Side-view optical diode package and fabricating process thereof

Semiconductor light emitting devices including flexible silicone film having a lens therein

Light emitting diode package and method of manufacturing the same

Tunable white point light source using a wavelength converting element

Semiconductor wafer

PACKAGE STRUCTURE FOR LEAD-FREE PROCESS

ELECTRONIC DEVICE

Rapid conductive cooling using a secondary process plane

Ceramic substrate grid structure for the creation of virtual coax arrangement

Heat Sinks For Dissipating A Thermal Load

Active condensation enhancement for alternate working fluids

Heat dissipation device with a heat pipe

METHOD OF MANUFACTURING A HEAT DISSIPATION DEVICE AND A HEAT DISSIPATION DEVICE OBTAINED THEREBY

HEAT DISSIPATION DEVICE WITH A HEAT PIPE

Micro-heat exchanger

RFID label technique

Rapid conductive cooling using a secondary process plane

Heat Radiating Silicone Composition

Plasma Processing Apparatus

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors

Wafer bonding method of system in package

Triple alignment substrate method and structure for packaging devices

Luminescent ceramic for a light emitting device

BACKLIGHT ASSEMBLY AND DISPLAY DEVICE HAVING THE SAME

Compliant structure for an electronic device, method of manufacturing same, and system containing same

Apparatus and method for thermal stabilization of PCB-mounted electronic components within an enclosed housing

Clip module and heat-dissipation device having the same

Compound heat sink

Boost spring holder for securing a power device to a heatsink

Heat dissipation device

System and method that dissipate heat from an electronic device

Heat dissipation device for computer add-on cards

Method of fabricating a microelectronic device including embedded thin film capacitor by over-etching thin film capacitor bottom electrode and microelectronic device made according to the method

Methods and systems for capacitors

Process monitoring system, process monitoring method, and method for manufacturing semiconductor device

MEASURING A DAMAGED STRUCTURE FORMED ON A WAFER USING OPTICAL METROLOGY

COLOR TUNABLE OLED ILLUMINATION DISPLAY AND METHOD FOR CONTROLLED DISPLAY ILLUMINATION

Method of Forming a Cell Identification, Display Substrate and Display Device Having the Same

Internal noise reducing structures in camera systems employing an optics stack and associated methods

INTEGRATED CAMERA AND ASSOCIATED METHODS

ELECTRONIC DEVICE AND RF MODULE

Semiconductor integrated circuit including charging pump

Selective coupling of voltage feeds for body bias voltage in an integrated circuit device

Method and apparatus for cooling non-native instrument in automatic test equipment

Broken die detect sensor

Determining chip separation by comparing coupling capacitances

Alternating current light emitting device

Color tunable illumination source and method for controlled illumination

Illumination source providing enhanced color mixing

Method of improving overlay performance in semiconductor manufacture

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

Multilayer wiring structure, semiconductor device, pattern transfer mask and method for manufacturing multilayer wiring structure

Metal wiring of semiconductor device and forming method thereof

Methods of Forming Electrical Interconnects Using Non-Uniformly Nitrified Metal Layers and Interconnects Formed Thereby

Interconnect assemblies, and methods of forming interconnects, between conductive contact bumps and conductive contact pads

INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Method for filling a contact hole and integrated circuit arrangement with contact hole

Metal line pattern of semiconductor device and method of forming the same

Semiconductor device comprising a doped metal comprising main electrode

Germanium-containing dielectric barrier for low-k process

Semiconductor constructions comprising a layer of metal over a substrate

Method for manufacturing semiconductor device and semiconductor device

IMAGINE SENSOR PACKAGE AND FORMING METHOD OF THE SAME

Gate conductor structure

Method of forming pre-metal dielectric layer of semiconductor device

Substrate Laser Marking

Semiconductor device which includes a capacitor and an interconnection film coupled to each other and a manufacturing method thereof

Semiconductor integrated circuit device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device comprising high-withstand voltage MOSFET and its manufacturing method

Semiconductor device having an electrode pad

MODULATED TRIGGER DEVICE

TFT containing coalesced nanoparticles

Semiconductor device and method for manufacturing same

Selective coupling of voltage feeds for body bias voltage in an integrated circuit device

Circuitry and method

Semiconductor element

Trench polysilicon diode

PRINTED BOARD

Miniature actuator integration for liquid cooling

HEAT DISSIPATION DEVICE

Heat Pipe and Method for Manufacturing Same

HEAT DISSIPATION MODULE

Diamond semiconductor element and process for producing the same

DIAMOND SEMICONDUCTOR ELEMENT AND PROCESS FOR PRODUCING THE SAME

Regional pattern density determination method and system

Methods for discretized processing and process sequence integration of regions of a substrate

Methods for discretized processing and process sequence integration of regions of a substrate

Silicon Rich Dielectric Antireflective Coating

Semiconductor substrate having a protection layer at the substrate back side

Semiconductor integrated circuit device and fabrication method for semiconductor integrated circuit device

Electrical programmable metal resistor

Integration of thin film resistors having different TCRs into single die

Hardmask for improved reliability of silicon based dielectrics

Planar vertical resistor and bond pad resistor and related method

Method and apparatus for applying external coating to grid array packages for increased reliability and performance

Electronic part and method for manufacturing the same

CHIP SCALE PACKAGE AND METHOD FOR MARKING CHIP SCALE PACKAGES

Soft template with alignment mark

Aerogel/PTFE Composite Insulating Material

Surface mount component having magnetic layer thereon and method of forming same

Hybrid-Level Three-Dimensional Memory

Fastening mechanism

Heat sink fixing assembly

Heat dissipation device assembly

Heat sink clip

Wafer having thermal circuit and power supplier therefor

Apparatus and system, to secure a heat sink

Heat sink assembly

Heat dissipation module

Flat heat column and heat dissipating apparatus thereof

Heat dissipating module and heat sink thereof

Heat dissipation device

Dual impeller push-pull axial fan heat sink

Integrated circuit comb capacitor

Gettering/stop layer for prevention of reduction of insulating oxide in metal-insulator-metal device

Image sensor, method of manufacturing the same, and camera module having the same

Chip seal ring having a serpentine geometry

Semiconductor device having in-chip critical dimension and focus patterns

TUNGSTEN INTERCONNECT SUPER STRUCTURE FOR SEMICONDUCTOR POWER DEVICES

Semiconductor structure and method of forming the same

Semiconductor package and method for manufacturing the same

SEMICONDUCTOR STRUCTURE WITH LINER

Semiconductor device and manufacturing method thereof

Micro-electro-mechanical systems device and integrated circuit device integrated in a three-dimensional semiconductor structure

Integrated thermal systems

Semiconductor package substrate and methods for forming same, in particular for MEMS devices

Capacitor structure for integrated circuit

Multi-Finger Capacitor

Semiconductor device having metal-insulator-metal capacitor and method of fabricating the same

Low-noise semiconductor photodetectors

Electrostatic discharge protection circuit using triple welled silicon controlled rectifier

Dual wired integrated circuit chips

Nano-fuse structural arrangements having blow protection barrier spaced from and surrounding fuse link

Nanostructures and method for selective preparation

TELECOMMUNICATIONS SWITCH ARRAY WITH THYRISTOR ADDRESSING

Light emitting unit

Side emitting LED

Manufacturing method for semiconductor chips and semiconductor wafer

Reliability test structure for multilevel interconnect

Multi-purpose poly edge test structure

Scribe based bond pads for integrated circuits

Electrochemical device and methods for producing the same

Method of making a thermopile detector and package

Resin film evaluation method and method for manufacturing a semiconductor device

Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon and the printed circuit board

Method for making a thermal interface material

FIN-PIPE SHAPED RADIATOR SPECIALLY ADAPTED TO A SEMICONDUCTOR CHILLING UNIT AND THE METHOD OF MAKING SAME

HEAT DISSIPATION DEVICE WITH A HEAT PIPE

Vapor chamber heat sink having a carbon nanotube fluid interface

Liquid cooling device

COOLING DEVICE AND ELECTRONIC APPARATUS

Heat dissipation device with heat pipes

HEAT SINK ASSEMBLY HAVING A FAN MOUNTING DEVICE

Two-phase cooling technology for electronic cooling applications

Heat transfer composite, associated device and method

WIRING BOARD WITH BUILT-IN CAPACITOR

Buckle devise

Semiconductor device

Semiconductor device including a discontinuous film and method for manufacturing the same

Hafnium lanthanide oxynitride films

Trench Gate FET with Self-Aligned Features

HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS

Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode

Thermosetting resin composition and photo-semiconductor encapsulant

Systems and methods for semiconductor structure processing using multiple laser beam spots

Flexible light emitting module

LED Illumination Device with Cubic Zirconia Lens

Illumination device including wavelength converting element side holding heat sink

Folded-sheet-metal heatsinks for closely packaged heat-producing devices

Electronic apparatus

Heat dissipation system

Heat sink backplate module, circuit board, and electronic apparatus having the same

Cooling apparatus for memory modules

Heat dissipation device having a fan holder for attachment of a fan

Heat conduction bus, particularly for a microprocessor-based computation unit

Heat dissipation device

Electronic device

LIGHT EMITTING DIODE PACKAGE, BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY HAVING THE SAME

CAMERA MODULE

TEST PATTERN

Quantum dot-dispersed light emitting device, and manufacturing method thereof

Semiconductor device and rectifier system

Overlay mark, method for forming the same and application thereof

Semiconductor package with encapsulant delamination-reducing structure and method of making the package

Semiconductor device having a interlayer insulation film with low dielectric constant and high mechanical strength

Electronic component, manufacturing method of the electronic component, electronic component assembly body, and electronic device

Bonding structures and methods of forming bonding structures

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

Contact aperture and contact via with stepped sidewall and methods for fabrication thereof

Porous and dense hybrid interconnect structure and method of manufacture

Damascene interconnect structure having air gaps between metal lines and method for fabricating the same

Embedded nano UV blocking and diffusion barrier for improved reliability of copper/ultra low K interlevel dielectric electronic devices

Semiconductor device having oxidized metal film and manufacture method of the same

Method of forming metal wiring in semiconductor device

Methods for lateral current carrying capability improvement in semiconductor devices

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Interconnect structures with linear repair layers and methods for forming such interconnection structures

INTERCONNECT STRUCTURE WITH LINE RESISTANCE DISPERSION

Solder bump structure and method of manufacturing same

Systems and methods to passivate on-die redistribution interconnects

Heat sink

Wafer level package configured to compensate size difference in different types of packages

Circuit module having force resistant construction

Varying Pitch Adapter and a Method of Forming a Varying Pitch Adapter

GUARD RING STRUCTURE WITH METALLIC MATERIALS

Semiconductor device

Semiconductor device and manufacturing the same

Vertical electrical device

Inductor formed on semiconductor substrate

Semiconductor device and method of cutting electrical fuse

STRUCTURE FOR CREATION OF A PROGRAMMABLE DEVICE

Microelectromechanical devices and fabrication methods

SEMICONDUCTOR COMPONENT ARRANGEMENT AND METHOD FOR PRODUCING THEREOF

Circuit configuration and manufacturing processes for vertical transient voltage suppressor (TVS) and EMI filter

Semiconductor structure, semiconductor memory device and method of manufacturing the same

Verification architecture of infrared thermal imaging array module

Top layers of metal for integrated circuits

Sub-surface region with diagonal gap regions

Methods of automatically generating dummy fill having reduced storage size

Wavelength-Converted Semiconductor Light Emitting Device

Planar Flip & Small Chips Integrated LED Chip and its Manufacture Method

Small footprint high power light emitting package with plurality of light emitting diode chips

Transparent electrode for LED array

Surface-stabilized semiconductor device

Laser source detection system and method

Semiconductor Chip With Identification Codes, Manufacturing Method Of The Chip And Semiconductor Chip Management System

Methods and systems for semiconductor structure processing using multiple laser beam spots

Wiring board with built-in capacitor

Cooler module

Method for connecting heat-dissipating body and heat pipe and structure thereof

HEAT DISSIPATION DEVICE

Heat dissipation device

HEAT DISSIPATION DEVICE WITH A HEAT PIPE

HEAT DISSIPATION ASSEMBLY HAVING FAN DUCT

Heat dissipation device

METHOD FOR ATTACHING AND PEELING PRESSURE-SENSITIVE ADHESIVE SHEET, AND ATTACHING APPARATUS OF PRESSURE-SENSITIVE ADHESIVE SHEET AND PEELING APPARATUS OF PRESSURE-SENSITIVE ADHESIVE SHEET

Thermoacoustic cooling device with annular emission port

High density planarized inductor and method of making the same

THERMAL MANAGEMENT OF ON-CHIP CACHES THROUGH POWER DENSITY MINIMIZATION

Personalized hardware

Schemes for forming barrier layers for copper in interconnect structures

Method of making a contact on a backside of a die

Methods of forming an interconnect structure

Semiconductor devices having pFET with SiGe gate electrode and embedded SiGe source/drain regions and methods of making the same

Microcircuit fabrication and interconnection

Heat Spreading Member And Manufacturing Method Thereof

Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device

HARDMASK FOR IMPROVED RELIABILITY OF SILICON BASED DIELECTRICS

System that prevents reduction in data retention

Method, apparatus and system providing memory cells associated with a pixel array

THERMAL MANAGEMENT MODULE AND ELECTRONIC ASSEMBLY USING THE SAME

LIGHT EMITTING DIODE MODULE HAVING A THERMAL MANAGEMENT ELEMENT

Axial-flow fan unit and heat-emitting element cooling

Variable mount voltage regulator

Display device and flat display device

Inductors having input/output paths on opposing sides

Semiconductor device and method of forming the same

Method of manufacturing multilevel interconnect structure and multilevel interconnect structure

Initiation layer for reducing stress transition due to curing

Semiconductor device production method that includes forming a gold interconnection layer

Semiconductor devices and methods of manufacture thereof

Semiconductor memory modules, methods of arranging terminals therein, and methods of using thereof

Structures to enhance cooling of computer memory modules

Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack package

TRANSMISSION TYPE PHOTO INTERRUPTER AND MANUFACTURING METHOD FOR SAME

Packaged semiconductor chips

STRUCTURE FOR INTEGRATING AN RF SHIELD STRUCTURE IN A CARRIER SUBSTRATE

Methods and apparatus for a dual-metal magnetic shield structure

CMOS transistor and method of manufacture thereof

Integrated Circuit Used in Smart Power Technology

METAL-OXIDE-SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MuGFET with increased thermal mass

Method for manufacturing a semiconductor device

EL display device, driving method thereof, and electronic equipment provided with the EL display device

Protective cover

Cooling device for an electronic component

Heat sink

HEAT DISSIPATION DEVICE WITH HEAT PIPES

METHOD OF FABRICATING SEMICONDUCTOR-BASED POROUS STRUCTURE

Semiconductor-based porous structure enabled by capillary force

HEAT DISSIPATION SYSTEM FOR SOLARLOK PHOTOVOLTAIC INTERCONNECTION SYSTEM

Fluid encapsulant for protecting electronics

Semiconductor integrated circuit device

Systems and methods for maintaining performance at a reduced power

Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same

METHOD OF FORMING A THROUGH-SUBSTRATE VIA

Method of construction of CTE matching structure with wafer processing and resulting structure

Method of forming a wall structure in a microelectronic assembly

Method of forming contact hole, method of manufacturing wiring board, method of manufacturing semiconductor device, and method of manufacturing electro-optical device

PROCESS FOR PROTECTING IMAGE SENSOR WAFERS FROM FRONT SURFACE DAMAGE AND CONTAMINATION

MEMBRANE ELECTRODE ASSEMBLIES FOR USE IN FUEL CELLS

Luminescent device including nanofibers and light stimulable particles disposed on a surface of or at least partially within the nanofibers

Electronic or optoelectronic assembly with an electromagnetic screening structure, method for manufacturing same

Molecular self-assembly in substrate processing

Power converter package and thermal management

FASTENER AND HEAT DISSIPATION MODULE HAVING THE SAME