212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
HEAT DISSIPATION ASSEMBLY
#23402Heat dissipation module
#23403Heat dissipation device having a back plate unit
#23404NANOSTRUCTURED MICRO HEAT PIPES
#23405ELECTRICALLY INSULATED HEAT SINK WITH HIGH THERMAL CONDUCTIVITY
#23406ELECTRONIC APPARATUS
#23407METHOD AND APPARATUS FOR MONITORING PLASMA-INDUCED DAMAGE USING DC FLOATING POTENTIAL OF SUBSTRATE
#23408Nanoscale thermoelectric refrigerator
#23409Structure for on chip shielding structure for integrated circuits or devices on a substrate
#23410Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin
#23411Semiconductor device for use in radio tuner and method for manufacturing the same
#23412Method for fabricating a semiconductor device
#23413Method for forming a metal line in a semiconductor device
#23414Manufacturing method of semiconductor device and manufacturing apparatus of the same
#23415Indented lid for encapsulated devices and method of manufacture
#23416Memory circuit arrangement and method for the production thereof
#23417SEMICONDUCTOR LIGHT EMITTING DEVICE
#23418Interconnection structure having oxygen trap pattern in semiconductor device
#23419RELEASE FILM FOR SEMICONDUCTOR RESIN MOLDS
#23420Alloy for heat dissipation of semiconductor device and semiconductor module, and method of manufacturing alloy
#23421Digital camera with ink reservoir and ink reservoir information integrated circuit
#23422Semiconductor device including antifuse element
#23423Memory circuit arrangement and method for the production thereof
#23424Light source including reflective wavelength-converting layer
#23425LIGHT EMITTING DEVICE AND LIGHTING APPARATUS
#23426System and method for supporting one or more heat-generating electrical devices
#23427Heat dissipation device assembly with retainer device
#23428Heat-Dissipation Apparatus For Communication Device With Card Slot
#23429Wing-spanning thermal-dissipating device
#23430Micro thrust cooling
#23431HEAT DISSIPATION DEVICE
#23432LIQUID-COOLED GROUNDED HEATSINK FOR DIODE RECTIFIER SYSTEM
#23433Electronic apparatus
#23434Multi-functional composite substrate structure
#23435Integrated circuit, and apparatus and method for production thereof
#23436Composition of epoxy resin, spherical alumina, ultrafine silica polyorganosiloxane and phenolic resin
#23437Wafer-level packaged structure and method for making the same
#23438MULTILAYER WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE FOR USE IN IC INSPECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME
#23439Power layout of integrated circuits and designing method thereof
#23440Through-substrate via for semiconductor device
#23441SEMICONDUCTOR INTEGRATED CIRCUIT
#23442RELIABILITY IMPROVEMENT OF METAL-INTERCONNECT STRUCTURE BY CAPPING SPACERS
#23443Method of fabricating a patterned nanoscopic article
#23444Semiconductor device having seal ring structure
#23445IC package sacrificial structures for crack propagation confinement
#23446Semiconductor device and method for fabricating the same
#23447METHOD OF FABRICATING INDUCTOR IN SEMICONDUCTOR DEVICE
#23448Methods and Structures Involving Electrically Programmable Fuses
#23449Electrical fuse having a thin fuselink
#23450MOS structures that exhibit lower contact resistance and methods for fabricating the same
#23451Camera module and array based thereon
#23452Light Emitting Diode Array
#23453Light emitting diode module
#23454Light emitting device packages using light scattering particles of different size
#23455FLAT PANEL BASED LIGHT EMITTING DIODE PACKAGE STRUCTURE
#23456Semiconductor device having silicon carbide and conductive pathway interface
#23457High-output diamond semiconductor element
#23458CHIP ON FILM (COF) PACKAGE HAVING TEST PAD FOR TESTING ELECTRICAL FUNCTION OF CHIP AND METHOD FOR MANUFACTURING SAME
#23459Test device, SRAM test device, semiconductor integrated circuit device and methods of fabricating the same
#23460Semiconductor wafers and methods of fabricating semiconductor devices
#23461FEATURE FORMED BENEATH AN EXISTING MATERIAL DURING FABRICATION OF A SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEMS COMPRISING THE SEMICONDUCTOR DEVICE
#23462Metal Oxide Particle-Containing Polysiloxane Composition and Method for Producing Same
#23463Radiation detector
#23464Wiring structure and electronic device designed on basis of electron wave-particle duality
#23465Controllable heat transfer medium system and method for use with a circuit board
#23466Base Structure for a Heat Sink
#23467HEAT PIPE STRUCTURE OF A HEAT RADIATOR
#23468Electronic device cooling apparatus
#23469Miniature liquid cooling device with two sets of electrodes crossed over one another to drive a fluid
#23470COOLING FACILITY FOR AN ELECTRONIC COMPONENT
#23471Dissipating Module Structure for Heat Generating Device
#23472Evaporation-enhanced thermal management devices, systems, and methods of heat management
#23473Sheet-combined thermal-dissipating device
#23474Circuit board heat exchanger carrier system and method
#23475Solar-cell marking method and solar cell
#23476Method for embedding heat pipe into heat-conducting seat
#23477Semiconductor device using logic chip
#23478Selective wet etching of hafnium aluminum oxide films
#23479Insulated transformers, and power converting device
#23480Method and power supply system for preventing functional impairing transient noise within high frequency operated integrated circuits
#23481WLAN SiP module
#23482Thermal module and fin assembly thereof
#23483Cooling device for cooling a heat-generating component, and electronic apparatus having the cooling device
#23484Semiconductor device
#23485Inductor structure
#23486Thin film magnetic device and method of manufacturing the same
#23487Stacked memory without unbalanced temperature distributions
#23488Semiconductor device having via connecting between interconnects
#23489Semiconductor device for preventing voids in the contact region and method of forming the same
#23490IC device having compact design
#23491Semiconductor device containing an aluminum tantalum carbonitride barrier film and method of forming
#23492Semiconductor device with side terminals
#23493Power semiconductor module
#23494METHODS AND SYSTEMS INVOLVING ELECTRICALLY REPROGRAMMABLE FUSES
#23495Semiconductor device having breakdown voltage maintaining structure and its manufacturing method
#23496CMOS image sensor package structure
#23497Semiconductor device fabricated by selective epitaxial growth method
#23498SEMICONDUCTOR DEVICE
#23499ESD protection for high voltage applications
#23500Photonic crystal light emitting device
#23501Semiconductor chip and method for producing a semiconductor chip
#23502SILICONE BASED CIRCUIT BOARD INDICATOR LED LENS
#23503Light emitting diode (LED) with longitudinal package structure
#23504Contact structure and semiconductor device
#23505Semiconductor die with fuse window and a monitoring window over a structure which indicates fuse integrity
#23506Switch Device and Method of Fabricating the Same
#23507Electron bombarded image sensor array device as well as such an image sensor array
#23508Liquid cooling module
#23509Method and apparatus for preventing cracking in a liquid cooling system
#23510THERMAL MODULE AND FIN UNIT THEREOF
#23511Thermal contact arrangement
#23512Interposer with Electrical Contact Button and Method
#23513Method and apparatus for reducing optical emissions in an integrated circuit
#23514Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer
#23515Semiconductor device using metal nitride as insulating film and its manufacture method
#23516Method of fabricating an integrated circuit having a multi-layer structure with a seal ring
#23517Methods of passivating surfaces of wide bandgap semiconductor devices
#23518Electrical fuse with a thinned fuselink middle portion
#23519Printed wiring board, method for forming the printed wiring board, and board interconnection structure
#23520Exposure method and electronic device manufacturing method
#23521Corrugated interfaces for multilayered interconnects
#23522Packaging substrate having electrical connection structure and method for fabricating the same
#23523Cooling fan with balance structure
#23524Electronic system having free space optical elements
#23525Tamper respondent system
#23526Heat dissipation device having a rotatable fastener
#23527Heat sink assembly
#23528Fixing Structure and Heat Dissipation Device
#23529Circuit Carrier Structure with Improved Heat Dissipation
#23530Vapor chamber structure and method for manufacturing the same
#23531Heat dissipation device
#23532Heat dissipation module and detachable expansion card using the same
#23533COMPUTER COOLING SYSTEM AND METHOD
#23534Graphite heat dissipation apparatus and clamping frame for clamping graphite heat dissipation fin module
#23535Fluid-to-fluid spot-to-spreader heat management devices and systems and methods of managing heat
#23536Computer component protection
#23537Semiconductor device and method of fabricating the same
#23538Image sensor module for camera device
#23539DRIVING MODULE FOR DRIVING LCD PANEL AND METHOD OF FORMING LCD DEVICE
#23540Apparatus to monitor process-based parameters of an integrated circuit (IC) substrate
#23541Method for improving the efficiency of a power supply device
#23542Integrated circuits with inductors
#23543Electronic device, and information apparatus, communications apparatus, AV apparatus, and mobile apparatus using the same
#23544Low-loss electrical component with an amplifier
#23545Extrusion failure monitor structures
#23546SEMICONDUCTOR DEVICE PACKAGE HAVING A BACK SIDE PROTECTIVE SCHEME
#23547Bipolar and CMOS integration with reduced contact height
#23548SEMICONDUCTOR CIRCUIT DEVICE, WIRING METHOD FOR SEMICONDUCTOR CIRCUIT DEVICE AND DATA PROCESSING SYSTEM
#23549SEMICONDUCTOR DEVICE, PHOTOMASK, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND PATTERN LAYOUT METHOD
#23550Method for forming a damascene structure
#23551Power semiconductor component with metal contact layer and production method therefor
#23552Ionizing radiation blocking in IC chip to reduce soft errors
#23553Thermally insulating bonding pad structure for solder reflow connection
#23554Semiconductor device
#23555Heatsink and semiconductor device with heatsink
#23556Integrated circuit with galvanically bonded heat sink
#23557Semiconductor package
#23558Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it
#23559Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same
#23560Semiconductor device and methods of forming the same
#23561MODULE FOR INTEGRATING PERIPHERAL CIRCUIT AND A MANUFACTURING METHOD THEREOF
#23562Silicon nitride substrate, a manufacturing method of the silicon nitride substrate, a silicon nitride wiring board using the silicon nitride substrate, and semiconductor module
#23563Formation method of porous insulating film, manufacturing apparatus of semiconductor device, manufacturing method of semiconductor device, and semiconductor device
#23564Structure and method for creating reliable deep via connections in a silicon carrier
#23565Metal sealed wafer level CSP
#23566Stress relief of a semiconductor device
#23567On-chip decoupling capacitor structures
#23568On-chip decoupling capacitor structures
#23569SEMICONDUCTOR DEVICE
#23570FUSE BOX AND METHOD FOR FABRICATING THE SAME AND METHOD FOR REPAIRING THE SAME IN SEMICONDUCTOR DEVICE
#23571Low crosstalk substrate for mixed-signal integrated circuits
#23572Semiconductor device including a film for applying stress to a channel formation region to increase current flow
#23573Semiconductor device and method of manufacturing the same
#23574LIGHT EMITTING DIODE PACKAGE STRUCTURE
#23575Package and semiconductor device for preventing occurrence of false connection
#23576Light emitting diodes with a P-type surface bonded to a transparent submount to increase light extraction efficiency
#23577(Thio)phenoxy phenyl silane compostion and method for making same
#23578Processing method, manufacturing method of semiconductor device, and processing apparatus
#23579Pattern inspection method and pattern inspection system
#23580Method for Forming a Solder Mold with Venting Channels and Method for Using the Same
#23581Method for sorting integrated circuit devices
#23582WIRING SUBSTRATE WITH LEAD PIN AND LEAD PIN
#23583Heat exchange system
#23584Pumpless liquid cooling system
#23585HEAT SINK AND MANUFACTURING METHOD THEREOF
#23586Methods of forming inductors on integrated circuits
#23587Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing
#23588Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback
#23589Connector and printed circuit board
#23590In-situ deposition for Cu hillock suppression
#23591Method of forming a wire structure
#23592High power MCM package with improved planarity and heat dissipation
#23593Semiconductor structure and method of manufacturing same
#23594Monolithic ceramic component and production method
#23595Strengthening of a structure by infiltration
#23596Integrated laser and photodetector chip for an optical subassembly
#23597Thermal-emitting memory module, thermal-emitting module socket, and computer system
#23598Switching device, rewritable logic integrated circuit, and memory device
#23599SEMICONDUCTOR STORAGE DEVICE AND METHOD OF FABRICATING THE SAME
#23600Electric power conversion system
#23601Illuminating device for microscopes
#23602Electronic assemblies without solder having overlapping components
#23603Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board
#23604Heat sink assembly with a locking device
#23605Apparatus for transferring heat from a heat spreader
#23606Cr-Cu alloy, method for producing the same, heat-release plate for semiconductor, and heat-release component for semiconductor
#23607HEAT-DISSIPATING MODULE
#23608Heat sink assembly having a fastener assembly for fastening the heat sink to an electronic component
#23609Heat sink assembly having a clip
#23610APPARATUS AND METHOD FOR ATTACHING HEATSINKS
#23611Heatsink, method of manufacturing same, and microelectronic package containing same
#23612HEAT-DISSIPATING MODULE
#23613Heat-dissipating module
#23614Miniaturized liquid cooling device
#23615HEAT-DISSIPATING MODULE
#23616Cooling device for memory chips
#23617Multi-purpose poly edge test structure
#23618Processing method for graphite piece
#23619Semiconductor device having alignment mark and its manufacturing method
#23620Via configurable architecture for customization of analog circuitry in a semiconductor device
#23621Semiconductor device having p-n column portion
#23622System and method for providing semiconductor device features using a protective layer
#23623Semiconductor structures including tight pitch contacts and methods to form same
#23624SEMICONDUCTOR DEVICE HAVING A LOCALLY ENHANCED ELECTROMIGRATION RESISTANCE IN AN INTERCONNECT STRUCTURE
#23625Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices
#23626Electrical fuses and resistors having sublithographic dimensions
#23627Intermetallic conductors
#23628Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics
#23629Semiconductor device having a contact pattern electrically connecting at least three conductive layers
#23630Semiconductor device which may prevent electrical failures of contacts
#23631Semiconductor device having a mim capacitor and method of manufacturing the same
#23632Tantalum amido-complexes with chelate ligands useful for CVD and ALD of TaN and Ta205 thin films
#23633Small area, robust silicon via structure and process
#23634INTEGRATED CIRCUIT
#23635SOLDER BUMP ON A SEMICONDUCTOR SUBSTRATE
#23636Electronic package with direct cooling of active electronic components
#23637Cooling systems for power semiconductor devices
#23638Semiconductor device, method for the same, and heat radiator
#23639HERMETICALLY SEALED PACKAGE WITH WINDOW
#23640Semiconductor Package, Printed Wiring Board Structure and Electronic Apparatus
#23641PRINTED WIRING BOARD STRUCTURE AND ELECTRONIC APPARATUS
#23642Dielectric stack containing lanthanum and hafnium
#23643Semiconductor device and method of manufacturing it
#23644Orientation-independent multi-layer BEOL capacitor
#23645Semiconductor wafer and manufacturing method for semiconductor device
#23646Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
#23647Concave Wide Emitting Lens for LED Useful for Backlighting
#23648Semiconductor device and electrical circuit device using thereof
#23649Detector and detecting method
#23650Method for manufacturing thermal interface material having carbon nanotubes
#23651Power converter assembly with symmetrical layout of power modules
#23652CONNECTOR AND PRINTED CIRCUIT BOARD
#23653Apparatus for transferring heat in a fin of a heat sink
#23654METHODS AND SYSTEMS FOR COOLING INVERTERS FOR VEHICLES
#23655COOLER DEVICE
#23656CLIP MODULE AND HEAT DISSIPATION DEVICE HAVING THE SAME
#23657Apparatus for spreading heat over a finned surface
#23658Semiconductor integrated circuit and semiconductor device with the same
#23659Transparent desiccating agent
#23660Method of batch integration of low dielectric substrates with MMICs
#23661METHOD OF FABRICATING ANTI-FUSE AND METHOD OF PROGRAMMING ANTI-FUSE
#23662Method for fabricating tungsten line and method for fabricating gate of semiconductor device using the same
#23663Method of exposing circuit lateral interconnect contacts by wafer saw
#23664Semiconductor production method and semiconductor production device
#23665MOLECULAR DETECTOR
#23666Barrier layers for conductive features
#23667Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device
#23668SYSTEM AND METHOD FOR INSPECTING ELECTRONIC DEVICE
#23669System and method for wireless communication in a backplane fabric architecture
#23670Semiconductor memory device with power supply wiring on the most upper layer
#23671Cooling device with a preformed compliant interface
#23672Surface mounted heat sink and electromagnetic shield
#23673HEAT DISSIPATING DEVICE ASSEMBLY
#23674Heat spreader constructions, intergrated circuitry, methods of forming heat spreader constructions, and methods of forming integrated circuitry
#23675Heat dissipation device having fixing bracket
#23676Cooling Device and Electronic Apparatus
#23677Method for manufacturing substrate, liquid crystal display apparatus and method for manufacturing the same, and electronic device
#23678Inductance comprising turns on several metallization levels
#23679Inductance with a small surface area and with a midpoint which is simple to determine
#23680Semiconductor device and offset voltage adjusting method
#23681Semiconductor integrated circuit device
#23682Method for fabricating a test structure
#23683Circuit substrate, electro-optical device and electronic appliances
#23684ALIGNMENT PRECISION ENHANCEMENT OF ELECTRONIC COMPONENT PROCESS ON FLEXIBLE SUBSTRATE DEVICE AND METHOD THEREOF THE SAME
#23685VENTED MOLD FOR ENCAPSULATING SEMICONDUCTOR COMPONENTS
#23686Support structures for on-wafer testing of wafer-level packages and multiple wafer stacked structures
#23687Method for fabricating semiconductor device and semiconductor device
#23688Adhesion enhancement for metal/dielectric interface
#23689SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING METAL LINE THEREOF
#23690Buried metal-semiconductor alloy layers and structures and methods for fabrication thereof
#23691Semiconductor device with dual damascene wirings and method for manufacturing same
#23692METHOD FOR CUTTING MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, LIGHT EMITTING DEVICE, AND BACKLIGHT DEVICE
#23693Method for Backside Metallization for Semiconductor Substrate
#23694Semiconductor device including interlayer interconnecting structures and methods of forming the same
#23695Wafer level packaging integrated hydrogen getter
#23696Superjunction Device Having Oxide Lined Trenches and Method for Manufacturing a Superjunction Device Having Oxide Lined Trenches
#23697Semiconductor Device and Method for Manufacturing the same
#23698Antifuse element and semiconductor device including same
#23699ANTI-FUSE
#23700SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME