ClassID:

212006

H01L2924/0002 - page 80 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#23701
20090026574
2009-01-29

Electrical fuse having sublithographic cavities thereupon

#23702
20090026570
2009-01-29

Methods and structures for discharging plasma formed during the fabrication of semiconductor device

#23703
20090026562
2009-01-29

Package structure for optoelectronic device

#23704
20090026526
2009-01-29

Methods of forming integrated circuit devices including a multi-layer structure with a contact extending therethrough

#23705
20090026483
2009-01-29

HIGH-POWER LED PACKAGE

#23706
20090026453
2009-01-29

Display device and manufacturing method thereof

#23707
20090025976
2009-01-29

Electric component

#23708
20090025967
2009-01-29

Methods of attaching a die to a substrate

#23709
20090025912
2009-01-29

Heat dissipation apparatus with coarse surface capable of intensifying heat transfer

#23710
20090025911
2009-01-29

Heat dissipation device with coarse surface capable of intensifying heat transfer

#23711
20090025910
2009-01-29

Vapor chamber structure with improved wick and method for manufacturing the same

#23712
20090025909
2009-01-29

Cooler module

#23713
20090025906
2009-01-29

COOLER DEVICE

#23714
20090025882
2009-01-29

DIE MOLDING FOR FLIP CHIP MOLDED MATRIX ARRAY PACKAGE USING UV CURABLE TAPE

#23715
20090025840
2009-01-29

Cu—Ni—Si—Co—Cr copper alloy for electronic materials and method for manufacturing same

#23716
20090025788
2009-01-29

Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module

#23717
20090025780
2009-01-29

Light receiving or light emitting semiconductor module

#23718
20090025779
2009-01-29

SOLAR CELL ASSEMBLY

#23719
20090025223
2009-01-29

Method of fabricating a heat exchanger with angled secondary fins extending from primary fins

#23720
20090025222
2009-01-29

Method for manufacturing heat radiator having plate-shaped fins

#23721
20090025213
2009-01-29

Substantially continuous layer of embedded transient protection for printed circuit boards

#23722
20090025210
2009-01-29

CIRCUIT BOARD STRUCTURE WITH CONCAVE CONDUCTIVE CYLINDERS AND METHOD FOR FABRICATING THE SAME

#23723
20090024890
2009-01-22

CIRCUIT ARRANGEMENT, DATA PROCESSING DEVICE COMPRISING SUCH CIRCUIT ARRANGEMENT AS WELL AS METHOD FOR IDENTIFYING AN ATTACK ON SUCH CIRCUIT ARRANGEMENT

#23724
20090024345
2009-01-22

Device and method for determining the temperature of a heat sink

#23725
20090023855
2009-01-22

Curable resin, production method thereof, epoxy resin composition, and electronic device

#23726
20090023833
2009-01-22

Resin compositions, cured article obtained therefrom, and sheet

#23727
20090023364
2009-01-22

METHOD OF MAKING A WAFER HAVING AN ASYMMETRIC EDGE PROFILE

#23728
20090023266
2009-01-22

Method of forming a multi-level interconnect structure by overlay alignment procedures

#23729
20090023253
2009-01-22

Method of making semiconductor device

#23730
20090023083
2009-01-22

Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning

#23731
20090021944
2009-01-22

LED LAMP

#23732
20090021926
2009-01-22

Wavelength converting system

#23733
20090021920
2009-01-22

Module and method for producing a module

#23734
20090021918
2009-01-22

Stacked heat-transfer interface structure

#23735
20090021917
2009-01-22

Method and apparatus for securing a microprocessor and heat sink using fewer mounting holes

#23736
20090021915
2009-01-22

Multi-layer heat-dissipating device

#23737
20090021914
2009-01-22

Air guide with heat pipe and heat sink and electronic apparatus equipped with the same

#23738
20090021913
2009-01-22

Heat dissipation device

#23739
20090021909
2009-01-22

METHOD AND SYSTEM FOR COOLING AT LEAST ON ELECTRONIC DEVICE

#23740
20090021908
2009-01-22

System and method for cooling an electronic device

#23741
20090021872
2009-01-22

ESD protection circuit with active triggering

#23742
20090021338
2009-01-22

Electrical fuse having a cavity thereupon

#23743
20090021329
2009-01-22

Chip-level through hole structure of electronic package

#23744
20090021298
2009-01-22

Method and apparatus to select a parameter/mode using a capacitor of a feedback loop of the power supply

#23745
20090021270
2009-01-22

CAPACITIVE DETECTION OF DUST ACCUMULATION IN A HEAT SINK

#23746
20090021109
2009-01-22

Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer

#23747
20090020883
2009-01-22

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

#23748
20090020877
2009-01-22

TRANSMISSION LINE STRUCTURE AND SIGNAL TRANSMISSION STRUCTURE

#23749
20090020875
2009-01-22

Semiconductor device and manufacturing method thereof

#23750
20090020871
2009-01-22

SEMICONDUCTOR CHIP WITH SOLDER BUMP SUPPRESSING GROWTH OF INTER-METALLIC COMPOUND AND METHOD OF FABRICATING THE SAME

#23751
20090020866
2009-01-22

Semiconductor device

#23752
20090020863
2009-01-22

Stacked semiconductor devices and signal distribution methods thereof

#23753
20090020854
2009-01-22

Process of forming ultra thin wafers having an edge support ring

#23754
20090020850
2009-01-22

SEMICONDUCTOR DESIGN APPARATUS, SEMICONDUCTOR CIRCUIT AND SEMICONDUCTOR DESIGN METHOD

#23755
20090020843
2009-01-22

Bottom anode Schottky diode structure and method

#23756
20090020829
2009-01-22

Methods of making metal silicide contacts, interconnects, and/or seed layers

#23757
20090020800
2009-01-22

Semiconductor device and method of making same

#23758
20090020787
2009-01-22

Semiconductor device using semiconductor nanowire and display apparatus and image pick-up apparatus using the same

#23759
20090020784
2009-01-22

METHOD FOR DESIGNING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

#23760
20090020774
2009-01-22

Package of light emitting diode and method for manufacturing the same

#23761
20090020768
2009-01-22

BURIED CONTACT DEVICES FOR NITRIDE-BASED FILMS AND MANUFACTURE THEREOF

#23762
20090020762
2009-01-22

Display device and method of fabricating the same

#23763
20090020756
2009-01-22

Test structures of a semiconductor device and methods of forming the same

#23764
20090020755
2009-01-22

Test structure of a semiconductor device and semiconductor device

#23765
20090020754
2009-01-22

Test structure for determining gate-to-body tunneling current in a floating body FET

#23766
20090020744
2009-01-22

Stacked multilayer structure and manufacturing method thereof

#23767
20090020689
2009-01-22

Optical Detection System

#23768
20090020437
2009-01-22

Method and system for controlled material removal by electrochemical polishing

#23769
20090020323
2009-01-22

Circuit board structure and method for fabricating the same

#23770
20090020322
2009-01-22

Packaging substrate with conductive structure

#23771
20090020321
2009-01-22

Method for manufacturing a metal-ceramic substrate

#23772
20090020313
2009-01-22

CIRCUIT LOGIC EMBEDDED WITHIN IC PROTECTIVE LAYER

#23773
20090020279
2009-01-22

Jointing structure of a heat dissipating fin

#23774
20090020274
2009-01-22

Heat diffusing device and method of producing the same

#23775
20090020272
2009-01-22

ELECTRONIC APPARATUS

#23776
20090020271
2009-01-22

Apparatus and method for thermal management using vapor chamber

#23777
20090020267
2009-01-22

Working liquid for latent heat transport apparatus and method for operating latent heat transport apparatus

#23778
20090020266
2009-01-22

System and method of boiling heat transfer using self-induced coolant transport and impingements

#23779
20090020262
2009-01-22

Heat dissipation device with clip for mounting a fan to a heat sink thereof

#23780
20090020148
2009-01-22

Methods and devices for controlling thermal conductivity and thermoelectric power of semiconductor nanowires

#23781
20090019690
2009-01-22

Fabrication method of a nanotube-based electric connection having air gaps

#23782
20090019414
2009-01-15

High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature

#23783
20090018708
2009-01-15

Method for pre-heating high power devices to enable low temperature start-up and operation

#23784
20090017670
2009-01-15

Electronic component and method of forming the same

#23785
20090017623
2009-01-15

Wafer processing method

#23786
20090017618
2009-01-15

Method of fabricating semiconductor device

#23787
20090017615
2009-01-15

Method of removing an insulation layer and method of forming a metal wire

#23788
20090017614
2009-01-15

Semiconductor device

#23789
20090017611
2009-01-15

Semiconductor device and method for fabricating the same

#23790
20090017610
2009-01-15

Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure

#23791
20090017609
2009-01-15

Rectangular contact used as a low voltage fuse element

#23792
20090017576
2009-01-15

Semiconductor Processing Methods

#23793
20090016408
2009-01-15

Extending the operating temperature range of high power devices

#23794
20090016388
2009-01-15

Laser processing of conductive links

#23795
20090016207
2009-01-15

Recording device with a porous heat barrier

#23796
20090016079
2009-01-15

Planar lighting apparatus

#23797
20090016063
2009-01-15

Built-in Heat Diffusion Lamp Body for LED Lamp

#23798
20090016038
2009-01-15

MATRIX RELAY

#23799
20090016027
2009-01-15

Conducting liquid crystal polymer matrix comprising carbon nanotubes, use thereof and method of fabrication

#23800
20090016023
2009-01-15

Heat dissipation device with heat pipes

#23801
20090015978
2009-01-15

Non-inductive silicon transient voltage suppressor

#23802
20090015706
2009-01-15

Auto focus/zoom modules using wafer level optics

#23803
20090015369
2009-01-15

Semiconductor device and method for manufacturing the same

#23804
20090015363
2009-01-15

Integrated transformer

#23805
20090015322
2009-01-15

Integrated circuit with multiple layers of circuits

#23806
20090015312
2009-01-15

Calibration circuit, semiconductor device including the same, and memory module

#23807
20090015286
2009-01-15

Power supply voltage detection circuit and semiconductor integrated circuit device

#23808
20090015242
2009-01-15

Method to test the measurement accuracy of at least one magnetic field sensor using a semiconductor chip having a measurement coil

#23809
20090015125
2009-01-15

Heat exchange enhancement

#23810
20090015101
2009-01-15

Embedded circuits on an ultrasound transducer and method of manufacture

#23811
20090014909
2009-01-15

PRINTING DEVICE, PRODUCTION UNIT, AND PRODUCTION METHOD OF ELECTRONIC PARTS

#23812
20090014892
2009-01-15

Integrated circuit device

#23813
20090014887
2009-01-15

METHOD OF PRODUCING MULTILAYER INTERCONNECTION AND MULTILAYER INTERCONNECTION STRUCTURE

#23814
20090014884
2009-01-15

SLOTS TO REDUCE ELECTROMIGRATION FAILURE IN BACK END OF LINE STRUCTURE

#23815
20090014879
2009-01-15

Semiconductor device and method of manufacturing the same

#23816
20090014878
2009-01-15

Method of forming electrodeposited contacts

#23817
20090014877
2009-01-15

Selective formation of boron-containing metal cap pre-layer

#23818
20090014869
2009-01-15

SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER

#23819
20090014868
2009-01-15

MANUFACTURING IC CHIP IN PORTIONS FOR LATER COMBINING, AND RELATED STRUCTURE

#23820
20090014864
2009-01-15

Thermal interface material having carbon nanotubes and component package having the same

#23821
20090014862
2009-01-15

Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof

#23822
20090014846
2009-01-15

Methods for coating a substrate with an amphiphilic compound

#23823
20090014843
2009-01-15

Manufacturing process and structure of through silicon via

#23824
20090014836
2009-01-15

Memory array with a selector connected to multiple resistive cells

#23825
20090014832
2009-01-15

Semiconductor Device with Reduced Capacitance Tolerance Value

#23826
20090014829
2009-01-15

Semiconductor fuse box and method for fabricating the same

#23827
20090014821
2009-01-15

Method for producing conductor structures and applications thereof

#23828
20090014812
2009-01-15

Semiconductor device and a method of manufacturing the same

#23829
20090014811
2009-01-15

Dynamic array architecture

#23830
20090014796
2009-01-15

Semiconductor device with contact structure with first/second contacts formed in first/second dielectric layers and method of forming same

#23831
20090014791
2009-01-15

Lateral Power MOSFET With Integrated Schottky Diode

#23832
20090014750
2009-01-15

RESIN FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION CONTAINING POLYBOROSILOXANE

#23833
20090014733
2009-01-15

LIGHT-EMITTING DIODE MODULE

#23834
20090014719
2009-01-15

Semiconductor device with large blocking voltage

#23835
20090014718
2009-01-15

Test element group for monitoring leakage current in semiconductor device and method of manufacturing the same

#23836
20090014717
2009-01-15

TEST IC STRUCTURE

#23837
20090014562
2009-01-15

Spray nozzle apparatus and method of use

#23838
20090014433
2009-01-15

Utilization of overvoltage and overcurrent compensation to extend the usable operating range of electronic devices

#23839
20090014162
2009-01-15

Counter-stream-mode oscillating-flow heat transport apparatus

#23840
20090014160
2009-01-15

HEAT DISSIPATION MODULE

#23841
20090014158
2009-01-15

Nano shower for chip-scale cooling

#23842
20090014157
2009-01-15

Cooler

#23843
20090014156
2009-01-15

Thermal management system

#23844
20090014155
2009-01-15

Thermally pumped liquid/gas heat exchanger for cooling heat-generating devices

#23845
20090014125
2009-01-15

Substrate processing system and method

#23846
20090012439
2009-01-08

Attachment member for semiconductor sensor device

#23847
20090012233
2009-01-08

Epoxy Resin Molding Material for Sealing and Electronic Component Device

#23848
20090012232
2009-01-08

Curing accelerator, curable resin composition and electronic parts device

#23849
20090011922
2009-01-08

Ceramic antenna module and methods of manufacture thereof

#23850
20090011614
2009-01-08

RECONFIGURABLE SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS

#23851
20090011596
2009-01-08

Electronic device and manufacturing method thereof

#23852
20090011590
2009-01-08

Method of fabricating semiconductor device

#23853
20090011576
2009-01-08

Ultra-violet protected tamper resistant embedded EEPROM

#23854
20090011549
2009-01-08

Process and system for manufacturing an encapsulated semiconductor device

#23855
20090011544
2009-01-08

Method of forming molded standoff structures on integrated circuit devices

#23856
20090011539
2009-01-08

Flexible structures for interconnect reliability test

#23857
20090011534
2009-01-08

Solid-state imaging device and method of manufacturing solid-state imaging device

#23858
20090011524
2009-01-08

Method for determining suitability of a resist in semiconductor wafer fabrication

#23859
20090011186
2009-01-08

Flexible base for manufacturing flexible printed circuit boards

#23860
20090011131
2009-01-08

METHOD FOR TREATING SURFACE OF HEAT DISSIPATING MODULE

#23861
20090010797
2009-01-08

Copper alloy plate for electric and electronic parts having bending workability

#23862
20090010316
2009-01-08

Reconfigurable MIMO transceiver and method for use therewith

#23863
20090010290
2009-01-08

Semiconductor chip having a reduced band offset in its p-doped region and method for producing the semiconductor chip

#23864
20090009975
2009-01-08

Camera module package

#23865
20090009973
2009-01-08

Nanotube-based fluid interface material and approach

#23866
20090009972
2009-01-08

HEAT DISSIPATION MODULE

#23867
20090009971
2009-01-08

Fixing structure of fixing a thermal module

#23868
20090009969
2009-01-08

Heat-dissipating casing structure

#23869
20090009967
2009-01-08

Fan unit and electronic apparatus and method of controlling the same

#23870
20090009964
2009-01-08

Heatsink and Cooling Apparatus

#23871
20090009963
2009-01-08

Fastener and heat-dissipating device having the fastener

#23872
20090009926
2009-01-08

Capacitor structure

#23873
20090009917
2009-01-08

Electrostatic discharge device

#23874
20090009741
2009-01-08

Device manufacturing method, device manufacturing system, and measurement/inspection apparatus

#23875
20090009611
2009-01-08

Thin-type image capturing module structure for a web cam

#23876
20090009198
2009-01-08

Probing device

#23877
20090009196
2009-01-08

Analogue measurement of alignment between layers of a semiconductor device

#23878
20090009186
2009-01-08

Systems and methods for determining the state of a programmable fuse in an IC

#23879
20090009045
2009-01-08

High performance LED lamp system

#23880
20090008802
2009-01-08

Flexible carrier for high volume electronic package fabrication

#23881
20090008798
2009-01-08

Semiconductor device suitable for a stacked structure

#23882
20090008794
2009-01-08

Thickness Indicators for Wafer Thinning

#23883
20090008790
2009-01-08

Semiconductor device having through electrode and method of fabricating the same

#23884
20090008786
2009-01-08

Sputtering Target

#23885
20090008783
2009-01-08

Semiconductor device with pads of enhanced moisture blocking ability

#23886
20090008782
2009-01-08

Integrated circuit structure and manufacturing method thereof

#23887
20090008780
2009-01-08

Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods

#23888
20090008773
2009-01-08

Mounted semiconductor device and a method for making the same

#23889
20090008759
2009-01-08

Semiconductor device and lead frame used to manufacture semiconductor device

#23890
20090008757
2009-01-08

METHOD OF FABRICATING SUBSTRATE FOR PACKAGE OF SEMICONDUCTOR LIGHT-EMITTING DEVICE

#23891
20090008753
2009-01-08

Integrated circuit with intra-chip and extra-chip RF communication

#23892
20090008750
2009-01-08

SEAL RING FOR SEMICONDUCTOR DEVICE

#23893
20090008742
2009-01-08

SEMICONDUCTOR DEVICE INCLUDING MEMORY CELL AND ANTI-FUSE ELEMENT

#23894
20090008741
2009-01-08

Semiconductor device including memory cell and anti-fuse element

#23895
20090008733
2009-01-08

Electric field steering cap, steering electrode, and modular configurations for a radiation detector

#23896
20090008723
2009-01-08

Semiconductor component including an edge termination having a trench and method for producing

#23897
20090008721
2009-01-08

Semiconductor device with three-dimensional field effect transistor structure

#23898
20090008707
2009-01-08

SRAM device

#23899
20090008693
2009-01-08

Semiconductor device and method of manufacturing same

#23900
20090008683
2009-01-08

IMAGING APPARATUS

#23901
20090008682
2009-01-08

Light-Receiving Device

#23902
20090008680
2009-01-08

Semiconductor intergrated circuit device

#23903
20090008671
2009-01-08

LED packaging structure with aluminum board and an LED lamp with said LED packaging structure

#23904
20090008655
2009-01-08

White Light Source

#23905
20090008654
2009-01-08

Semiconductor light emitting device, illumination module, illumination apparatus, method for manufacturing semiconductor light emitting device, and method for manufacturing semiconductor light emitting element

#23906
20090008641
2009-01-08

Probe resistance measurement method and semiconductor device with pads for probe resistance measurement

#23907
20090008640
2009-01-08

Semiconductor device

#23908
20090008636
2009-01-08

Semiconductor device and method for fabricating the same

#23909
20090008632
2009-01-08

Superconducting shielding for use with an integrated circuit for quantum computing

#23910
20090008426
2009-01-08

Addition of D2 to H2 to Detect and Calibrate Atomic Hydrogen Formed By Dissociative Electron attachment

#23911
20090008066
2009-01-08

Heat dissipation device

#23912
20090008065
2009-01-08

Heat dissipation device with heat pipes

#23913
20090008063
2009-01-08

System and Method for Passive Cooling Using a Non-Metallic Wick

#23914
20090008062
2009-01-08

Heat Transport Medium and Heating or Cooling System with the Medium

#23915
20090008061
2009-01-08

Easily assembled cooler

#23916
20090007571
2009-01-08

Peltier cooling systems with high aspect ratio

#23917
20090007051
2009-01-01

Selectable device options for characterizing semiconductor devices

#23918
20090007035
2009-01-01

Accurate parasitic capacitance extraction for ultra large scale integrated circuits

#23919
20090007032
2009-01-01

Method and apparatus for substrate noise analysis using substrate tile model and tile grid

#23920
20090004902
2009-01-01

Land grid array (LGA) socket loading mechanism for mobile platforms

#23921
20090004885
2009-01-01

Method for fabricating semiconductor device

#23922
20090004880
2009-01-01

Mask reuse in semiconductor processing

#23923
20090004879
2009-01-01

Test structure formation in semiconductor processing

#23924
20090004846
2009-01-01

Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof

#23925
20090004845
2009-01-01

Method for making semiconductor structures implementing sacrificial material

#23926
20090004827
2009-01-01

Lead cutter and method of fabricating semiconductor device

#23927
20090004807
2009-01-01

Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same

#23928
20090004786
2009-01-01

Method for fabricating a 3-D integrated circuit using a hard mask of silicon-oxynitride on amorphous carbon

#23929
20090004762
2009-01-01

Stacking apparatus and method for stacking integrated circuit elements

#23930
20090004508
2009-01-01

Thin-film materials, thin films and producing method thereof

#23931
20090004463
2009-01-01

REDUCING RESISTIVITY IN METAL INTERCONNECTS USING INTERFACE CONTROL

#23932
20090003028
2009-01-01

Carbon nanotube fuse element

#23933
20090002956
2009-01-01

Power converter

#23934
20090002951
2009-01-01

SYSTEM HAVING A HEAT TRANSFER APPARATUS

#23935
20090002937
2009-01-01

Heat-dissipating module connecting to a plurality of heat-generating components and related device thereof

#23936
20090002119
2009-01-01

Fuse sensing scheme

#23937
20090002115
2009-01-01

Method to improve inductance with a high-permeability slotted plate core in an integrated circuit

#23938
20090002114
2009-01-01

INTEGRATED INDUCTOR

#23939
20090002025
2009-01-01

Memory utilizing oxide nanolaminates

#23940
20090002012
2009-01-01

Accurate capacitance measurement for ultra large scale integrated circuits

#23941
20090001909
2009-01-01

Automotive power inverter with reduced capacitive coupling

#23942
20090001617
2009-01-01

Alignment key, method for fabricating the alignment key, and method for fabricating thin film transistor substrate using the alignment key

#23943
20090001616
2009-01-01

Method and apparatus for wafer marking

#23944
20090001615
2009-01-01

Semiconductor test structures

#23945
20090001601
2009-01-01

Memory array on more than one die

#23946
20090001595
2009-01-01

Integrated circuit, intermediate structure and a method of fabricating a semiconductor structure

#23947
20090001594
2009-01-01

AIRGAP INTERCONNECT SYSTEM

#23948
20090001592
2009-01-01

Metal interconnect forming methods and IC chip including metal interconnect

#23949
20090001591
2009-01-01

REDUCING RESISTIVITY IN METAL INTERCONNECTS BY COMPRESSIVE STRAINING

#23950
20090001590
2009-01-01

Wiring structure and method of manufacturing the same

#23951
20090001589
2009-01-01

NOR FLASH DEVICE AND METHOD FOR FABRICATING THE DEVICE

#23952
20090001584
2009-01-01

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

#23953
20090001583
2009-01-01

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#23954
20090001581
2009-01-01

METAL LINE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

#23955
20090001580
2009-01-01

Metal line of semiconductor device having a diffusion barrier including CRBand method for forming the same

#23956
20090001579
2009-01-01

Multi-layered metal line having an improved diffusion barrier of a semiconductor device and method for forming the same

#23957
20090001578
2009-01-01

Metal line of semiconductor device having a diffusion barrier with an amorphous TaBN layer and method for forming the same

#23958
20090001577
2009-01-01

METAL LINE OF SEMICONDUCTOR DEVICE WITH A TRIPLE LAYER DIFFUSION BARRIER AND METHOD FOR FORMING THE SAME

#23959
20090001566
2009-01-01

Semiconductor device having improved gate electrode placement and decreased area design

#23960
20090001564
2009-01-01

Package substrate dynamic pressure structure

#23961
20090001560
2009-01-01

Embedded heat pipe in a hybrid cooling system

#23962
20090001558
2009-01-01

Lamp seat for a light emitting diode and capable of heat dissipation, and method of manufacturing the same

#23963
20090001546
2009-01-01

Ultra-thick thick film on ceramic substrate

#23964
20090001541
2009-01-01

Method and apparatus for stackable modular integrated circuits

#23965
20090001537
2009-01-01

Gettering material for encapsulated microdevices and method of manufacture

#23966
20090001527
2009-01-01

Series-shunt switch with thermal terminal

#23967
20090001522
2009-01-01

Die seal ring and wafer having the same

#23968
20090001521
2009-01-01

Semiconductor wafer

#23969
20090001512
2009-01-01

Providing a moat capacitance

#23970
20090001510
2009-01-01

Air gap in integrated circuit inductor fabrication

#23971
20090001507
2009-01-01

Semiconductor device

#23972
20090001506
2009-01-01

DUAL STRESS LINER EFUSE

#23973
20090001503
2009-01-01

Semiconductor device having floating body element and bulk body element

#23974
20090001497
2009-01-01

Semiconductor integrated circuit device

#23975
20090001493
2009-01-01

ELECTRONIC IMAGING DEVICE

#23976
20090001491
2009-01-01

Method for producing a microchip that is able to detect infrared light with a semiconductor at room temperature

#23977
20090001478
2009-01-01

Semiconductor device and method of manufacturing the same

#23978
20090001465
2009-01-01

Method of forming a guard ring or contact to an SOI substrate

#23979
20090001456
2009-01-01

Semiconductor device and method of fabricating the same

#23980
20090001455
2009-01-01

ACCUFET with Schottky source contact

#23981
20090001447
2009-01-01

Semiconductor device with dummy electrode

#23982
20090001426
2009-01-01

Integrated Fin-Local Interconnect Structure

#23983
20090001390
2009-01-01

Matrix material including an embedded dispersion of beads for a light-emitting device

#23984
20090001370
2009-01-01

Method and apparatus for extracting properties of interconnect wires and dielectrics undergoing planarization process

#23985
20090001369
2009-01-01

Evaluation method for interconnects interacted with integrated-circuit manufacture

#23986
20090001368
2009-01-01

Semiconductor device including semiconductor evaluation element, and evaluation method using semiconductor device

#23987
20090001348
2009-01-01

Semiconductor device

#23988
20090001138
2009-01-01

Method for preventing void formation in a solder joint

#23989
20090000950
2009-01-01

Automatic deposition profile targeting

#23990
20090000773
2009-01-01

Integrated cooling system

#23991
20090000768
2009-01-01

Heat dissipation device

#23992
20090000543
2009-01-01

Parallel substrate treatment for a plurality of substrate treatment lines

#23993
20090000498
2009-01-01

Production unit including a printing device and upper and lower sealed chambers

#23994
20090000332
2009-01-01

Electronic equipment cooling system

#23995
20080319292
2008-12-25

ANALYTE MONITORING DEVICE AND METHODS OF USE

#23996
20080318429
2008-12-25

Fabrication method of semiconductor integrated circuit device

#23997
20080318425
2008-12-25

SEMICONDUCTOR DEVICE PRODUCTION METHOD

#23998
20080318422
2008-12-25

Method of manufacturing III-V nitride semiconductor device

#23999
20080318419
2008-12-25

Charge dissipation of cavities

#24000
20080318417
2008-12-25

METHOD OF FORMING RUTHENIUM FILM FOR METAL WIRING STRUCTURE