
20100206629
2010-08-19

Display device with desiccant

#18587
20100206538
2010-08-19

THERMAL MODULE HAVING ENHANCED HEAT-DISSIPATING EFFICIENCY AND HEAT DISSIPATING SYSTEM THEREOF

#18588
20100206524
2010-08-19

Thermal module with quick assembling structure

#18589
20100206522
2010-08-19

Heat dissipation device

#18590
20100206521
2010-08-19

Heat dissipating fin and heat sink

#18591
20100206454
2010-08-19

Substrate bonding apparatus

#18592
20100204389
2010-08-12

RESIN COMPOSITION AND CURED PRODUCT USING IT, AND SHEET

#18593
20100204380
2010-08-12

Thermally Conductive Polymer Composites and Articles Made Using the Same

#18594
20100203724
2010-08-12

Method of manufacturing a semiconductor integrated circuit device

#18595
20100203719
2010-08-12

Method of forming an antifuse and a conductive interconnect, and methods of forming DRAM circuitry

#18596
20100203707
2010-08-12

Semiconductor chip manufacturing method

#18597
20100203701
2010-08-12

Crack stop and moisture barrier

#18598
20100203356
2010-08-12

Magnesium alloy compound type thermal metal material

#18599
20100202479
2010-08-12

Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus

#18600
20100202141
2010-08-12

Methods for optimal operation of light emitting diodes