ClassID:

212006

H01L2924/0002 - page 66 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#19501
20100110157
2010-05-06

Transfer method of functional region, LED array, LED printer head, and LED printer

#19502
20100109756
2010-05-06

Semiconductor device

#19503
20100109568
2010-05-06

Common optical element for an array of phosphor converted light emitting devices

#19504
20100109167
2010-05-06

Conductive paths for transmitting an electrical signal through an electrical connector

#19505
20100109163
2010-05-06

Semiconductor device and manufacturing method thereof

#19506
20100109161
2010-05-06

Reducing metal voids in a metallization layer stack of a semiconductor device by providing a dielectric barrier layer

#19507
20100109159
2010-05-06

BUMPED CHIP WITH DISPLACEMENT OF GOLD BUMPS

#19508
20100109158
2010-05-06

Semiconductor device including a reduced stress configuration for metal pillars

#19509
20100109155
2010-05-06

RELIABLE INTERCONNECT INTEGRATION

#19510
20100109133
2010-05-06

Semiconductor device

#19511
20100109131
2010-05-06

Reduced wafer warpage in semiconductors by stress engineering in the metallization system

#19512
20100109128
2010-05-06

Crack deflector structure for improving semiconductor device robustness against saw-induced damage

#19513
20100109122
2010-05-06

Method to reduce metal fuse thickness without extra mask

#19514
20100109119
2010-05-06

Method of forming a guard ring or contact to an SOI substrate

#19515
20100109115
2010-05-06

Virtual IC wafers and bonding of constitutent IC films

#19516
20100109114
2010-05-06

Semiconductor device and manufacturing method thereof

#19517
20100109113
2010-05-06

Semiconductor device and method for manufacturing the same

#19518
20100109101
2010-05-06

Method of positioning catalyst nanoparticle and nanowire-based device employing same

#19519
20100109096
2010-05-06

Semiconductor integrated circuit device

#19520
20100109043
2010-05-06

Structures for lowering trigger voltage in an electrostatic discharge protection device

#19521
20100109042
2010-05-06

Light emitting device

#19522
20100109032
2010-05-06

SEMICONDUCTOR LIGHT EMITTING DEVICE

#19523
20100109028
2010-05-06

Vertical ACLED structure

#19524
20100108950
2010-05-06

METHOD FOR PREPARING AN AQUEOUS SUSPENSION OF CARBON NANOTUBES AND SUSPENSION THUS OBTAINED

#19525
20100108937
2010-05-06

Heat transfer fluids with carbon nanocapsules

#19526
20100108362
2010-05-06

ELECTRONIC SYSTEM WITH HEAT DISSIPATION DEVICE

#19527
20100108302
2010-05-06

Heat dissipating module

#19528
20100108298
2010-05-06

HEAT PIPE WITH PLANISHED END SURFACE

#19529
20100108297
2010-05-06

Heat Pipe and Making Method Thereof

#19530
20100108292
2010-05-06

Heat sink system with fin structure

#19531
20100108237
2010-05-06

Device and method for joining substrates

#19532
20100108117
2010-05-06

THERMOELECTRIC MODULE PACKAGE AND MANUFACTURING METHOD THEREFOR

#19533
20100107403
2010-05-06

Semiconductor device comprising eFUSES of enhanced programming efficiency

#19534
20100106001
2010-04-29

Analyte monitoring device and methods of use

#19535
20100105204
2010-04-29

Method to modulate coverage of barrier and seed layer using titanium nitride

#19536
20100105203
2010-04-29

Methods for reducing damage to substrate layers in deposition processes

#19537
20100105166
2010-04-29

Method for manufacturing semiconductor devices having gallium nitride epilayers on diamond substrates

#19538
20100105160
2010-04-29

Techniques for glass attachment in an image sensor package

#19539
20100104240
2010-04-29

Package manufacturing method, package, optical module and die for integral molding

#19540
20100103674
2010-04-29

LED lamp having a vapor chamber for dissipating heat generated by LEDs of the LED lamp

#19541
20100103671
2010-04-29

LED lamp

#19542
20100103669
2010-04-29

LED lamp

#19543
20100103625
2010-04-29

Printed circuit board and heat sink

#19544
20100103624
2010-04-29

HEAT DISSIPATING DEVICE WITH TEMPERATURE DETECTING FUNCTION

#19545
20100103619
2010-04-29

Interchangeable Heat Exchanger for a Circuit Board

#19546
20100103389
2010-04-29

Multi-MEMS Single Package MEMS Device

#19547
20100103296
2010-04-29

SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD THEREOF

#19548
20100102921
2010-04-29

Electrical closing switch made from reactive composite materials

#19549
20100102903
2010-04-29

Conformal reference planes in substrates

#19550
20100102743
2010-04-29

FLEXIBLE LED LIGHTING FILM

#19551
20100102736
2010-04-29

Color-variable LED light, particularly for lighting the interior of vehicles

#19552
20100102696
2010-04-29

Heat dissipating device having turbine ventilator and LED lamp comprising the same

#19553
20100102455
2010-04-29

Semiconductor device and method of manufacturing the same

#19554
20100102452
2010-04-29

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

#19555
20100102450
2010-04-29

Zinc oxide based composites and methods for their fabrication

#19556
20100102449
2010-04-29

Semiconductor device and method for fabricating the same

#19557
20100102448
2010-04-29

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

#19558
20100102442
2010-04-29

Heat spreader having single layer of diamond particles and associated methods

#19559
20100102440
2010-04-29

High density three dimensional semiconductor die package

#19560
20100102435
2010-04-29

Method and apparatus for reducing semiconductor package tensile stress

#19561
20100102426
2010-04-29

Dual face package having resin insulating layer

#19562
20100102421
2010-04-29

Integrated circuit chip with seal ring structure

#19563
20100102392
2010-04-29

Electrostatic discharge protection circuit and integrated circuit device including electrostatic discharge protection circuit

#19564
20100102383
2010-04-29

Semiconductor device

#19565
20100102355
2010-04-29

Semiconductor light emitting device

#19566
20100102344
2010-04-29

LED DEVICE AND ILLUMINATING APPARATUS

#19567
20100102339
2010-04-29

Light emitting diode and LED chip thereof

#19568
20100102331
2010-04-29

Ohmic electrode for SiC semiconductor, method of manufacturing ohmic electrode for SiC semiconductor, semiconductor device, and method of manufacturing semiconductor device

#19569
20100102318
2010-04-29

Semiconductor device, semiconductor module, and electronic apparatus including process monitoring pattern overlapping with I/O pad

#19570
20100102317
2010-04-29

Semiconductor wafer including guard ring patterns and process monitoring patterns

#19571
20100101878
2010-04-29

Semiconductor device including power semiconductor element, branch line, and thermoelectric conversion element, and electrically powered vehicle

#19572
20100101846
2010-04-29

Method and apparatus for spatially optimizing surface mount pads on a ball grid array package

#19573
20100101834
2010-04-29

INTERLAYER INSULATION FILM, INTERCONNECT STRUCTURE, AND METHODS OF MANUFACTURING THEM

#19574
20100101763
2010-04-29

THIN HEAT DISSIPATING APPARATUS

#19575
20100101759
2010-04-29

Apparatus and method for facilitating immersion-cooling of an electronic subsystem

#19576
20100101758
2010-04-29

HEAT DISSIPATION DEVICE WITH FAN

#19577
20100101757
2010-04-29

Heat dissipation device

#19578
20100101756
2010-04-29

LIQUID-COOLING DEVICE

#19579
20100101701
2010-04-29

Method of manufacturing non-shrinking multilayer ceramic substrate

#19580
20100101638
2010-04-29

Using 3d integrated diffractive gratings in solar cells

#19581
20100101084
2010-04-29

Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP)

#19582
20100101083
2010-04-29

Method for fabricating circuit board structure with concave conductive cylinders

#19583
20100100078
2010-04-22

Analyte monitoring device and methods of use

#19584
20100099969
2010-04-22

Analyte monitoring device and methods of use

#19585
20100099968
2010-04-22

Analyte monitoring device and methods of use

#19586
20100099967
2010-04-22

Analyte monitoring device and methods of use

#19587
20100099818
2010-04-22

Benzoxazine-formulations with reduced outgassing behaviour

#19588
20100099302
2010-04-22

Rectification chip terminal structure

#19589
20100099254
2010-04-22

SEMICONDUCTOR MANUFACTURING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, STORAGE MEDIUM AND COMPUTER PROGRAM

#19590
20100099251
2010-04-22

METHOD FOR NITRIDATION PRETREATMENT

#19591
20100099250
2010-04-22

Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers

#19592
20100099223
2010-04-22

Integrated circuit device and method

#19593
20100099222
2010-04-22

Solder joint flip chip interconnection having relief structure

#19594
20100099221
2010-04-22

Stacked device manufacturing method

#19595
20100099217
2010-04-22

Semiconductor device, electronic device, and method of manufacturing semiconductor device

#19596
20100098960
2010-04-22

MAGNETIC INSULATOR NANOLAMINATE DEVICE FOR INTEGRATED SILICON VOLTAGE REGULATORS

#19597
20100097875
2010-04-22

Enhanced power distribution in an integrated circuit

#19598
20100097768
2010-04-22

ELECTRONIC APPARATUS

#19599
20100097766
2010-04-22

Fixing device for heat sink

#19600
20100097764
2010-04-22

Electronic device

#19601
20100097763
2010-04-22

Heat dissipation device

#19602
20100097762
2010-04-22

Heat dissipation apparatus

#19603
20100097761
2010-04-22

MOTHERBOARD

#19604
20100097760
2010-04-22

Impingement Cooling

#19605
20100097159
2010-04-22

Semiconductor chip and semiconductor device

#19606
20100097084
2010-04-22

Method for self-monitoring of breakdown in semiconductor components and semiconductor component constructed thereof

#19607
20100096967
2010-04-22

Lighting device

#19608
20100096965
2010-04-22

Lighting device comprising a color conversion unit

#19609
20100096772
2010-04-22

Release film for semiconductor resin molds

#19610
20100096761
2010-04-22

Semiconductor substrate for build-up packages

#19611
20100096760
2010-04-22

Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect

#19612
20100096756
2010-04-22

Semiconductor device and method of manufacturing the same

#19613
20100096753
2010-04-22

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same

#19614
20100096750
2010-04-22

Packaging substrate

#19615
20100096748
2010-04-22

Combined semiconductor apparatus with semiconductor thin film

#19616
20100096745
2010-04-22

Bonded wafer structure and method of fabrication

#19617
20100096738
2010-04-22

IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV

#19618
20100096730
2010-04-22

PASSIVATION TECHNIQUE

#19619
20100096726
2010-04-22

Metal capacitor and method of making the same

#19620
20100096724
2010-04-22

Semiconductor device with electric fuse having interconnects and via

#19621
20100096723
2010-04-22

Semiconductor device

#19622
20100096722
2010-04-22

Fuse in a semiconductor device and method for fabricating the same

#19623
20100096719
2010-04-22

Methods of forming fine patterns in integrated circuit devices

#19624
20100096718
2010-04-22

Backside illuminated image sensor

#19625
20100096704
2010-04-22

Suspended nanochannel transistor structure and method for fabricating the same

#19626
20100096699
2010-04-22

PREVENTION OF PLASMA INDUCED DAMAGE ARISING FROM ETCHING OF CRACK STOP TRENCHES IN MULTI-LAYERED LOW-K SEMICONDUCTOR DEVICES

#19627
20100096677
2010-04-22

Backside-illuminated solid-state image pickup device

#19628
20100096671
2010-04-22

Semiconductor device including at least six transistor forming linear shapes including at least two different gate contact connection distances

#19629
20100096658
2010-04-22

Structure of Light Emitting Diode

#19630
20100096647
2010-04-22

LIGHT OUTPUT DEVICE

#19631
20100096629
2010-04-22

MULTI-CHIP MODULE FOR AUTOMATIC FAILURE ANALYSIS

#19632
20100096536
2010-04-22

On demand circuit function execution employing optical sensing

#19633
20100096176
2010-04-22

CONTACT STRUCTURE OF A WIRES AND METHOD MANUFACTURING THE SAME, AND THIN FILM TRANSISTOR SUBSTRATE INCLUDING THE CONTACT STRUCTURE AND METHOD MANUFACTURING THE SAME

#19634
20100096170
2010-04-22

Circuit board layout method

#19635
20100096117
2010-04-22

RADIATOR PLATE, PERFORATED PLATE AND METHODS OF MAKING THE SAME

#19636
20100096112
2010-04-22

Thermal module

#19637
20100096107
2010-04-22

Heat dissipation device for at least two electronic devices with two sets of fins

#19638
20100096106
2010-04-22

CLIP AND HEAT SINK ASSEMBLY HAVING THE SAME

#19639
20100095519
2010-04-22

Apparatus for manufacturing a wireless communication device

#19640
20100095263
2010-04-15

Post-routing power supply modification for an integrated circuit

#19641
20100093928
2010-04-15

Epoxy phosphorous-containing resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition

#19642
20100093158
2010-04-15

Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices

#19643
20100092890
2010-04-15

Method to align mask patterns

#19644
20100092659
2010-04-15

Conductive ink and conductor

#19645
20100092070
2010-04-15

High accuracy beam placement for local area navigation

#19646
20100091504
2010-04-15

Heat conducting slug having multi-step structure and light emitting diode package using the same

#19647
20100091501
2010-04-15

Light emitting diode apparatus and optical engine using the same

#19648
20100091476
2010-04-15

Electrical device with screen

#19649
20100091473
2010-04-15

Electrical Component

#19650
20100091463
2010-04-15

COOLING BODY

#19651
20100091461
2010-04-15

Mounting structure for power module, and motor controller including the same

#19652
20100091460
2010-04-15

Electronic module with heat sink

#19653
20100091459
2010-04-15

STREAMING-BASED MICRO/MINI CHANNEL ELECTRONIC COOLING TECHNIQUES

#19654
20100091457
2010-04-15

Cooling system for electronic structural units

#19655
20100091450
2010-04-15

Heat dissipating hinge for portable electronic device

#19656
20100091447
2010-04-15

System and Method for Providing Liquid Cooling of Memory Devices

#19657
20100091428
2010-04-15

Insulator, capacitor with the same and fabrication method thereof, and method for fabricating semiconductor device

#19658
20100091151
2010-04-15

Solid-state image pickup device with optical communication unit and cooling unit

#19659
20100091150
2010-04-15

SOLID-STATE IMAGING DEVICE AND SIGNAL PROCESSING SYSTEM

#19660
20100090791
2010-04-15

Fuse of semiconductor memory device

#19661
20100090781
2010-04-15

Sheet-like composite electronic component and method for manufacturing same

#19662
20100090752
2010-04-15

CMOS RF IC

#19663
20100090751
2010-04-15

Electrical Fuse Structure and Method

#19664
20100090714
2010-04-15

Sensing circuit for devices with protective coating

#19665
20100090357
2010-04-15

Optical device molding system

#19666
20100090349
2010-04-15

Methods of forming fine patterns in the fabrication of semiconductor devices

#19667
20100090346
2010-04-15

Integration of self-aligned trenches in-between metal lines

#19668
20100090343
2010-04-15

Interconnect structure for semiconductor devices

#19669
20100090342
2010-04-15

Metal Line Formation Through Silicon/Germanium Soaking

#19670
20100090340
2010-04-15

Drawn dummy FeCAP, via and metal structures

#19671
20100090339
2010-04-15

Structures and Methods for Wafer Packages, and Probes

#19672
20100090337
2010-04-15

System and method for multi-layer global bitlines

#19673
20100090336
2010-04-15

Semiconductor element cooling structure

#19674
20100090316
2010-04-15

Wafer with design printed outside active region and spaced by design tolerance of reticle blind

#19675
20100090308
2010-04-15

METAL-OXIDE-METAL CAPACITORS WITH BAR VIAS

#19676
20100090285
2010-04-15

Integrated circuit with a contact structure including a portion arranged in a cavity of a semiconductor structure

#19677
20100090283
2010-04-15

Electro static discharge protection device

#19678
20100090270
2010-04-15

TRENCH MOSFET WITH SHORT CHANNEL FORMED BY PN DOUBLE EPITAXIAL LAYERS

#19679
20100090265
2010-04-15

High density nanodot nonvolatile memory

#19680
20100090250
2010-04-15

Semiconductor device

#19681
20100090246
2010-04-15

VERTICAL NITRIDE-BASED LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME

#19682
20100090014
2010-04-15

Semiconductor device and RFID tag chip

#19683
20100090009
2010-04-15

Method of manufacturing cards comprising at least one electronic module, assembly produced during this method and intermediate products

#19684
20100089891
2010-04-15

Apparatus for preparing an antenna for use with a wireless communication device

#19685
20100089624
2010-04-15

MULTILAYER CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING THE SAME

#19686
20100089620
2010-04-15

Electronic Component Module and Method for the Production Thereof

#19687
20100089555
2010-04-15

LIQUID-COOLING TYPE THERMAL MODULE

#19688
20100089441
2010-04-15

METHOD AND APPARATUS FOR MANUFACTURING THIN-FILM PHOTOVOLTAIC DEVICES

#19689
20100089174
2010-04-15

Vibratory flow meter and method for determining viscosity in a flow material

#19690
20100088042
2010-04-08

Method of detecting defects on an object

#19691
20100087590
2010-04-08

Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin

#19692
20100087419
2010-04-08

HIV integrase inhibitors

#19693
20100087042
2010-04-08

Methods of fabricating three-dimensional capacitor structures having planar metal-insulator-metal and vertical capacitors therein

#19694
20100087041
2010-04-08

Semiconductor device fabrication method

#19695
20100087014
2010-04-08

Heat treatment apparatus and method of manufacturing semiconductor device

#19696
20100086670
2010-04-08

Substrate processing method and substrate processing apparatus for performing a deposition process and calculating a termination time of the deposition process

#19697
20100085872
2010-04-08

Self-healing chip-to-chip interface

#19698
20100085715
2010-04-08

PRINTED ELECTRONIC COMPONENT ASSEMBLY ENABLED BY LOW TEMPERATURE PROCESSING

#19699
20100085714
2010-04-08

Mounting apparatus for heat sink

#19700
20100085711
2010-04-08

HEAT DISSIPATION MODULE AND FAN THEREOF

#19701
20100085132
2010-04-08

Differential transmission line having a plurality of leakage resistors spaced between the transmission line

#19702
20100084926
2010-04-08

Circuit assembly including a power semiconductor module and a controller

#19703
20100084770
2010-04-08

Semiconductor device which includes contact plug and embedded interconnection connected to contact plug

#19704
20100084769
2010-04-08

Semiconductor device and dummy pattern arrangement method

#19705
20100084767
2010-04-08

Discontinuous/non-uniform metal cap structure and process for interconnect integration

#19706
20100084766
2010-04-08

SURFACE REPAIR STRUCTURE AND PROCESS FOR INTERCONNECT APPLICATIONS

#19707
20100084763
2010-04-08

Metallic bump structure without under bump metallurgy and manufacturing method thereof

#19708
20100084760
2010-04-08

Semiconductor device and method for manufacturing same

#19709
20100084757
2010-04-08

Mono-acid hybrid conductive composition and method

#19710
20100084751
2010-04-08

Double broken seal ring

#19711
20100084739
2010-04-08

Semiconductor device and method of manufacturing the same

#19712
20100084737
2010-04-08

Tunable Semiconductor Component Provided with a Current Barrier

#19713
20100084727
2010-04-08

Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device

#19714
20100084726
2010-04-08

Wafer level packaging image sensor module having lens actuator and method of manufacturing the same

#19715
20100084715
2010-04-08

Photo alignment mark for a gate last process

#19716
20100084711
2010-04-08

ELECTROSTATIC DISCHARGE PROJECTION SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

#19717
20100084707
2010-04-08

Polysilicon control etch-back indicator

#19718
20100084698
2010-04-08

Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same

#19719
20100084673
2010-04-08

Light-emitting semiconductor packaging structure without wire bonding

#19720
20100084668
2010-04-08

Semiconductor color-tunable broadband light sources and full-color microdisplays

#19721
20100084662
2010-04-08

SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS OVERLAPPING LENGTHWISE ON A STRUCTURE

#19722
20100084657
2010-04-08

Thin film transistor array substrate

#19723
20100084654
2010-04-08

Display device

#19724
20100084554
2010-04-08

Method of controlling particle absorption on a wafer sample being inspected by a charged particle beam imaging system

#19725
20100084166
2010-04-08

METHOD FOR FITTING AN ELECTRICAL COMPONENT TO A CONTACTING ELEMENT AND CONTACTING ELEMENT WITH AN ELECTRICAL COMPONENT

#19726
20100084162
2010-04-08

ELECTRONIC PACKAGE DEVICE

#19727
20100084086
2010-04-08

Manufacturing methods of piezoelectric devices

#19728
20100081276
2010-04-01

Method for forming cobalt tungsten cap layers

#19729
20100081275
2010-04-01

Method for forming cobalt nitride cap layers

#19730
20100081272
2010-04-01

Methods of forming electrical interconnects using electroless plating techniques that inhibit void formation

#19731
20100081270
2010-04-01

Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device

#19732
20100081269
2010-04-01

Method for manufacturing semiconductor device having electrode for external connection

#19733
20100081237
2010-04-01

Integrated Circuit Assemblies and Methods for Encapsulating a Semiconductor Device

#19734
20100081236
2010-04-01

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH EMBEDDED INTERPOSER

#19735
20100081232
2010-04-01

Layer transfer process and functionally enhanced integrated circuits produced thereby

#19736
20100081220
2010-04-01

Method for manufacturing light-emitting diode

#19737
20100081219
2010-04-01

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

#19738
20100081217
2010-04-01

Defect inspection apparatus, defect inspection method, and semiconductor device manufacturing method

#19739
20100079959
2010-04-01

Semiconductor device comprising an in-chip active heat transfer system

#19740
20100079958
2010-04-01

Transistor clamping device

#19741
20100079956
2010-04-01

Power transducer

#19742
20100079955
2010-04-01

Microfins for cooling an ultramobile device

#19743
20100079952
2010-04-01

Heat-dissipating module and electronic device having the same

#19744
20100079951
2010-04-01

ELECTRONIC APPARATUS

#19745
20100079950
2010-04-01

Radiating Fin and Thermal Module Formed Therefrom

#19746
20100079943
2010-04-01

Synthetic jet and method of making same

#19747
20100079941
2010-04-01

Heat dissipation device

#19748
20100079924
2010-04-01

Method of patterning a metal on a vertical sidewall of an excavated feature, method of forming an embedded MIM capacitor using same, and embedded memory device produced thereby

#19749
20100079600
2010-04-01

Printer CPU with VLIW processor

#19750
20100079286
2010-04-01

Encapsulated RFID device for flexible, non-planar or curvilinear surfaces

#19751
20100079246
2010-04-01

Integrated circuit with a rectifier element

#19752
20100079222
2010-04-01

Coplanar waveguide having trenches covered by a passivation film and fabrication method thereof

#19753
20100079203
2010-04-01

Semiconductor device

#19754
20100079133
2010-04-01

HEAT SINK MOUNTING STRUCTURE AND ELECTRONIC APPARATUS

#19755
20100079059
2010-04-01

Solid state lighting devices including light mixtures

#19756
20100078827
2010-04-01

Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation

#19757
20100078825
2010-04-01

Method for fabricating interconnect structures for semiconductor devices

#19758
20100078821
2010-04-01

Method of fabricating a metal cap layer with enhanced etch resistivity for copper-based metal regions in semiconductor devices

#19759
20100078820
2010-04-01

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#19760
20100078817
2010-04-01

Interconnect structure

#19761
20100078815
2010-04-01

Ruthenium interconnect with high aspect ratio and method of fabrication thereof

#19762
20100078814
2010-04-01

SYSTEM AND METHOD FOR USING POROUS LOW DIELECTRIC FILMS

#19763
20100078811
2010-04-01

METHOD OF PRODUCING SEMICONDUCTOR DEVICES

#19764
20100078810
2010-04-01

Semiconductor apparatus, substrate design method, and substrate design apparatus

#19765
20100078809
2010-04-01

Semiconductor module with micro-buffers

#19766
20100078795
2010-04-01

ELECTRONIC DEVICE

#19767
20100078787
2010-04-01

Semiconductor device

#19768
20100078782
2010-04-01

Coating composition and a method of coating

#19769
20100078780
2010-04-01

Semiconductor device

#19770
20100078776
2010-04-01

On-chip RF shields with backside redistribution lines

#19771
20100078773
2010-04-01

Semiconductor device and method of forming semiconductor device

#19772
20100078771
2010-04-01

On-chip RF shields with through substrate conductors

#19773
20100078769
2010-04-01

Semiconductor device having enhanced scribe and method for fabrication

#19774
20100078764
2010-04-01

Reducing shunt currents in a semiconductor body

#19775
20100078756
2010-04-01

Semiconductor device with semiconductor body and method for the production of a semiconductor device

#19776
20100078754
2010-04-01

Guard ring structures and method of fabricating thereof

#19777
20100078749
2010-04-01

Distance image sensor

#19778
20100078739
2010-04-01

Vertical mount package for MEMS sensors

#19779
20100078727
2010-04-01

eFuse and Resistor Structures and Method for Forming Same in Active Region

#19780
20100078726
2010-04-01

SEMICONDUCTOR DEVICE

#19781
20100078724
2010-04-01

TRANSISTOR-TYPE PROTECTION DEVICE, SEMICONDUCTOR INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF THE SAME

#19782
20100078709
2010-04-01

Semiconductor device

#19783
20100078700
2010-04-01

Semiconductor memory device

#19784
20100078695
2010-04-01

Low leakage capacitors including portions in inter-layer dielectrics

#19785
20100078690
2010-04-01

Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device

#19786
20100078688
2010-04-01

NITRIDE SEMICONDUCTOR DEVICE, NITRIDE SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE

#19787
20100078685
2010-04-01

Semiconductor memory device

#19788
20100078667
2010-04-01

Light-emitting diode

#19789
20100078664
2010-04-01

LED phosphor deposition

#19790
20100078656
2010-04-01

Light emitting device and method of fabricating the same

#19791
20100078643
2010-04-01

Display device with defective pixels correction structure

#19792
20100078642
2010-04-01

Layered structure, electron device, and an electron device array having a variable wettability layer and semiconductor layer formed thereon

#19793
20100078329
2010-04-01

OPTICALLY MONITORING AN ALOX FABRICATION PROCESS

#19794
20100078154
2010-04-01

Heat dissipation device

#19795
20100078153
2010-04-01

Vapor Augmented Heatsink with Multi-Wick Structure

#19796
20100078151
2010-04-01

CERAMIC HEAT PIPE WITH POROUS CERAMIC WICK

#19797
20100078056
2010-04-01

Optical tandem photovoltaic cell panels

#19798
20100077615
2010-04-01

METHOD FOR MANUFACTURING A PLATE-TYPE HEAT PIPE

#19799
20100077614
2010-04-01

METHOD FOR MANUFACTURING A WICK STRUCTURE OF A PLATE-TYPE HEAT PIPE

#19800
20100077363
2010-03-25

Isolation method and package using a high isolation differential ball grid array (BGA) pattern