SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated inductor structure

SEMICONDUCTOR DEVICE

Semiconductor device

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE

Semiconductor ground shield

Semiconductor structure

Semiconductor device and method for fabricating the same

Composite passivation process for nitride FET

Pads and pin-outs in three dimensional integrated circuits

Group III nitride compound semiconductor stacked structure

Light-emitting diode

Backside illuminated image sensor

PRINTED WIRELESS RF IDENTIFICATION LABEL STRUCTURE

STORAGE SYSTEM FOR COMPONENTS INCORPORATING A LIQUID-METAL THERMAL INTERFACE

COOLER

Cooling device

Heat dissipation device

Non-linear fin heat sink

Heat sink and a method of manufacturing the heat sink

Heat dissipation module and fastening structure thereof

Enhanced process yield using a hot-spot library

Direct interconnection between processor and memory component

ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT DEVICE

Electrical connector assembly with heat dissipating device

REDUCED ELECTROMIGRATION AND STRESSED INDUCED MIGRATION OF CU WIRES BY SURFACE COATING

Method for reducing dielectric overetch when making contact to conductive features

Method and apparatus for deploying a liquid metal thermal interface for chip cooling

Semiconductor laser equipment

SYSTEMS AND METHODS FOR LINK PROCESSING WITH ULTRAFAST AND NANOSECOND LASER PULSES

Fuse box and semiconductor memory device including the same

Methods involving memory with high dielectric constant antifuses adapted for use at low voltage

Metal gate compatible electrical antifuse

Semiconductor memory device

Optoelectronic semiconductor component capable of centralizing emitted light

Method for diminishing dark gap in arrayed led module, arrayed LED module, and imaging apparatus thereof

MULTILAYER, THERMALLY-STABILIZED SUBSTRATE STRUCTURES

Heat dissipation device having a clip assembly

Apparatus for directing heat to a heat spreader

HEAT DISSIPATION APPARATUS

THIN FILM MULTI-LAYERED CERAMIC CAPACITOR AND METHOD OF FABRICATING THE SAME

Screen-printable encapsulants based on soluble polybenzoxazoles

Semiconductor devices and methods of manufacture thereof

Device for short-circuiting power semiconductor modules

Electrostatic discharge circuit

Inkjet printhead integrated circuit

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

LAYOUT FOR DUT ARRAYS USED IN SEMICONDUCTOR WAFER TESTING

Method for identifying electronic circuits and identification device

Light-emitting device with miniature elements

Quartz crystal vibrator, oscillator and electronic apparatus

Micro-electro-mechanical transducers

METHOD FOR FORMING A VIA IN A SUBSTRATE AND SUBSTRATE WITH A VIA

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF PROTOTYPING A SEMICONDUCTOR CHIP

Hybrid contact structure with low aspect ratio contacts in a semiconductor device

Copper Alloy Sputtering Target and Semiconductor Element Wiring

Metal interconnection of a semiconductor device and method of manufacturing the same

Air gap structure having protective metal silicide pads on a metal feature

METHOD FOR INTEGRATING POROUS LOW-K DIELECTRIC LAYERS

Hermetic seal and reliable bonding structures for 3D applications

Edge seal for thru-silicon-via technology

Wafer scribe line structure for improving IC reliability

Warpage resistant semiconductor package and method for manufacturing the same

Seal ring in semiconductor device

Nitride semiconductor device including an electrode in ohmic contact with a P-type nitride semiconductor contact layer

High-density 3-dimensional resistors

Capacitor with nanotubes and method for fabricating the same

PROCESS FOR OBTAINING A THIN, INSULATING, SOFT MAGNETIC FILM OF HIGH MAGNETIZATION, CORRESPONDING FILM AND CORRESPONDING INTEGRATED CIRCUIT

METHOD OF CREATING SPIRAL INDUCTOR HAVING HIGH Q VALUE

ELECTRIC FUSE DEVICE MADE OF POLYSILICON SILICIDE

Apparatus for providing device with gaps for capacitance reduction

Semiconductor device

Image sensor with back-side illuminated photoelectric converters

Drain-extended field effect transistor

Method for preventing gate oxide damage of a trench MOSFET during wafer processing while adding an ESD protection module atop

Semiconductor device having capacitor formed on plug, and method of forming the same

Semiconductor device and method for manufacturing the same

Memory with high dielectric constant antifuses adapted for use at low voltage

Semiconductor component including a short-circuit structure

Transparent zirconia dispersion and zirconia particle-containing resin composition, composition for sealing light emitting element and light emitting element, hard coat film and optical functional film and optical component, and method for producing zirconia particle-containing resin

Substrate-free light emitting diode chip

Solide-state light source

III-nitride light emitting device including porous semiconductor layer

Solid-state light source

FIELD-EFFECT TRANSISTOR

Method and test structure for monitoring CMP processes in metallization layers of semiconductor devices

Structure for a Method and Structure for Screening NFET-to-PFET Device Performance Offsets Within a CMOS Process

Semiconductor device and method of manufacturing the same

ELECTROCONDUCTIVE THICK FILM COMPOSITION(S), ELECTRODE(S), AND SEMICONDUCTOR DEVICE(S) FORMED THEREFROM

Photoelectric conversion device, imaging device and photosensor

Copper alloy sputtering target and semiconductor element wiring

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

HEAT SINK DEVICE

Two-phase cross-connected micro-channel heat sink

Carbon-based waterlock with attached heat-exchanger for cooling of electronic devices

HEAT TRANSFER DEVICE AND METHOD OF MAKING SAME

TWO PHASE MICRO-CHANNEL HEAT SINK

Heat radiating fin

HEAT DISSIPATION APPARATUS

HEAT SINK AND METHOD FOR PRODUCING A HEAT SINK

Packaged micro movable device and method for making the same

DEVICES FOR COOLING AND POWER

Implementing enhanced wiring capability for electronic laminate packages

ADAMANTANE DERIVATIVE, EPOXY RESIN, AND OPTICAL ELECTRONIC MEMBER USING RESIN COMPOSITION COMPRISING THEM

ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

Semiconductor device, semiconductor wafer, and methods of producing the same device and wafer

Manufacturing method for electronic devices

Manufacturing method for partially-good memory modules with defect table in EEPROM

METHOD FOR FORMING AN INDUCTOR

Metal-based composite material containing both micron-size carbon fiber and nano-size carbon fiber

Semiconductor memory device capable of identifying a plurality of memory chips stacked in the same package

Semiconductor apparatus

Assembly device and assembly method for a cooling element

Heat dissipation device

HEAT DISSIPATING DEVICE AND HEAT SINK FASTENER

High Q and low stress capacitor electrode array

Print roll for a camera having an internal printer

Camera device incorporating a color printer with ink validation apparatus

Programmable structured arrays

INTEGRATED CIRCUIT DIE STRUCTURE SIMPLIFYING IC TESTING AND TESTING METHOD THEREOF

Overlay mark

Interconnect structure to reduce stress induced voiding effect

Microstrip structure including a signal line with a plurality of slit holes

Integrated circuit and manufacturing method of copper germanide and copper silicide as copper capping layer

Process integration scheme to lower overall dielectric constant in BEoL interconnect structures

Semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device and semiconductor device

Through substrate via semiconductor components

WAFER AND METHOD OF FORMING ALIGNMENT MARKERS

Method of designing semiconductor device

System including an inter-chip communication system

Power semiconductor module having a substrate and a pressure device

Semiconductor interconnect

DUAL WORK FUNCTION SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor structure

Semiconductor device with integrated circuit electrically connected to a MEMS sensor by a through-electrode

Segmented pillar layout for a high-voltage vertical transistor

Nonvolatile semiconductor memory device including via-holes continuously formed through plural cell array layers

Semiconductor device

Resin for optical-semiconductor-element encapsulation and optical semiconductor device obtained with the same

Light emitting structure and securing device thereof

Light emitting diode device for clamping electrically conductive element

Semiconductor light emitting device with a substrate having a cross sectional trapezoidal shape and an oblique surface

A1 alloy film, electronic device, and active matrix substrate for use in electrooptic display device

REFLOW APPARATUS AND METHOD

RESIN COMPOSITION AND HYBRID INTEGRATED CIRCUIT BOARD MAKING USE OF THE SAME

ELECTRODE AND METHOD FOR FORMING THE SAME

COOLING APPARATUS FOR ELECTRONIC EQUIPMENT

COPPER ALLOY THIN FILMS, COPPER ALLOY SPUTTERING TARGETS AND FLAT PANEL DISPLAYS

Combination Thermo-Electric and Magnetic Refrigeration System

Chip capacitor

Integrated circuit devices and methods and apparatuses for designing integrated circuit devices

Method and system for the modular design and layout of integrated circuits

Striped on-chip inductor

CONTROLLED AND SELECTIVE FORMATION OF CATALYST NANAOPARTICLES

Multimode transceiver for use with multiple antennas and method for use therewith

Method and system for forming an air gap structure

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION THEREOF

Semiconductor device fabrication method

Method of forming low-resistivity recessed features in copper metallization

Protected solder ball joints in wafer level chip-scale packaging

In situ deposition of a low κ dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application

Power semiconductor component with charge compensation structure and method for the fabrication thereof

Manufacturing method of semiconductor device

METHOD AND LINE FOR MANUFACTURING SEMICONDUCTOR DEVICE

Light guide

Self-diagnostic scheme for detecting errors

Light-emitting module, particularly for use in an optical projection apparatus

Illumination assembly having multiple reflective cavities each with a single emitter

Imaging device

Integrated non-isolated VRM and microprocessor assembly

INVERTED THROUGH CIRCUIT BOARD MOUNTING WITH HEAT SINK

Thermal module allowing adjustment in the height of heat sink relative to fixing rack

Micro-chimney and thermosiphon die-level cooling

ELECTRONIC APPARATUS

HEAT DISSIPATION DEVICE WITH FAN HOLDER

Heat dissipation device assembly with a fan duct having guiding members for guiding a screwdriver to assemble the heat dissipation device assembly to a printed circuit board

METHOD AND APPARATUS FOR HEAT TRANSFER

Liquid cooled module

Electrically conducting and optically transparent nanowire networks

MULTI-TIER CAPACITOR STRUCTURE, FABRICATION METHOD THEREOF AND SEMICONDUCTOR SUBSTRATE EMPLOYING THE SAME

Integrated circuit (IC) incorporating rows of proximal ink ejection ports

Apparatus for attenuating reflections of electromagnetic waves, method for its manufacture and its use

Fixing device of a radiator sheet

Integrated circuit device

Filter with magnetic layer and manufacturing method thereof

Structure of an apparatus for programming an electronically programmable semiconductor fuse

ATTACHMENT FOR SOCKET AND SEMICONDUCTOR DEVICE-TESTING UNIT HAVING THE SAME

Organic light emitting display apparatus

AIM-Compatible Targets for Use with Methods of Inspecting and Optionally Reworking Summed Photolithography Patterns Resulting from Plurally-Overlaid Patterning Steps During Mass Production of Semiconductor Devices

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

FLIP CHIP WAFER, FLIP CHIP DIE AND MANUFACTURING PROCESSES THEREOF

Contact plug of semiconductor device and method of forming the same

Semiconductor device

Nanotube-based directionally-conductive adhesive

Semiconductor device

Thermal attach for electronic device cooling

Composite contact for fine pitch electrical interconnect assembly

Stacked assembly of semiconductor packages with fastening lead-cut ends of leadframe

High-frequency hermetically-sealed circuit package

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND MASK PATTERN FOR MANUFACTURING THE SAME

Method for forming interlayer dielectric film, interlayer dielectric film, semiconductor device and semiconductor manufacturing apparatus

Semiconductor device, method of manufacturing the same, and phase shift mask

Fully differential, high Q, on-chip, impedance matching section

Structure of very high insertion loss of the substrate noise decoupling

Semiconductor device with dummy pattern within active region and method of manufacturing the same

Non-volatile memory devices

Product and method for integration of deep trench mesh and structures under a bond pad

Stress-generating shallow trench isolation structure having dual composition

Semiconductor device having SOI substrate and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Tunable antifuse elements

Method of manufacturing a semiconductor device having a group-III nitride superlattice layer on a silicon substrate

Wafer with scribe lanes comprising external pads and/or active circuits for die testing

Multilayer film with stack of nanometer-scale thicknesses

Heat transfer device

Method for manufacturing a heat pipe with a planished end surface

Thermal module allowing adjustment in the height of heat sink relative to fixing rack

HEAT TRANSFER MEMBER, CONVEX STRUCTURAL MEMBER, ELECTRONIC APPARATUS, AND ELECTRIC PRODUCT

Method for forming radio frequency identification tag on packing bag and device therefor

Heat pipe fin stack with extruded base

VACUUM CLEANER WITH HEAT SINK IN AIR PATH

INTERLAYER INSULATING FILM FORMATION METHOD

Electronic Device and Method for Manufacturing the Same

Hearing apparatus chip with a separate EMC ground and corresponding hearing apparatus

Device mounting structure and device mounting method

Universal patterned metal thermal interface

Memory heat sink device provided with a larger heat dissipating area

Heat dissipation assembly for graphics card and blade server using the same

LIGHT EMITTING DEVICE, LIGHT RECEIVING DEVICE, SPATIAL TRANSMISSION DEVICE, LENS DESIGN METHOD, AND ILLUMINATING DEVICE

Imaging system with relaxed assembly tolerances and associated methods

Camera module and electronic apparatus having the same

Imaging module package

Disposable built-in self-test devices, systems and methods for testing three dimensional integrated circuits

Process for Producing Circuit Substrate and Circuit Substrate Obtained in Accordance With the Process

Semiconductor device having dual damascene structure

Method for fabricating a semiconductor device that includes processing an insulating film to have an upper portion with a different composition than an other portion

DESIGN STRUCTURE FOR BRIDGE OF A SEMINCONDUCTOR INTERNAL NODE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of manufacturing a multilayer interconnection structure in a semiconductor device

Semiconductor Device and Method of Fabricating the Same

DUAL DAMASCENE BEOL INTEGRATION WITHOUT DUMMY FILL STRUCTURES TO REDUCE PARASITIC CAPACITANCE

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

Semiconductor device including main substrate and sub substrates

Semiconductor chip and semiconductor device

Wafer and a method of dicing a wafer

Semiconductor device, DRAM integrated circuit device, and method of producing the same

Manufacturing method for forming an integrated circuit device and corresponding integrated circuit device

SEMICONDUCTOR DEVICE WITH AT LEAST ONE AIR GAP PROVIDED IN CHIP OUTER AREA

Semiconductor package

IMAGE CAPTURE MODULE

MICROELECTRONIC IMAGER PACKAGES AND ASSOCIATED METHODS OF PACKAGING

DUAL WIRED INTEGRATED CIRCUIT CHIPS

Light modulating sensing MOSFET transistor and process for manufacturing the same

SEMICONDUCTOR DEVICE CAPABLE OF IMPROVING CONTACT RESISTANCE AND METHOD FOR MANUFACTURING THE SAME

Optoelectronic Semiconductor Chip

LED packaging structure and production method thereof

Double collimator LED color mixing system

LED array for microdisplays or like application

Semiconductor device

Siloxane-grafted silica, transparent silicone composition, and optoelectronic device encapsulated therewith

Microbolometer infrared security sensor

METHOD FOR MAKING AIRTIGHT CONTAINER

Method of multi-stage substrate etching and terahertz oscillator manufactured using the same method

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method for encapsulating electrical and/or electronic components in a housing

Conductive through via structure and process for electronic device carriers

WIRING SUBSTRATE AND ASSOCIATED MANUFACTURING METHOD

MICRO DEVICE WITH MICROTUBES

Method and apparatus for cooling electronic or other devices

Heat collector

HEAT SINK

Heat dissipation module

Iron-nickel alloy strip for the manufacture of support grids for the integrated circuits

Production method of an electronic circuit device

Method of controlling a fabrication process using an iso-dense bias

Insulating film-forming composition

TRANSCEIVER FOR USE WITH MULTIPLE ANTENNAS AND METHOD FOR USE THEREWITH

Protection of seedlayer for electroplating

Manufacturing method of semiconductor integrated device with inverting plating cup

Selective epitaxial growth method using halogen containing gate sidewall mask

Method for Laterally Cutting Through a Semiconductor Wafer and Optoelectronic Component

Light emitting devices with phosphor wavelength conversion and methods of fabrication thereof

Method for manufacturing semiconductor device including ferroelectric capacitor

Thermal interface material with thin transfer film or metallization

Thermal interface material with thin transfer film or metallization

CIRCUIT BOARD, METHOD FOR MANUFACTURING SUCH CIRCUIT BOARD, AND ELECTRONIC COMPONENT USING SUCH CIRCUIT BOARD

Methods of forming magnetic vias to maximize inductance in integrated circuits and structures formed thereby

Thermal module

LED illumination system with polarization recycling

Heat dissipating device

Structure and method to form a heat sink

Water cooled heat dissipation module for electronic device

Heat sink for dissipating heat and apparatus having the same

Structure and manufacturing method of substrate board

Method and system for removing heat

Structure and method for overlay measurement

Homeland intelligence systems technology “H-List”