ClassID:

212006

H01L2924/0002 - page 88 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#26101
20080112137
2008-05-15

COOLING DEVICE FOR INVERTER AND LDC ELEMENTS FOR HEV

#26102
20080112136
2008-05-15

CIRCUIT BOARD ADAPTED TO FAN AND FAN STRUCTURE

#26103
20080112134
2008-05-15

Dust accumulation resistant heat sink

#26104
20080112130
2008-05-15

Housing temperature suppressing structure in electronic device and portable computer

#26105
20080112108
2008-05-15

Method for forming MIM in semiconductor device

#26106
20080112037
2008-05-15

HERMETIC SEALING OF MICRO DEVICES

#26107
20080111907
2008-05-15

Imaging module and method of manufacturing imaging module

#26108
20080111906
2008-05-15

Pixel circuit of CMOS image sensor for dual capture and structure thereof

#26109
20080111866
2008-05-15

Nozzle arrangement with a top wall portion having etchant holes therein

#26110
20080111760
2008-05-15

Radio frequency integrated circuit tag and method of using the RFIC tag

#26111
20080111565
2008-05-15

Concept of compensating for piezo influences on integrated circuitry

#26112
20080111470
2008-05-15

Expandable LED array interconnect

#26113
20080111250
2008-05-15

Structure and method for enhancing resistance to fracture of bonding pads

#26114
20080111246
2008-05-15

Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device

#26115
20080111243
2008-05-15

High performance system-on-chip using post passivation process

#26116
20080111242
2008-05-15

Integrated circuit chips with fine-line metal and over-passivation metal

#26117
20080111240
2008-05-15

Semiconductor device and method for fabricating the same

#26118
20080111239
2008-05-15

Interconnect structure having enhanced electromigration reliability and a method of fabricating same

#26119
20080111238
2008-05-15

Integrated circuit processing system

#26120
20080111237
2008-05-15

SEMICONDUCTOR DEVICE MANUFACTURED USING AN ELECTROCHEMICAL DEPOSITION PROCESS FOR COPPER INTERCONNECTS

#26121
20080111227
2008-05-15

Semiconductor package structure for vertical mount and method

#26122
20080111223
2008-05-15

Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same

#26123
20080111210
2008-05-15

Antifuse structure having an integrated heating element

#26124
20080111207
2008-05-15

High-voltage semiconductor device and method of fabricating the same

#26125
20080111203
2008-05-15

Wafer-level packaging of micro devices

#26126
20080111193
2008-05-15

Serpentine ballasting resistors for multi-finger ESD protection device

#26127
20080111192
2008-05-15

HIGH-VOLTAGE-WITHSTANDING SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

#26128
20080111164
2008-05-15

Integrated circuit device and method of producing the same

#26129
20080111154
2008-05-15

Integration of a SiGe- or SiGeC-based HBT with a SiGe- or SiGeC-strapped semiconductor device

#26130
20080111148
2008-05-15

Led reflective package

#26131
20080111141
2008-05-15

LED assembly with an LED and adjacent lens and method of making same

#26132
20080111111
2008-05-15

Highly filled polymer materials

#26133
20080111069
2008-05-15

Determining dopant information

#26134
20080111058
2008-05-15

Integrated optical imaging systems including an interior space between opposing substrates and associated methods

#26135
20080110667
2008-05-15

Printed circuit board with embedded capacitors therein and manufacturing process thereof

#26136
20080110600
2008-05-15

COOLING APPARATUS FOR ELECTRONIC DEVICES

#26137
20080110599
2008-05-15

Orientation insensitive multi chamber thermosiphon

#26138
20080110598
2008-05-15

System and method of a heat transfer system with an evaporator and a condenser

#26139
20080110597
2008-05-15

Cooling apparatus having low profile extrusion and method of manufacture therefor

#26140
20080110594
2008-05-15

Air/fluid cooling system

#26141
20080109768
2008-05-08

Impurity concentration distribution predicting method and program for deciding impurity concentration distribution

#26142
20080108774
2008-05-08

Linked periodic networks of alternating carbon and inorganic clusters for use as low dielectric constant materials

#26143
20080108220
2008-05-08

Interconnect structure with a barrier-redundancy feature

#26144
20080108219
2008-05-08

Semiconductor interconnect and method of making same

#26145
20080108217
2008-05-08

ESD protection for passive integrated devices

#26146
20080108216
2008-05-08

Method for forming a roughened contact in a semiconductor device

#26147
20080108215
2008-05-08

INTEGRATED CIRCUIT INTERCONNECT LINES HAVING REDUCED LINE RESISTANCE

#26148
20080108205
2008-05-08

Semiconductor device and method for manufacturing the same

#26149
20080108171
2008-05-08

Release strategies for making transferable semiconductor structures, devices and device components

#26150
20080108167
2008-05-08

Solid state image pickup device and method of producing solid state image pickup device

#26151
20080108153
2008-05-08

Method for fabricating semiconductor device

#26152
20080107373
2008-05-08

Diffusion and laser photoelectrically coupled integrated circuit signal line

#26153
20080107149
2008-05-08

Structure for monitoring stress-induced degradation of conductive interconnects

#26154
20080106943
2008-05-08

NAND-type EEPROM with increased reading speed

#26155
20080106923
2008-05-08

Phase change memory cells with dual access devices

#26156
20080106894
2008-05-08

Light emitting module and display device having the same

#26157
20080106869
2008-05-08

Heat dissipation device

#26158
20080106868
2008-05-08

THERMAL INTERFACE MATERIAL VOLUME BETWEEN THERMAL CONDUCTING MEMBERS

#26159
20080106866
2008-05-08

Electronic appliance

#26160
20080106863
2008-05-08

Heat dissipation assembly for computing devices

#26161
20080106605
2008-05-08

Secure Sensor Chip

#26162
20080106469
2008-05-08

Semiconductor Device

#26163
20080106299
2008-05-08

Semiconductor integrated circuit having current leakage reduction scheme

#26164
20080106209
2008-05-08

Electronic module, methods of manufacturing and driving the same, and electronic instrument

#26165
20080105983
2008-05-08

Method of forming metal line of semiconductor device, and semiconductor device

#26166
20080105982
2008-05-08

Semiconductor device and method of manufacturing the same

#26167
20080105980
2008-05-08

Method for manufacturing semiconductor device having damascene MIM type capacitor

#26168
20080105977
2008-05-08

Interconnect layers without electromigration

#26169
20080105976
2008-05-08

Metal filled through via structure for providing vertical wafer-to-wafer interconnection

#26170
20080105972
2008-05-08

Method for making a circuit plate

#26171
20080105969
2008-05-08

Semiconductor constructions and semiconductor device fabrication methods

#26172
20080105968
2008-05-08

INTEGRATED CIRCUIT INTERCONNECT LINES HAVING REDUCED LINE RESISTANCE

#26173
20080105958
2008-05-08

High temperature, high voltage SiC void-less electronic package

#26174
20080105948
2008-05-08

Fuse structures and integrated circuit devices

#26175
20080105947
2008-05-08

Semiconductor device, wiring of semiconductor device, and method of forming wiring

#26176
20080105928
2008-05-08

Low ohmic layout technique for MOS transistors

#26177
20080105883
2008-05-08

Method and system for electrically coupling a chip to chip package

#26178
20080105664
2008-05-08

ENERGY-EFFICIENT, LASER-BASED METHOD AND SYSTEM FOR PROCESSING TARGET MATERIAL

#26179
20080105458
2008-05-08

Substrate for mounting flip chip and the manufacturing method thereof

#26180
20080105411
2008-05-08

Heat dissipation device with heat pipes

#26181
20080105409
2008-05-08

HEAT DISSIPATION DEVICE WITH HEAT PIPES

#26182
20080105408
2008-05-08

Heat-pipe type heat sink

#26183
20080105407
2008-05-08

Integrated heat dissipating assembly

#26184
20080105404
2008-05-08

Heat dissipating system having a heat dissipating cavity body

#26185
20080105373
2008-05-08

Aerogel/PTFE composite insulating material

#26186
20080104992
2008-05-08

Miniature liquid cooling device having an integral pump

#26187
20080104970
2008-05-08

Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof

#26188
20080104840
2008-05-08

Heat transfer unit extrusion process

#26189
20080104839
2008-05-08

Method for combining heat pipe with heat sink fin

#26190
20080104420
2008-05-01

Protected storage of a datum in an integrated circuit

#26191
20080102701
2008-05-01

Connector with Shield, and Circuit Board Device

#26192
20080102636
2008-05-01

Method for manufacturing semiconductor device

#26193
20080102630
2008-05-01

Method of manufacturing semiconductor device

#26194
20080102610
2008-05-01

Method of controlling stress in gallium nitride films deposited on substrates

#26195
20080102604
2008-05-01

Electrical die contact structure and fabrication method

#26196
20080102602
2008-05-01

Structure of strained silicon on insulator and method of manufacturing the same

#26197
20080102596
2008-05-01

Methods of forming semiconductor structures

#26198
20080102585
2008-05-01

Method of manufacturing silicon carbide semiconductor device

#26199
20080102554
2008-05-01

Solid state image pickup device and method of producing solid state image pickup device

#26200
20080102409
2008-05-01

Inductor for a system-on-a-chip and a method for manufacturing the same

#26201
20080102304
2008-05-01

Refractory Metal Substrate with Improved Thermal Conductivity

#26202
20080101146
2008-05-01

One-time-programmable logic bit with multiple logic elements

#26203
20080101113
2008-05-01

Memory device and method of manufacturing the same

#26204
20080101062
2008-05-01

Lighting device for projecting a beam of light

#26205
20080101037
2008-05-01

Securing object relative to PC board using retention device attached to surface-mounted attachment mechanisms

#26206
20080101036
2008-05-01

Heat-dissipating assembly structure

#26207
20080101035
2008-05-01

Heat-dissipating assembly structure

#26208
20080101033
2008-05-01

Component retention with distributed compression

#26209
20080101030
2008-05-01

Heat sink assembly

#26210
20080101029
2008-05-01

Clip for heat sink

#26211
20080101028
2008-05-01

Heat sink

#26212
20080101027
2008-05-01

Heat dissipation device

#26213
20080101025
2008-05-01

Multi-chip module with power system

#26214
20080101023
2008-05-01

Negative pressure pump device

#26215
20080101022
2008-05-01

Micro-fluidic cooling apparatus with phase change

#26216
20080101018
2008-05-01

Heat dissipation device

#26217
20080101017
2008-05-01

Cooling device and electronic device

#26218
20080101015
2008-05-01

Air flow regulation devices

#26219
20080101014
2008-05-01

Miniature cooling device

#26220
20080101013
2008-05-01

Power module having self-contained cooling system

#26221
20080101012
2008-05-01

Heat dissipation assembly for computing devices

#26222
20080100989
2008-05-01

Layout for capacitor pair with high capacitance matching

#26223
20080100763
2008-05-01

CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME

#26224
20080100732
2008-05-01

Optical device module, fabrication method thereof, optical device unit and fabrication method thereof

#26225
20080100408
2008-05-01

Inductor structure

#26226
20080100367
2008-05-01

Crosstalk noise reduction circuit and method

#26227
20080100348
2008-05-01

Semiconductor device having metal thin film resistance element

#26228
20080100319
2008-05-01

Intra-chip power and test signal generation for use with test structures on wafers

#26229
20080100291
2008-05-01

Solid high aspect ratio via hole used for burn-in boards, wafer sort probe cards, and package test load boards with electronic circuitry

#26230
20080100210
2008-05-01

Luminous means and lighting device with such a luminous means

#26231
20080099930
2008-05-01

Semiconductor device

#26232
20080099926
2008-05-01

Semiconductor device

#26233
20080099924
2008-05-01

Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape

#26234
20080099923
2008-05-01

Dual damascene integration of ultra low dielectric constant porous materials

#26235
20080099921
2008-05-01

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

#26236
20080099919
2008-05-01

SEMICONDUCTOR DEVICE INCLUDING COPPER INTERCONNECT AND METHOD FOR MANUFACTURING THE SAME

#26237
20080099918
2008-05-01

SEMICONDUCTOR DEVICE INCLUDING A POROUS LOW-K MATERIAL LAYER STACK WITH REDUCED UV SENSITIVITY

#26238
20080099908
2008-05-01

Systems, devices, components and methods for hermetically sealing electronic modules and packages

#26239
20080099906
2008-05-01

Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering

#26240
20080099901
2008-05-01

Package substrate with inserted discrete capacitors

#26241
20080099889
2008-05-01

Semiconductor device and method for manufacturing same

#26242
20080099886
2008-05-01

Semiconductor element, semiconductor device and mounting board

#26243
20080099884
2008-05-01

Staggered guard ring structure

#26244
20080099880
2008-05-01

Structure for symmetrical capacitor

#26245
20080099879
2008-05-01

Capacitor pairs with improved mismatch performance

#26246
20080099877
2008-05-01

Damage propagation barrier and method of forming

#26247
20080099875
2008-05-01

Structure of strained silicon on insulator and method of manufacturing the same

#26248
20080099869
2008-05-01

Two-dimensional image detecting apparatus and method for manufacturing the same

#26249
20080099866
2008-05-01

Image sensing module and method for packaging the same

#26250
20080099862
2008-05-01

Physical quantity sensor and method for manufacturing the same

#26251
20080099855
2008-05-01

Semiconductor device and method of fabricating the same

#26252
20080099848
2008-05-01

Method and apparatus for electrostatic discharge protection having a stable breakdown voltage and low snapback voltage

#26253
20080099834
2008-05-01

Transistor, an inverter and a method of manufacturing the same

#26254
20080099831
2008-05-01

Semiconductor memory device and method for the same

#26255
20080099802
2008-05-01

Transmission line transistor

#26256
20080099800
2008-05-01

Integrated matching network and method for manufacturing integrated matching networks

#26257
20080099790
2008-05-01

Layout structure having a fill element arranged at an angle to a conducting line

#26258
20080099761
2008-05-01

Test structure for OPC-related shorts between lines in a semiconductor device

#26259
20080099659
2008-05-01

HIGH-HARDNESS AND CORROSION-TOLERANT INTEGRATED CIRCUIT PACKING MOLD

#26260
20080099537
2008-05-01

Method for sealing vias in a substrate

#26261
20080099453
2008-05-01

Energy-efficient, laser-based method and system for processing target material

#26262
20080099234
2008-05-01

Electronic module with dual connectivity

#26263
20080099193
2008-05-01

SELF-REGULATED COOLING MECHANISM

#26264
20080099189
2008-05-01

Self-pumped cooling device

#26265
20080099186
2008-05-01

FLEXIBLE HEAT PIPE

#26266
20080099139
2008-05-01

Method for sealing microcomponent

#26267
20080097738
2008-04-24

Redundant micro-loop structure for use in an integrated circuit physical design process and method of forming the same

#26268
20080096384
2008-04-24

Method of forming damascene filament wires

#26269
20080096383
2008-04-24

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH MULTIPLE DIELECTRICS

#26270
20080096331
2008-04-24

METHOD FOR FABRICATING HIGH COMPRESSIVE STRESS FILM AND STRAINED-SILICON TRANSISTORS

#26271
20080096320
2008-04-24

High density chip packages, methods of forming, and systems including same

#26272
20080096295
2008-04-24

Method of manufacturing a semiconductor integrated circuit device

#26273
20080095991
2008-04-24

Electric component comprising external electrodes and method for the production of an electric component comprising external electrodes

#26274
20080095204
2008-04-24

Laser device

#26275
20080094829
2008-04-24

Lighting system using multiple colored light emitting sources and diffuser element

#26276
20080094802
2008-04-24

Heat sink, circuit board, and electronic apparatus

#26277
20080094801
2008-04-24

HEAT DISSIPATION MODULE

#26278
20080094800
2008-04-24

Heat-dissipating device and method for producing the same

#26279
20080094798
2008-04-24

Apparatus for cooling computer parts and method of manufacturing the same

#26280
20080094640
2008-04-24

Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method for controlling energy delivered to a target structure

#26281
20080094628
2008-04-24

Surface inspection apparatus and surface inspection method

#26282
20080094321
2008-04-24

ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURE

#26283
20080094168
2008-04-24

Encapsulated metal resistor

#26284
20080094004
2008-04-24

Light-Generating Body

#26285
20080093746
2008-04-24

Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface

#26286
20080093745
2008-04-24

High performance system-on-chip using post passivation process

#26287
20080093743
2008-04-24

Sub-lithographic nano interconnect structures, and method for forming same

#26288
20080093742
2008-04-24

Method for shielding integrated circuits

#26289
20080093713
2008-04-24

Coupling metal clad fiber optics for enhanced heat dissipation

#26290
20080093712
2008-04-24

Chip with Light Protection Layer

#26291
20080093711
2008-04-24

DIELECTRIC LAYERS AND METHODS OF FORMING THE SAME

#26292
20080093706
2008-04-24

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#26293
20080093705
2008-04-24

Semiconductor device preventing bridge between fuse pattern and guard ring

#26294
20080093704
2008-04-24

Semiconductor device having moisture-proof dam and method of fabricating the same

#26295
20080093703
2008-04-24

Electrical fuse and method of making

#26296
20080093702
2008-04-24

SEMICONDUCTOR DEVICE HAVING A PASSIVE DEVICE

#26297
20080093697
2008-04-24

Semiconductor device preventing recovery breakdown and manufacturing method thereof

#26298
20080093679
2008-04-24

Semiconductor device

#26299
20080093672
2008-04-24

String contact structure for high voltage ESD

#26300
20080093670
2008-04-24

Signal and/or ground planes with double buried insulator layers and fabrication process

#26301
20080093636
2008-04-24

Scalable Process And Structure For JFET For Small And Decreasing Line Widths

#26302
20080093632
2008-04-24

Size-reduced layout of cell-based integrated circuit with power switch

#26303
20080093596
2008-04-24

Semiconductor Device and Method of Fabricating the Same

#26304
20080093530
2008-04-24

Optical feedback system with improved accuracy

#26305
20080093454
2008-04-24

Wireless processor, wireless memory, information system, and semiconductor device

#26306
20080093424
2008-04-24

Probe arrays and method for making

#26307
20080093139
2008-04-24

Drive for a vehicle, especially a tracked vehicle or a vehicle with wheel-based steering

#26308
20080093058
2008-04-24

Systems and methods for orientation and direction-free cooling of devices

#26309
20080093056
2008-04-24

THERMAL MODULE

#26310
20080093052
2008-04-24

HEAT DISSIPATION DEVICE WITH HEAT PIPES

#26311
20080092937
2008-04-24

Energy harvesting devices

#26312
20080092381
2008-04-24

Method for manufacturing an electronic key with USB connector

#26313
20080092353
2008-04-24

Angled elongated features for improved alignment process integration

#26314
20080092101
2008-04-17

Ceramic package in which far end noise is reduced using capacitive cancellation by offset wiring

#26315
20080092095
2008-04-17

Design structure and system for identification of defects on circuits or other arrayed products

#26316
20080091961
2008-04-17

Power network reconfiguration using MEM switches

#26317
20080091096
2008-04-17

Analyte monitoring device and methods of use

#26318
20080090986
2008-04-17

Heat stable aryl polysiloxane compositions

#26319
20080090427
2008-04-17

Microelectronic component with foam-metal posts

#26320
20080090410
2008-04-17

Semiconductor device having oxidized metal film and manufacture method of the same

#26321
20080090409
2008-04-17

Method for manufacturing a semiconductor device including interconnections having a smaller width

#26322
20080090407
2008-04-17

Terminal pad structures and methods of fabricating same

#26323
20080090404
2008-04-17

CONTACT STRUCTURE OF A WIRES AND METHOD MANUFACTURING THE SAME, AND THIN FILM TRANSISTOR SUBSTRATE INCLUDING THE CONTACT STRUCTURE AND METHOD MANUFACTURING THE SAME

#26324
20080090398
2008-04-17

Method for manufacturing a structure in a semiconductor device and a structure in a semiconductor device

#26325
20080090382
2008-04-17

Substrate dividing method

#26326
20080090376
2008-04-17

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

#26327
20080090372
2008-04-17

Method of manufacturing coil

#26328
20080090371
2008-04-17

Semiconductor apparatus including a thin-metal-film resistor element and a method of manufacturing the same

#26329
20080090363
2008-04-17

Method of manufacturing semiconductor device

#26330
20080090358
2008-04-17

Method of fabricating semiconductor integrated circuit device

#26331
20080090308
2008-04-17

Semiconductor device alignment mark having a plane pattern and semiconductor device

#26332
20080090176
2008-04-17

Semiconductor wafer and semiconductor device

#26333
20080089159
2008-04-17

Apparatus and method for programming an electronically programmable semiconductor fuse

#26334
20080089151
2008-04-17

Methods of determining laser alignment and related structures, devices, and circuits

#26335
20080089062
2008-04-17

Solid-state lateral emitting optical system

#26336
20080089039
2008-04-17

Method for Micropacking of Electrical or Electrochemical Devices and Micropackage

#26337
20080089034
2008-04-17

Heat dissipation apparatus utilizing empty component slot

#26338
20080089033
2008-04-17

Thermal conductive medium cover

#26339
20080089030
2008-04-17

Heat sink retaining device

#26340
20080089027
2008-04-17

Cooling Fan

#26341
20080089026
2008-04-17

Heat dissipating apparatus for computer add-on cards

#26342
20080089024
2008-04-17

Multi-Chip Module (MCM) of a Computer System

#26343
20080088996
2008-04-17

Active protection device for protecting circuit against mechanical and electromagnetic attack

#26344
20080088977
2008-04-17

HEAT TRANSFER FOR A HARD-DRIVE PRE-AMP

#26345
20080088027
2008-04-17

Dry etchback of interconnect contacts

#26346
20080088026
2008-04-17

Enhanced interconnect structure

#26347
20080088023
2008-04-17

Semiconductor device with bonding pad support structure

#26348
20080088022
2008-04-17

Implementation of a metal barrier in an integrated electronic circuit

#26349
20080088021
2008-04-17

Semiconductor device including a silicide layer and a dielectric layer

#26350
20080088020
2008-04-17

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

#26351
20080088017
2008-04-17

Semiconductor integrated circuit device

#26352
20080088010
2008-04-17

Electronic device with integrated micromechanical contacts and cooling system

#26353
20080088007
2008-04-17

System, device and method for reducing cross-talk in differential signal conductor pairs

#26354
20080087998
2008-04-17

Interconnection between different circuit types

#26355
20080087997
2008-04-17

Semiconductor package substrate and method, in particular for MEMS devices

#26356
20080087985
2008-04-17

Forming high-k dielectric layers on smooth substrates

#26357
20080087982
2008-04-17

Semiconductor device with liquid repellant layer

#26358
20080087963
2008-04-17

Tapered voltage polysilicon diode electrostatic discharge circuit for power MOSFETs and ICs

#26359
20080087953
2008-04-17

Power mosfet including inter-source connection pattern

#26360
20080087932
2008-04-17

NAND flash memory devices having 3-dimensionally arranged memory cells and methods of fabricating the same

#26361
20080087911
2008-04-17

Light emitting diode system, method for producing such a system, and backlighting device

#26362
20080087891
2008-04-17

Semiconductor-on-diamond devices and methods of forming

#26363
20080087844
2008-04-17

Technique for matching performance of ion implantation devices using an in-situ mask

#26364
20080087736
2008-04-17

Printed infra-red data structure with targets

#26365
20080087646
2008-04-17

Method for manufacturing carbon nanotube composite material

#26366
20080087457
2008-04-17

Ceramic Package in Which Far End Noise is Reduced Using Capacitive Cancellation by Offset Wiring

#26367
20080087412
2008-04-17

Heat Transport Device

#26368
20080087407
2008-04-17

Heat dissipation device

#26369
20080087404
2008-04-17

Thermal module

#26370
20080087024
2008-04-17

Hybrid heat exchanger

#26371
20080086870
2008-04-17

Single footprint family of integrated power modules

#26372
20080086710
2008-04-10

Method and system for the modular design and layout of integrated circuits

#26373
20080086282
2008-04-10

Method for validation of thermal solution for an electronic component

#26374
20080085969
2008-04-10

Epoxy resin composition for encapsulating semiconductor element and semiconductor device

#26375
20080085622
2008-04-10

System and method for increasing the surface mounting stability of a lamp

#26376
20080085599
2008-04-10

Alignment mark, use of a hard mask material, and method

#26377
20080085403
2008-04-10

HEAT TRANSFER COMPOSITE, ASSOCIATED DEVICE AND METHOD

#26378
20080084766
2008-04-10

Flash memory device and method of erasing memory cell block in the same

#26379
20080084672
2008-04-10

Reconfigurable heat sink assembly

#26380
20080084669
2008-04-10

Heat dissipation device

#26381
20080084663
2008-04-10

Heat dissipation module and fan thereof

#26382
20080084662
2008-04-10

Heat-dissipating device

#26383
20080084255
2008-04-10

Integrated circuit arrangement and use of connecting lines

#26384
20080084228
2008-04-10

Body bias compensation for aged transistors

#26385
20080083992
2008-04-10

Bonding and probing pad structures

#26386
20080083968
2008-04-10

Bipolar transistor and method of manufacturing the same

#26387
20080083967
2008-04-10

Capacitor integrated in semiconductor device

#26388
20080083959
2008-04-10

Stacked structures and methods of forming stacked structures

#26389
20080083954
2008-04-10

Semiconductor device and manufacturing method thereof

#26390
20080083937
2008-04-10

Semiconductor integrated circuit for driving the address of a display device

#26391
20080083936
2008-04-10

Interconnect layer of a modularly designed analog integrated circuit

#26392
20080083922
2008-04-10

Radio frequency test key structure

#26393
20080083612
2008-04-10

Synthesis of aligned carbon nanotubes on double-sided metallic substrate by chemical vapor depositon

#26394
20080083561
2008-04-10

Thin printed circuit board for manufacturing chip scale package

#26395
20080083560
2008-04-10

Wiring board having wiring laminate portion with via conductors embedded in resin insulating layers

#26396
20080083558
2008-04-10

Multilayer wiring board

#26397
20080083528
2008-04-10

Heat dissipation device having mounting brackets

#26398
20080083500
2008-04-10

Method for detecting an end point of resist peeling, method and apparatus for peeling resist, and computer-readable storage medium

#26399
20080083343
2008-04-10

Semiconductor bridge device and igniter including semiconductor bridge circuit device

#26400
20080082300
2008-04-03

Design Structure for a Metal Fill Region of a Semiconductor Chip