Semiconductor device including memory cell and anti-fuse element

High voltage GaN-based heterojunction transistor structure and method of forming same

Light source

Surface-textured encapsulations for use with light emitting diodes

Light emitting device and method of manufacturing the same

Light emitting device and method of manufacturing a light emitting device

Electrical antifuse

Nickel-rhenium alloy powder and conductor paste containing the same

Arrangement for energy conditioning

Concentric vias in electronic substrate

Semiconductor device and manufacturing process thereof

Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same

HEAT SINK PROVIDED WITH CENTRIFUGAL FAN

MULTI-STAGE ELECTROHYDRODYNAMIC FLUID ACCELERATOR APPARATUS

LOOP HEAT PIPE

Heat dissipation device

Method of producing body having flow path formed therein, and body having flow path formed therein

HEAT DISSIPATION DEVICE

Radiating fin

HEAT DISSIPATION ASSEMBLY

FLOW DIVERTERS TO ENHANCE HEAT SINK PERFORMANCE

MONOLITHIC STRUCTURALLY COMPLEX HEAT SINK DESIGNS

ACTIVE HEAT SINK DESIGNS

HEAT ABSORBING DEVICE

Method and system for the modular design and layout of integrated circuits

Method and system for the modular design and layout of integrated circuits

Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices

Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices

Method for manufacturing semiconductor device

Evaluation method of semiconductor device

Foldable LED light recycling cavity

Led lamp

LIGHT EMITTING DIODE

LED light fixture and method for manufacturing the same

Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same

Heat sink assembly having a clip

Heat sink system having thermally conductive rods

Heat dissipation device having an improved fin structure

Heat dissipation device with a fan holder attached with a position-adjustable air guiding member

Memory module assembly having heat sinks with improved structure

Method for the electrolytic production of self-supporting conductive nanocomposite elements

Structure for an on-chip high frequency electro-static discharge device

Design structure for an on-chip high frequency electro-static discharge device

LED ARRAY MANUFACTURING METHOD, LED ARRAY AND LED PRINTER

WIRELESS TRANSMISSION PACKAGE DEVICE

Method and system for communicating via flip-chip die and package waveguides

Transmission circuit

Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance

Shape memory alloy motor

Semiconductor chip including identifying marks

Semiconductor device

Silicide interconnect structure

FRAME AND METHOD OF MANUFACTURING ASSEMBLY

Method and system for the modular design and layout of integrated circuits

LEADFRAMES HAVING BOTH ENHANCED-ADHESION AND SMOOTH SURFACES AND METHODS TO FORM THE SAME

Wiring board and electrical signal transmission system

Protection for proximity electronics against electrostatic discharge

Diffusion barrier and method of formation thereof

Method for testing group III-nitride wafers and group III-nitride wafers with test data

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

Semiconductor component and method of manufacture

Method and structure for SOI body contact FET with reduced parasitic capacitance

IMAGE SENSOR MODULE AND CAMERA MODULE HAVING SAME

Solid-state image pickup device and method for manufacturing same

SEMICONDUCTOR DEVICE HAVING OTP CELLS AND METHOD FOR FABRICATING THE SAME

Method of making flash memory cells and peripheral circuits having STI, and flash memory devices and computer systems having the same

Programmable circuit with carbon nanotube

Insulting gate AlGaN/GaN HEMT

Optoelectronic semiconductor chip

Group-III nitride compound semiconductor light-emitting device, method of manufacturing group-III nitride compound semiconductor light-emitting device, and lamp

Film thickness monitoring structure for semiconductor substrate

CARBON NANOTUBES BONDING ON METALLIC ELECTRODES

ELECTROMAGNETIC NOISE SUPPRESSOR, STRUCTURE WITH ELECTROMAGNETIC NOISE SUPPRESSING FUNCTION AND THEIR MANUFACTURING METHODS

Tag enclosing structure

Manufacturing method of a wiring substrate

Heat radiating component

HEAT PIPE TYPE HEAT SINK AND METHOD OF MANUFACTURING THE SAME

Passive heat radiator and streetlight heat radiating device

Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins

Heat dissipation apparatus having heat pipes inserted therein

Heat dissipation device

Solar tracking sensor array

Self-cooled vertical electronic component

Microchannel heat exchanger fabricated by wire electro-discharge machining

Method for manufacturing evaporator for loop heat pipe system

METHOD AND A TOOL FOR MANUFACTURING HEAT RADIATOR

ALIGNMENT MARK AND ALIGNMENT METHOD USING THE ALIGNMENT MARK

Apparatus and method for thermal stabilization of PCB-mounted electronic components within an enclosed housing

Electrostatic discharge protection for wrist-worn device

Analyte Monitoring Device And Methods Of Use

Ceramic powder and applications thereof

Socket for testing main board having water-cooled cooler fixing structure

Electrical connector assembly having improved clip mechanism

Methods of forming fine patterns in the fabrication of semiconductor devices

Method of manufacturing a through-silicon-via on-chip passive MMW bandpass filter

Method for fabricating organic light emitting display device

Method of manufacturing bendable solid state lighting

Copper alloy sheets for electrical/electronic part

Apparatus and method of using multiple LED light sources to generate a unitized beam

Semiconductor module

Integrated heat-dissipating device for portable electronic product

Heat dissipation device

Fan impeller and heat dissipating device incorporating the same

Heat dissipation device

Heat dissipation device for computer add-on cards

Heat-dissipating mechanism for use with memory module

Method and circuit for eFuse protection

Semiconductor device

Sub-segmented alignment mark arrangement

Liquid crystal display assembly comprising an LED backlight assembly and a movable element placed behind the LED backlight assembly having a hinge to allow access to a rear portion of the LED backlight assembly

Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device

Semiconductor integrated circuit

Semiconductor device

Method of making connections in a back-lit circuit

Air gap formation and integration using a patterning cap

Silicon single electron device

Interconnect in low-k interlayer dielectrics

Interconnect structure for electromigration enhancement

Interconnect layers without electromigration

Semiconductor device and method of manufacturing the same

Circuit Module Turbulence Enhancement

Body to be plated, method of determining plated film thickness, and method of manufacturing semiconductor device

Semiconductor device and its manufacturing method

Structure and method to form e-fuse with enhanced current crowding

Wafer level camera module and method of manufacturing the same

Semiconductor device having a power cutoff transistor

Structure for Preventing Leakage of a Semiconductor Device

Method for forming self-aligned source and drain contacts using a selectively passivated metal gate

MOS TYPE SEMICONDUCTOR DEVICE

Light emitting diode package

LED semiconductor element having increased luminance

Optoelectronic semiconductor component

TESTING DEVICE ON WATER FOR MONITORING VERTICAL MOSFET ON-RESISTANCE

Chip having side protection terminal and package using the chip

Wafer level package and method of manufacturing the same

Thermal conduction principle and device of the multi-layers structure with different thermal characteristics

HEAT SINK

HEAT DISSIPATION MODULE

HEAT SINK ASSEMBLY

HEAT DISSIPATION DEVICE

Heat transfer assembly and methods therefor

SYSTEMS, DEVICES, AND METHODS FOR SEMICONDUCTOR DEVICE TEMPERATURE MANAGEMENT

Semiconductor device production control method

Ceramic powder and use thereof

Socket connector with flexible orientation heat pipe

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

Manufacturing method of semiconductor device

Intralevel conductive light shield

Semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer

Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse application

Systems, devices, and methods for semiconductor device temperature management

Method for manufacturing semiconductor device

System and Method for Thermal Optimized Chip Stacking

Method for generating and/or imprinting a retrievable cryptographic key during the production of a topographic structure

Light emitting device and lighting system having the same

Interface module with high heat-dissipation

Systems and methods for cooling an electronic device

Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs)

MEMORY MODULE

Integrated circuit

Method for forming wiring film, transistor and electronic device

Semiconductor device and manufacturing method of the same

Structure and method for forming hybrid substrate

Semiconductor device and manufacturing method thereof

Through substrate via semiconductor components

SEMICONDUCTOR STRUCTURES HAVING VIAS

Integrated circuit with embedded contacts

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Systems, devices, and methods for semiconductor device temperature management

Self-assembled monolayer release films

Heat sink for power module

Method for shielding semiconductor device

Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer

Laser beam machining method and semiconductor chip

Method and apparatus for creating a deep trench capacitor to improve device performance

Semiconductor device

FUSE STRUCTURE OF A SEMICONDUCTOR DEVICE

Structure and method to form dual silicide e-fuse

Programmable electrical fuse

Photodiode array and production method thereof, and radiation detector

Integrated circuit including a buried wiring line

Structure and method for forming power devices with carbon-containing region

Process of forming an electronic device including a resistor-capacitor filter

Light-emitting element array

Switching device and testing apparatus

Phase change memory device having a word line contact

Visible light and IR combined image camera

PATTERN FORMING METHOD

Chip carrier substrate including capacitor and method for fabrication thereof

Printed circuit board

Heat dissipation device

System and method to redirect and/or reduce airflow using actuators

Electronic Apparatus Cooling Device

Active Multiphase Heat Transportation System

HEAT DISSIPATION DEVICE

Fastening device and heat-dissipating module having the same

DEVICE FOR COOLING, IN PARTICULAR, ELECTRONIC COMPONENTS, GAS COOLER AND EVAPORATOR

Optimizing layout of irregular structures in regular layout context

Systems and methods for determining two or more characteristics of a wafer

Electronic device

SILICIDE FORMING METHOD AND SYSTEM THEREOF

Fabricating a top conductive layer in a semiconductor die

INTERCONNECT STRUCTURE WITH HIGH LEAKAGE RESISTANCE

Structure and method for creating reliable via contacts for interconnect applications

Lead frame thermoplastic solar cell receiver

Method of enclosing a micro-electromechanical element

ULTRA LOW K (ULK) SiCOH FILM AND METHOD

Materials containing voids with void size controlled on the nanometer scale

Nonvolatile memory devices having electromagnetically shielding source plates

LED lamp

LED lamp

Heat dissipation device with base having fasteners

Thermal management device and method for making the same

CAPACITOR STRUCTURE AND METAL LAYER LAYOUT THEREOF

Back-illuminated type solid-state image pickup apparatus with peripheral circuit unit

Digital camera system incorporating VLIM image processor

Display device with threshold correction

IC package antenna

DEVICE CONFIGURATION

Temperature control device

Cold temperature control in a semiconductor device

Programmable switch circuit and method, method of manufacture, and devices and systems including the same

TEST PATTERN OF SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF TESTING DEVICE USING TEST PATTERN

Constant current and voltage controller in a three-pin package with dual-use power pin

Hybrid solar nanogenerator cells

Overlay mark

Packaging substrate structure

Methods of forming conductive features and structures thereof

Interconnect structures with ternary patterned features generated from two lithographic processes

Semiconductor device having wiring layer with a wide wiring and fine wirings

Bonding method for through-silicon-via based 3D wafer stacking

Interconnect structure for integrated circuits having improved electromigration characteristics

Integrated circuit with contact region and multiple etch stop insulation layer

Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing

CARBON NANOTUBES AS INTERCONNECTS IN INTEGRATED CIRCUITS AND METHOD OF FABRICATION

Method of manufacturing a semiconductor device

Electrically-conductive inorganic coating, method for producing the coating, circuit board, and semiconductor apparatus

COOLING DEVICE WITH A PREFORMED COMPLIANT INTERFACE

Contrast Interposer Stacking System And Method

Package-Borne Selective Enablement Stacking

Semiconductor light emitting device

Seal ring structure for integrated circuits

Semiconductor-device isolation structure

Hafnium lanthanide oxynitride films

Structure and method for reducing threshold voltage variation

Method of producing semiconductor device

Bonding method for through-silicon-via based 3D wafer stacking

TSV-enabled twisted pair

Semiconductor device and method for manufacturing the same

Semiconductor device

Integrated circuit system employing back end of line via techniques

Anti-fusse structure and method of fabricating the same

Semiconductor device including capacitor element and method of manufacturing the same

Structure and method of forming electrically blown metal fuses for integrated circuits

Fuse device

SEAL RING STRUCTURE FOR INTEGRATED CIRCUITS

Method for capping a MEMS wafer

Non-volatile semiconductor memory device with contact plug electrically conductive in response to light

I/O and power ESD protection circuits by enhancing substrate-bias in deep-submicron CMOS process

Resurf semiconductor device charge balancing

Plasma Display Apparatus

Enclosed void cavity for low dielectric constant insulator

CARD TYPE MEMORY PACKAGE

THIN FILM TRANSISTOR ARRAY PANEL HAVING A MEANS FOR ARRAY TEST

Process for eliminating delamination between amorphous silicon layers

System for overlay measurement in semiconductor manufacturing

Image sensing device having a shielding layer

Metal-containing transaction card and method of making the same

Display device, method of laying out wiring in display device, and electronic device

Vapor Chamber-Thermoelectric Module Assemblies

Thermal Interconnect System and Production Thereof

HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF

Method and apparatus for chip cooling

Selectively Grooved Cold Plate for Electronics Cooling

Vapor chamber

Heat dispensing unit for memory chip

Multi-chip package

Method of making self-aligned nanotube contact structures

Analyte monitoring device and methods of use

Forming method of etching mask, control program and program storage medium

Semiconductor chip and method for fabricating the same

Process management method and process management data for semiconductor device

Method for laterally cutting through a semiconductor wafer and optoelectronic component

Pad design with buffers for STT-MRAM or other short pulse signal transmission

Structure for blocking an electromagnetic interference, wafer level package and printed circuit board having the same

Heat dissipation device

Heat sink for chips

ENTRAINMENT HEATSINK USING ENGINE BLEED AIR

HEAT SINK FOR AN ELECTRONIC DEVICE

Scalable integrated circuit high density capacitors

Multi-chip module package including external and internal electrostatic discharge protection circuits, and/or method of making the same

Display driving apparatus, display module package, display panel module, and television set

Apparatus for silencing electromagnetic noise

FLICKER-FREE LED LAMP AND LED STRING LAMP

Method of encapsulating optoelectronic components

SEMICONDUCTOR WAFER

SEMICONDUCTOR WAFER

LIGHT-PROOF CHIP PACKAGING STRUCTURE AND METHOD FOR ITS MANUFACTURE

LOW CONTACT RESISTANCE SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME