Heat sink module for dual heat sources

Electronic device and heat conduction member

Resistor circuit and oscillation circuit

Circuit with fuse/anti-fuse transistor with selectively damaged gate insulating layer

Integrated circuit device and electronic instrument

Configurable voltage regulator

Device for supplying power to an intergrated circuit

Various methods, apparatuses, and systems that use ionic wind to affect heat transfer

Middle spring supported micro-electro-mechanical transducers

BEOL interconnect structures with improved resistance to stress

Process for manufacturing deep through vias in a semiconductor device, and semiconductor device made thereby

Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same

Plated pillar package formation

Semiconductor device having metal wirings of laminated structure

Interconnect structure with bi-layer metal cap

Semiconductor device having at least two layers of wirings stacked therein and method of manufacturing the same

STRUCTURE FOR REDUCING LATERAL FRINGE CAPACITANCE IN SEMICONDUCTOR DEVICES

Semiconductor device including copper wiring and via wiring having length longer than width thereof and method of manufacturing the same

Lidless semiconductor cooling

Semiconductor package

Small outline package in which MOSFET and Schottky diode being co-packaged

AMORPHOUS CARBON METAL-TO-METAL ANTIFUSE WITH ADHESION PROMOTING LAYERS

WIRING STRUCTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND METHOD AND DEVICE FOR DESIGNING THE SAME

Isolation and termination structures for semiconductor die

Semiconductor component with cell structure and method for producing the same

Wafer level image sensor package with die receiving cavity and method of making the same

MAGNETIC MEMORY DEVICE

Method for manufacturing insulated gate field effect transistor

Segmented pillar layout for a high-voltage vertical transistor

White light emitting diode module

Diode having reduced on-resistance and associated method of manufacture

Working Fluid For Heat Transfer

Method and apparatus for measuring pattern dimensions

Method for the production of a functional constructional unit, and functional constructional unit

Micro-structured cooler and use thereof

Liquid submersion cooling system

Case for a liquid submersion cooled electronic device

HEAT DISSIPATION MODULE

Pressure sensor incorporating a compliant pin

Integrated circuit transformer devices for on-chip millimeter-wave applications

Method and system for improving critical dimension uniformity

Method of manufacturing a semiconductor device

Process for wafer bonding

Programming of laser fuse

LED ARRAY PACKAGE STRUCTURE HAVING SILICON SUBSTRATE AND METHOD OF MAKING THE SAME

Methods for fabricating micro-electro-mechanical devices

Method of fabricating a semiconductor light-emitting device

Method for making a light emitting device

Uv-Curing Adhesive, Preparation Process, Adhesively Bonded Semiconductor Component, and Method of Adhesive Bonding

Radiation imaging device

Thermal management device for multiple heat producing devices

Connection assembly

Heatsink assembly structure

Heatsink assembly structure

Heatsink module

Fluid circulator for fluid cooled electronic device

Heat dissipation assembly

Projection apparatus

Inductor structure

Electronic Circuit and Method for Manufacturing an Electronic Circuit

Isolation circuit

Light emitting device and method of manufacturing the same

Electroluminescent Device

Semiconductor package having impedance matching device

Adhesive Strip Conductor on an Insulating Layer

SEMICONDUCTOR DEVICE HAVING BUFFER LAYER PATTERN AND METHOD OF FORMING SAME

Multilayered circuitized substrate with p-aramid dielectric layers and method of making same

Stacked contact with low aspect ratio

SYSTEM FOR DISTRIBUTING ELECTRICAL POWER FOR A CHIP

ELECTRONIC APPARATUS AND SEMICONDUCTOR PACKAGE

Semiconductor memory device, memory device support and memory module

Semiconductor die package and embedded printed circuit board

Semiconductor device

Light emitting device, package and lead frame

Method for manufacturing coreless packaging substrate

Metal-insulator-metal capacitor and fabrication method thereof

Methods for charge dissipation in integrated circuits

Isolated transistor

MOSFET DEVICE HAVING IMPROVED AVALANCHE CAPABILITY

Method and device for wafer scale packaging of optical devices using a scribe and break process

Low-Dielectric Constant Cryptocrystal Layers And Nanostructures

Single Side Package Memory Card

Multilayer printed wiring board

PNEUMATICALLY COOLED ENCLOSED FINNED HEAT SINKS

HEAT-DISSIPATING MODULE

Carbon-based apparatus for cooling of electronic devices

Sealed thermal interface component

Method of assembling a sealed thermal interface

Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same

Optoelectronical semiconductor device

PACKAGE FOR HOUSING A SEMICONDUCTOR CHIP AND METHOD FOR OPERATING A SEMICONDUCTOR CHIP AT LESS-THAN-AMBIENT TEMPERATURES

Method of Manufacture of Electronic or Functional Devices

Precursors for porous low-dielectric constant materials for use in electronic devices

Packaging for low-cost, high-performance microwave and millimeter wave modules

Peeling-free porous capping material

Electrostatic discharge protection device and method of fabricating the same

Methods for operating and fabricating a semiconductor device having a buried guard ring structure

Nanoparticle containing siloxane polymers

Packaging method of a light-sensing semiconductor device and packaging structure thereof

Semiconductor device manufacturing method

Strip socket for testing and burn-in having recessed portions with material that extends across a bottom surface of the corresponding semiconductor device

APPARATUS AND METHOD OF TEMPERATURE CONROL DURING CLEAVING PROCESSES OF THICK FILM MATERIALS

METHOD FOR DESIGNING A LEADLESS CHIP CARRIER

Method for making high thermal conductivity metal matrix composite

Vacuum molding apparatus

Methods and systems for enabling return to same position in a review of messages in a voice mail system using tag or identifier stored in the voice mail system

Semiconductor package

Electrical fuse and associated methods

Advanced MRAM design

Power conversion apparatus

Array of Light Emitting Devices to Produce a White Light Source

Electronic assembly cooling

Nanoparticle Enhanced Heat Conduction Apparatus

Electrical connector assembly

Heatsink apparatus

Capacitor having electrodes at different depths to reduce parasitic capacitance

Capacitance for decoupling intermediate level power rails

PACKAGE STRUCTURE FOR A HIGH-FREQUENCY ELECTRONIC COMPONENT

Semiconductor device having dummy pattern

Memory cell device with coplanar electrode surface and method

Microelectronic circuit structure with layered low dielectric constant regions and method of forming same

Semiconductor device capable of selecting wiring connection mode by controlling via formation

Semiconductor device

Bump structure having a reinforcement member

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Processes of Manufacturing Portable Electronic Storage Devices Utilizing Lead Frame Connectors

Semiconductor device

METHOD AND STRUCTURE FOR INTEGRATING MIM CAPACITORS WITHIN DUAL DAMASCENE PROCESSING TECHNIQUES

High Voltage Metal-On-Passivation Capacitor

INDUCTOR LAYOUT AND MANUFACTURING METHOD THEREOF

Semiconductor device and a method of fabricating the device

Semiconductor integrated circuit device including a pad and first mosfet

SEMICONDUCTOR STRUCTURE INCLUDING STEPPED SOURCE/DRAIN REGION

Semiconductor device test structures and methods

Memory device in a programmed state having a memory layer comprising conductive nanoparticles coated with an organic film formed between two conductive layers

Packaging module of optical sensor

Tape for semiconductor package and cutting method thereof

Integrated liquid cooling unit for computers

Control of Critical Dimensions of Etched Structures on Semiconductor Wafers

Cooling device

CONNECTION STRUCTURE OF CIRCUIT SUBSTRATE

METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND STORAGE MEDIUM FOR EXECUTING THE METHOD

Elastic engaging element

Methods of Forming Carbon Nano-Tube Wires on a Catalyst Metal Layer and Related Methods of Wiring Semiconductor Devices Using Such Carbon Nano-Tube Wires

METHOD OF FORMING VIAS IN A SEMICONDUCTOR DEVICE

Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime

Self-aligned air-gap in interconnect structures

Semiconductor wafer with low-K dielectric layer and process for fabrication thereof

Method for integrally forming an electrical fuse device and a MOS transistor

Substrate processing method and semiconductor manufacturing apparatus

Barrier films for plastic substrates fabricated by atomic layer deposition

RF bus controller

Heat Exchange Enhancement

Heat Exchange Enhancement

Printed circuit board and manufacturing method thereof

Compliant penetrating packaging interconnect

Microwave surface mount hermetically sealed package and method of forming the same

Encapsulated electronic device

Easily disassembling cooling apparatus

Integrated heat spreader and exchanger

Electronic apparatus and fin unit

Radiator, heat sink fan, and radiator manufacturing method

HEATSINK THERMAL MODULE WITH NOISE IMPROVEMENT

Imaging Apparatus, Image Processing Method and Integrated Circuit

Multiple-level inductance

Systems and methods for reducing circuit area

Semiconductor device and method of fabricating the same

Electronic device identifying method

Heat generating member cooling structure and drive unit

Method for producing a device and device

STRUCTURE AND METHOD FOR CREATING RELIABLE DEEP VIA CONNECTIONS IN A SILICON CARRIER

Semiconductor device having thermally formed air gap in wiring layer and method of fabricating same

INTERCONNECTIONS OF AN INTEGRATED ELECTRONIC CIRCUIT

Undoped polysilicon metal silicide wiring

Interconnects having sealing structures to enable selective metal capping layers

Electrode, method for producing same and semiconductor device using same

Chip cooling channels formed in wafer bonding gap

Microelectronics Package and Method

Semiconductor device

Semiconductor package with electromagnetic shield

Multilevel interconnects structure with shielding function and fabricating method thereof

Integrated multiple gate dielectric composition and thickness semiconductor chip and method of manufacturing the same

Semiconductor wafer with improved crack protection

Integrated circuit fuse

Semiconductor device including a plurality of fuse elements and attenuation members between or around the plurality of fuse elements

Semiconductor device having a fuse element

Electronically programmable fuse having anode and link surrounded by low dielectric constant material

Semiconductor device

Integrated circuit having a semiconductor arrangement

Mounting structures for integrated circuit modules

Semiconductor component comprising an optically active layer, arrangement comprising a multiplicity of optically active layers and method for producing a semiconductor component

Edge-emitting light-emitting diode

Silicon Deflector on a Silicon Submount For Light Emitting Diodes

Wafer level phosphor coating method and devices fabricated utilizing method

Light emitting device including a filter

Fault tolerant light emitters, systems incorporating fault tolerant light emitters and methods of fabricating fault tolerant light emitters

Display device including a test pad configuration for an improved inspection test

Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore

Method of laser drilling vias

Wiring structure and wiring designing method

Flexible heat cable device

WATER COOLING APPARATUS

Liquid cooled heat sink

Heat dissipating device

Heat sink fin with joining structure

Heat dissipating device for heat dissipation of an electronic component

Ceramic composite

Methods of manufacturing copper interconnect systems

Method of manufacturing a MOSFET structure

Method for smart dummy insertion to reduce run time and dummy count

COATING DEVICE, AND COATING METHOD USING SAID DEVICE

Depletion-mode MOSFET circuit and applications

Edge-emitting light-emitting diode

Heat dissipation device having a locking device

Fan bracket and heat dissipation apparatus incorporating the same

Heat dissipation device

Heat spreader with vapor chamber defined therein

Mini-sized heat-dissipating module having an engaging structure

Mini-sized heat-dissipating module having an extra strength of assembled relationship

HEAT DISSIPATION ASSEMBLY

Method of measurement, an inspection apparatus and a lithographic apparatus

Pulse output circuit, shift register, and display device

Tiled electronic display structure

Planar spiral inductor structure having enhanced Q value

TRANSFORMERS AND BALUNS

Active matrix electroluminescence device having a metallic protective layer and method for fabricating the same

SEMICONDUCTOR INTERCONNECT STRUCTURE WITH ROUNDED EDGES AND METHOD FOR FORMING THE SAME

Method for realizing an electric linkage in a semiconductor electronic device between a nanometric circuit architecture and standard electronic components

Semiconductor device and fabrication method thereof

SEMICONDUCTOR DEVICES HAVING METAL INTERCONNECTIONS, SEMICONDUCTOR CLUSTER TOOLS USED IN FABRICATION THEREOF AND METHODS OF FABRICATING THE SAME

Semiconductor device and method for manufacturing the same

Semiconductor device and method for fabricating the same

Hybrid interconnect structure for performance improvement and reliability enhancement

Flexible Printed Wiring Board and Semiconductor Device

REMOVAL OF ETCHING PROCESS RESIDUAL IN SEMICONDUCTOR FABRICATION

METHOD OF MAKING RELEASE COATINGS FOR COMPOSITE MATERIALS

Chip carrier substrate capacitor and method for fabrication thereof

Leadframe designs for plastic overmold packages

Multilayer silicon nitride deposition for a semiconductor device

Semiconductor device and method for manufacturing the same

INTEGRATED CIRCUIT (IC) CHIP WITH ONE OR MORE VERTICAL PLATE CAPACITORS AND METHOD OF MAKING THE CAPACITORS

Semiconductor device with leaning storage node contact and method for fabricating the same

Air gap under on-chip passive device

Method of creating isolated electrodes in a nanowire-based device

Semiconductor device

METHOD OF FORMING A SEMICONDUCTOR DEVICE HAVING A SYMMETRIC DIELECTRIC REGIONS AND STRUCTURE THEREOF

Manufacturing method of semiconductor device

Semiconductor device and storage medium

Wafer level phosphor coating method and devices fabricated utilizing method

Galvanic optocoupler and method of making

SEMICONDUCTOR APPARATUS

Method and resulting structure for fabricating test key structures in DRAM structures

Radiation-emitting body and method for producing a radiation-emitting body

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Micro heat exchanger and its use as cooler for electronic components

Heat exchange enhancement

Heat dissipation device with multiple heat pipes

HEAT DISSIPATION DEVICE WITH HEAT PIPES

THIN SHEET TYPE HEAT PIPE

CLIP MODULE AND HEAT-DISSIPATION APPARATUS HAVING THE SAME

Determining Die Health by Expanding Electrical Test Data to Represent Untested Die

Curable thick film paste compositions for use in moisture control

Wafer Bump Manufacturing Using Conductive Ink

System and method for selectivity etching an integrated circuit

Metal interconnect structure and process for forming same

Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio

Method to Fabricate Passive Components Using Conductive Polymer

Heat dissipation structures

Capacitively coupling layers of a multilayer device

METHOD FOR SENSING A SIGNAL IN AN INTEGRATED CIRCUIT COMPLEMENTARY FUSE ARRANGEMENT

Side emitting illumination systems incorporating light emitting diodes

LED array and method for fabricating same

Stacked mounting structure

Low-thickness electronic module comprising a stack of electronic packages provided with connection balls

Cooling structure using rigid movable elements

HEAT DISSIPATING APPARATUS, HEAT DISSIPATING BASE AND ITS MANUFACTURING METHOD

Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled

Heat dissipation assembly

Heat dissipation device with a fan duct

Active matrix device with electrostatic protection

Optical devices

Automated process control using optical metrology and a correlation between profile models and key profile shape variables

Lens assembly with a rotatable adjustable member for discretely varying position of a mounting member

Light-emitting device

SEMICONDUCTOR DEVICE AND METHODS FOR CONTROLLING ITS PATTERNS

Reference current source circuit and infrared signal processing circuit

Interconnect structure encased with high and low k interlevel dielectrics

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING A REFLOW SPUTTERING TECHNIQUE

Bonding pad of semiconductor integrated circuit, method for manufacturing the bonding pad, semiconductor integrated circuit, and electronic device

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

Metal capping process for BEOL interconnect with air gaps

Semiconductor device having conductive bumps and deviated solder pad

Chip package module heat sink

Fabrication of a micro-electromechanical system (MEMS) device from a complementary metal oxide semiconductor (CMOS)

Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same

Two dimensional stacking using interposers

Semiconductor device and manufacturing method thereof

Lead frame structure of light emitting diode

Under bump metallurgy structure of a package and method of making same

Semiconductor device and signal terminating method thereof