ClassID:

212006

H01L2924/0002 - page 84 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#24901
20080232074
2008-09-25

Circuit Card Assembly Including Individually Testable Layers

#24902
20080232064
2008-09-25

Cooling system for information device

#24903
20080232059
2008-09-25

Protruding lock for notebook computer or other personal electronic device

#24904
20080232011
2008-09-25

Apparatus and methods for integrated circuit with devices with body contact and devices with electrostatic discharge protection

#24905
20080231739
2008-09-25

SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME

#24906
20080231345
2008-09-25

Silicon wafer for semiconductor with powersupply system on the backside of wafer

#24907
20080231312
2008-09-25

Structure for modeling stress-induced degradation of conductive interconnects

#24908
20080231182
2008-09-25

Electroluminescent device with liquid-repellent portion and electronic apparatus

#24909
20080231145
2008-09-25

Method for sealing a quartz crystal device

#24910
20080230934
2008-09-25

Method of producing a wafer scale package

#24911
20080230929
2008-09-25

OVERLAY MARK OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE INCLUDING THE OVERLAY MARK

#24912
20080230927
2008-09-25

Fully tested wafers having bond pads undamaged by probing and applications thereof

#24913
20080230925
2008-09-25

SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD

#24914
20080230919
2008-09-25

Dual damascene with via liner

#24915
20080230918
2008-09-25

SEMICONDUCTOR INTEGRATED CIRCUIT AND DESIGN METHOD OF SIGNAL TERMINALS ON INPUT/OUTPUT CELL

#24916
20080230917
2008-09-25

Method of fabricating two-step self-aligned contact

#24917
20080230912
2008-09-25

Wafer-level stack package and method of fabricating the same

#24918
20080230907
2008-09-25

INTEGRATED CIRCUIT SYSTEM WITH CARBON ENHANCEMENT

#24919
20080230906
2008-09-25

CONTACT STRUCTURE HAVING DIELECTRIC SPACER AND METHOD

#24920
20080230902
2008-09-25

Method of forming solder bump on high topography plated Cu

#24921
20080230874
2008-09-25

Semiconductor device, moisture-resistant frame, groove and method of producing semiconductor device

#24922
20080230873
2008-09-25

Semiconductor device with capacitor and/or inductor and method of making

#24923
20080230845
2008-09-25

Semiconductor device and method of forming the same

#24924
20080230820
2008-09-25

SEMICONDUCTOR DEVICE

#24925
20080230807
2008-09-25

Transistor with heat dissipating means

#24926
20080230791
2008-09-25

Optoelectronic device

#24927
20080230789
2008-09-25

Light emitting device, method of manufacturing the same and monolithic light emitting diode array

#24928
20080230785
2008-09-25

Termination and contact structures for a high voltage GaN-based heterojunction transistor

#24929
20080230779
2008-09-25

[100] or [110] aligned, semiconductor-based, large-area, flexible, electronic devices

#24930
20080230765
2008-09-25

Light emitting diode

#24931
20080230515
2008-09-25

Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof

#24932
20080230375
2008-09-25

Sputtering method and sputtering apparatus

#24933
20080230260
2008-09-25

Flip-chip substrate

#24934
20080230210
2008-09-25

Thermosiphon boiler plate

#24935
20080230209
2008-09-25

Spot cooler for heat generating electronic components

#24936
20080230208
2008-09-25

Liquid Cooling System Cold Plate Assembly

#24937
20080230112
2008-09-25

Photovoltaic cells

#24938
20080230110
2008-09-25

THIN FILM PHOTODETECTOR, METHOD AND SYSTEM

#24939
20080230106
2008-09-25

Forming a thin film electric cooler and structures formed thereby

#24940
20080229580
2008-09-25

Method of manufacturing a brazed micro-channel cold plate heat exchanger assembly

#24941
20080229573
2008-09-25

System for fabricating semiconductor components with conductive interconnects

#24942
20080228419
2008-09-18

Process condition sensing wafer and data analysis system

#24943
20080227909
2008-09-18

Method for Producing Thermally Conductive Sheet and Thermally Conductive Sheet Produced by the Method

#24944
20080227293
2008-09-18

Integrated circuit fabrication

#24945
20080227289
2008-09-18

Method of fabricating integrated circuitry

#24946
20080227286
2008-09-18

Method for manufacturing an interconnection structure with cavities for an integrated circuit

#24947
20080227247
2008-09-18

BARRIER DIELECTRIC STACK FOR SEAM PROTECTION

#24948
20080227237
2008-09-18

Method of joining chips utilizing copper pillar

#24949
20080227236
2008-09-18

Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays

#24950
20080227226
2008-09-18

Semiconductor substrate, manufacturing method of a semiconductor device and testing method of a semiconductor device

#24951
20080226902
2008-09-18

Getter systems comprising one or more deposits of getter material and a layer of material for the transport of water

#24952
20080226896
2008-09-18

Nanoparticles with covalently bonded stabilizer

#24953
20080226841
2008-09-18

Formation of dielectric film by alternating between deposition and modification

#24954
20080226826
2008-09-18

Substrate Processing Method and Substrate Processing Apparatus

#24955
20080226815
2008-09-18

NOVEL THIN LAMINATE AS EMBEDDED CAPACITANCE MATERIAL IN PRINTED CIRCUIT BOARDS

#24956
20080225591
2008-09-18

Nonvolatile semiconductor memory

#24957
20080225502
2008-09-18

Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid

#24958
20080225493
2008-09-18

Three-dimensional multichip module

#24959
20080225492
2008-09-18

Electronic Device and Heat Sink

#24960
20080225491
2008-09-18

System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices

#24961
20080225490
2008-09-18

Thermal interface materials

#24962
20080225489
2008-09-18

Heat spreader with high heat flux and high thermal conductivity

#24963
20080225486
2008-09-18

Heat-dissipating device connected in series to water-cooling circulation system

#24964
20080225485
2008-09-18

Distributed transmit/receive integrated microwave module chip level cooling system

#24965
20080225482
2008-09-18

Semiconductor cooling system for use in electric or hybrid vehicle

#24966
20080224771
2008-09-18

Compensation for parasitic coupling between RF or microwave transistors in the same package

#24967
20080224332
2008-09-18

Transistor circuit formation substrate

#24968
20080224326
2008-09-18

Chip structure with bumps and testing pads

#24969
20080224321
2008-09-18

CELL DATA FOR SPARE CELL, METHOD OF DESIGNING A SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR INTEGRATED CIRCUIT

#24970
20080224318
2008-09-18

System and method for integrated circuit arrangement having a plurality of conductive structure levels

#24971
20080224311
2008-09-18

Semiconductor device

#24972
20080224307
2008-09-18

Semiconductor die with mask programmable interface selection

#24973
20080224292
2008-09-18

Interposer structure with embedded capacitor structure, and methods of making same

#24974
20080224275
2008-09-18

Semiconductor device with ONO film

#24975
20080224262
2008-09-18

Semiconductor device with a high-frequency interconnect

#24976
20080224261
2008-09-18

Fuse/anti-fuse structure and methods of making and programming same

#24977
20080224259
2008-09-18

Methods of fabricating passive element without planarizing and related semiconductor device

#24978
20080224257
2008-09-18

Semiconductor device

#24979
20080224256
2008-09-18

Semiconductor-on-insulator(SOI) structures including gradient nitrided buried oxide (BOX)

#24980
20080224253
2008-09-18

Radio frequency semiconductor device

#24981
20080224249
2008-09-18

Semiconductor device and method of manufacturing the same

#24982
20080224229
2008-09-18

Semiconductor device having a plurality of antifuse memory cells

#24983
20080224220
2008-09-18

Electrostatic discharge protection device

#24984
20080224215
2008-09-18

Thin film semiconductor device and its manufacturing method

#24985
20080224188
2008-09-18

Image sensor and method for manufacturing the same that uses thermoelectric device for cooling

#24986
20080224158
2008-09-18

Light Emitting Device With Undoped Substrate And Doped Bonding Layer

#24987
20080224155
2008-09-18

LIGHT-EMITTING DIODE UNIT

#24988
20080224153
2008-09-18

Electronic device, method of producing the same, light-emitting diode display unit, and method of producing the same

#24989
20080224149
2008-09-18

Silicon carbide semiconductor device and manufacturing method thereof

#24990
20080224148
2008-09-18

Semiconductor sensing device

#24991
20080224135
2008-09-18

Method and structure for determining thermal cycle reliability

#24992
20080224019
2008-09-18

Support device for heat dissipation module

#24993
20080223609
2008-09-18

Electronic device and electronic component mounting method

#24994
20080223567
2008-09-18

Heat Dissipating Device

#24995
20080223558
2008-09-18

COOLING DEVICE

#24996
20080223556
2008-09-18

Pump-free water-cooling system

#24997
20080223555
2008-09-18

Method and apparatus for controlling temperature

#24998
20080223554
2008-09-18

Fan

#24999
20080223552
2008-09-18

LIQUID COOLING SYSTEM

#25000
20080223551
2008-09-18

MANUFACTURING METHOD OF FIN UNIT

#25001
20080220998
2008-09-11

Reversible thermal thickening grease

#25002
20080220684
2008-09-11

Method of producing electronic component comprising electrodes and ring residues

#25003
20080220608
2008-09-11

Modified via bottom structure for reliability enhancement

#25004
20080220607
2008-09-11

Signal routing on redistribution layer

#25005
20080220548
2008-09-11

MULTI-CHIP SURFACE MOUNTED LED STRUCTURE AND A METHOD FOR MANUFACTURING THE SAME

#25006
20080220547
2008-09-11

SINGLE-CHIP SURFACE MOUNTED LED STRUCTURE AND A METHOD FOR MANUFACTURING THE SAME

#25007
20080220543
2008-09-11

Method for fabricating semiconductor device

#25008
20080220374
2008-09-11

METHOD AND STRUCTURE FOR IMPROVED ALIGNMENT IN MRAM INTEGRATION

#25009
20080220342
2008-09-11

Methods of fabricating optical packages, systems comprising the same, and their uses

#25010
20080220220
2008-09-11

Semiconductor die having increased usable area

#25011
20080220213
2008-09-11

ZEOLITE - CARBON DOPED OXIDE COMPOSITE LOW K DIELECTRIC

#25012
20080220202
2008-09-11

Laminated substrates for mounting electronic parts and methods for making same

#25013
20080220155
2008-09-11

Manufacturing method of wiring and storage element

#25014
20080219754
2008-09-11

FIXING METHOD AND FIXING DEVICE

#25015
20080219007
2008-09-11

Thermal management system for LED array

#25016
20080219006
2008-09-11

Display apparatus

#25017
20080218978
2008-09-11

IC fixing structure

#25018
20080218977
2008-09-11

Cycling LED heat spreader

#25019
20080218976
2008-09-11

Retention module for a heat sink

#25020
20080218975
2008-09-11

Mounting structure with heat sink for electronic component and female securing member for same

#25021
20080218972
2008-09-11

Cooling device, system containing same, and cooling method

#25022
20080218968
2008-09-11

WINGED PIEZO FAN

#25023
20080218965
2008-09-11

Electronic device, package having the same, and electronic apparatus

#25024
20080218964
2008-09-11

DESKTOP PERSONAL COMPUTER AND THERMAL MODULE THEREOF

#25025
20080218963
2008-09-11

Desktop personal computer and thermal module thereof

#25026
20080218919
2008-09-11

Protection of integrated electronic circuits from electrostatic discharge

#25027
20080218287
2008-09-11

Circuit and method for adjusting impedance

#25028
20080218249
2008-09-11

Semiconductor device and trimming method therefor

#25029
20080218095
2008-09-11

LED assembly and module

#25030
20080218093
2008-09-11

Structure of AC light-emitting diode dies

#25031
20080217794
2008-09-11

Overlay measurement target

#25032
20080217791
2008-09-11

SEMICONDUCTOR DEVICE

#25033
20080217790
2008-09-11

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#25034
20080217789
2008-09-11

Method of forming metal line of semiconductor device

#25035
20080217788
2008-09-11

Method of fabricating self-aligned contact

#25036
20080217783
2008-09-11

Semiconductor device

#25037
20080217782
2008-09-11

Method for preparing 2-dimensional semiconductor devices for integration in a third dimension

#25038
20080217766
2008-09-11

Acoustic transducer module

#25039
20080217764
2008-09-11

Piezoelectric cooling of a semiconductor package

#25040
20080217757
2008-09-11

Power semiconductor module

#25041
20080217756
2008-09-11

POWER SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING IT

#25042
20080217755
2008-09-11

Systems and Methods for Providing Voltage Compensation in an Integrated Circuit Chip Using a Divided Power Plane

#25043
20080217752
2008-09-11

Functional device package with metallization arrangement for improved bondability of two substrates

#25044
20080217747
2008-09-11

Introduction of metal impurity to change workfunction of conductive electrodes

#25045
20080217743
2008-09-11

Method of manufacturing semiconductor device and semiconductor device

#25046
20080217739
2008-09-11

Semiconductor packaging substrate structure with capacitor embedded therein

#25047
20080217737
2008-09-11

Semiconductor device and method of manufacturing the same

#25048
20080217736
2008-09-11

Method of manufacturing an electrical antifuse

#25049
20080217735
2008-09-11

Metal e-fuse structure design

#25050
20080217734
2008-09-11

Multi-level electrical fuse using one programming device

#25051
20080217733
2008-09-11

Electrical fuse structure for higher post-programming resistance

#25052
20080217691
2008-09-11

Higher performance CMOS on (110) wafers

#25053
20080217668
2008-09-11

Semiconductor device and method of manufacturing the same

#25054
20080217658
2008-09-11

Electrical antifuse with integrated sensor

#25055
20080217642
2008-09-11

Light emitting diode with a step section between the base and the lens of the diode

#25056
20080217636
2008-09-11

Electroluminescence device

#25057
20080217630
2008-09-11

Light emission device

#25058
20080217626
2008-09-11

Diamond semiconductor element and process for producing the same

#25059
20080217624
2008-09-11

Capacitor and light emitting display using the same

#25060
20080217615
2008-09-11

Test arrangement having chips of a first substrate on a second substrate and chips of the second substrate on a third substrate

#25061
20080217614
2008-09-11

Systems and Methods for Controlling of Electro-Migration

#25062
20080217613
2008-09-11

Positional offset measurement pattern unit featuring via-plug and interconnections, and method using such positional offset measurement pattern unit

#25063
20080217529
2008-09-11

Method for adjusting imaging magnification and charged particle beam apparatus

#25064
20080217413
2008-09-11

Method and apparatus for a contactless smartcard incorporating a pressure sensitive switch

#25065
20080217149
2008-09-11

INTEGRATED ARRANGEMENT AND METHOD FOR PRODUCTION

#25066
20080216997
2008-09-11

Heat plate construction and attachment for dismounting heat plate

#25067
20080216994
2008-09-11

Vapor-Augmented Heat Spreader Device

#25068
20080216993
2008-09-11

HEAT DISSIPATING DEVICE

#25069
20080216992
2008-09-11

HEAT DISSIPATING DEVICE

#25070
20080216991
2008-09-11

COOLING DEVICE FOR INFORMATION EQUIPMENT

#25071
20080216990
2008-09-11

Heat dissipation device with a heat pipe

#25072
20080216311
2008-09-11

Producing method of solid state pickup device, and attaching method and device for the same

#25073
20080216031
2008-09-04

Structures for semiconductor structures with error detection and correction

#25074
20080215914
2008-09-04

Self-reparable semiconductor and method thereof

#25075
20080215284
2008-09-04

Apparatus for thermal characterization under non-uniform heat load

#25076
20080214914
2008-09-04

ANALYTE MONITORING DEVICE AND METHODS OF USE

#25077
20080213993
2008-09-04

Method and apparatus of stress relief in semiconductor structures

#25078
20080213958
2008-09-04

Capacitor structure and fabricating method thereof

#25079
20080213948
2008-09-04

Dual wired integrated circuit chips

#25080
20080213944
2008-09-04

Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure

#25081
20080213936
2008-09-04

Alignment mark forming method, alignment method, semiconductor device manufacturing method, and solid-state image capturing apparatus manufacturing method

#25082
20080213927
2008-09-04

METHOD FOR MANUFACTURING AN IMPROVED RESISTIVE STRUCTURE

#25083
20080213539
2008-09-04

Thin film getter protection

#25084
20080212975
2008-09-04

Interconnection network between semiconductor structures, integrated circuit and method for transmitting signals

#25085
20080212641
2008-09-04

Apparatus for thermal characterization under non-uniform heat load

#25086
20080212625
2008-09-04

SEMICONDUCTOR DEVICE

#25087
20080212351
2008-09-04

Pin configuration changing circuit, base chip and system in package including the same

#25088
20080212302
2008-09-04

Housing for a power semiconductor module

#25089
20080212289
2008-09-04

Easily disassembling cooling apparatus

#25090
20080212280
2008-09-04

Electronic apparatus

#25091
20080211992
2008-09-04

Diode substrate of LCD

#25092
20080211939
2008-09-04

Backside illuminated imager and method of fabricating the same

#25093
20080211571
2008-09-04

Device For Passive Stabilization of Supply Voltages of a Semiconductor Element

#25094
20080211416
2008-09-04

Illumination devices using externally interconnected arrays of light emitting devices, and methods of fabricating same

#25095
20080211109
2008-09-04

Semiconductor device and method of visual inspection and apparatus for visual inspection

#25096
20080211105
2008-09-04

Method of assembling chips

#25097
20080211102
2008-09-04

Laterally grown nanotubes and method of formation

#25098
20080211101
2008-09-04

Interlayer wiring of semiconductor device using carbon nanotube and method of manufacturing the same

#25099
20080211100
2008-09-04

Method and structure for reducing contact resistance between silicide contact and overlying metallization

#25100
20080211099
2008-09-04

SEMICONDUCTOR DEVICE

#25101
20080211098
2008-09-04

Semiconductor device and method for fabricating the same

#25102
20080211097
2008-09-04

Semiconductor device and method for manufacturing same

#25103
20080211094
2008-09-04

Semiconductor device and method of manufacturing the same

#25104
20080211072
2008-09-04

Testing and burn-in using a strip socket

#25105
20080211063
2008-09-04

Semiconductor wafer and manufacturing method of semiconductor device

#25106
20080211060
2008-09-04

ANTI-FUSE WHICH WILL NOT GENERATE A NON-LINEAR CURRENT AFTER BEING BLOWN AND OTP MEMORY CELL UTILIZING THE ANTI-FUSE

#25107
20080211059
2008-09-04

Electronic fuse having heat spreading structure

#25108
20080211058
2008-09-04

Semiconductor device and method of manufacturing same

#25109
20080211056
2008-09-04

Semiconductor device and a method of manufacturing the same and designing the same

#25110
20080211049
2008-09-04

Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe

#25111
20080211040
2008-09-04

Nanosensors

#25112
20080211030
2008-09-04

Semiconductor device and method of manufacturing thereof

#25113
20080211027
2008-09-04

ESD structure without ballasting resistors

#25114
20080211000
2008-09-04

Semiconductor device having transistors each having gate electrode of different metal ratio and production process thereof

#25115
20080210970
2008-09-04

Fabrication of Conductive Metal Layer on Semiconductor Devices

#25116
20080210845
2008-09-04

Photodiode having rounded edges for high electrostatic discharge threshold

#25117
20080210458
2008-09-04

Flexible substrate, multilayer flexible substrate

#25118
20080210406
2008-09-04

Method and apparatus for high heat flux heat transfer

#25119
20080210405
2008-09-04

Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system

#25120
20080210404
2008-09-04

COOLING DEVICE WITH RINGED FINS

#25121
20080209914
2008-09-04

DEVICE FOR COOLING ELECTRICAL EQUIPMENT IN A TURBOMACHINE

#25122
20080209126
2008-08-28

Method for achieving very high bandwidth between the levels of a cache hierarchy in 3-dimensional structures, and a 3-dimensional structure resulting therefrom

#25123
20080208658
2008-08-28

METHOD AND SYSTEM FOR ESTIMATING SUPPLY IMPACT ON A FIRM UNDER A GLOBAL CRISIS

#25124
20080208513
2008-08-28

Protection of an integrated circuit and method thereof

#25125
20080206993
2008-08-28

Using spectra to determine polishing endpoints

#25126
20080206990
2008-08-28

Methods for fabricating semiconductor components with conductive interconnects

#25127
20080206986
2008-08-28

METHOD OF FORMING A COPPER-BASED METALLIZATION LAYER INCLUDING A CONDUCTIVE CAP LAYER BY AN ADVANCED INTEGRATION REGIME

#25128
20080206981
2008-08-28

Semiconductor device and manufacturing method therefor

#25129
20080206978
2008-08-28

Electronic fuses in semiconductor integrated circuits

#25130
20080206977
2008-08-28

Methods of forming wiring to transistor and related transistor

#25131
20080206960
2008-08-28

REWORKABLE CHIP STACK

#25132
20080206929
2008-08-28

Printing device, production unit, and production method of electronic parts

#25133
20080206918
2008-08-28

Image sensor package and forming method of the same

#25134
20080206906
2008-08-28

Method of manufacturing nitride semiconductor device including SiC substrate and apparatus for manufacturing nitride semiconductor device

#25135
20080205132
2008-08-28

Memory element and semiconductor device, and method for manufacturing the same

#25136
20080205062
2008-08-28

Multiple light-emitting element heat pipe assembly

#25137
20080205027
2008-08-28

Assembly of two parts of an integrated electronic circuit

#25138
20080205015
2008-08-28

Lead frame mount for circuit component

#25139
20080205002
2008-08-28

Composite board for heat dissipation and forming methodology

#25140
20080204971
2008-08-28

Integrated multilayer chip capacitor module and integrated circuit apparatus having the same

#25141
20080204383
2008-08-28

Multicolor light emitting device incorporating tunable quantum confinement devices

#25142
20080204238
2008-08-28

Method to RFID enable electronic devices

#25143
20080204170
2008-08-28

Tunable artificial dielectrics

#25144
20080204104
2008-08-28

Clocking architecture in stacked and bonded dice

#25145
20080204102
2008-08-28

METHOD TO REGULATE PROPAGATION DELAY OF CAPACITIVELY COUPLED PARALLEL LINES

#25146
20080204055
2008-08-28

Crosstalk suppression in wireless testing of semiconductor devices

#25147
20080203981
2008-08-28

Semiconductor device structure and semiconductor device incorporating same

#25148
20080203911
2008-08-28

Light Source With Glass Housing

#25149
20080203900
2008-08-28

LED White Source with Improved Color Rendering

#25150
20080203897
2008-08-28

Light Source Comprising Led Arranged in Recess

#25151
20080203590
2008-08-28

Integrated circuit semiconductor device with overlay key and alignment key and method of fabricating the same

#25152
20080203589
2008-08-28

Variable fill and cheese for mitigation of BEOL topography

#25153
20080203574
2008-08-28

Insulating film material, multilayer interconnection structure, method for manufacturing same, and method for manufacturing semiconductor device

#25154
20080203573
2008-08-28

LSI wiring pattern for reduced deformation and cracking

#25155
20080203572
2008-08-28

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

#25156
20080203570
2008-08-28

Structure including via having refractory metal collar at copper wire and dielectric layer liner-less interface and related method

#25157
20080203562
2008-08-28

Method for designing semiconductor device and semiconductor device

#25158
20080203558
2008-08-28

Method of semiconductor device protection, package of semiconductor device

#25159
20080203556
2008-08-28

Through-wafer interconnection

#25160
20080203539
2008-08-28

Semiconductor components with conductive interconnects

#25161
20080203538
2008-08-28

Semiconductor wafer with division guide pattern

#25162
20080203534
2008-08-28

Complementary zener triggered bipolar ESD protection

#25163
20080203532
2008-08-28

Semiconductor device and method of manufacturing the same

#25164
20080203531
2008-08-28

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#25165
20080203526
2008-08-28

Semiconductor device equipped with thin-film circuit elements

#25166
20080203525
2008-08-28

Capacitance trimming circuit of semiconductor device having vertically stacked capacitor layers and operation method thereof

#25167
20080203495
2008-08-28

Integration circuits for reducing electromigration effect

#25168
20080203494
2008-08-28

Apparatus and method for reducing noise in mixed-signal circuits and digital circuits

#25169
20080203457
2008-08-28

Fast switching power insulated gate semiconductor device

#25170
20080203450
2008-08-28

Photoelectric conversion apparatus and image pickup system using photoelectric conversion apparatus

#25171
20080203440
2008-08-28

Semiconductor device fabrication method and semiconductor device fabricated thereby

#25172
20080203439
2008-08-28

Semiconductor integrated circuit having plural transistors

#25173
20080203422
2008-08-28

Structure of light emitting diode and method to assemble thereof

#25174
20080203419
2008-08-28

Semiconductor light emitting apparatus

#25175
20080203405
2008-08-28

Method for Preparing an Electric Circuit Comprising Multiple Leds

#25176
20080203388
2008-08-28

Apparatus and method for detection of edge damages

#25177
20080203071
2008-08-28

LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES

#25178
20080202740
2008-08-28

Resilient fastener and thermal module incorporating the same

#25179
20080202730
2008-08-28

LIQUID COOLING SYSTEM

#25180
20080202729
2008-08-28

HEAT SINK

#25181
20080202726
2008-08-28

Fastening structure for combining heat conducting pipe and fins

#25182
20080202637
2008-08-28

Method for improving adhesion between a shape memory alloy and a polymer

#25183
20080202209
2008-08-28

Radiation sensor with cap and optical elements

#25184
20080201685
2008-08-21

Minimizing number of masks to be changed when changing existing connectivity in an integrated circuit

#25185
20080201682
2008-08-21

Method of designing wiring structure of semiconductor device and wiring structure designed accordingly

#25186
20080201677
2008-08-21

Integrated Circuit (IC) Chip Input/Output (I/O) Cell Design Optimization Method And IC chip With Optimized I/O Cells

#25187
20080200028
2008-08-21

Methods of positioning and/or orienting nanostructures

#25188
20080200023
2008-08-21

METHOD OF FABRICATING MICRO CONNECTORS

#25189
20080200022
2008-08-21

Post-seed deposition process

#25190
20080200004
2008-08-21

Method of fabricating semiconductor optical device

#25191
20080199993
2008-08-21

Protective layer in device fabrication

#25192
20080199688
2008-08-21

Thermal Diffusion Sheet and Manufacturing Method of the Same

#25193
20080198896
2008-08-21

Airflow sensor for filter blockage detection

#25194
20080198568
2008-08-21

Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness

#25195
20080198560
2008-08-21

Thin-film magnetic device, and electronic component module having same

#25196
20080198557
2008-08-21

HEAT-DISSIPATING MODULE

#25197
20080198556
2008-08-21

Heatsink structure for solid-state image sensor

#25198
20080198554
2008-08-21

Cooling assembly

#25199
20080198553
2008-08-21

Electronic device including electronic component, heat dissipating member and alloy layer

#25200
20080198551
2008-08-21

Heat conduction apparatus providing for selective configuration for heat conduction