ClassID:

212006

H01L2924/0002 - page 64 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#18901
20100171405
2010-07-08

High power LED module assembly and method for manufacturing the same

#18902
20100171403
2010-07-08

LED lamp

#18903
20100171226
2010-07-08

IC having TSV arrays with reduced TSV induced stress

#18904
20100171223
2010-07-08

Through-silicon via with scalloped sidewalls

#18905
20100171219
2010-07-08

Extended liner for localized thick copper interconnect

#18906
20100171218
2010-07-08

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

#18907
20100171209
2010-07-08

Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips

#18908
20100171198
2010-07-08

Method for manufacturing semiconductor device, semiconductor device, semiconductor manufacturing apparatus and storage medium

#18909
20100171186
2010-07-08

System and method for metal-oxide-semiconductor field effect transistor

#18910
20100171185
2010-07-08

Semiconductor devices and methods of manufacture thereof

#18911
20100171146
2010-07-08

Optical semiconductor-sealing composition

#18912
20100171135
2010-07-08

Optoelectronic semiconductor body and method for producing the same

#18913
20100171117
2010-07-08

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE

#18914
20100170951
2010-07-08

Image transformation device

#18915
20100170804
2010-07-08

Plating film and forming method thereof

#18916
20100170709
2010-07-08

Electronic carrier board and package structure thereof

#18917
20100170706
2010-07-08

ELECTRONIC MODULE AND METHOD FOR MANUFACTURING AN ELECTRONIC MODULE

#18918
20100170666
2010-07-08

Heat Exchanger and Method of Making and Using the Same

#18919
20100170660
2010-07-08

Heat exchangers and related methods

#18920
20100170657
2010-07-08

Integrated blower diffuser-fin heat sink

#18921
20100170294
2010-07-08

Integrated electric compressor

#18922
20100169851
2010-07-01

Designing supply wirings in semiconductor integrated circuit by detecting power supply wiring of specific wiring layer in projection area

#18923
20100169481
2010-07-01

TEST SYSTEM FOR SEMICONDUCTOR DEVICES BASED ON NETWORK MONITORING

#18924
20100169046
2010-07-01

Heat sink blockage detector

#18925
20100168659
2010-07-01

Analyte monitoring device and methods of use

#18926
20100168658
2010-07-01

Analyte monitoring device and methods of use

#18927
20100168303
2010-07-01

TAB leader tape made of polyphenylene ether-based resin

#18928
20100167535
2010-07-01

CLEANING AGENT FOR SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE CLEANING AGENT

#18929
20100167528
2010-07-01

Low resistance metal silicide local interconnects and a method of making

#18930
20100167525
2010-07-01

Semiconductor device and method of manufacture thereof

#18931
20100167498
2010-07-01

Substrate level bonding method and substrate level package

#18932
20100167473
2010-07-01

Semiconductor device and fabrication method for the semiconductor device

#18933
20100167469
2010-07-01

Resin sealing method of semiconductor device

#18934
20100167465
2010-07-01

Multiphase synchronous buck converter

#18935
20100167432
2010-07-01

Method of manufacturing semiconductor device

#18936
20100167427
2010-07-01

PASSIVE DEVICE TRIMMING

#18937
20100167424
2010-07-01

Variable thickness single mask etch process

#18938
20100167064
2010-07-01

Reference wafer for calibration and method for fabricating the same

#18939
20100167004
2010-07-01

Solid state thermal rectifier

#18940
20100166574
2010-07-01

Heat dissipation device and fan assembly thereof

#18941
20100165775
2010-07-01

Semiconductor device having electrical fuses with less power consumption and interconnection arrangement

#18942
20100165774
2010-07-01

Small-sized fuse box and semiconductor integrated circuit having the same

#18943
20100165737
2010-07-01

Electromechanical memory devices and methods of manufacturing the same

#18944
20100165624
2010-07-01

Light source module and lighting apparatus

#18945
20100165596
2010-07-01

Lead frame for quad flat no-lead package

#18946
20100165580
2010-07-01

Fastener and heat sink assembly having the same

#18947
20100165578
2010-07-01

Heat sink mount for providing non-rigid support of overhanging portions of heat sink

#18948
20100165576
2010-07-01

Power system module and method of fabricating the same

#18949
20100165573
2010-07-01

Heat sink used in interface card

#18950
20100165568
2010-07-01

AIRFLOW CONDUCTING APPARATUS

#18951
20100165562
2010-07-01

MEMORY MODULE

#18952
20100165524
2010-07-01

Integrated circuit

#18953
20100165523
2010-07-01

INTEGRATED CIRCUIT

#18954
20100165340
2010-07-01

Spectroscopic scatterometer system

#18955
20100165246
2010-07-01

Illuminating device and liquid-crystal display device using the same

#18956
20100165172
2010-07-01

Imaging device manufacturing method and imaging device

#18957
20100165134
2010-07-01

Arrayed imaging systems having improved alignment and associated methods

#18958
20100164679
2010-07-01

INTEGRATED CIRCUIT INCLUDING A FUSING CIRCUIT CAPABLE FOR PROTECTING A FUSING SPARK

#18959
20100164672
2010-07-01

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

#18960
20100164671
2010-07-01

Integrated electronic device with transceiving antenna and magnetic interconnection

#18961
20100164610
2010-07-01

Multiple circuit blocks with interblock control and power conservation

#18962
20100164605
2010-07-01

SEMICONDUCTOR INTEGRATED CIRCUIT

#18963
20100164604
2010-07-01

FUSE CIRCUIT AND LAYOUT DESIGNING METHOD THEREOF

#18964
20100164603
2010-07-01

Method of forming programmable anti-fuse element

#18965
20100164542
2010-07-01

System LSI

#18966
20100164530
2010-07-01

Adjusting configuration of a multiple gate transistor by controlling individual fins

#18967
20100164521
2010-07-01

Parametric testline with increased test pattern areas

#18968
20100164508
2010-07-01

System and method for test structure on a wafer

#18969
20100164390
2010-07-01

Light source and method for producing light modifiable in colour and/or luminosity

#18970
20100164344
2010-07-01

Light emitting device including multiple OLEDs

#18971
20100164127
2010-07-01

Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same

#18972
20100164126
2010-07-01

RESIN COMPOSITION, RESIN SPACER FILM, AND SEMICONDUCTOR DEVICE

#18973
20100164122
2010-07-01

Method of forming conductive layer and semiconductor device

#18974
20100164120
2010-07-01

Through-hole electrode substrate and method of manufacturing the same

#18975
20100164119
2010-07-01

Semiconductor device and method of manufacturing the same

#18976
20100164116
2010-07-01

Electromigration resistant via-to-line interconnect

#18977
20100164113
2010-07-01

Method for forming copper wiring in semiconductor device

#18978
20100164111
2010-07-01

Method of forming an interconnect structure including a metallic interfacial layer located at a bottom via portion

#18979
20100164110
2010-07-01

Metal silicide nanowires and methods for their production

#18980
20100164109
2010-07-01

Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips

#18981
20100164107
2010-07-01

SEMICONDUCTOR DEVICE HAVING MULTILAYERED INTERCONNECTION STRUCTURE FORMED BY USING Cu DAMASCENE METHOD, AND METHOD OF FABRICATING THE SAME

#18982
20100164104
2010-07-01

Structures and methods for improving solder bump connections in semiconductor devices

#18983
20100164099
2010-07-01

Semiconductor integrated circuit device

#18984
20100164095
2010-07-01

Semiconductor device and method for manufacturing of same

#18985
20100164094
2010-07-01

Multi-chip package memory device

#18986
20100164089
2010-07-01

Non-Conductive Planarization of Substrate Surface for Mold Cap

#18987
20100164073
2010-07-01

Electrical passivation of silicon-containing surfaces using organic layers

#18988
20100164069
2010-07-01

Reducing high-frequency signal loss in substrates

#18989
20100164067
2010-07-01

Capacitor element and semiconductor device

#18990
20100164066
2010-07-01

Integrated capacitor having a non-uniform thickness

#18991
20100164059
2010-07-01

Semiconductor device including wiring having main portion and extended portion

#18992
20100164033
2010-07-01

Method for manufacturing the image sensor

#18993
20100164026
2010-07-01

PREMOLD HOUSING HAVING INTEGRATED VIBRATION ISOLATION

#18994
20100164013
2010-07-01

Random personalization of chips during fabrication

#18995
20100164002
2010-07-01

Dual salicide integration for salicide through trench contacts and structures formed thereby

#18996
20100163995
2010-07-01

Semiconductor device with cooling element

#18997
20100163950
2010-07-01

Power device with monolithically integrated RC snubber

#18998
20100163949
2010-07-01

Vertical metal-insulator-metal (MIM) capacitor using gate stack, gate spacer and contact via

#18999
20100163937
2010-07-01

Methods of forming nickel sulfide film on a semiconductor device

#19000
20100163897
2010-07-01

Flexible light source device and fabrication method thereof

#19001
20100163896
2010-07-01

Nitride red phosphors and white light emitting diode using rare-earth-co-doped nitride red phosphors

#19002
20100163892
2010-07-01

LED device and method of packaging the same

#19003
20100163887
2010-07-01

Light emitting device having a plurality of non-polar light emitting cells and a method of fabricating the same

#19004
20100163877
2010-07-01

Display device

#19005
20100163871
2010-07-01

Method for indexing dies comprising integrated circuits

#19006
20100163866
2010-07-01

Thin film transistor (TFT) having a protective layer and manufacturing method thereof

#19007
20100163833
2010-07-01

ELECTRICAL FUSE DEVICE BASED ON A PHASE-CHANGE MEMORY ELEMENT AND CORRESPONDING PROGRAMMING METHOD

#19008
20100163287
2010-07-01

Method of manufacturing a substrate structure

#19009
20100163285
2010-07-01

Graphene electronics fabrication

#19010
20100163217
2010-07-01

Advanced thermal control interface

#19011
20100163213
2010-07-01

Active heat sink for use with electronic device

#19012
20100163210
2010-07-01

Cooling box for components or circuits

#19013
20100162551
2010-07-01

Method for assembling heat sink

#19014
20100162545
2010-07-01

Methods for manufacturing crystal devices

#19015
20100161276
2010-06-24

System and methods for parametric test time reduction

#19016
20100161103
2010-06-24

Method and system for advanced process control in an etch system by gas flow control on the basis of CD measurements

#19017
20100160761
2010-06-24

Analyte Monitoring Device and Methods of Use

#19018
20100160748
2010-06-24

Analyte Monitoring Device and Methods of Use

#19019
20100160018
2010-06-24

Gaming apparatus with cooling of certain components

#19020
20100159898
2010-06-24

SERVICES PLATFORM FOR NETWORKED DEVICES THAT PROVIDE TELEPHONY AND DIGITAL MEDIA SERVICES

#19021
20100159693
2010-06-24

Method of Forming Via Recess in Underlying Conductive Line

#19022
20100159691
2010-06-24

PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE

#19023
20100159686
2010-06-24

Semiconductor device and method of manufacturing the same

#19024
20100159673
2010-06-24

Method of cutting electrical fuse

#19025
20100159461
2010-06-24

Ion sensitive field effect transistors

#19026
20100159259
2010-06-24

VOLTAGE SWITCHABLE DIELECTRIC MATERIAL INCORPORATING P AND N TYPE MATERIAL

#19027
20100159208
2010-06-24

Barrier layer configurations and methods for processing microelectronic topographies having barrier layers

#19028
20100159057
2010-06-24

Process and system for manufacturing an encapsulated semiconductor device

#19029
20100158509
2010-06-24

Camera module

#19030
20100157990
2010-06-24

SYSTEMS FOR PROVIDING TELEPHONY AND DIGITAL MEDIA SERVICES

#19031
20100157989
2010-06-24

Application store and intelligence system for networked telephony and digital media services devices

#19032
20100157621
2010-06-24

LIGHT EMITTING DEVICE WITH LED OPTICAL FIBER COUPLING

#19033
20100157597
2010-06-24

LED lamp

#19034
20100157594
2010-06-24

LED LAMP

#19035
20100157549
2010-06-24

Image sensor module

#19036
20100157543
2010-06-24

Telephony and digital media services device

#19037
20100157541
2010-06-24

Heat sink and electronic device using same

#19038
20100157540
2010-06-24

FIN-TYPE HEAT SINK AND ELECTRONIC DEVICE USING SAME

#19039
20100157539
2010-06-24

Heatsink mounting system

#19040
20100157537
2010-06-24

Fin-type heat sink and electronic device using same

#19041
20100157536
2010-06-24

Heat radiating member mounting structure

#19042
20100157535
2010-06-24

HEAT-TRANSPORTING DEVICE AND ELECTRONIC APPARATUS

#19043
20100157534
2010-06-24

Heat-transporting device and electronic apparatus

#19044
20100157533
2010-06-24

HEAT-TRANSPORTING DEVICE, ELECTRONIC APPARATUS, AND METHOD OF PRODUCING A HEAT-TRANSPORTING DEVICE

#19045
20100157446
2010-06-24

Optical unit

#19046
20100156768
2010-06-24

DISPLAY MEDIA, METHOD OF FORMING DISPLAY MEDIA, AND PRINTER FOR PRINTING ON DISPLAY MEDIA

#19047
20100156585
2010-06-24

Semiconductor module for connecting to a transformer winding, and transformer arrangement

#19048
20100156453
2010-06-24

Accurate capacitance measurement for ultra large scale integrated circuits

#19049
20100156441
2010-06-24

Capacitive divider device, voltage sensor, trip device module and electrical protection apparatus provided with such a device

#19050
20100156243
2010-06-24

Ultrasound transducer featuring a pitch independent interposer and method of making the same

#19051
20100155967
2010-06-24

Integrated circuits on a wafer and method of producing integrated circuits

#19052
20100155963
2010-06-24

Dummy vias for damascene process

#19053
20100155959
2010-06-24

Semiconductor devices having narrow conductive line patterns and related methods of forming such semiconductor devices

#19054
20100155956
2010-06-24

Fill patterning for symmetrical circuits

#19055
20100155952
2010-06-24

Copper interconnection structures and semiconductor devices

#19056
20100155951
2010-06-24

Copper interconnection structure and method for forming copper interconnections

#19057
20100155950
2010-06-24

Implementation of a metal barrier in an integrated electronic circuit

#19058
20100155946
2010-06-24

Solder limiting layer for integrated circuit die copper bumps

#19059
20100155940
2010-06-24

Semiconductor device and method of manufacturing the same

#19060
20100155937
2010-06-24

Wafer structure with conductive bumps and fabrication method thereof

#19061
20100155935
2010-06-24

Protective coating for semiconductor substrates

#19062
20100155928
2010-06-24

Semiconductor package and manufacturing method of the same

#19063
20100155927
2010-06-24

Semiconductor packages with stiffening support for power delivery

#19064
20100155908
2010-06-24

Passivation structure and fabricating method thereof

#19065
20100155890
2010-06-24

MIM capacitor of semiconductor device and manufacturing method thereof

#19066
20100155886
2010-06-24

Semiconductor device

#19067
20100155885
2010-06-24

Fuse corner pad for an integrated circuit

#19068
20100155884
2010-06-24

MELTING FUSE OF SEMICONDUCTOR AND METHOD FOR FORMING THE SAME

#19069
20100155857
2010-06-24

Semiconductor device and a method of manufacturing the same and designing the same

#19070
20100155846
2010-06-24

Metal-insulator-semiconductor tunneling contacts having an insulative layer disposed between source/drain contacts and source/drain regions

#19071
20100155796
2010-06-24

Semiconductor device with an electrode as an alignment mark, and method of manufacturing the same

#19072
20100155794
2010-06-24

REWORK METHOD OF METAL STRUCTURE OF SEMICONDUCTOR DEVICE

#19073
20100155783
2010-06-24

Standard cell architecture and methods with variable design rules

#19074
20100155782
2010-06-24

Super CMOS devices on a microelectronics system

#19075
20100155751
2010-06-24

Light emitting diode assembly and light emitting diode display device

#19076
20100155749
2010-06-24

LIGHT-EMITTING DIODE (LED) DEVICES COMPRISING NANOCRYSTALS

#19077
20100155745
2010-06-24

Multichip light-emitting diode having multiple lenses

#19078
20100155733
2010-06-24

Array substrate for display device and method for fabricating the same

#19079
20100155732
2010-06-24

Semiconductor device and manufacturing method thereof

#19080
20100155724
2010-06-24

Flat panel display including electrostatic protection circuit

#19081
20100155700
2010-06-24

Thermoelectric cooler for semiconductor devices with TSV

#19082
20100155695
2010-06-24

Light emitting device using nano size needle

#19083
20100155693
2010-06-24

Light emitting device having plurality of light emitting cells and method of fabricating the same

#19084
20100155692
2010-06-24

Nano memory, light, energy, antenna and strand-based systems and methods

#19085
20100155260
2010-06-24

MICRO-BLASTING TREATMENT FOR LEAD FRAMES

#19086
20100155247
2010-06-24

RADIATION-CURABLE RUBBER ADHESIVE/SEALANT

#19087
20100155107
2010-06-24

INTER-LAYER CONNECTION FOR FOIL MEMS TECHNOLOGY

#19088
20100155047
2010-06-24

Systems and methods to dissipate heat in an information handling system

#19089
20100155040
2010-06-24

Heat Sink Comprising a Tube Through Which Cooling Medium Flows

#19090
20100155035
2010-06-24

Liquid-cooled heat radiator

#19091
20100155033
2010-06-24

THERMAL MANAGEMENT SYSTEM USING MICRO HEAT PIPE FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS

#19092
20100155030
2010-06-24

THERMAL MODULE

#19093
20100155029
2010-06-24

BLOWER ASSEMBLY

#19094
20100155027
2010-06-24

COOLING DEVICE

#19095
20100155025
2010-06-24

COLLECTOR ELECTRODES AND ION COLLECTING SURFACES FOR ELECTROHYDRODYNAMIC FLUID ACCELERATORS

#19096
20100155023
2010-06-24

HEAT DISSIPATION APPARATUS HAVING HEAT PIPES INSERTED THEREIN

#19097
20100155022
2010-06-24

Heat dissipation device

#19098
20100155019
2010-06-24

EVAPORATOR AND LOOP HEAT PIPE EMPLOYING IT

#19099
20100154558
2010-06-24

Method and installation for exposing the surface of an integrated circuit

#19100
20100154213
2010-06-24

Method for forming copper interconnection structures

#19101
20100153065
2010-06-17

INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND PROGRAM

#19102
20100153043
2010-06-17

Monitoring method for through-silicon vias of three-dimensional intergrated circuit (3D IC) and apparatus using the same

#19103
20100151675
2010-06-17

Wiring structure and method for manufacturing the same

#19104
20100151674
2010-06-17

Structures electrically connecting aluminum and copper interconnections and methods of forming the same

#19105
20100151673
2010-06-17

Semiconductor device and manufacturing method of semiconductor device

#19106
20100151672
2010-06-17

Methods of forming metal interconnection structures

#19107
20100151670
2010-06-17

Methods of adding pads and one or more interconnect layers to the passivated topside of a wafer including connections to at least a portion of the integrated circuit pads thereon

#19108
20100151640
2010-06-17

Methods of manufacturing a semiconductor device with active regions of different heights

#19109
20100151626
2010-06-17

Locking feature and method for manufacturing transfer molded IC packages

#19110
20100151623
2010-06-17

Phase change memory

#19111
20100151323
2010-06-17

ELECTRODE, ELECTRODE PASTE AND ELECTRONIC PARTS USING THE SAME

#19112
20100151217
2010-06-17

ELECTRONIC PART

#19113
20100151192
2010-06-17

Sensor-securing apparatus and camera module

#19114
20100150757
2010-06-17

CIRCUIT BOARD ADAPTED TO FAN AND FAN STRUCTURE

#19115
20100149898
2010-06-17

Antifuses and program circuits having the same

#19116
20100149853
2010-06-17

Thin film capacitor, and display device and memory cell employing the same, and manufacturing methods of them

#19117
20100149851
2010-06-17

Memory device and manufacturing method the same

#19118
20100149849
2010-06-17

Memory array on more than one die

#19119
20100149798
2010-06-17

Light emitting diode luminaire

#19120
20100149783
2010-06-17

Light-emitting module and illumination apparatus

#19121
20100149775
2010-06-17

Tape circuit substrate with reduced size of base film

#19122
20100149774
2010-06-17

SEMICONDUCTOR DEVICE

#19123
20100149756
2010-06-17

HEAT SPREADER

#19124
20100149749
2010-06-17

Heat dissipation apparatus

#19125
20100149719
2010-06-17

Thermal device with ionized air flow

#19126
20100149710
2010-06-17

Snap-back tolerant integrated circuits

#19127
20100149014
2010-06-17

SEMICONDUCTOR INTEGRATED CIRCUIT

#19128
20100148984
2010-06-17

LED (light emitting diode) module

#19129
20100148915
2010-06-17

Electrical fuse structure

#19130
20100148910
2010-06-17

Electronic circuit device

#19131
20100148863
2010-06-17

Arrangement for reducing interference

#19132
20100148859
2010-06-17

Methods for manufacturing RFID tags and structures formed therefrom

#19133
20100148845
2010-06-17

Limiter and semiconductor device using the same

#19134
20100148812
2010-06-17

Semiconductor device including chip

#19135
20100148379
2010-06-17

Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same

#19136
20100148378
2010-06-17

THERMOSETTING SILICONE RESIN COMPOSITION, SILICONE RESIN, SILICONE RESIN SHEET AND USE THEREOF

#19137
20100148371
2010-06-17

Via first plus via last technique for IC interconnects

#19138
20100148366
2010-06-17

Grain growth promotion layer for semiconductor interconnect structures

#19139
20100148336
2010-06-17

Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereof

#19140
20100148334
2010-06-17

Integrated circuit package support system

#19141
20100148333
2010-06-17

Packaging millimeter wave modules

#19142
20100148329
2010-06-17

Quad flat no lead (QFN) integrated circuit (IC) package having a modified paddle and method for designing the package

#19143
20100148314
2010-06-17

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACURING THE SAME

#19144
20100148312
2010-06-17

REINFORCED SMART CARDS & METHODS OF MAKING SAME

#19145
20100148307
2010-06-17

Semiconductor device including metal-insulator-metal capacitor arrangement

#19146
20100148305
2010-06-17

Semiconductor Device and Fabricating Method Thereof

#19147
20100148304
2010-06-17

Integrated circuit decoupling capacitors

#19148
20100148303
2010-06-17

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

#19149
20100148281
2010-06-17

Semiconductor device and method for fabricating the same

#19150
20100148268
2010-06-17

Insulated-gate semiconductor device with protection diode

#19151
20100148247
2010-06-17

Semiconductor device

#19152
20100148245
2010-06-17

Electronic device including a trench and a conductive structure therein

#19153
20100148219
2010-06-17

Semiconductor integrated circuit device with reduced cell size

#19154
20100148209
2010-06-17

Light-emitting device and electronic device

#19155
20100148202
2010-06-17

Semiconductor light-emitting device and method for manufacturing the same

#19156
20100148193
2010-06-17

Systems and methods for packaging light-emitting diode devices

#19157
20100148190
2010-06-17

Light emitting diode with ITO layer and method for fabricating the same

#19158
20100147674
2010-06-17

Method for fabrication of aligned nanowire structures in semiconductor materials for electronic, optoelectronic, photonic and plasmonic devices

#19159
20100147571
2010-06-17

COMPONENT HAVING A METALIZED CERAMIC BASE

#19160
20100147558
2010-06-17

Anchor pin lead frame

#19161
20100147502
2010-06-17

HEAT DISSIPATION DEVICE WITH HEAT PIPE

#19162
20100147496
2010-06-17

HEAT DISSIPATION DEVICE WITH HEAT PIPE

#19163
20100147495
2010-06-17

HEAT DISSIPATION APPARATUS

#19164
20100147494
2010-06-17

WATER-COOLING HEAT DISSIPATION SYSTEM

#19165
20100147493
2010-06-17

Heat-dissipating fin

#19166
20100147492
2010-06-17

IGBT cooling method

#19167
20100147491
2010-06-17

HEAT DISSIPATION DEVICE HAVING A FAN HOLDER FOR ATTACHMENT OF A FAN

#19168
20100146641
2010-06-10

Method and device for protection of an MRAM device against tampering

#19169
20100146470
2010-06-10

Method and system for voltage fluctuation amount calculation

#19170
20100145646
2010-06-10

Predicting wafer failure using learned probability

#19171
20100145422
2010-06-10

Method for manufacturing an implantable electronic device

#19172
20100144964
2010-06-10

Benzoxazine-containing formulations polymerizable/curable at low temperature

#19173
20100144139
2010-06-10

Methods for fabricating semiconductor components with conductive interconnects having planar surfaces

#19174
20100144112
2010-06-10

Methods of manufacturing semiconductor devices

#19175
20100144104
2010-06-10

Semiconductor device and method of manufacturing the same

#19176
20100144072
2010-06-10

Organic light emitting display and method of fabricating the same

#19177
20100143690
2010-06-10

PRODUCTION OF COMPOSITE MATERIALS WITH HIGH THERMAL CONDUCTIVITY

#19178
20100143656
2010-06-10

Method and structure for adapting solder column to warped substrate

#19179
20100143619
2010-06-10

Thermal conduction principle and device for intercrossed structure having different thermal characteristics

#19180
20100142886
2010-06-10

Optical element module and method of manufacturing the same

#19181
20100142252
2010-06-10

Reconfigurable input/output in hierarchical memory link

#19182
20100142205
2010-06-10

Two part surface mount LED strip connector and LED assembly

#19183
20100142153
2010-06-10

Heat sink device with a shielding member

#19184
20100142152
2010-06-10

Fastener and heat sink assembly having the same

#19185
20100142147
2010-06-10

Electronic device and heat dissipating module thereof

#19186
20100142142
2010-06-10

Method and device for cooling heat-generating computer components

#19187
20100142119
2010-06-10

Capacitor structure

#19188
20100142107
2010-06-10

ESD protection circuit with active triggering

#19189
20100141815
2010-06-10

Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same

#19190
20100141547
2010-06-10

Shielded contactless electronic document

#19191
20100141374
2010-06-10

Transformer with signal immunity to external magnetic fields

#19192
20100141290
2010-06-10

Microspring array having reduced pitch contact elements

#19193
20100141176
2010-06-10

Light emitting diode display device and portable terminal device

#19194
20100141175
2010-06-10

Light sources utilizing segmented LEDs to compensate for manufacturing variations in the light output of individual segmented LEDs

#19195
20100141172
2010-06-10

Light Source, Solid State Light Emitting Element Module, Fluorescent Module, Light Orientation Element Module, Illumination Device, Image Display Device, and Light Source Adjustment Method

#19196
20100141108
2010-06-10

LED illuminating device and light engine thereof

#19197
20100141087
2010-06-10

SURFACE ACOUSTIC WAVE BASED SENSOR APPARATUS AND METHOD UTILIZING SEMI-SYNCHRONOUS SAW RESONATORS

#19198
20100140816
2010-06-10

Method of forming a marker, substrate having a marker and device manufacturing method

#19199
20100140808
2010-06-10

Power distribution in a vertically integrated circuit

#19200
20100140805
2010-06-10

Method of forming bump structure having tapered sidewalls for stacked dies