CHIP INDUCTOR

Semiconductor device having ESD protection circuit and method of testing the same

Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded

Alignment features for proximity communication

Semiconductor device and layout method thereof

Semiconductor device having a multilayered interconnection structure

Cladded silver and silver alloy metallization for improved adhesion electromigration resistance

Electrical contacts for integrated circuits and methods of forming using gas cluster ion beam processing

Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuits

Semiconductor device with copper wirebond sites and methods of making same

Wafer-level package and method of manufacturing the same

Method of fabrication of on-chip heat pipes and ancillary heat transfer components

Power semiconductor module

Semiconductor device and method for manufacturing the same

Packaging carrier with high heat dissipation and method for manufacturing the same

SIDEWALL PROTECTION LAYER

Semiconductor device and method for manufacturing same

Vertical diode based memory cells having a lowered programming voltage and methods of forming the same

Three dimensional vertical E-fuse structures and methods of manufacturing the same

SEMICONDUCTOR FUSE STRUCTURE AND METHOD

Semiconductor structure comprising an electrically conductive feature and method of forming a semiconductor structure

On chip antenna and method of manufacturing the same

Semiconductor storage device and manufacturing method of the same

Method for Reduction of Resist Poisoning in Via-First Trench-Last Dual Damascene Process

Semiconductor device and method of manufacturing the same

Biosensor using nanoscale material as transistor channel and method of fabricating the same

High-voltage semiconductor switching element

Increased reliability for a contact structure to connect an active region with a polysilicon line

Image detecting device and image capturing system

Circuit board, electronic device and method for manufacturing the same

Heat exchange enhancement

Heat pipe with composite wick structure

Heatsink apparatus and electronic device having the same

THERMOELECTRIC MODULE SUBSTRATE AND THERMOELECTRIC MODULE USING SUCH BOARD

Method to Form Pin Having Void Reducing Pin Head and Flattening Head to Perform the Method

Cooling Body for Electronics Housing

Electronic assembly and techniques for installing a heatsink in an electronic assembly

Method and apparatus for creating a Spacer-Optimization (S-O) library

Method of forming a semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thicknesses formed thereon

Method for fabricating semiconductor device

METHOD OF FORMING METAL WIRING LAYER OF SEMICONDUCTOR DEVICE

Method and apparatus for managing manufacturing equipment, method for manufacturing device thereby

Method and apparatus for spacer-optimization (S-O)

Production method for semiconductor device

Metal photoetching product and production method thereof

WAFER HAVING SCRIBE LANES SUITABLE FOR SAWING PROCESS, RETICLE USED IN MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING THE SAME

Spin-on antireflective coating for integration of patternable dielectric materials and interconnect structures

Electroless palladium plating liquid

Structure to share internally generated voltages between chips in MCP

Method of forming a single-layer metal conductors with multiple thicknesses

HEAT DISSIPATION DEVICE FOR COMPUTER ADD-ON CARD

Heat dissipation device with a heat pipe

Heat sink and cooling unit using the same

Comb-shaped power bus bar assembly structure having integrated capacitors

Electric power conversion apparatus including cooling units

Stackable self-aligning insulative guide tray for holding semiconductor substrates

Heat transfer system for memory modules

Semiconductor chips having improved electrostatic discharge protection circuit arrangement

Methods and systems for lithography process control

Forming a helical inductor

Integrated circuit including inductive device and ferromagnetic material

Semiconductor integrated circuit

Local defect memories on semiconductor substrates in a stack computer

Evaluation pattern suitable for evaluation of lateral hillock formation

Test structures, systems, and methods for semiconductor devices

EFUSE SYSTEM AND TESTING METHOD THEREOF

Semiconductor wafer, semiconductor chip cut from the semiconductor wafer, and method of manufacturing semiconductor wafer

Semiconductor device having multilayer interconnection structure

Semiconductor device

Preventing breakage of long metal signal conductors on semiconductor substrates

INTERCONNECT STRUCTURE AND FABRICATING METHOD OF THE SAME

Semiconductor Device with Multi-Layer Metallization

Semiconductor device with a low dielectric constant film between lower interconnections

Method of fabricating improved interconnect structure with a via gouging feature absent profile damage to the interconnect dielectric

Patternable dielectric film structure with improved lithography and method of fabricating same

Interconnect structures with patternable low-k dielectrics and method of fabricating same

Method for stacking semiconductor chips

Integrated semiconductor substrate structure using incompatible processes

Semiconductor substrate elastomeric stack

Large substrate structural vias

COF package and tape substrate used in same

Semiconductor package and method for manufacturing the same

Semiconductor device, method for manufacturing semiconductor device, and method for designing manufacturing semiconductor device

Capacitor structure having butting conductive layer

Semiconductor device having fuse with protection capacitor

Substrate provided with semiconductor films and manufacturing method thereof

Manufacturing method of SOI substrate provided with barrier layer

METHOD FOR FORMING A DIELECTRIC STACK

Method and structure for improving device performance variation in dual stress liner technology

Superjunction structures for power devices

Multi-channel ESD device and method therefor

Semiconductor device having decreased contact resistance

Semiconductor device and method for manufacturing the same

Semiconductor integrated circuit device and a method of manufacturing the same

Integrated circuit device and method for forming the same

Assembly of a heat dissipating base and a lead frame for a light emitting diode packaging device and method for making the same

Method for Forming Cu Film

Dielectric sheet

Mesh grid protection

DATA READING METHOD FOR SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY DEVICE

Interface for bridging out-of-band information from a downstream communication link to an upstream communication link

Integrated circuit tester information processing system

System and method for semiconductor identification chip read out

PACKAGED BIOMEDICAL ELECTRODE UNIT AND METHOD OF INSPECTING QUALITY THEREOF

Heat transfer member and connector

Silicon Carbide Doped Oxide Hardmask For Single and Dual Damascene Integration

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

System and process for producing nanowire composites and electronic substrates therefrom

Substrate provided with an alignment mark in a substantially transmissive process layer, mask for exposing said mark, device manufacturing method, and device manufactured thereby

Integrated high voltage capacitor having capacitance uniformity structures and a method of manufacture therefor

Process for making microelectronic element chips

Thermally conductive graphite reinforced alloys

Electrochemically deposited indium composites

ALUMINUM-SILICON CARBIDE COMPOSITE BODY AND METHOD FOR PROCESSING THE SAME

Pitch-based carbon fiber, web and resin molded product containing them

MINIATURIZED LIQUID COOLING DEVICE HAVING DROPLET GENERATOR AND PIZEOELECTRIC MICROPUMP

COOLING APPARATUS FOR ELECTRONIC DEVICES

HEAT SINK, HEAT SINK FAN, AND METHOD FOR MANUFACTURING THE SAME

Circuit board for mounting multilayer chip capacitor and circuit board apparatus including the multilayer chip capacitor

Semiconductor device with capacitor

Circuit arrangement comprising an electronic component and an ESD protection arrangement

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE

IMAGE SENSOR

Inkjet printhead having nozzle arrangements with actuator pivot anchors

Ink jet printhead with displaceable nozzle crown

Method for pre-treating epitaxial layer, method for evaluating epitaxial layer, and apparatus for evaluating epitaxial layer

Passivation film and electronic display device including the passivation film

Phosphor-containing molded member, method of manufacturing the same, and light emitting device having the same

Microelectronic circuit structure with layered low dielectric constant regions

Interconnect Structures Incorporating Air-Gap Spacers

INTERCONNECT STRUCTURE WITH IMPROVED ELECTROMIGRATION RESISTANCE AND METHOD OF FABRICATING SAME

Semiconductor device

Wiring structure, semiconductor device and manufacturing method thereof

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer

CONTACT FORMING IN TWO PORTIONS AND CONTACT SO FORMED

Structure and method for fabricating flip chip devices

Semiconductor package with package main body cooling structure using coolant, and semiconductor package assembly with the semiconductor package and coolant circulating structure

Electronic assemblies providing active side heat pumping

Microelectromechanical device packages with integral heaters

Carrier structure stacking system and method

Methods and articles incorporating local stress for performance improvement of strained semiconductor devices

Semiconductor device and method for fabricating the same

Semiconductor device and method of producing the same

Semiconductor device and method of producing the same

Semiconductor Manufacturing Process Charge Protection Circuits

Nitride semiconductor light-emitting device

Programmable via structure for three dimensional integration technology

Anti-fuse memory device

Rubber-modified polyamide resin, epoxy resin composition and cured product thereof

ELECTRONIC DEVICE MOUNTING STRUCTURE AND METHOD OF MAKING THE SAME

Finned heat pipe comprising concentric pipes of different length

HEAT-RADIATING DEVICE WITH COMPOSITE RADIATION EFFICIENCY

Fluid heat exchanger configured to provide a split flow

Cooling Hot-Spots by Lateral Active Heat Transport

Device and methods for internal cooling of an integrated circuit (IC)

Integrated laser auto-destruct system for electronic components

Three dimensional integrated circuits and methods of fabrication

Three dimensional memory in a system on a chip

Analyte Monitoring Device and Methods of Use

Analyte Monitoring Device and Methods of Use

Analyte Monitoring Device and Methods of Use

Analyte Monitoring Device and Methods of Use

Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin

Socket connector assembly with a heat sink detachably attached thereon

Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias

Semiconductor device and manufacturing method thereof

Method for fabricating a semiconductor device

HERMETIC SEAL COVER AND METHOD FOR MANUFACTURING THE SAME

Composite thermal interface material including aligned nanofiber with low melting temperature binder

Resin Sealing and Molding Apparatus for Electronic Component

Multi-chip systems with optical bypass

Heat treatment apparatus heating substrate by irradiation with light

Electronic device

Heat sink having protective device for thermal interface material spread thereon

Heat spreader and method of making the same

Arrangement for heat dissipation

Electrostatic discharge protective circuit and semiconductor integrated circuit using the same

Surface inspection apparatus and surface inspection method for strained silicon wafer

IC HAVING IN-TRACE ANTENNA ELEMENTS

Planar inductive structure

Gain control methods and systems in an amplifier assembly

Methods and apparatus for detecting defects in interconnect structures

Probe card assembly with carbon nanotube probes having a spring mechanism therein

Electroluminescent device

Apparatus, circuit and method of wiring for supplying power

Method and structures for accelerated soft-error testing

Semiconductor device having circularly connected plural pads via through holes and method of evaluating the same

Method for fabricating semiconductor device and semiconductor device

Reworked integrated circuit device and reworking method thereof

Semiconductor device, display device, and method of manufacturing semiconductor device

METAL WIRING OF A SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Method for integrating selective ruthenium deposition into manufacturing of a semiconductior device

Semiconductor element and method for manufacturing same

SUBSTRATE, ELECTRONIC COMPONENT, ELECTRONIC CONFIGURATION AND METHODS OF PRODUCING THE SAME

SYSTEMS AND METHODS FOR BALL GRID ARRAY (BGA) ESCAPE ROUTING

Semiconductor device and method for fabricating the same

Integrated BEOL thin film resistor

MIM capacitor high-k dielectric for increased capacitance density

Semiconductor device and method for manufacturing the same

Semiconductor device having a nickel silicide layer on a single crystal silicon layer

Semiconductor memory device having layout area reduced

Semiconductor Device and Method of Fabricating the Same

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE HAVING MIM CAPACITOR AND METHOD OF MANUFACTURING THE SAME

Packaging technique for the fabrication of polarized light emitting diodes

LED chips having fluorescent substrates with microholes and methods for fabricating

Semiconductor substrate with islands of diamond and resulting devices

APPARATUS FOR DETECTING PATTERN ALIGNMENT ERROR

Programmable fuse/non-volatile memory structures in BEOL regions using externally heated phase change material

EDS protection for an image detecting device

Semiconductor device, manufacturing method thereof, and manufacturing method of antenna

ADJUSTABLE COOLING UNIT FOR SEMICONDUCTOR MODULE

COOLING DEVICE

Planar heat pipe for cooling

Liquid cooling jacket

Cooling with microwave excited micro-plasma and ions

Fin-type heat sink for electronic component

Heat sink for an electrical device and method of manufacturing the same

Method of designing a semiconductor integrated circuit having a dummy area and the semiconductor integrated circuit thereof

ANALYTE MONITORING DEVICE AND METHODS OF USE

Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component device

Epoxy Resin Composition for Sealing and Electronic Component Device

LOW k POROUS SiCOH DIELECTRIC AND INTEGRATION WITH POST FILM FORMATION TREATMENT

Laser trimming problem suppressing semiconductor device manufacturing apparatus and method

Method of manufacturing metal interconnection

Semiconductor device and method of manufacturing the same

Wafer-level packaging cutting method capable of protecting contact pads

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Methods for manufacturing thin film transistor and display device

Via configurable architecture for customization of analog circuitry in a semiconductor device

Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure

Resinous hollow package and producing method thereof

Multilayered structures and methods thereof

Laser circuit etching by additive deposition

CARBON FIBER COMPOSITE SHEET, USE THEREOF AS A HEAT CONDUCTOR AND PITCH-BASED CARBON FIBER WEB SHEET FOR USE IN THE SAME

Composite substrate and method for manufacture thereof

ANISOTROPIC FILM AND METHOD OF MANUFACTURING ANISOTROPIC FILM

Aerosol Jet (R) printing system for photovoltaic applications

Method for growing carbon nanotubes having a predetermined chirality

Method for sorting integrated circuit devices

Method for integration of magnetic random access memories with improved lithographic alignment to magnetic tunnel junctions

Housing comprising a housing underpart and method for emitting electromagnetic radiation

Heat dissipation device

Heat dissipation assembly

Heat dissipation assembly

Electronic system with a heat sink assembly

Bolster plate assembly for printed circuit board

Heat sink assembly and method manufacturing the same

HEAT DISSIPATION DEVICE FOR COMPUTER ADD-ON CARDS

HEAT DISSIPATION DEVICE

ESD PROTECTION CIRCUIT WITH IMPROVED COUPLING CAPACITOR

Substrate processing method, substrate processing system, program, and recording medium

Exposure device with mechanism for forming alignment marks and exposure process conducted by the same

Wiring board, method of designing the same, and electronic apparatus

Manufacturing system, manufacturing method, managing apparatus, managing method and computer readable medium

Test structure

Method for measuring a property of interconnections and structure for the same

Ultraviolet light monitoring system

Light-emitting device

Methods of fabricating semiconductor devices and structures thereof

Partitioned through-layer via and associated systems and methods

Method of embedding passive component within via

INTERCONNECTION STRUCTURE

Encapsulated silicidation for improved SiC processing and device yield

Semiconductor Device and Method of Manufacturing the Same

COPPER METAL LINE IN SEMICONDCUTOR DEVICE AND METHOD OF FORMING SAME

Post passivation structure for a semiconductor device and packaging process for same

Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package

Semiconductor device

Wafer level chip size package for MEMS devices and method for fabricating the same

WINDOW-TYPE BALL GRID ARRAY PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

Gallium nitride wafer

Selective removal of on-die redistribution interconnects from scribe-lines

WAFER

Semiconductor device structure and integrated circuit therefor

Semiconductor device having diode-built-in IGBT and semiconductor device having diode-built-in DMOS

Semiconductor device and method of designing the same

METAL-INSULATOR-METAL CAPACITOR AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Devices and Methods of Manufacture Thereof

Semiconductor Device and a Method for Fabricating the Same

Inductor of semiconductor device and method for manufacturing the same

Semiconductor structure with a discontinuous material density for reducing eddy currents

REPROGRAMMABLE METAL-TO-METAL ANTIFUSE EMPLOYING CARBON-CONTAINING ANTIFUSE MATERIAL

Electrical fuse device

Methods and systems involving electrically programmable fuses

Semiconductor memory

Method for self-aligned removal of a high-K gate dielectric above an STI region

Semiconductor device having multiple element formation regions and manufacturing method thereof

Semiconductor device, semiconductor element, and substrate

SMALL-SIZE MODULE

Semiconductor device

Electrostatic discharge protection circuit

Integration of silicon boron nitride in high voltage and small pitch semiconductors

Trench MOSFET with trench termination and manufacture thereof

CMOS inverter coupling circuit comprising vertical transistors

Low capacitance semiconductor device

LIGHT EMITTING DIODE MODULE

COSMIC RAY DETECTORS FOR INTEGRATED CIRCUIT CHIPS

ELECTRONIC UNIT AND PRODUCTION METHOD OF THE SAME