212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Interconnect structures with encasing cap and methods of making thereof
#24002Method of forming metal electrode of system in package
#24003Method for manufacturing semiconductor device
#24004METHOD OF FORMING ALIGNMENT KEY OF SEMICONDUCTOR DEVICE
#24005Method for fabricating non-volatile storage with individually controllable shield plates between storage elements
#24006Insulation paste for a metal core substrate and electronic device
#24007Method for selectively forming symmetrical or asymmetrical features using a symmetrical photomask during fabrication of a semiconductor device and electronic systems including the semiconductor device
#24008LASER TRANSFER ARTICLES AND METHOD OF MAKING
#24009Method for producing an electrical connection using individually sheathed nanotubes
#24010Method for making a carbon nanotube-based electrical connection
#24011Wiring board and method for making the same
#24012Electronic components
#24013VLSI hot-spot minimization using nanotubes
#24014Thermal energy removal structure and method
#24015Low cost cold plate with film adhesive
#24016Heat dissipation device with heat pipes
#24017Heat dissipation device having a fan mounted thereon
#24018Reducing input capacitance of high speed integrated circuits
#24019Micro-lens fabricated from semiconductor wafer
#24020Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
#24021Image Acquisition System
#24022Image pickup element module, and lens unit and portable electronic device using image pickup element modules
#24023Flexible LED screen
#24024Self-aligned wafer or chip structure, and self-aligned stacked structure
#24025Method for improving the selectivity of a CVD process
#24026Metal cap with ultra-low k dielectric material for circuit interconnect applications
#24027Semiconductor Devices and Methods for Fabricating the Same
#24028Methods and apparatuses for three dimensional integrated circuits
#24029Chromium/Titanium/Aluminum-based semiconductor device contact
#24030Printed circuit board, memory module having the same and fabrication method thereof
#24031Stacked semiconductor package and method for manufacturing the same
#24032CHIP FRAME FOR OPTICAL DIGITAL PROCESSOR
#24033Semiconductor packages including thermal stress buffers and methods of manufacturing the same
#24034Silicon wafer having through-wafer vias
#24035Semiconductor device
#24036Semiconductor die with backside passive device integration
#24037SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#24038FUSE FOR SEMICONDUCTOR DEVICE
#24039Empty vias for electromigration during electronic-fuse re-programming
#24040Pitch by splitting bottom metallization layer
#24041PROVIDING GAPS IN CAPPING LAYER TO REDUCE TENSILE STRESS FOR BEOL FABRICATION OF INTEGRATED CIRCUITS
#24042Packaged chip devices with atomic layer deposition protective films
#24043Sacrificial self-aligned interconnect structures
#24044System and method for forming a semiconductor device source/drain contact
#24045Semiconductor Devices Including Transistors Having Three Dimensional Channels
#24046Capacitor pair structure for increasing the match thereof
#24047Capacitor pair structure for increasing the match thereof
#24048Light-emitting diode arrangement
#24049Solderless integrated package connector and heat sink for LED
#24050Display device and manufacturing method thereof
#24051Semiconductor apparatus
#24052System for using test structures to evaluate a fabrication of a wafer
#24053Method and apparatus for monitoring via's in a semiconductor fab
#24054Via structure for improving signal integrity
#24055Method and apparatus for chip cooling
#24056HEAT EXCHANGE STRUCTURE AND HEAT DISSIPATING APPARATUS HAVING THE SAME
#24057Heat dissipation device having a fan for dissipating heat generated by at least two electronic components
#24058Heat dissipation device
#24059HEAT DISSIPATION DEVICE WITH A HEAT PIPE
#24060Apparatus and method for detecting resin leak
#24061Integrated circuit protection and detection grid
#24062Semiconductor integrated circuit, semiconductor device, and manufacturing method of the semiconductor integrated circuit
#24063Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics
#24064Manufacturing method of semiconductor device
#24065Selective W-CVD method and method for forming multi-layered Cu electrical interconnection
#24066Power composite integrated semiconductor device and manufacturing method thereof
#24067Method of Forming a Self Aligned Copper Capping Layer
#24068Tunable semiconductor diodes
#24069Mobility enhancement by strained channel CMOSFET with single workfunction metal-gate and fabrication method thereof
#24070Method for manufacturing semiconductor device
#24071LEAD FRAME AND A METHOD OF MANUFACTURING THE SAME
#24072Method and apparatus for creating a gate optimization evaluation library
#24073Method and apparatus for optimizing a gate channel
#24074Microwave integrated circuit package and method for forming such package
#24075Enhanced thermal conducting formulations
#24076High refractive index materials and composites thereof
#24077Single-chip wireless tranceiver
#24078CMOS Compatible Single-Poly Non-Volatile Memory
#24079Optimization of critical dimensions and pitch of patterned features in and above a substrate
#24080Solid state illumination device
#24081Thermal dissipating device
#24082Electric sub-assembly
#24083Clip on heat sink
#24084CPU Heat Sink Mounting Method And Apparatus
#24085Heatsink having an internal plenum
#24086SYSTEM AND METHOD FOR MOUNTING A COOLING DEVICE AND METHOD OF FABRICATION
#24087HEAT DISSIPATING APPARATUS AND WATER COOLING SYSTEM HAVING THE SAME
#24088Methods and apparatus for compact active cooling
#24089Microarchitecture controller for thin-film thermoelectric cooling
#24090Control circuit of semiconductor device having over-heat protecting function
#24091Methods of achieving linear capacitance in symmetrical and asymmetrical EMI filters with TVS
#24092Methods of achieving linear capacitance in symmetrical and asymmetrical EMI filters with TVS
#24093Wafer-to-wafer alignments
#24094Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
#24095Semiconductor integrated circuit
#24096Wiring structure and semiconductor device, and their fabrication methods
#24097Semiconductor wiring structures including dielectric cap within metal cap layer
#24098LATERAL CURRENT CARRYING CAPABILITY IMPROVEMENT IN SEMICONDUCTOR DEVICES
#24099Semiconductor device and method for fabricating semiconductor device
#24100Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structure
#24101COPPER-FREE SEMICONDUCTOR DEVICE INTERFACE AND METHODS OF FABRICATION AND USE THEREOF
#24102Method and structure for self-aligned device contacts
#24103Semiconductor device, chip package and method of fabricating the same
#24104Circuit module having force resistant construction
#24105Hollow sealing structure and manufacturing method for hollow sealing structure
#24106Semiconductor device including through-wafer interconnect structure
#24107Integrated circuit having a thin passivation layer that facilitates laser programming, and applications thereof
#24108Plasma excited chemical vapor deposition method silicon/oxygen/nitrogen-containing-material and layered assembly
#24109Substrate for manufacturing semiconductor device and manufacturing method thereof
#24110Image sensing module and method for packaging the same
#24111Integrated circuit having a Fin structure
#24112Semiconductor apparatus and complimentary MIS logic circuit
#24113Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
#24114Thin flash or video recording light using low profile side emitting LED
#24115Overvoltage-protected light-emitting semiconductor device, and method of fabrication
#24116Structure for stochastic integrated circuit personalization
#24117Method of evaluating thermal stress resistance of semiconductor device, and semiconductor wafer having test element
#24118WIRING STRUCTURE AND MANUFACTURING METHOD THEREFOR
#24119Cold plate stability
#24120Heat dissipating assembly
#24121Portable Die Cleaning Apparatus and Method Thereof
#24122Charge system for destroying chips on a circuit board and method for destroying chips on a circuit board
#24123Method of assembly to achieve thermal bondline with minimal lead bending
#24124Actuator member for socket connector
#24125Compliant off-chip interconnects for use in electronic packages
#24126Poison-free and low ULK damage integration scheme for damascene interconnects
#24127High capacitance density vertical natural capacitors
#24128METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING OPENINGS
#24129Method of manufacturing active matrix display device
#24130Method and system for controlling copper chemical mechanical polish uniformity
#24131Adhesive film and use thereof
#24132Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning
#24133Semiconductor device and method comprising a high voltage reset driver and an isolated memory array
#24134Electronic module configured for air flow therethrough and system including same
#24135Intertwined finger capacitors
#24136High capacitance density vertical natural capacitors
#24137Semiconductor device and method of manufacturing the same
#24138Printhead with reciprocating cantilevered thermal actuators
#24139Inductor structure
#24140Semiconductor device having driver with temperature detection
#24141Parametric testline with increased test pattern areas
#24142Variable frequency drive system apparatus and method for reduced ground leakage current and transistor protection
#24143Method for pattern metalization of substrates
#24144Integrated circuit arrangement including vias having two sections, and method for producing the same
#24145Structure and method of reducing electromigration cracking and extrusion effects in semiconductor devices
#24146SEMICONDUCTOR DEVICE
#24147Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning
#24148Semiconductor integrated circuit device
#24149Semiconductor devices and methods of forming interconnection lines therein
#24150Methods and structure for forming copper barrier layers integral with semiconductor substrates structures
#24151Electronic system with vertical intermetallic compound
#24152Semiconductor device
#24153Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices
#24154Integrated Electronic Circuitry and Heat Sink
#24155Integrated circuit with multi-stage matching circuit
#24156Power FET with low on-resistance using merged metal layers
#24157Semiconductor apparatus
#24158Semiconductor device including a nitride containing film to generate stress for improving current driving capacity of a field effect transistor
#24159Charge-balance power device comprising columnar structures and having reduced resistance
#24160Semiconductor device with strain in channel region and its manufacture method
#24161Light emitting element, manufacturing method thereof and light emitting module using the same
#24162Backlight module and light emitting diode package structure therefor
#24163RETICLE POD AND RETICLE TRANSPORT POD
#24164CIRCUIT ASSEMBLY INCLUDING A METAL CORE SUBSTRATE AND PROCESS FOR PREPARING THE SAME
#24165Flexible and elastic dielectric integrated circuit
#24166Method and Device for Tempering a Substrate
#24167Thermal dissipating device
#24168Plasma-driven cooling heat sink
#24169Heat sink and modular heat sink
#24170HEAT-DISSIPATING DEVICE WITH HIGH HEAT-DISSIPATING EFFICIENCY
#24171Adjustable cooling apparatus
#24172Heat sink
#24173Evaporative cooling system
#24174SOLAR CELL MODULE CONNECTOR AND METHOD OF PRODUCING SOLAR CELL MODULE PANEL
#24175Combined pressure compensator and cooling unit
#24176Novel Packaging Solution for Highly Filled Phase-Change Thermal Interface Material
#24177Method of combining heat pipe and fins and the assembly thereof
#24178Method of manufacturing a cold plate heat exchanger assembly having a metallic compliant gasket
#24179Computer readable recording medium with a wiring design program stored thereon and wiring design device
#24180Method for determining a length of shielding of a semiconductor integrated circuit wiring
#24181Manufacturing method of substrate with through electrode
#24182Method for fabricating semiconductor device
#24183Interconnection having dual-level or multi-level capping layer and method of forming the same
#24184Method for fabricating semiconductor device
#24185Method for manufacturing a semiconductor device
#24186Method of manufacturing semiconductor device
#24187Method of fabricating a wafer structure having a pad and a first protection layer and a second protection layer
#24188METHOD FOR FORMING INDUCTOR ON SEMICONDUCTOR SUBSTRATE
#24189Wafer level package fabrication method
#24190Multi-step deposition control
#24191Exposure method and electronic device manufacturing method
#24192Durable, heat-resistant multi-layer coatings and coated articles
#24193SUBSTRATE FOR OPTICAL SEMICONDUCTOR
#24194Led Lamp System
#24195Heat sink assembly having a locking device assembly
#24196Notebook computer with hybrid diamond heat spreader
#24197Heat dissipation device having holes
#24198COOLING AN ELECTRONIC DEVICE UTILIZING SPRING ELEMENTS WITH FINS
#24199Auxiliary cooling device for memory chips
#24200Resilient fastener and heat dissipation apparatus incorporating the same
#24201HOLDING BASE FOR A RADIATOR ASSEMBLY
#24202Electrochromic rearview mirror assembly incorporating a display/signal light
#24203Liquid crystal display device
#24204Method of manufacturing addressable and static electronic displays
#24205Interfacing at low temperature using CMOS technology
#24206Device for measuring metal/semiconductor contact resistivity
#24207Semiconductor device
#24208Addressable or static light emitting or electronic apparatus
#24209Light Emitting Diode Construction
#24210Semiconductor device
#24211Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case
#24212Method of forming catalyst nanoparticles for nanowire growth and other applications
#24213Interconnection Structure and Integrated Circuit
#24214Semiconductor device and method for manufacturing semiconductor device
#24215Power semiconductor device with improved heat dissipation
#24216Semiconductor device
#24217Semiconductor device with two barrier layers formed between copper-containing line layer and aluminum-containing conductive layer
#24218Cylindrical bonding structure and method of manufacture
#24219HEAT SPREADER COMPOSITIONS AND MATERIALS, INTEGRATED CIRCUITRY, METHODS OF PRODUCTION AND USES THEREOF
#24220Molded ceramic surface mount package
#24221Integrated Circuit
#24222Method of manufacturing semiconductor device, and semiconductor device
#24223Semiconductor structure for fuse and anti-fuse applications
#24224Programmable poly fuse
#24225Fuse structure for maintaining passivation integrity
#24226Backside-illuminated imaging device and manufacturing method of the same
#24227Semiconductor device in peripheral circuit region using a dummy gate
#24228Analog switch
#24229Semiconductor apparatus
#24230LOW RESISTIVITY CONDUCTIVE STRUCTURES, DEVICES AND SYSTEMS INCLUDING SAME, AND METHODS FORMING SAME
#24231Semiconductor device with strain
#24232LIGHT-EMITTING DIODE LEAD FRAME AND MANUFACTURE METHOD THEREOF
#24233Light emitting device with high light extraction efficiency
#24234Solid-State Lighting Device Package
#24235III-V Nitride Semiconductor Layer-Bonded Substrate and Semiconductor Device
#24236Wiring material and a semiconductor device having a wiring using the material, and the manufacturing method thereof
#24237Semiconductor device
#24238Apparatus and method for absorption of incident gamma radiation and its conversion to outgoing radiation at less penetrating, lower energies and frequencies
#24239SECURE DEVICE
#24240THREE-DIMENSIONAL COLD PLATE AND METHOD OF MANUFACTURING SAME
#24241PLATING APPARATUS
#24242Cooling device for CPU
#24243Cooling mechanism
#24244STABLE CAVITY-INDUCED TWO-PHASE HEAT TRANSFER IN SILICON MICROCHANNELS
#24245HEAT SINK AND MANUFACTURING METHOD THEREOF
#24246Heat-dissipating fin assembly and assembling method thereof
#24247Heat dissipation apparatus with heat pipes
#24248Electrode assembly for the removal of surface oxides by electron attachment
#24249Engine control unit
#24250Processing condition determining method and apparatus, display method and apparatus, processing apparatus, measurement apparatus and exposure apparatus, substrate processing system, and program and information recording medium
#24251Semiconductor device and method of manufacturing the same
#24252Semiconductor device and manufacturing method thereof
#24253Methods of positioning and/or orienting nanostructures
#24254Post last wiring level inductor using patterned plate process
#24255METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#24256Method of fabricating trench-constrained isolation diffusion for semiconductor devices
#24257Post last wiring level inductor using patterned plate process
#24258Method for manufacturing image sensor
#24259Method for forming LED array
#24260Method for manufacturing light emitting diode devices
#24261Method and system of tape automated bonding
#24262Soft Magnetic Member and Magnetic Device Including the Same
#24263Printed circuit board
#24264SHAPING DIE FOR CHIP PACKAGE LEADS
#24265Electronic device with a base plate
#24266Package assembly with heat dissipating structure
#24267Method and apparatus for cooling computer memory
#24268Apparatus for extending an operator panel
#24269Defect inspection system
#24270IMAGE SENSOR PACKAGE STRUCTURE AND CAMERA MODULE HAVING SAME
#24271Solid-state imaging device and camera
#24272Metamaterial having the capability of broadband left-hand guidance of electromagnetic waves
#24273Semiconductor device
#24274Control of eddy currents in magnetic vias for inductors and transformers in integrated circuits
#24275Signal transmitter and signal transmission apparatus
#24276MILLIMETER WAVE INTEGRATED CIRCUIT INTERCONNECTION SCHEME
#24277Method of forecasting and detecting polishing endpoint and the device thereof and real time film thickness monitoring method and the device thereof
#24278Micro-electro-mechanical transducer having an insulation extension
#24279SEMICONDUCTOR DEVICE HAVING PHOTO ALIGNING KEY AND METHOD FOR MANUFACTURING THE SAME
#24280Methods for forming arrays of small, closely spaced features
#24281Test patterns for detecting misalignment of through-wafer vias
#24282Through via in ultra high resistivity wafer and related methods
#24283Semiconductor device including barrier metal and coating film and method for manufacturing same
#24284Carbon containing silicon oxide film having high ashing tolerance and adhesion
#24285Semiconductor device
#24286SEMICONDUCTOR DEVICE WITH BONDING PAD SUPPORT STRUCTURE
#24287Properties of metallic copper diffusion barriers through silicon surface treatments
#24288Apparatus for crack prevention in integrated circuit packages
#24289Semiconductor device
#24290Semiconductor device
#24291Manufacturing methods for semiconductor device with sealed cap
#24292Semiconductor Device Package Leadframe
#24293Microelectronic assembly
#24294Wafer level device package with sealing line having electroconductive pattern and method of packaging the same
#24295Method for making semiconductor chips having coated portions
#24296Edge seal for a semiconductor device and method therefor
#24297Post last wiring level inductor using patterned plate process
#24298Electrical fuse with metal silicide pipe under gate electrode
#24299SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME
#24300Trench-constrained isolation diffusion for integrated circuit die