Dual metal interconnects for improved gap-fill, reliability, and reduced capacitance

Film forming method and film forming apparatus

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE MODULE

Apparatus and method for packaging circuits

Process For Manufacturing Contact Elements For Probe Card Assembles

GRAPHITE NANOPLATELETS FOR THERMAL AND ELECTRICAL APPLICATIONS

Accessing or interconnecting integrated circuits

Stacked ball grid array package module utilizing one or more interposer layers

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Interconnection of lead frame to die utilizing flip chip process

Alpha shielding techniques and configurations

Integrated circuit with improved transmission line structure and electromagnetic shielding between radio frequency circuit paths

Rare-earth oxides, rare-earth nitrides, rare-earth phosphides and ternary alloys

Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief

Parallel Plane Memory and Processor Coupling in a 3-D Micro-Architectural System

Integrated circuits on a wafer and methods for manufacturing integrated circuits

Structure of capacitor set

Semiconductor device with shield line disposed between capacitors

Protection device with a thin-film resistance connected to plural drain regions

Electro static discharge clamping device

Multi-thickness semiconductor with fully depleted devices and photonic integration

Semiconductor device

Printing shielded connections and circuits

Thermal designs of packaged gallium nitride material devices and methods of packaging

Transparent heat spreader for LEDs

Surface-textured encapsulations for use with light emitting diodes

Semiconductor device and method for manufacturing the same

Methods for combining light emitting devices in a package and packages including combined light emitting devices

BENZOXAZINE CONTAINING COMPOSITIONS OF MATTER AND CURABLE COMPOSITIONS MADE THEREWITH

EMI/RFI shielding resin composite material and molded product made using the same

Method for processing a memory link with a set of at least two laser pulses

Electrical apparatus, cooling system therefor, and electric vehicle

Wiring board having lead pin, and lead pin

Printed circuit board comprising metal bumps integrated with connection pads

Combination Heat Sink Formed of a Stack of Heat Spreader Sheet Members

Heat sink and fabricating method of the same

THERMAL MODULE

HEAT SINK WITH VAPOR CHAMBER

HEAT SPREADER WITH VAPOR CHAMBER

HEAT DISSIPATION DEVICE

RADIATOR AND COOLING UNIT

HEAT SPREADER AND HEAT DISSIPATION DEVICE USING SAME

Substrate bonding apparatus and substrate bonding method

Compound-type thin film, method of forming the same, and electronic device using the same

Epoxy resin-forming liquid preparation containing inorganic particle

APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT

On-chip cooling systems for integrated circuits

Method of manufacturing through-via

Simultaneous via and trench patterning using different etch rates

Method for manufacturing semiconductor device

Method of manufacturing an integrated circuit

Silicon carbide semiconductor device and manufacturing method thereof

Method for making a P-I-N diode crystallized adjacent to a silicide in series with a dielectric antifuse

LED array

Thick film getter paste compositions with pre-hydrated desiccant for use in atmosphere control

Nitride semiconductor heterostructures and related methods

Redundant signal transmission

Antifuse circuit with well bias transistor

Multi-port memory device having serial input/output interface

Electronic component mounting module and electrical apparatus

Power semiconductor module

Embedding thin film resistors in substrates in power delivery networks

MEMORY HEAT DISSIPATING STRUCTURE AND MEMORY DEVICE HAVING THE SAME

Heat sink assembly

Cooling fan housing structrue

Heat dissipation apparatus

Capacitor device and method of manufacturing the same

Light emitting element, light emitting element array, backlight unit, and liquid crystal display

Electronic device including circuitry comprising open failure-susceptible components, and open failure-actuated anti-fuse pathway

Antifuse circuit having protection circuit

Electronic chip package with reduced contact pad pitch

Semiconductor device and method for manufacturing semiconductor device

PERFORMANCE ENHANCEMENT IN METALLIZATION SYSTEMS OF MICROSTRUCTURE DEVICES BY INCORPORATING GRAIN SIZE INCREASING METAL FEATURES

MICROSTRUCTURE DEVICE INCLUDING A METALLIZATION STRUCTURE WITH AIR GAPS FORMED COMMONLY WITH VIAS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Low resistance through-wafer via

Isolation structure for protecting dielectric layers from degradation

Metal interconnect and IC chip including metal interconnect

Process for producing silicic coating, silicic coating and semiconductor device

Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature

Semiconductor device

Semiconductor integrated circuit device

Semiconductor device with solder bump formed on high topography plated Cu pads

DUAL-SIDED SUBSTATE INTEGRATED CIRCUIT PACKAGE INCLUDING A LEADFRAME HAVING LEADS WITH INCREASED THICKNESS

Crack stopping structure and method for fabricating the same

Methods for forming conductive vias in semiconductor device components

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT CHIP

Integrated circuit devices including passive device shielding structures and methods of forming the same

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LATERALLY SPACED LASER BEAM SPOTS WITH JOINT VELOCITY PROFILING

Semiconductor device

Contact efuse structure

Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines

Bottom anode Schottky diode structure

METHODS OF FORMING WIRING TO TRANSISTOR AND RELATED TRANSISTOR

Isolated transistor

Nonvolatile memory device and method for fabricating the same

Method for passivating a field-effect transistor

ANALOG CIRCUIT CELL ARRAY AND ANALOG INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE HAVING DUMMY POWER LINE

Semiconductor integrated circuit

Top contact LED thermal management

LED array package covered with a highly thermal conductive plate

Methods of Making Semiconductor-Based Electronic Devices on a Wire and Articles That Can Be Made Thereby

Superconducting shielding for use with an integrated circuit for quantum computing

X-ray detector module with a collimator

ELECTRONIC ELEMENT WAFER MODULE AND METHOD FOR MANUFACTURING SAME, ELECTRONIC ELEMENT MODULE, OPTICAL ELEMENT WAFER MODULE AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC INFORMATION DEVICE

Electronic housing

Substrate having metal post and method of manufacturing the same

Device mounting board and semiconductor module

METHOD FOR PRODUCING A METALIZED COMPONENT, CORRESPONDING COMPONENT, AND A SUBSTRATE FOR SUPPORTING THE COMPONENT DURING METALIZATION

Partable Thermal Heat Pipe

COOLING DEVICE FOR ELECTRONIC COMPONENTS

Heat sink

Cooling fan housing assembly

Thermal diffusion sheet and method for mounting the same

Copper alloy plate and method for producing same

BONDS AND METHOD FOR FORMING BONDS FOR A TWO-PHASE COOLING APPARATUS

Method for measuring rotation angle of bonded wafer

INJECTION TOOL FOR ENCAPSULATING ELECTRONIC CIRCUITS WITH LIGHT SOURCES, AND RELATED ENCAPSULATION PROCESSES

Method for manufacturing electronic component

Method for transmission lines using meta-materials

Sharing resources in multi-dice stacks

Polymer for forming insulating film, composition for forming insulating film, insulating film, and electronic device having same

AROMATIC POLYIMIDE AND PROCESS FOR PRODUCTION THEREOF

Using optical metrology for wafer to wafer feed back process control

Power semiconductor module with prestressed auxiliary contact spring

Through-via and method of forming

Method of forming carbon nanotube on semiconductor substrate, method of forming semiconductor metal wire using the same, and method of fabricating inductor using the same

Multilayered through via

Manufacturing method of a semiconductor device having wirings

Method of manufacturing semiconductor device

Integrated circuit with capacitor and method for the production thereof

Semiconductor chip package fixture

PHOTOGRAPHIC MODULES AND METHODS OF FORMING THE SAME

Using optical metrology for within wafer feed forward process control

Characterization of -glycans using exoglycosidases

ELECTRONIC PACKAGING AND HEAT SINK BONDING ENHANCEMENTS, METHODS OF PRODUCTION AND USES THEREOF

SURFACE HAVING A NANOPOROUS COATING, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME

High density prom

Clamp for mounting semiconductor laser bar chips and method of mounting chips

Heat-dissipated fastener and elastic frame thereof

HEAT DISSIPATING MODULE

HEAT SINK ASSEMBLY

Arc discharge device

HEAT SINK ASSEMBLY HAVING A CLIP

HEAT DISSIPATION MODULE

Method and apparatus for cooling electronics

HYBRID LIQUID-AIR COOLED GRAPHICS DISPLAY ADAPTER

Electrostatic discharge protection circuit and device

Alignment marks for polarized light lithography and method for use thereof

Antenna Integrated in a Semiconductor Chip

Apparatus for bypassing faulty connections

Efuse device

Antifuse circuit of inverter type and method of programming the same

Organic electroluminescent display device and method and apparatus of manufacturing the same

Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof

Semiconductor apparatus manufacturing method and semiconductor apparatus

Methods for selective reverse mask planarization and interconnect structures formed thereby

Fixture for semiconductor device and assembly of semiconductor device

Cooling structures and methods

Metal injection molded heat dissipation device

Power semiconductor module

Semiconductor device

Semiconductor device and method

Integrated capacitor with interlinked lateral fins

Integrated capacitor with array of crosses

Integrated capacitor with cabled plates

Shielding for integrated capacitors

3-D circuits with integrated passive devices

CONTACT OVER ISOLATOR

Integrated capacitor with alternating layered segments

ESD protection device and method of forming an ESD protection device

LIGHT EMITTING DIODE PACKAGE

Ceramic package for headlamp and headlamp modul having the same

Semiconductor light emitting device, illumination module, illumination apparatus, method for manufacturing semiconductor light emitting device, and method for manufacturing semiconductor light emitting element

Light emitting diode module with three part color matching

Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers

SWITCH AND ESD PROTECTION ELEMENT

Heat Dissipating Module

HEAT-RADIATING BASE PLATE AND HEAT SINK USING THE SAME

Method for filling metal into fine space

Paper including semiconductor device and manufacturing method thereof

Cold plate and refrigeration system

Vision system for positioning a bonding tool

Probe for ultrasound system and method of manufacturing the same

Probe For Ultrasound System And Method Of Manufacturing The Same

Surface mounting structure for ball grid array

Methods for forming a conductive material, methods for selectively forming a conductive material, methods for forming platinum, and methods for forming conductive structures

Method of manufacturing light emitting device

Method of forming a high voltage sense element

Eddy current sensor with enhanced edge resolution

Method for production of a plurality of semiconductor chips, and a semiconductor component

Cooling device for light emitting device package of vibration generating machine and head lamp for vibration generating machine

Control module for a lighting system, lighting system and light module for a lighting system

Electronic substrate device

METHOD FOR PLATING FILM ON A HEAT DISSIPATION MODULE

THERMOELECTRIC COOLING APPARATUS AND METHOD FOR COOLING AN INTEGRATED CIRCUIT

Heat radiating fin assembly and thermal module formed therefrom

Radiating fin assembly and thermal module formed therefrom

Heat dissipation module

DISPLAY SUBSTRATE AND DISPLAY DEVICE HAVING THE SAME

Semiconductor integrated circuit

Semiconductor device, method of manufacturing same, and apparatus for designing same

Phosphor-Coated Light Extraction Structures for Phosphor-Converted Light Emitting Devices

Semiconductor device and a method for making the semiconductor device

Semiconductor device

Feature patterning methods and structures thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor package of multi stack type

Trench shielding structure for semiconductor device and method

Heat spreader structures in scribe lines

Metal-oxide-metal structure with improved capacitive coupling area

Metal-insulator-metal capacitors

Semiconductor device and method of manufacturing the same

Apparatus and Method of Manufacture for Movable Lens on Transparent Substrate

Method to prevent surface decomposition of III-V compound semiconductors

Semiconductor device

Semiconductor devices having Si and SiGe epitaxial layers

LDMOS transistor and method for manufacturing the same

Semiconductor device having trench shield electrode structure

High ultraviolet light absorbance silicon oxynitride film for improved flash memory device performance

Multi-chip package with a plurality of chip pads arranged in an array

Method of producing semiconductor device and SOQ (Silicon On Quartz) substrate used in the method

HYDROTALCITE COMPOUND, PROCESS FOR PRODUCING SAME, INORGANIC ION SCAVENGER, COMPOSITION, AND ELECTRONIC COMPONENT-SEALING RESIN COMPOSITION

Electrochemical-codeposition methods for forming carbon nanotube reinforced metal composites

Method for combining heat pipes with a fixing base

HEAT TRANSPORT DEVICE, ELECTRONIC APPARATUS, AND HEAT TRANSPORT DEVICE MANUFACTURING METHOD

Heat dissipation apparatus

HEAT DISSIPATION DEVICE

Engine tool

Fluorine-containing elastomer composition and sealing material made of same

Epoxy silicone and process for producing same, and curable mix composition using same and use thereof

In-line wafer thickness sensing

WAFER LEVEL INTERPOSER

Method of fabrication an integrated circuit

Flash memory having insulating liners between source/drain lines and channels

Integrated circuit arrangement with shockley diode or thyristor and method for production and use of a thyristor

Electronic device having thermally managed electron path and method of thermal management of very cold electrons

Methods and systems involving electrically reprogrammable fuses

Memory device using antifuses

LIGHT EMITTING DEVICE USING OLED PANELS IN FOLDED OR DEPLOYED CONFIGURATION

High color rendering index white LED light system using multi-wavelength pump sources and mixed phosphors

Integrated inductor

Heat transport assembly

ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT

Semiconductor device

High density composite focal plane array

SEMICONDUCTOR DIODE

Semiconductor chip and radio frequency circuit

Piezoelectric and semiconducting coupled nanogenerators

Silicided trench contact to buried conductive layer

Metal line in semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device having an electrode and method for manufacturing the same

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Semiconductor module

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

Semiconductor package for improving characteristics for transmitting signals and power

Cooling channels in 3DIC stacks

Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same

Semiconductor device and method for fabricating the same

Capacitor integration at top-metal level with a protective cladding for copper surface protection

Semiconductor device having capacitor cells

Semiconductor device having interconnect structure for MIM capacitor and fuse elements

FUSE STRUCTURE FOR INTERGRATED CIRCUIT DEVICES

SEMICONDUCTOR DEVICE

Semiconductor device with π-shaped semiconductor conductive layer and method for making the same

Scratch protection for direct contact sensors

Integrated circuit arrangement with Shockley diode or thyristor and method for production and use of a thyristor

Optoelectronic component and method for the manufacture of a plurality of optoelectronic components

LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE

VERTICAL STRUCTURE SEMICONDUCTOR DEVICES WITH IMPROVED LIGHT OUTPUT

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR DRIVING DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

Memory cells including nanoporous layers containing conductive material

Memory array with a selector connected to multiple resistive cells

Method for manufacturing multilayer wiring board

Printed circuit board having a buried solder bump and a circuit layer flush with an insulating layer

Extremely stretchable electronics

Radiator

HEAT DISSIPATION DEVICE

HEAT DISSIPATION SYSTEM

Misalignment compensation for proximity communication

MULTI-CHIP PROCESSOR

Resin composition for encapsulating an electronic tag, a resin-encapsulated electronic tag and a method for producing the same

Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium

Method and apparatus for indicating directionality in integrated circuit manufacturing

PHOTOELECTRIC SENSOR HOUSING ASSEMBLING METHOD AND PHOTOELECTRIC SENSOR

LAYERED THERMAL INTERFACE SYSTEMS METHODS OF PRODUCTION AND USES THEREOF

LIGHT-EMITTING DIODE (LED) DEVICES COMPRISING NANOCRYSTALS

Light output device

Semiconductor device

High thermal conductivity metal matrix composites

Insulating and Dissipating Heat Structure of an Electronic Part

Thermal management of very small form factor projectors with synthetic jets

Synthetic jet embedded heat sink

THERMAL MODULE CAPABLE OF DISSIPATING HEAT GENERATED BY A PLURALITY OF HEAT SOURCES AND RELATED COMPUTER SYSTEM

Method of fabricating vertical capacitors in through-substrate vias

Input surge protection device using JFET

Thermal conduction by encapsulation