Die saw crack stopper

eFuse containing SiGe stack

MEMS structure using carbon dioxide and method of fabrication

Semiconductor devices and methods of forming the same

Stack resistor structure for integrated circuits

Self-aligned body contact for a semiconductor-on-insulator trench device and method of fabricating same

Substrate having thin film of GaN joined thereon and method of fabricating the same, and a GaN-based semiconductor device and method of fabricating the same

Semiconductor light emitting device having metal reflective layer

Thin film transistor array substrate and method of manufacturing the same

Semiconductor device

Test cells for semiconductor yield improvement

Phase changeable memory devices including nitrogen and/or silicon

Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof

HEAT SINK ASSEMBLY

Heating element cooling structure and drive device having the cooling structure

Evaporative compact high intensity cooler

Heat dissipating device

Nanowire electronic devices and method for producing the same

Temperature Control Including Integrated Thermoelectric Temperature Sensing and Related Methods and Systems

Method of producing antenna elements for a wireless communication device

Analyte Monitoring Device And Methods Of Use

Method for forming polysilicon by illuminating a laser beam at the amorphous silicon substrate through a mask

Fabrication of Interconnect Structures

Process for high voltage superjunction termination

METAL-INSULATOR-METAL (MIM) CAPACITOR AND METHOD FOR FABRICATING THE SAME

Method for evaluating semiconductor wafer, apparatus for evaluating semiconductor wafer, and method for manufacturing semiconductor wafer

Silicone based compositions for thermal interface materials

Tab leader tape made of polyphenylene ether-based resin

Apparatus, and Corresponding Method, For Detecting the Anatomic Shape of a Subject

Measuring apparatus for thermal resistance of heat dissipating device

Lateral light emitting apparatus

Light-emitting device

Heat dissipation device

High-load even pressure heatsink loading for low-profile blade computer applications

Semiconductor cooling device and stack of semiconductor cooling devices

Quasi-radial heatsink with rectangular form factor and uniform fin length

Quasi-radial heatsink with rectangular form factor and uniform fin length

Method and apparatus for thermal dissipation in an information handling system

Cooling unit

Semiconductor device

Temperature control device and temperature control method

Modular soft starter

Wiring board

Strip Conductor Structure for Minimizing Thermomechanical Loads

Connection between an I/O region and the core region of an integrated circuit

Semiconductor device

ULTRA-THIN Cu ALLOY SEED FOR INTERCONNECT APPLICATION

METHOD FOR MAKING AN INTEGRATED CIRCUIT HAVING A VIA HOLE

SPACERS FOR WAFER BONDING

Semiconductor device

Method for reduction of soft error rates in integrated circuits

ELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING THE SAME

INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE

Semiconductor device and method of manufacturing the same

SUBSTRATE WITH EMBEDDED PASSIVE ELEMENT AND METHODS FOR MANUFACTURING THE SAME

Embedded stressed nitride liners for CMOS performance improvement

Structure and method for MOSFET gate electrode landing pad

Process for high voltage superjunction termination

Semiconductor integrated circuit

Method for fabrication of a semiconductor device

Semiconductor device with measurement pattern in scribe region

Reinforced semiconductor structures

Reflective type semiconductor light emitting device

Input/output pads placement for a smart card chip

System and method for multi-pulse laser processing

Liquid cooling type heat-dissipating device

Loop heat pipe with flat evaportor having a wick with an internal chamber

Method, system, and computer program product for preparing multiple layers of semiconductor substrates for electronic designs

Method for manufacturing semiconductor device

Method for forming insulating film

Method of forming metal wire in semiconductor device

Method for fabricating semiconductor device with an intermediate stack structure

METHOD OF FORMING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Addressable hierarchical metal wire test methodology

Method of verifying line reliability and method of manufacturing semiconductor device

Two-step method for etching a fuse window on a semiconductor substrate

Recessing trench to target depth using feed forward data

System and method for controlling an electrochemical etch process

Method for manufacturing semiconductor device

METHOD AND STRUCTURE FOR IMPROVED ALIGNMENT IN MRAM INTEGRATION

Aryl (thio)ether aryl polysiloxane composition and methods for making and using same

Method for adjusting ablation threshold

Overlay vernier of semiconductor device and method of manufacturing the same

Circuit board unit and method for production thereof

Component Moulding Process

Temperature calculation based on non-uniform leakage power

High efficiency thermoelectric cooler control system

Latch circuits and operation circuits having scalable nonvolatile nanotube switches as electronic fuse replacement elements

Heat dissipating light emitting diode module having fastened heat spreader

Electronic control apparatus

Heatsink structure and assembly fixture thereof

Heat sink clip

Electronic control apparatus

HEAT DISSIPATION DEVICE FOR COMPUTER ADD-ON CARDS

Heat dissipating module

Face-centered cubic structure capacitor and method of fabricating the same

Semiconductor device and method for fabricating the same

Common centroid symmetric structure capacitor

Structure and method for self aligned vertical plate capacitor

RADIATION TOLERANT ELECTROSTATIC DISCHARGE PROTECTION NETWORKS

Integrated circuit antenna structure

Adjustable integrated circuit antenna structure

On die thermal sensor and method for generating thermal code of ODTS

Soft magnetic layer for on-die inductively coupled wires with high electrical resistance

Amorphous soft magnetic layer for on-die inductively coupled wires

Electrically programmable fuse sense circuit

Test pads on leads unconnected with die pads

Method of manufacture of encapsulated package

Recyclable stamp device and recyclable stamp process for wafer bond

Trench structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels

PMD LAYER OF SEMICONDUCTOR DEVICE

RF semiconductor devices and methods for fabricating the same

METHOD OF FORMING LOW-K DIELECTRIC LAYER AND STRUCTURE THEREOF

Semiconductor package and module printed circuit board for mounting the same

Semiconductor device having dummy pattern and the method for fabricating the same

IC package with integral vertical passive delay cells

Alignment Key of Semiconductor Device and Method of Manufacturing the Same

Semiconductor device with gate stack structure

DIRECT TERMINATION OF A WIRING METAL IN A SEMICONDUCTOR DEVICE

Semiconductor Device and Method for Manufacturing the Same

Semiconductor device having a metal interconnection and method of fabricating the same

Metal line of semiconductor device and method of forming the same

Metal line of semiconductor device and method of manufacturing the same

Metal wire for a semiconductor device formed with a metal layer without voids therein and a method for forming the same

Multi-layered metal line of semiconductor device for preventing diffusion between metal lines and method for forming the same

Multi-layered metal line of semiconductor device having excellent diffusion barrier and method for forming the same

MULTI-LAYER METAL WIRING OF SEMICONDUCTOR DEVICE PREVENTING MUTUAL METAL DIFFUSION BETWEEN METAL WIRINGS AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

Semiconductor device having a nanoscale conductive structure

IC package having improved structure

Thermal interface material with hotspot heat remover

Heat spreader and semiconductor device using the same

Stacked MEMS device

Semiconductor packaging substrate improving capability of electrostatic dissipation

Structure and method for stochastic integrated circuit personalization

LEAD FRAME

Stress-Resistant Leadframe and Method

Semiconductor device

Packaging implementation while mitigating threshold voltage shifting

METHOD TO ACHIEVE A LOW COST TRANSISTOR ISOLATION DIELECTRIC PROCESS MODULE WITH IMPROVED PROCESS CONTROL, PROCESS COST, AND YIELD POTENTIAL

Semiconductor device and method of fabricating semiconductor device

Semiconductor device having a indicator indicating cleavage direction

Semiconductor device with seal ring having protruding portions

Guard ring extension to prevent reliability failures

Semiconductor capacitor and manufacturing method

Metal to Metal Low-K Antifuse

Reversible electric fuse and antifuse structures for semiconductor devices

Fuse Element Using Low-K Dielectric

Method for co-alignment of mixed optical and electron beam lithographic fabrication levels

Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME, AND NAND GATE CIRCUIT USING THE SEMICONDUCTOR DEVICE

MOS transistor capable of withstanding significant currents

Tuned tensile stress low resistivity slot contact structure for n-type transistor performance enhancement

Semiconductor device and method of fabricating the same, and nor gate circuit using the semiconductor device

Semiconductor component and method of manufacture

Stressed barrier plug slot contact structure for transistor performance enhancement

Device for protecting semiconductor IC

Electrically programmable fuse

Convex shaped thin-film transistor device

Local interconnect having increased misalignment tolerance

Method and structure for improved alignment in MRAM integration

CMOS DEVICE AND METHOD OF MANUFACTURING THE SAME

Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same

Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same

Transistor based antifuse with integrated heating element

Semiconductor integrated circuit

Laminating encapsulant film containing phosphor over LEDs

Light-emitting diode assembly

Test structure for estimating electromigration effects with increased robustness with respect to barrier defects in vias

CMOS sensor with electrodes across photodetectors at approximately equal potential

End point detection method applying resonance phenomenon, end point detection apparatus, chemical mechanical polishing apparatus on which the detection apparatus is loaded, and semiconductor device fabricated by the chemical mechanical polishing apparatus

SYSTEM FOR PROCESSES INCLUDING FLUORINATION

Printed circuit boardc structure

Thermal interfaces in electronic systems

Cooling Liquid Device for a Computer

Unique cooling scheme for advanced thermal management of high flux electronics

Heat sink fan

THERMAL MODULE

Heat dissipation device with a heat pipe

Heat dissipation device with fixtures for attachment of a fan

Semiconductor device and electronic device

Solar cell having active region with nanostructures having energy wells

Inorganic colors and related nanotechnology

Spreading thermoelectric coolers

Detecting faulty CPU heat sink coupling during system power-up

Semiconductor chip and method of manufacturing semiconductor chip

METHOD FOR PREPARING A METAL FEATURE SURFACE

Doped single crystal silicon silicided eFuse

Method and structures for indexing dice

Method for fabricating semiconductor wafer with enhanced alignment performance

Semiconductor device and method of forming passive devices

Method for manufacturing passive components

Chip-probing and bumping solutions for stacked dies having through-silicon vias

Copper process methodology

Multilayer ceramics substrate

Dimensionally stable, leak-free graphite substrate

Methods, apparatuses, and systems for fabricating three dimensional integrated circuits

Method and apparatus for data recovery in a digital data stream using data eye tracking

Method and apparatus for protection against process-induced charging

Light-emitting module

Thermal management system for LED array

Enhanced Ball Grid Array Package

Heat sink fastening assembly

Heat dissipation device

System and method for cooling a module

Electronic device and heat dissipation module thereof

Heat-Radiating Device with a Guide Structure

Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive

Capacitor having electrode terminals at same end of capacitor to reduce parasitic inductance

Electrostatic discharge protection device and layout thereof

Optical microsystem and fabrication process

Voltage regulator integrated with semiconductor chip

Semiconductor device, method of manufacturing same, and apparatus for designing same

Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths

METHOD FOR FORMING METAL WIRING IN SEMICONDUCTOR DEVICE

Selective processing of semiconductor nanowires by polarized visible radiation

Semiconductor device and method of protecting passivation layer in a solder bump process

Carbon nanotube-based interconnection element

System and method for filling vias

Redundant micro-loop structure for use in an integrated circuit physical design process and method of forming the same

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Adhesion and electromigration performance at an interface between a dielectric and metal

GUARD RING IN SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

Multilevel wiring, laminated aluminum wiring, semiconductor device and manufacturing method of the same

Manufacturing method for an integrated semiconductor structure and corresponding semiconductor structure

Semiconductor device and method of manufacturing the same

Process integration scheme to lower overall dielectric constant in BEoL interconnect structures

Transceiver device

Routing density through asymmetric array of vias

Stacking packages with alignment elements

Semiconductor chip shape alteration

CAPACITOR IN SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

Semiconductor Device and Fabricating Method Thereof

Electrical fuse, semiconductor device having the same, and method of programming and reading the electrical fuse

High voltage CMOS device and method of fabricating the same

Nonvolatile semiconductor memory

RF power transistor with large periphery metal-insulator-silicon shunt capacitor

Multi-grain luminescent ceramics for light emitting devices

Electronic cooling device and fabrication method thereof

Semiconductor device for measuring an overlay error, method for measuring an overlay error, lithographic apparatus and device manufacturing method

Module With At Least Two Pairs of Module Connecting Plates

Removal of surface oxides by electron attachment for wafer bumping applications

Wiring substrate and method for manufacturing the same

Material board for producing hybrid circuit board with metallic terminal plate and method for producing hybrid circuit board

THERMAL MODULE MOUNTED ON CARRIER BY USING MAGNETIC FORCE

Structure of a heat dissipating module

Heat transfer duct fastening structure

Thermal module with centrifugal blower and electronic assembly incorporating the same

Thermal diodic devices and methods for manufacturing same

STRUCTURED THERMAL TRANSFER ARTICLE

Method of forming an interconnection structure in a organosilicate glass having a porous layer with higher carbon content located between two lower carbon content non-porous layers

Method of depositing copper using physical vapor deposition

Method for forming a metal structure

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

Method of manufacturing wafer level chip size package

Super thin LED package for the backlighting applications and fabrication method

MONITORING OF ELECTROSTATIC DISCHARGE (ESD) EVENTS DURING SEMICONDUCTOR MANUFACTURE USING ESD SENSITIVE RESISTORS

Element mounting substrate and method for manufacturing same

Methods for active boosting to minimize capacitive coupling effect between adjacent gates of flash memory devices

Semiconductor device

Light-emitting diode assembly

Semiconductor module with heat sink and method thereof

Securing heat sinks to a device under test

Compliant thermal interface structure utilizing spring elements

Heat dissipating device having a fin also functioning as a fan holder

Heat Sinks For Dissipating A Thermal Load

Heat sinks for dissipating a thermal load

HEAT SINK

Fan frame

Fuse structure integrated in semiconductor device

Trimming circuits and methods

Electronic device and method of manufacturing the same

Electroluminescent module with thermal-conducting carrier substrate

Light Emitting Device Comprising Inorganic Light Emitting Diode (S)

Zero-order overlay targets

Metal structure

Layout and process to contact sub-lithographic structures

Semiconductor device and manufacturing method of semiconductor device

Semiconductor integrated circuit including a multi-level interconnect with a diagonal wire

Wiring substrate with improvement in tensile strength of traces

Semiconductor device having a multilayer interconnection structure

Semiconductor device and method for manufacturing same

Methods and systems for low interfacial oxide contact between barrier and copper metallization

Interconnect structure and method of manufacturing a damascene structure

Nanowire chemical mechanical polishing

Integrated circuit packages, systems, and methods

Hermetic seal and reliable bonding structures for 3D applications

Semiconductor device

Fabricating method of a semiconductor device

Method of producing a porous dielectric element and corresponding dielectric element

SCRIBE-LINE STRUCTURES AND METHODS OF FORMING THE SAME

Semiconductor chip

Image sensor module, method of manufacturing the same, and camera module having the same

INTERCONNECT FEATURE HAVING ONE OR MORE OPENINGS THEREIN AND METHOD OF MANUFACTURE THEREFOR

Power transistor with trench sinker for contacting the backside

Method and system for utilizing DRAM components in a system-on-chip

Multi-channel transistor structure and method of making thereof

Methods and apparatus for inline variability measurement of integrated circuit components