Isolation structures for integrated circuits

Isolation structures for integrated circuits

Isolation structures for integrated circuits

PROCESS FOR HIGH VOLTAGE SUPERJUNCTION TERMINATION

Optical device

WAFER LEVEL LENS ARRAYS FOR IMAGE SENSOR PACKAGES AND THE LIKE, IMAGE SENSOR PACKAGES, AND RELATED METHODS

TRANSISTOR DESIGN SELF-ALIGNED TO CONTACT

Semiconductor device and method for fabricating the same

Semiconductor device with a resistance element in a trench

Thin film transistor array panel for a liquid crystal display

Semiconductor Integrated Circuit

Layouts for multiple-stage ESD protection circuits for integrating with semiconductor power device

Reflective Layered System Comprising a Plurality of Layers that are to be Applied to a III/V Compound Semiconductor Material

Package for light emitting device with metal base to conduct heat

Semiconductor light emitting apparatus

Method for fabricating a semiconductor device having embedded interconnect structures to improve die corner robustness

Wiring Board and Wiring Board Manufacturing Method

Printed wiring board and method for producing the same

Surface finish structure of multi-layer substrate and manufacturing method thereof

Thermal diffusion sheet and method for positioning thermal diffusion sheet

Cooling apparatus

RADIATOR AND COOLING SYSTEM

HEAT DISSIPATION DEVICE WITH A HEAT PIPE

Heat dissipation device with heat pipes

Heat dissipation device having cap for protecting thermal interface material thereon

Plasma processing apparatus

Method for producing a printed wiring board

Process for the collective fabrication of 3D electronic modules

Nonvolatile semiconductor memory system

MULTI-WAFER 3D CAM CELL

Structure and method for monitoring variation within an active region of a semiconductor device using scaling

Organic/inorganic composite

Ultra-Low Dielectrics Film for Copper Interconnect

Electronic device having molded resin case, and molding tool and method of manufacturing the same

Method for producing through-contacts in semi-conductor wafers via production of through-plated holes

Semiconductor device manufacturing method

Method of manufacturing semiconductor device suitable for forming wiring using damascene method

Method to manufacture a silicon wafer electronic component protected against the attacks and such a component

Integrated circuit inductor with integrated vias

Stacked bit line dual word line nonvolatile memory

Fin-type antifuse

Method for manufacturing semiconductor package

Method for adhering semiconductor devices

Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method

TEST STRUCTURES AND METHODOLOGY FOR DETECTING HOT DEFECTS

Extensions of self-assembled structures to increased dimensions via a “bootstrap” self-templating method

HEAT CONDUCTOR

Incorporation of nitrogen into high k dielectric film

Heat exchange enhancement

METHOD FOR THERMAL CONDUCTION INTERFACING

METHOD OF COATING LEAD FRAMES

Apparatus and method for transmitting signals with multiple antennas

Method and apparatus for thermal protection in an integrated circuit

Heat Exchange Enhancement

Ic Holder

Grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers

Finned Heat Sink, Particularly for a Thermoelectric Module

Apparatus, system, and method for thermal conduction interfacing

Heat dissipating member, heat dissipating mechanism, and information processing apparatus

INTEGRATED CIRCUIT WITH PROTECTION AGAINST ELECTROSTATIC DAMAGE

Composite integrated semiconductor device

CDM ESD PROTECTION FOR INTEGRATED CIRCUITS

Fully integrated tuner architecture

Image pickup device and image pickup result outputting method

Methods and systems for thermal-based laser processing a multi-material device

Vertical system integration

Tamper respondent enclosure

Integrated transformer and method of fabrication thereof

FUSE DEVICE, METHOD FOR WRITING DATA, METHOD FOR READING DATA, AND METHOD FOR WRITING AND READING DATA

PROGRAMMABLE CIRCUIT HAVING A CARBON NANOTUBE

Testing Using Independently Controllable Voltage Islands

Semiconductor device and method of measuring sheet resistance of lower layer conductive pattern thereof

Light Emitting Module, and Method for Producing the Same

Vacuum extrusion method of manufacturing a thermal paste

ANISOTROPICALLY CONDUCTIVE MEMBER AND METHOD OF MANUFACTURE

INTERCONNECT STRUCTURES WITH TERNARY PATTERNED FEATURES GENERATED FROM TWO LITHOGRAPHIC PROCESSES

Enhanced mechanical strength via contacts

Method of manufacturing a semiconductor device and semiconductor device

Electrically Conductive Line

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Method for FEOL and BEOL wiring

Semiconductor contact structure containing an oxidation-resistant diffusion barrier and method of forming

Chip assembly with interconnection by metal bump

Semiconductor devices including interlayer conductive contacts and methods of forming the same

Fastener for heat sinks

Electronic device and pressure sensor

Housed active microstructures with direct contacting to a substrate

Wafer level package and wafer level packaging method

Semiconductor device and method for manufacturing the same

Electromagnetic shielding device for an infrared receiver

Semiconductor integrated circuit device and process for manufacturing the same

Seal ring structure with improved cracking protection

Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse application

Semiconductor device and method of producing the same

Production of a carrier wafer contact in trench insulated integrated SOI circuits having high-voltage components

Tapered through-silicon via structure

Process for high voltage superjunction termination

Substantially L-shaped silicide for contact

Semiconductor device and method for fabricating the same

Illuminating efficiency-increasable and light-erasable embedded memory structure

MISFET with capacitors

Biosensor having ultra fine fiber

Semiconductor device and method of manufacturing the same

Optoelectronic thin-film chip

Heat exchange enhancement

Heat sink and method of making same

WATER-COOLING HEAT-DISSIPATING SYSTEM

WATER-COOLING HEAT-DISSIPATING SYSTEM

HEAT SPREADER WITH VAPOR CHAMBER AND HEAT DISSIPATION APPARATUS USING THE SAME

Direct Air Contact Liquid Cooling System Heat Exchanger Assembly

METHODS AND APPARATUS FOR MULTIPLE TEMPERATURE LEVELS

Chamber sealing valve

High power microjet cooler

Reconfigurable integrated circuit

System and method for product yield prediction

System for and method of verifying IC authenticity

Electrical connector assembly having connecting portion

Substrate processing method and substrate processing apparatus

Method for fabricating an inductor structure or a dual damascene structure

Producing a covered through substrate via using a temporary cap layer

Enhanced mechanical strength via contacts

Barrier material and process for Cu interconnect

CMOS DEVICE WITH DUAL POLYCIDE GATES AND METHOD OF MANUFACTURING THE SAME

Methods for forming co-planar wafer-scale chip packages

METHOD OF MANUFACTURING THIN FILM TRANSISTOR SUBSTRATE AND MANUFACTURING SYSTEM USING THE SAME

Copper diffusion barrier

Apparatus and method for measuring local surface temperature of semiconductor device

Semiconductor laser device and method of manufacturing the same

Die module system

Hybrid integrated circuit device and method for manufacturing same

Electronic control apparatus

Memory module assembly and heat sink thereof

Electronic component unit and electronic apparatus

Termination compensation for differential signals on glass

Test Structure for Statistical Characterization of Metal and Contact/Via Resistances

Method of using a four terminal hybrid silicon/organic field effect sensor device

Ceramic base material

Semiconductor wafer with assisting dicing structure and dicing method thereof

Mask layout method, and semiconductor device and method for fabricating the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Interconnect structures

Electronic structures utilizing etch resistant boron and phosphorus materials and methods to form same

Semiconductor Device and Method for Manufacturing the Same

Semiconductor devices and methods for manufacturing the same

Semiconductor Device

Method for manufacturing a semiconductor device, and said semiconductor device

Electrical circuit device

Layer Transfer Process and Functionally Enhanced Integrated Circuits Products Thereby

Ultra-thin near-hermetic package based on rainier

Circuit structures and methods with BEOL layer(s) configured to block electromagnetic interference

Post last wiring level inductor using patterned plate process

Semiconductor device

Ballasted polycrystalline fuse

ELECTRONIC DEVICE AND METHOD FOR OPERATING A MEMORY CIRCUIT

Small size transistor semiconductor device capable of withstanding high voltage

Field effect transistor with air bridge

High power density switch module with improved thermal management and packaging

SURFACE LIGHT EMITTING DIODE MODULE WITH A SURFACE LIGHT EMITTING DIODE CONNECTED TO A CONDUCTIVE SUBSTRATE TIGHTLY

Light emitting diode assembly and light emitting diode display device

Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device

Lid structure for microdevice and method of manufacture

Semiconductor device, manufacturing method thereof, and measuring method thereof

Test structure for semiconductor chip

Electroless gold plating method and electronic parts

Piezoelectric gas ejecting device

Circulation-type liquid cooling apparatus and electronic device containing same

Heat transfer apparatus of a forced convection type

LIGHT EMITTING DIODE FOR ELECTRIC SIGNBOARD

METHOD AND COMPUTER PROGRAM FOR AUTOMATED ASSIGNMENT AND INTERCONNECTION OF DIFFERENTIAL PAIRS WITHIN AN ELECTRONIC PACKAGE

Method of shield line placement for semiconductor integrated circuit, design apparatus for semiconductor integrated circuit, and design program for semiconductor integrated circuit

Integrated circuit having electrically isolatable test circuitry

Power managers for an integrated circuit

Shielded capacitor structure

Structure and method for enhancing resistance to fracture of bonding pads

Through-wafer vias

Wafer level image sensor package with die receiving cavity and method of making the same

Novel Ruthenium-Based Materials and Ruthenium Alloys, Their Use in Vapor Deposition or Atomic Layer Deposition and Films Produced Therefrom

Carbon materials

Fuse of a semiconductor memory device and repair process for the same

Structure of a light emitting diode

Holding device for a heat sink

Retaining tool for a heat sink

MAGNETICALLY COUPLED COOLING BLOCK

Retaining device for a heat sink

Secure device for a heat sink and CPU

Guard ring device receiving different voltages for forming decoupling capacitor and semiconductor device having the same

Light-Emitting Diode Package

Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs

Electrically optimized and structurally protected via structure for high speed signals

Methods of conditioning getter materials

Semiconductor Device and Method for Making Same

Through-wafer vias

Method of fabricating a semiconductor device

PLANAR INTERCONNECT STRUCTURE FOR HYBRID CIRCUITS

SEMICONDUCTOR DEVICE HAVING HIGH-FREQUENCY INTERCONNECT

Semiconductor device

Method of blocking a void during contact formation

Manufacturing of a semiconductor device and the manufacturing method

Liquid cooled power electronic circuit comprising stacked direct die cooled packages

Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips

Capture of residual refractory metal within semiconductor device

Thin film resistors integrated at two different metal single die

Semiconductor Device and Manufacturing Method of Semiconductor Device

Post last wiring level inductor using patterned plate process

Semiconductor device and method of manufacturing the same

Packaged MEMS device assembly

Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage

Semiconductor device and method of fabricating the same

Conductive structures, non-volatile memory device including conductive structures and methods of manufacturing the same

Light emitting diode

Resistance-based etch depth determination for SGT technology

Hydrogen getter

Scanning electron microscope and CD measurement calibration standard specimen

METHOD OF MANUFACTURING HEAT SPREADER MODULE

Process for Temporary Fixing of a Polymeric Layer Material on Rough Surfaces

Embedded test circuit for testing integrated circuits at the die level

Analyte Monitoring Device and Methods of Use

Heat dissipating silicone grease compositions

Sintered Ceramics for Mounting Light-Emitting Element

APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT

Method for front end of line fabrication

Method of Forming Overlay Mark of Semiconductor Device

HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS

Semiconductor device and adjusting method for semiconductor device

Fabrication method for semiconductor device, exposure method, pattern correction method and semiconductor device

Led Having Wide Wavelength-Range and Light Curing Unit Using the Same

Active control of time-varying spatial temperature distribution

MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYMIDE FILM, FILM FOR TAB, AND PREPREG

MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYIMIDE FILM FOR TAB, AND PREPREG

Apparatus and process for plasma-enhanced atomic layer deposition

Lighting Module With Compact Colour Mixing and Collimating Optics

Light source module with high heat-dissipation efficiency

Cooling Device for Cooling a Semiconductor Component, in Particular, an Optoelectronic Semiconductor Component

Radio frequency absorber

Shielding structures for signal paths in electronic devices

Lead frame with solder flow control

Chip component mounting structure, chip component mounting method, and electronic device

Enhanced thermal conducting formulations

Cooling assembly

Carrier For Electrical Components With Soldered-On Cooling Body

Thermally conductive grease

Heat sink with surface-formed vapor chamber base

Cold plate stability

Surface airflow heatsink device and the heatsink device components

Electronic device

HEAT DISSIPATING DEVICE

On-chip interconnect-stack cooling using sacrificial interconnect segments

HEAT DISSIPATOR FASTENER KIT

Scalable integrated circuit high density capacitors

Level conversion circuit and semiconductor integrated circuit device employing the level conversion circuit

LIGHTING APPARATUS AND LIQUID CRYSTAL DISPLAY APPARATUS

Illuminable GaAs switching component with transparent housing and associated microwave circuit

Semiconductor device and wiring part thereof

Enhanced substrate using metamaterials

Signal processing circuit comprising ion sensitive field effect transistor and method of monitoring a property of a fluid

METHOD OF IMPROVING FUSE STATE DETECTION AND YIELD IN SEMICONDUCTOR APPLICATIONS

Gate drive for wide bandgap semiconductor device

Wafer level interposer

EL display device and electronic device

Method of forming wiring of light emitting device, substrate for mounting light emitting device, display, back light, illuminating apparatus and electronic appliance

High current capacity rectifier package

THIN-FILM ALUMINUM NITRIDE ENCAPSULANT FOR METALLIC STRUCTURES ON INTEGRATED CIRCUITS AND METHOD OF FORMING SAME

Semiconductor device, electronic device, and method of producing semiconductor device

Electronic component to protect an interface between a conductor and an insulator and method for manufacturing the same

Anchoring structure and intermeshing structure

Semiconductor Device and Method for Manufacturing the Same

SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE FEATURE AND METHOD OF FORMING THE SAME

Method of manufacturing semiconductor device, and semiconductor device

Semiconductor device and method of manufacturing the same

Electrically conductive composite

Hybrid Metal Matrix Composite Packages with High Thermal Conductivity Inserts

REWORK PROCESS AND METHOD FOR LEAD-FREE CAPPED MULTI-CORE MODULES WITH ORGANIC SUBSTRATES

SiCOH DIELECTRIC

Method for fabricating a high-K dielectric layer

Scribe line layout design

AIR GAP WITH SELECTIVE PINCHOFF USING AN ANTI-NUCLEATION LAYER

Semiconductor device

Stacked semiconductor capacitor structure

Semiconductor device with improved contact fuse

Method for generating a layout, use of a transistor layout, and semiconductor circuit

Disposable pillars for contact formation

Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage

Technique for enhancing transistor performance by transistor specific contact design

Semiconductor device and method of manufacturing the same

Fin field-effect transistors

Semiconductor device having vertical MOSFET

Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same

Semiconductor device manufacturing method including forming a metal silicide layer on an indium-containing layer

Optoelectronic Component

Unified test structure for stress migration tests

Image inputting apparatus

Microfabricated miniature grids

Non-contact laser carving process and the equipment

Metal wiring plate

STRUCTURE OF MEMORY HEAT SINK

Heat plate

COOLING MECHANISM COMPRISING A HEAT PIPE AND WATER BLOCK

Piston reset apparatus for a multichip module and method for resetting pistons in the same

Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways