Mounting a heat sink in thermal contact with an electronic component

Thin-film solar cell and method of manufacturing the same

METHOD FOR FORMING SLOT ON SUBSTRATE AND STRUCTURE THEREOF

Methods of making thin film capacitors

Power supply wiring structure

Optical proximity correction method, optical proximity correction apparatus, and optical proximity correction program, method of manufacturing semiconductor device, design rule formulating method, and optical proximity correction condition calculating method

Analyte monitoring device and methods of use

Wireless local loop antenna

Electrical connection board and assembly of such a board and a semiconductor component comprising an integrated circuit chip

Semiconductor device with hydrogen barrier and method therefor

Semiconductor device having oxidized metal film and manufacture method of the same

Structure and method for mosfet with reduced extension resistance

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Method of processing semiconductor wafers

Metallic Air-Bridges

Thin film device having lead conductor film

Fabricating a contact rhodium structure by electroplating and electroplating composition

Ink composition and metallic material

Method of growing carbon nanotube and carbon nanotube growing system

LED illumination system

LED-element

Mounting a heat sink in thermal contact with an electronic component

Efficiently cool data centers and electronic enclosures using loop heat pipes

Heat-Receiving apparatus and electronic equipment

Electronic fuse with conformal fuse element formed over a freestanding dielectric spacer

HIGH FREQUENCY POWER AMPLIFIER AND WIRELESS PORTABLE TERMINAL USING THE SAME

Interchangeable LED bulbs

Heat Exchange Enhancement

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD OF THE SAME SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Semiconductor device having multiple wiring layers

Semiconductor device and manufacturing method of the same

System for controlling the temperature of an associated electronic device using an enclosure having a working fluid arranged therein and a chemical compound in the working fluid that undergoes a reversible chemical reaction to move heat from the associated electronic device

Process for producing and apparatus for improving the bonding between a plastic and a metal

MgO-based coating for electrically insulating semiconductive substrates and production method thereof

Method of producing semiconductor device and semiconductor device

Semiconductor device having sealing ring

ESD protected integrated capacitor with large capacity

Semiconductor electrically programmable fuse element with amorphous silicon layer after programming and method of programming the same

Electromigration Aggravated Electrical Fuse Structure

Semiconductor device with localized stressor

Semiconductor device and method for producing the same

Semiconductor device structure for anti-fuse

Shielded gate field effect transistor

Semiconductor component including compensation zones and discharge structures for the compensation zones

Method of manufacturing a device by locally heating one or more metallization layers and by means of selective etching

Light emission device including semiconductor light emitting elements

Semiconductor wafer, semiconductor chip and method of manufacturing semiconductor chip

Resistive memory cell fabrication methods and devices

Method of manufacturing printed circuit board for semiconductor package

HIGH THERMAL CONDUCTING CIRCUIT SUBSTRATE AND MANUFACTURING PROCESS THEREOF

FLEXIBLE CIRCUIT STRUCTURE WITH STRETCHABILITY AND METHOD OF MANUFACTURING THE SAME

Electrical power substrate

Electronic device

Heat sink assembly having a fin also functioning as a supporting bracket

CLIP MODULE

Silica powder and use thereof

Spring interconnect structures

Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer

Reducing effective dielectric constant in semiconductor devices

Method of manufacturing a semiconductor device with a peeling prevention layer

Void-free contact plug

Multilayered cap barrier in microelectronic interconnect structures

Apparatus and method for electronic fuse with improved ESD tolerance

Vertical system integration

Phosphor coating process for light emitting diode

Methods for forming an enriched metal oxide surface

Cobalt nitride layers for copper interconnects and methods for forming them

LIGHT-EMITTING DEVICE WITH POWER SUPPLY STRUCTURE

High brightness light emitting diode device

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

Damage prevention interposer for electronic package and electronic interconnect structure

Interposer

Printed circuit board employing heat sink retaining apparatus and method of use

Electronic device

Ic Component Comprising a Cooling Arrangement

Semiconductor module

Electronic apparatus

Multi-functional energy conditioner

Overlay mark, and fabrication and application of the same

Card based image manipulation method for camera

Methods and apparatus for dynamically authenticated identification

Electrical fuses with redundancy

Method for defeating reverse engineering of integrated circuits by optical means

METHOD AND APPARATUS FOR SINGULATED DIE TESTING

Power grid structure to optimize performance of a multiple core processor

Displacement detection pattern for detecting displacement between wiring and via plug, displacement detection method, and semiconductor device

LIGHT-EMITTING DEVICE AND ARTICLE

Intermediate semiconductor device structures

Semiconductor device and processing method of the same

Vertical system integration

Chip package

METAL INTERCONNECT STRUCTURE

Semiconductor device and dummy pattern arrangement method

Semiconductor device and semiconductor device manufacturing method

Post passivation interconnection schemes on top of the IC chips

Seal ring structures with reduced moisture-induced reliability degradation

Transitional interface between metal and dielectric in interconnect structures

Solder pad and method of making the same

System and method having evaporative cooling for memory

Electronic Device With Stress Relief Element

Conductor frame for an electronic component and method for the production thereof

Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same

Fuse structure, and semiconductor device

Fuse structure, semiconductor device, and method of forming the semiconductor device

Semiconductor fabrication method and system

Standard component for calibration and electron-beam system using the same

STRUCTURE AND METHOD TO OPTIMIZE STRAIN IN CMOSFETs

Strain enhanced semiconductor devices and methods for their fabrication

Structure for low capacitance ESD robust diodes

Integrated circuits and methods of manufacture

Semiconductor device with a high breakdown voltage device

LIGHT EMITTING DEVICE

Semiconductor device, LED head and image forming apparatus

Photoelectric element package with temperature compensation

Luminescent device and process of manufacturing the same

Thin film transistor substrate and flat panel display comprising the same

Light-emitting device and article

Four-terminal programmable via-containing structure and method of fabricating same

Method of manufacturing a substrate for a mini-UICC smart card with an associated plug-in UICC adapter, and a resulting substrate

METHOD OF PREPARING HIGHLY THERMALLY CONDUCTIVE CIRCUIT SUBSTRATE

Wiring Board and Production Method Thereof

PLATING APPARATUS

Method for aligning microscopic structures and substrate having microscopic structures aligned, as well as integrated circuit apparatus and display element

Method For Increasing a Routing Density For a Circuit Board and Such a Circuit Board

Heat sink

Parameter adjustment method, semiconductor device manufacturing method, and recording medium

Encapsulant of epoxy group-containing (meth)acrylic polymer, anhydride and (meth)acrylic monomer

First inter-layer dielectric stack for non-volatile memory

Method to create a metal pattern using a damascene-like process

Method of forming an apparatus having a dielectric containing cerium oxide and aluminum oxide

Method and device for wafer backside alignment overlay accuracy

Metal-Based Carbon Fiber Composite Material and Producing Method Thereof

Carbon Black Coloring Agent for Semiconductor Sealing Material and Method of Manufacturing the Same

Semiconductor laser equipment

Light-emitting diode cluster lamp

Heat dissipation apparatus for heat producing device

Arrangement for Energy Conditioning

Method of manufacturing nitride semiconductor device including SiC substrate and apparatus for manufacturing nitride semiconductor device

HEAT-DISSIPATING SYSTEM HAVING DUST DETECTING FUNCTION

LAMINATE DEVICE HAVING VOIDED STRUCTURE FOR CARRYING ELECTRONIC ELEMENT, SUCH AS LABEL FOR RFID TAG

Organic electroluminescent display/source with anode and cathode leads

Method for realizing a nanometric circuit architecture between standard electronic components and semiconductor device obtained with said method

Semiconductor device and method of fabricating the same

Interconnect structure

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING DEVICE ISOLATION FILM OF SEMICONDUCTOR DEVICE

Electrical Interconnect Structures Having Carbon Nanotubes Therein and Methods of Forming Same

METHOD FOR FABRICATING CONTACT PADS

Polar hybrid grid array package

Package-Borne Selective Enablement Stacking

Bent lead transistor

Manufacturing method for semiconductor devices with enhanced adhesivity and barrier properties

Surface patterned topography feature suitable for planarization

Semiconductor structure including laminated isolation region

Structure for spanning gap in body-bias voltage routing structure

Semiconductor device including power switch and power reinforcement cell

High-k dielectric film, method of forming the same and related semiconductor device

Split-channel antifuse array architecture

Semiconductor device

Optic wafer with reliefs, wafer assembly including same and methods of dicing wafer assembly

Light-emitting diode packaging structure

PCM pad design for peeling prevention

TEST STRUCTURES AND METHODS FOR INSPECTION OF SEMICONDUCTOR INTEGRATED CIRCUITS

System and method to create haze standard

Semiconductor device and method for manufacturing the same

Interconnection, electronic device and method for manufacturing an electronic device

MONOLITHIC INTEGRATED CIRCUIT ARRANGEMENT

HEAT DISSIPATION APPARATUS, TWO-PHASE HEAT EXCHANGE DEVICE AND MANUFACTURING METHOD THEREOF

SYSTEM AND METHOD FOR IMPROVED AUTO-BOATING

LOW LOSS GLASS-CERAMIC MATERIALS, METHOD OF MAKING SAME AND ELECTRONIC PACKAGES INCLUDING SAME

Resin composition for encapsulation and semiconductor unit encapsulated with resin

REDUCED SOCKET SIZE WITH PIN LOCATIONS ARRANGED INTO GROUPS WITH COMPRESSED PIN PITCH

METHOD OF FORMING LOW RESISTIVITY COPPER FILM STRUCTURES

Method for implementing diffusion barrier in 3D memory

Method and structure for making a top-side contact to a substrate

Methods of forming CMOS integrated circuit devices having stressed NMOS and PMOS channel regions therein and circuits formed thereby

Interposer and method for producing the same and electronic device

Method of assembling chips

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, PATTERN CORRECTION APPARATUS, AND COMPUTER-READABLE RECORDING MEDIUM

Method and apparatus for performing a site-dependent dual patterning procedure

Method and apparatus for performing a site-dependent dual damascene procedure

Thermal interface material and method for fabricating the same

Thermally conductive sheet and method of manufacturing the same

Surface modifying carbon nanotube material, manufacturing method therefor, electronic component and electronic device

MEMORY CIRCUIT ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF

Semiconductor memory devices having strapping contacts

Apparatus for Converting an Electrical Current and Method for Reducing the Load-Change Stress of Power Semiconductor Units in the High-Voltage Energy Distribution and Transmission Sector

Light emitting diode having electrodes with branches and backlight module using same

Heat dissipation device having metal die-casting component and metal-extrusion component

Spring loaded heat sink retention mechanism

Heat sink mounting systems and methods

THERMAL TRANSFER DEVICE

Cooling of High Power Density Devices Using Electrically Conducting Fluids

Semiconductor Element Mounting Substrate, Semiconductor Module, And Electric Vehicle

Heat dissipating device

Combined-natural-and-forced-convection heat sink

Printed circuit board and electronic apparatus

Cooling device for electronic component and power converter equipped with the same

Flux precoated solder preform for thermal interface material

Method and structure for reducing cracks in a dielectric layer in contact with metal

Manufacture of 3 dimensional MIM capacitors in the last metal level of an integrated circuit

Image-sensing module of image capture apparatus and manufacturing method thereof

Display apparatus and driving method with first and second time correction of pixel drive transistor

Electrostatic discharge protection device with phosphors and method of fabricating the same

Varistor and light emitting device

Package embedded equalizer

Flexible Capacitive Coupler Assembly And Method Of Manufacture

High accuracy and universal on-chip switch matrix testline

Anti Pad To Reduce Parasitic Capacitance And Improve Return Loss In A Semiconductor Die And Package

Three-dimensional crossbar array systems and methods for writing information to and reading information stored in three-dimensional crossbar array junctions

Wiring layout having differently shaped vias

Packaging substrate structure

Annular via drilling (AVD) technology

RECESSED SOLDER SOCKET IN A SEMICONDUCTOR SUBSTRATE

Semiconductor device and method of producing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device

Structure and method for low resistance interconnections

Method and structure for ultra narrow crack stop for multilevel semiconductor device

Low contact resistance metal contact

SEMICONDUCTOR DEVICE WITH STRENGTHENED PADS

Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor device

Implementation of diffusion barrier in 3D memory

INTERCONNECT STRUCTURES CONTAINING A RUTHENIUM BARRIER FILM AND METHOD OF FORMING

Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication

Electronic device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Integrated circuit arrangement

Semiconductor device having tape carrier with bendable region

Circuit board with decoupling capacitors

Semiconductor device and method for manufacturing semiconductor device

Integrated circuit having resistor between BEOL interconnect and FEOL structure and related method

Integrated circuit structure incorporating an inductor, a conductive sheet and a protection circuit

SEMICONDUCTOR INTEGRATED CIRCUIT

Non-planar fuse structure including angular bend

Isolated bipolar transistor

Isolated rectifier diode

Chip-stacked semiconductor device and manufacturing method thereof

SOI substrate and method for manufacturing SOI substrate

Semiconductor device and temperature sensor structure for a semiconductor device

Radiation detector

Method of fabricating back-illuminated imaging sensors using a bump bonding technique

Semiconductor device

Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed and methods for fabricating same

METHOD FOR FABRICATING HIGH COMPRESSIVE STRESS FILM AND STRAINED-SILICON TRANSISTORS

Semiconductor device

Structure and circuit technique for uniform triggering of multifinger semiconductor devices with tunable trigger voltage

Isolated lateral MOSFET in epi-less substrate

Ldmos Transistor

Isolated trench MOSFET in epi-less semiconductor sustrate

Semiconductor device and electronic device

Isolated junction field-effect transistor

Device for detecting a gas or gas mixture

Multi-level interconnections for an integrated circuit chip

LED with porous diffusing reflector

Vertical system integration

Structure for electrically tunable resistor

Method and circuit for stressing upper level interconnects in semiconductor devices

Methods and processing systems for using a gas cluster ion beam to offset systematic non-uniformities in workpieces processed in a process tool

Apparatus and methods for systematic non-uniformity correction using a gas cluster ion beam

Multiple directional scans of test structures on semiconductor integrated circuits

Corrosion barrier layer for photoconductive X-ray imagers

Light receiving element with upper and side light receiving faces and an optical semiconductor module with the light receiving element and a light emitting element mounted on the same mounting unit

Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers

Unique identifier on integrated circuit device

Oxidized barrier layer

Switching element, method for manufacturing the same, and display device including switching element

Method for connecting two objects electrically

Wiring structure and method of forming the same

Laminated body

Electrothermal interface material enhancer

BRAZED CHANNEL PLATE

Heat dissipation device with heat pipe

Cooling unit

Vapor augmented heatsink with multi-wick structure

LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING

Heat-removal device

Water block

Heat sink with angled fins

Thermosiphon for laptop computer

High performance compact thermosiphon with integrated boiler plate

Thermosiphon for laptop computer

Microarchitecture control for thermoelectric cooling

Semiconductor integrated circuit with multi-cut via and automated layout method for the same

Method and system for reducing inter-layer capacitance in integrated circuits

Sealant epoxy-resin molding material, and electronic component device

Progressive unplugging multi-cards body

Customizable backer for achieving consistent loading and engagement of array package connections

Fabrication method of semiconductor integrated circuit device

Etch depth determination for SGT technology

Interconnect structures for semiconductor devices

Method and structure for self-aligned device contacts

Method of placing wires

Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom

Method for selectively forming electric conductor and method for manufacturing semiconductor device

Integrated Resistor Capacitor Structure

Method for Manufacturing Light-Emitting Device

Coated nickel-containing powders

Thermosetting resin composition, resin sheet and resin sheet for insulated substrate