Spiral inductor

Inductor/transformer and manufacturing method thereof

SEMICONDUCTOR DEVICE WITH CONTROLLABLE DECOUPLING CAPACITOR

Semiconductor integrated circuit

Light emitting device and fabricating method thereof

Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

Semiconductor Device and Method of Manufacturing the Same

Metal wiring layer and method of fabricating the same

Spacer process for on pitch contacts and related structures

Semiconductor integrated circuit device and a method of manufacturing the same

Semiconductor device having a multilayer interconnection structure that includes an etching stopper film

Solving via-misalignment issues in interconnect structures having air-gaps

INTEGRATED CIRCUIT DEVICE AND METHOD

Back end integrated WLCSP structure without aluminum pads

Semiconductor device

Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and passivating coupling material comprising multiple organic components for use in a semiconductor device

Semiconductor device and method for manufacturing the same

Seal ring structure with improved cracking protection and reduced problems

CAPACITOR OF SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

ANTIFUSE ELEMENT IN WHICH MORE THAN TWO VALUES OF INFORMATION CAN BE WRITTEN

Electrical fuse and method of making

SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING THE SAME

Dual image sensor and manufacturing method thereof

Power device

Wiring board and method for manufacturing the same

Semiconductor device and inverter circuit having the same

Lighting structure comprising at least one light-emitting diode, method for making same and uses thereof

Light-emitting device

Mask design elements to aid circuit editing and mask redesign

SUBSTRATE STRUCTURE

Packaging substrate having pattern-matched metal layers

Water cooling type heat dissipation module for electronic device

HEAT REMOVAL METHOD AND HEAT REMOVAL APPARATUS

HEAT EXCHANGER

HEAT SINK

COOLING STRUCTURE FOR ELECTRIC DEVICE

Ceramic substrate grid structure for the creation of virtual coax arrangement

METHOD FOR REMOVING OXIDES

Reworking method for integrated circuit devices

Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor to be used for reliability evaluation

Over-passivation process of forming polymer layer over IC chip

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Techniques for impeding reverse engineering

Semiconductor integrated circuit devices having high-Q wafer back-side capacitors

Method for forming MIM capacitor in a copper damascene interconnect

Method for improved power distribution in a three dimensional vertical integrated circuit

Electronic Package and Method of Preparing Same

Surface Coating

Substrate anchor structure and method

Surface coating process

Surface coating process

Diffusion And Laser Photoelectrically Coupled Integrated Circuit Signal Line

Data storage in circuit elements with changed resistance

LED LAMP HAVING A HEAT DISSIPATION DEVICE INCORPORATING A HEAT PIPE STRUCTURE THEREIN

Power semiconductor module comprising load connection elements applied to circuit carriers

Electronic-component-mounting board

Heat sink assembly having a fixing base thereof

Heat dissipating device

Chip Cooling System with Convex Portion

Circuitized substrate with internal cooling structure and electrical assembly utilizing same

HEAT-RADIATING MODULE WITH COMPOSITE PHASE-CHANGE HEAT-RADIATING EFFICIENCY

Heat dissipating device

HEAT-DISSIPATING DEVICE OF PORTABLE ELECTRONIC APPARATUS

MEMORY MODULE HEAT SINK

Method and computer system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry

Metal-insulator-metal capacitors

Method of protecting circuits using integrated array fuse elements and process for fabrication

Inspection apparatus having heat sink assembly

Cross-coupled inductor pair formed in an integrated circuit

Circuit architecture for radiation resilience

Integrated circuit with stress sensing element

Multi-phase voltage regulation module

Ceramic substrate grid structure for the creation of virtual coax arrangement

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

DUAL INTEGRATION SCHEME FOR LOW RESISTANCE METAL LAYERS

Semiconductor device

Semiconductor structure and method of manufacture

Apparatus for improved power distribution in a three dimensional vertical integrated circuit

Integrated circuit and process for fabricating thereof

Semiconductor device and method for manufacturing the same

INTERCONNECT STRUCTURE AND METHOD OF MAKING SAME

SEMICONDUCTOR CLAMP SYSTEM

WAFER SCALE INTEGRATED THERMAL HEAT SPREADER

Method and System for Providing a Continuous Impedance Along a Signal Trace in an IC Package

Interlayer insulating film, interconnection structure, and methods of manufacturing the same

SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method thereof

Semiconductor device comprising MIM capacitor

MIM capacitor structure having penetrating vias

ANTI-FUSE STRUCTURE INCLUDING A SENSE PAD CONTACT REGION AND METHODS FOR FABRICATION AND PROGRAMMING THEREOF

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE INCORPORATING FUSE ELEMENTS

Fuse of Semiconductor Device and Method for Forming the Same

THIN FILM DEVICE WITH LAYER ISOLATION STRUCTURE

Electrical fuse having a fully silicided fuselink and enhanced flux divergence

Semiconductor device with a plurality of ground planes

Semiconductor device and fabrication method for the same

Semiconductor device

Radio Frequency Device of Semiconductor Type

Semiconductor device and method for manufacturing same

Methods, structures and designs for self-aligning local interconnects used in integrated circuits

Floating body field-effect transistors, and methods of forming floating body field-effect transistors

Light emitting diode package

Critical dimension for trench and vias

Electronic component

Spin isolation apparatus, spin asymmetric material producing method, current source, and signal processing method

Surface coating

Sensor for a hardware protection system for sensitive electronic-data modules protecting against external manipulations

Composite substrate

Method of manufacturing a printed circuit board (PCB)

HEAT DISSIPATION MODULE AND BASE AND MANUFACTURING METHOD THEREOF

Heat dissipation device with U-shaped and S-shaped heat pipes

ADHESION IMPROVEMENT OF DIELECTRIC BARRIER TO COPPER BY THE ADDITION OF THIN INTERFACE LAYER

System for recycling energy

FLUID DISPENSERS AND METHODS FOR DISPENSING VISCOUS FLUIDS WITH IMPROVED EDGE DEFINITION

Structures including means for lateral current carrying capability improvement in semiconductor devices

Delay adjusting method and LSI that uses air-gap wiring

CURABLE RESIN COMPOSITION

Switching element, antenna switch circuit and radio frequency module using the same

Method of producing insulator thin film, insulator thin film, method of manufacturing semiconductor device, and semiconductor device

Method for forming tantalum nitride film

Methods and systems for forming at least one dielectric layer

Image sensor

Element with optical marking, manufacturing method, and use

Carrier frame for electronic components and production method for electronic components

Three-dimensional memory module architectures

LED LAMP WITH A HEAT SINK

Immersed LEDs

LED array

LED LAMP WITH A HEAT SINK

Apparatus for securing heat sinks to a device under test

HEAT DISSIPATING DEVICE FOR MEMORY CARD

ELECTRONIC APPARATUS

IMAGE CAPTURE DEVICE AND METHOD FOR MANUFACTURING SAME

FREQUENCY DIVISION COUPLING CIRCUIT AND APPLICATIONS THEREOF

Edit structure that allows the input of a logic gate to be changed by modifying any one of the metal or via masks used to form the metal interconnect structure

System and method to manufacture an implantable electrode

Semiconductor device

Semiconductor device

Semiconductor package

Semiconductor Device and Fabricating Method Thereof

On-chip temperature gradient minimization using carbon nanotube cooling structures with variable cooling capacity

Packaging substrate having capacitor embedded therein

Semiconductor device and method for fabricating same

Through-silicon vias and methods for forming the same

DESIGN STRUCTURE INCORPORATING VERTICAL PARALLEL PLATE CAPACITOR STRUCTURES

Anti-fuse cell and its manufacturing process

Fuse box including a guard ring electrically connected to the fuse pattern and method of forming the same

Wafer level package and mask for fabricating the same

Package comprising an electrical circuit

Metal gate compatible electrical fuse

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

PROCESS FOR FABRICATING A FIELD-EFFECT TRANSISTOR WITH DOPING SEGREGATION USED IN SOURCE AND/OR DRAIN

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE

LED ARRANGEMENT FOR PRODUCING PURE MONOCHOMATIC LIGHT

Image detector

Method and resulting structure for fabricating test key structures in DRAM structures

PRINTED WIRING BOARD AND ELECTRONIC APPARATUS

Electronic control unit and process of producing the same

Heat conducting apparatus

Electrical connector assembly with heat dissipating device

HEAT DISSIPATING ASSEMBLY WITH REDUCED THERMAL GRADIENT

Turbo-guiding type cooling apparatus

Multistage heat exchanging duct comprising a parallel conduit

System and Method for Cooling Using Two Separate Coolants

Heat sink system and assembly

MINIATURIZED ICE WATER COOLING CIRCULATORY SYSTEM

Diagnostic method for root-cause analysis of FET performance variation

SYSTEM AND METHOD OF REPORTING AND MANAGING REAL-TIME AIRFLOW WITHIN AN INFORMATION HANDLING SYSTEM

Analyte Monitoring Device and Methods of Use

Analyte Monitoring Device and Methods of Use

Method of fabricating a semiconductor device with a dopant region in a lower wire

Method of Forming Metal Line of Semiconductor Device

Method of forming metallic bump and seal for semiconductor device

Method of forming metallic bump on I/O pad

Electrical fuse and method of making

Method for cutting solid-state image pickup device

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS

MULTILAYER CIRCUIT DEVICES AND MANUFACTURING METHODS USING ELECTROPLATED SACRIFICIAL STRUCTURES

LED light structure and combination device thereof

METHOD OF PROVIDING AN ENCAPSULATION LAYER STACK, COATING DEVICE AND COATING SYSTEM

LIGHT SOURCE MODULE

Light emitting diode based light source assembly

LED lamp with a heat sink assembly

Electrical Subassembly Comprising a Protective Sheathing

LOOP HEAT PIPE AND ELECTRONIC EQUIPMENT

Density-conforming vertical plate capacitors exhibiting enhanced capacitance and methods of fabricating the same

ESD protection circuit for IC with separated power domains

Method of laser marking, laser marking apparatus and method and apparatus for detecting a mark

Packaging a semiconductor wafer

Spiral inductor device

Mobile telephone with interblock control for power conservation

Method and apparatus for high performance switch mode voltage regulators

Reconfigurable connections for stacked semiconductor devices

Light-emitting systems

Radiation-emitting device

Projection module for a headlamp or an automobile light

Alignment mark

Epoxy resin composition and semiconductor device

Structure and methods of forming contact structures

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same

Semiconductor device having crack stop structure

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING BARRIER METAL LAYER THEREOF

Conductor structure including manganese oxide capping layer

Package substrate and method for fabricating the same

Semiconductor device

Cooling system for semiconductor devices

Tenon-and-mortise packaging structure

Semiconductor package and electronic device having the same

COF board

Metallic compound thin film that contains high-k dielectric metal, nitrogen, and oxygen

Structure and Method for Device-Specific Fill for Improved Anneal Uniformity

Electrical isolation of monolithic circuits using a conductive through-hole in the substrate

Method of forming poly pattern in R-string of LCD drive IC and structure of the same

Stack capacitor in semiconductor device and method for fabricating the same including one electrode with greater surface area

Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structure

Antifuse structures, antifuse array structures, methods of manufacturing the same

Fuse structure including monocrystalline semiconductor material layer and gap

Pinched poly fuse

On-chip cooling systems for integrated circuits

Semiconductor device and manufacturing method thereof

Semiconductor device

Power module

WIRE BOND LED LIGHTING UNIT

Multiple conversion material light emitting diode package and method of fabricating same

Bare die semiconductor device configured for lamination

Heat dissipation device for LED chips

Imager module packaging having top and bottom glass layers

Link processing with high speed beam deflection

SUPPORT ASSEMBLY

Semiconductor device, its manufacturing method, and sputtering target material for use in the method

Straddle type vehicle

Layered heat spreader and method of making the same

Thermal dissipating device

Cooling structure for electric device

HEAT DISSIPATION DEVICE FOR LED CHIPS

Microjet module assembly

Solar cell assembly

Showerhead assembly

Supercritical fluid-assisted direct write for printing integrated circuits

Method of fabricating an inductor structure on an integrated circuit structure

Method for producing a structure

IMMUNITY TO CHARGING DAMAGE IN SILICON-ON-INSULATOR DEVICES

Analyte Monitoring Device and Methods of Use

OXIDE PARTICLE-CONTAINING POLYSILOXANE COMPOSITION AND METHOD FOR PRODUCING SAME

Electrical connector assembly with fastening element

Self-assembled sidewall spacer

Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor device

METHOD FOR FORMING METAL LINE OF SEMICONDUCTOR DEVICE BY ANNEALING ALUMINUM AND COPPER LAYERS TOGETHER

Sprocket opening alignment process and apparatus for multilayer solder decal

Method of fabricating semiconductor package

Aluminum/silicon carbide composite and radiating part comprising the same

Multi-chip memory device with stacked memory chips, method of stacking memory chips, and method of controlling operation of multi-chip package memory

LED array grid, method and device for manufacturing said grid and LED component for use in the same

Light guide member, flat light source device, and display device

Manufacturing method of substrate, manufacturing method of wiring board, wiring board, electronic device, electron source, and image display apparatus

Semiconductor package

EMI SHIELDING AND HEAT DISSIPATING STRUCTURE

Semiconductor capacitor structure and layout pattern thereof

TRANSPONDER INLAY FOR A PERSONAL DOCUMENT AND METHOD OF MANUFACTURING SAME

Solution of power consumption reduction for inverter covered by metal case

On-chip identification circuit incorporating pairs of conductors, each having an essentially random chance of being shorted together as a result of process variations

Air gap for interconnect application

Shielding structure for semiconductors and manufacturing method therefor

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

On-chip inductors with through-silicon-via fence for Q improvement

Electromigration fuse and method of fabricating same

Single crystal fuse on air in bulk silicon

Capacitors integrated with metal gate formation

Intermediate optical packages and systems comprising the same, and their uses

Optoelectronic Semiconductor Chip

Image sensor having two-dimensionally arrayed pixels, focus detecting device using the sensor, and imaging system including the sensor

Substrate for AC/AC multiple-phase power converter

System and Method for Substrate with Interconnects and Sealing Surface

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COOLER

Water-cooling heat-dissipating module of electronic apparatus

PROCESS FOR PRODUCING NONFLAT CERAMIC SUBSTRATE

Method of manufacturing a printed wiring board

Analyte monitoring device and methods of use

Structure for a stacked power clamp having a BigFET gate pull-up circuit

Heat-resistant resin paste and method for producing same

ATTACH PASTE COMPOSITION FOR SEMICONDUCTOR PACKAGE

Method of making a semiconductor device having improved contacts

Aluminum contact integration on cobalt silicide junction

Method of fabricating semiconductor device having alignment key and semiconductor device fabricated thereby

Dummy Contact Fill to Improve Post Contact Chemical Mechanical Polish Topography

Void free soldering semiconductor chip attachment method for wafer scale chip size

Deposition method of III group nitride compound semiconductor laminated structure

Methods to fabricate functionally gradient materials and structures formed thereby

Deposition processes for titanium nitride barrier and aluminum

Programmable ROM using two bonded strata

Light source with variable radiation characteristic

Integrated electrical shield in a heat sink

HEAT SINK MODULE AND METHOD OF MANUFACTURING THE SAME

Vibrating device, jet flow generating device, electronic device, and manufacturing method of vibrating device

Imaging apparatus including a cooled imaging element which is shifted to perform high-definition imaging