212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer
#26402Method for forming metal line and method for manufacturing display substrate by using the same
#26403Method for fabricating semiconductor device
#26404Method of forming pad patterns using self-align double patterning method, pad pattern layout formed using the same, and method of forming contact holes using self-align double patterning method
#26405Integrated circuit chips with fine-line metal and over-passivation metal
#26406INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
#26407Method for manufacturing semiconductor device
#26408Cap Wafer for Wafer Bonded Packaging and Method for Manufacturing the Same
#26409Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance
#26410Method of fabricating a semiconductor device with reduced oxide film variation
#26411Structure and material of over-voltage protection device and manufacturing method thereof
#264123-dimensional substrate for embodying multi-packages and method of fabricating the same
#26413Ceramic substrate and fabricating method thereof
#26414Thermal interface material and method for manufacturing same
#26415Light emitting device including arrayed emitters defined by a photonic crystal
#26416Lamp socket, backlight assembly having the same, display device having the same and method of assembling a lamp module
#26417LED lighting apparatus with transparent flexible circuit structure
#26418LIGHT EMITTING DIODE MODULE AND BACKLIGHT SYSTEM USING THE SAME
#26419Thermal interfaces in electronic systems
#26420Video graphics array (VGA) card assembly
#26421Assembled structure of power semiconductor device and heat sink
#26422Impeller and aligned cold plate
#26423Heat sink and cooling apparatus
#26424Integrated circuit chips with fine-line metal and over-passivation metal
#26425Integrated circuit chips with fine-line metal and over-passivation metal
#26426Integrated circuit chips with fine-line metal and over-passivation metal
#26427Imaging method, apparatus and system having extended depth of field
#26428Switching power amplifier and DAC for an electronically-scanned array
#26429Electronically scanned array having a transmission line distributed oscillator and switch-mode amplifier
#26430High power integrated circuit beamforming array
#26431Hybrid on-chip-off-chip transformer
#26432INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
#26433BEOL interconnect structures with simultaneous high-k and low-k dielectric regions
#26434SEMICONDUCTOR DEVICE HAVING AN EPITAXIAL-GROWN CONTACT PLUG
#26435Semiconductor device
#26436Manufacturing method for semiconductor device, semiconductor device, substrate processing system, program and memory medium
#26437High-density 3-dimensional resistors
#26438Barrier formation and structure to use in semiconductor devices
#26439Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#26440Metal layer structure of semiconductor device
#26441System for separation of an electrically conductive connection
#26442Metal fill region of a semiconductor chip
#26443Metal line in semiconductor device and method for forming the same
#26444Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof
#26445SCALABLE INTERCHANGEABLE MULTIBAND POWER PACKAGE MOUNTING APPARATUS
#26446Package assembly pinout with superior crosstalk and timing performance
#26447Shape memory based mechanical enabling mechanism
#26448LEAD FRAME TYPE STACK PACKAGE AND METHOD O FABRICATING THE SAME
#26449Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same
#26450Termination structures for super junction devices
#26451Integrated capacitor structure
#26452Striped on-chip inductor
#26453Fuse structure including cavity and methods for fabrication thereof
#26454Semiconductor Device and Fabricating Method Thereof
#26455Method of fabricating semiconductor device having semiconductor elements
#26456Semiconductor device including recessed spherical silicide contact part and method of manufacturing the same
#26457Methods of producing semiconductor devices including multiple stress films in interface area
#26458Programmable connection and isolation of active regions in an integrated circuit using ambiguous features to confuse a reverse engineer
#26459Semiconductor apparatus and manufacturing method using a gate contact section avoiding an upwardly stepped polysilicon gate contact
#26460Insulated-gate semiconductor device
#26461Insulated-gate semiconductor device and PN junction diodes
#26462System and method for light source with discontinuity-containing diffusant
#26463Signal line for a display device, etchant, thin film transistor panel, and method for manufacturing the same
#26464Display device and electronic device
#26465Semiconductor Device and Method of Manufacturing the Same
#26466Microelectronic die having electrical connections to allow testing of guard wall for damage and method of testing guard wall for damage
#26467Electromechanical switch
#26468Heat pipe and manufacturing method thereof
#26469LOOP HEAT PIPE WITH FLEXIBLE ARTERY MESH
#26470Cooling of the power components of a frequency converter
#26471Heat sink with heat pipes
#26472Fan attachment apparatus for fan component assemblies
#26473Method for manufacturing wiring substrate having sheet
#26474Heat dissipating system and method
#26475HEAT DISSIPATING DEVICE
#26476ANALYTE MONITORING DEVICE AND METHODS OF USE
#26477METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM
#26478Test element group (TEG) system for measurement of SOI-MOSFET without a body contact comprising first and second TEGs of unequal gate electrode areas
#26479Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane
#26480Laminating magnetic materials in a semiconductor device
#26481Electronic device and method for manufacturing the same
#26482Method for fabricating a flip chip substrate structure
#26483Methods and systems for protection from over-stress
#26484Self-healing chip-to-chip interface
#26485Thermally conductive LED assembly
#26486Electronic Subassembly
#26487Heat sink and memory module using the same
#26488Thermal Interface Structure and the Manufacturing Method Thereof
#26489Heat dissipation device
#26490Heat sink having high heat dissipation efficiency
#26491Heat dissipation device having fan holder for attachment of a fan
#26492Exposure device, image forming apparatus and method for operating exposure device
#26493Multi-display apparatus and method of manufacturing the same
#26494Differential inductor for use in integrated circuits
#26495Electrically optimized and structurally protected via structure for high speed signals
#26496Al-Ni-based alloy wiring material and element structure using the same
#26497SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#26498Support device with discrete getter material microelectronic devices
#26499Positive-intrinsic-negative (PIN) diode semiconductor devices and fabrication methods thereof
#26500Test line placement to improve die sawing quality
#26501Semiconductor apparatus
#26502Four-terminal antifuse structure having integrated heating elements for a programmable circuit
#26503Dielectric spacers for metal interconnects and method to form the same
#26504Electronic component package, electronic component using the package, and method for manufacturing electronic component package
#26505Camera module and method of fabricating the same
#26506Buried guard ring structures and fabrication methods
#26507SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#26508Semiconductor device
#26509Semiconductor body and semiconductor chip comprising a semiconductor body
#26510Optoelectronic semiconductor chip
#26511Semiconductor device having a mount board
#26512Metal cage structure and method for EMI shielding
#26513Highly efficient heat dissipating composite material and a heat dissipating device made of such material
#26514HEAT SINK
#26515Noise elimination apparatus for radiator
#26516Sealed self-contained fluidic cooling device
#26517Heat sink
#26518Systems and methods for nanowire growth and harvesting
#26519APPARATUS AND METHOD OF EXPRESSING CIRCUIT VERSION IDENTIFICATION
#26520Temperature detector
#26521Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
#26522Method for adjusting sizes and shapes of plug openings
#26523Method and arrangement for contacting terminals
#26524Memory device in which data is written or read by a switching operation of a bit line that is inserted into a trench formed between a plurality of word lines
#26525Method For Fabricating Semiconductor Device Having Metal Fuse
#26526Group II element alloys for protecting metal interconnects
#26527Trench gate FET with self-aligned features
#26528STRUCTURE AND METHOD TO OPTIMIZE STRAIN IN CMOSFETs
#26529Semiconductor device manufacturing method, semiconductor wafer, and semiconductor device
#26530Image sensor using thin-film SOI
#26531Method for one-way coupling an input signal to an integrated circuit
#26532Microelectronic structures for patterned deposition of molecules onto surfaces
#26533LED light system
#26534Printed circuit board unit and electronic apparatus
#26535Heatsink attachment mechanism
#26536Fixing structure for computer mainboard
#26537Plasma Display Panel
#26538HEAT SINK ASSEMBLY FOR MULTIPLE ELECTRONIC COMPONENTS
#26539Heat dissipating device holder structure with a thin film thermal conducting medium coating
#26540Heatsink device with vapor chamber
#26541Dual impeller push-pull axial fan sink
#26542Mounting assembly and electronic device with the mounting assembly
#26543DISSIPATION MODULE AND ELECTRONIC DEVICE HAVING THE SAME
#26544Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment
#26545Image sensor and digital camera
#26546Ink jet printhead integrated circuit with surface-processed thermal actuators
#26547Mechanism of producing a conductor pattern on a substrate
#26548Semiconductor device and production method of the same
#26549Systems and methods for controlling of electro-migration
#26550Shielding of integrated circuit package with high-permeability magnetic material
#26551Integrated circuit wire patterns including integral plug portions
#26552Semiconductor device
#26553Deep via construction for a semiconductor device
#26554Power-via structure for integration in advanced logic/smart-power technologies
#26555Semiconductor device
#26556INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
#26557Semiconductor device and fabrication process thereof
#26558Semiconductor Device and Method for Manufacturing the Same, and Processing Liquid
#26559Electrical interconnection structure formation
#26560System in package (SIP) integrated circuit and packaging method thereof
#26561Microelectronic package, method of manufacturing same, and system containing same
#26562Locking feature and method for manufacturing transfer molded IC packages
#26563Insulating film and semiconductor device using this film
#26564Method for producing a composite material, associated composite material and associated semiconductor circuit arrangements
#26565Electrical Fuse Having Resistor Materials Of Different Thermal Stability
#26566Fuse structure and method for manufacturing same
#26567Lateral high-voltage devices with optimum variation lateral flux by using field plate
#26568Stress sensor for in-situ measurement of package-induced stress in semiconductor devices
#26569Storage Elements with Disguised Configurations and Methods of Using the Same
#26570Storage Elements with Disguised Configurations and Methods of Using the Same
#26571Wiring substrate and method of manufacturing thereof, and thin film transistor and method of manufacturing thereof
#26572High-voltage lateral DMOS device with diode clamp
#26573Method for producing multi-gate field-effect transistor with fin structure having drain-extended MOS field-effect transistor
#26574High-voltage extended drain MOSFET
#26575High-voltage lateral trench MOSFET
#26576Inverted-trench grounded-source FET structure with trenched source body short electrode
#26577Semiconductor device
#26578Semiconductor device having pseudo power supply wiring and method of designing the same
#26579Semiconductor device
#26580PHOTO-RADIATION SOURCE
#26581Via-hole processing method
#26582Via hole forming method
#26583Interposer And Manufacturing Method For The Same
#26584TAPE-LIKE HEAT SINK
#26585Heat dissipation device
#26586Normal-flow heat exchanger
#26587Passive fluid recovery system
#26588Apparatus and method for passive phase change thermal management
#26589Heat exchanging fluid return manifold for a liquid cooling system
#26590HEAT SINK
#26591Energy harvesting devices
#26592METHOD AND SYSTEM FOR DETECTING LEAK IN ELECTRONIC DEVICES
#26593Fastening board for cooling fins
#26594Epoxy resin composition and semiconductor device
#26595Semiconductor device power interconnect striping
#26596Silicon-alloy based barrier layers for integrated circuit metal interconnects
#26597Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
#26598Crack stop for low K dielectrics
#26599METHOD OF FORMING A MULTI-LAYER SEMICONDUCTOR STRUCTURE INCORPORATING A PROCESSING HANDLE MEMBER
#26600Method and structure for integrating MIM capacitors within dual damascene processing techniques
#26601Strained-channel fin field effect transistor (FET) with a uniform channel thickness and separate gates
#26602Semiconductor device and manufacturing process thereof
#26603Microelectronic devices and methods
#26604Method for fabricating a wafer level package having through wafer vias for external package connectivity
#26605Method of protecting integrated circuits
#26606Method and system for yield and productivity improvements in semiconductor processing
#26607Patternable low dielectric constant materials and their use in ULSI interconnection
#26608FLEXIBLE MICROELECTRONICS ADHESIVE
#26609Film Carrier Tape for Mounting Electronic Components and Method of Manufacturing the Film Carrier Tape
#26610Tape substrate having reinforcement layer for tape packages
#26611Stabilization for random chip identifier circuit
#26612Nanoscale wire coding for stochastic assembly
#26613Backlight assembly and display apparatus having the same
#26614Light bulb utilizing a replaceable LED light source
#26615Illumination System
#26616LED lighting device for replacing fluorescent tubes
#26617Electronic device assembly with clips for mounting a heat sink thereon
#26618Base heat spreader with fins
#26619Thermal management system and method for electronic assemblies
#26620Circuit board with a perforated structure for disposing a heat pipe
#26621Heat sinks for dissipating a thermal load
#26622Dual impeller push-pull axial fan
#26623Heat dissipation device
#26624Distributed electrostatic discharge protection circuit with varying clamp size
#26625Method and apparatus for personalization of semiconductor
#26626Stacked display medium
#26627Temperature sensor device and methods thereof
#26628POWER-ON CIRCUIT
#26629Led Array
#26630Galvanic isolator
#26631Semiconductor device and method for manufacturing the same
#26632METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#26633Interconnect structures with surfaces roughness improving liner and methods for fabricating the same
#26634Flexible via design to improve reliability
#26635Method of forming metal line in semiconductor device
#26636Structure of heat dissipated submount
#26637Electronic circuit unit
#26638CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
#26639Integrated passive devices with high Q inductors
#26640Dielectric layers for metal lines in semiconductor chips
#26641Edge termination region for high-voltage bipolar-CMOS-DMOS integrated circuit devices
#26642Semiconductor device
#26643Transistors, semiconductor integrated circuit interconnections and methods of forming the same
#26644Method of manufacturing semiconductor integrated circuit device having capacitor element
#26645Semiconductor device with an opening for cutting a fuse
#26646SYSTEM-IN-PACKAGE TYPE STATIC RANDOM ACCESS MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
#26647Field effect transistor (FET) devices and methods of manufacturing FET devices
#26648High-voltage depletion mode MOSFET
#26649High-voltage lateral DMOS device
#26650Semiconductor device
#26651Metal-oxide-metal structure with improved capacitive coupling area
#26652Integrated memory cell array
#26653Semiconductor memory device and method for forming the same
#26654Transistor, memory cell array and method of manufacturing a transistor
#26655Method of manufacturing a transistor and memory cell array
#26656Strained-channel fin field effect transistor (FET) with a uniform channel thickness and separate gates
#26657Semiconductor device with under-filled heat extractor
#26658Semiconductor device for measuring an overlay error, method for measuring an overlay error, lithographic apparatus and device manufacturing method
#26659Method and device for reflow soldering with volume flow control
#26660Flip chip substrate structure and the method for manufacturing the same
#26661COOLER DEVICE
#26662HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING
#26663Cooling apparatus for electronics
#26664Cooling air flow loop for a data center in a shipping container
#26665Methods of fabricating substrates including at least one conductive via
#26666Design structures incorporating interconnect structures with liner repair layers
#26667Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
#26668Fabricating method of semiconductor device
#26669Semiconductor device with a barrier film
#26670Method of forming crack arrest features in embedded device build-up package and package thereof
#26671Single spacer process for multiplying pitch by a factor greater than two and related intermediate IC structures
#26672Method of fabricating semiconductor integrated circuit device
#26673Method for fabricating a thick copper line and copper inductor resulting therefrom
#26674Method and structure for improving device performance variation in dual stress liner technology
#26675Semiconductor Device
#26676Manufacturing method of a semiconductor device having polycide wiring layer
#26677Integrated circuit cooling and insulating device and method
#26678Epitaxial silicon wafer and fabrication method thereof
#26679Method for Manufacturing Carbon Fiber Reinforced Carbon Composite Material Suitable for Semiconductor Heat Sink
#26680LAMINATED HEAT-TRANSFER INTERFACE FOR COOLER MODULE
#26681Phase change memory
#26682HEAT SINK FIXING ASSEMBLY
#26683Heat sink fastening device and assembling process thereof
#26684Electronic appliance having an electronic component and a heat-dissipating plate
#26685Heat-absorbing member, cooling device, and electronic apparatus
#26686Fastening element for heat dissipating apparatus
#26687Method for connecting heat pipes and a heat sink
#26688HEAT SINK FOR ELECTRONIC COMPONENTS
#26689Heat dissipation device
#26690HEAT DISSIPATING MODULE AND ASSEMBLY OF THE HEAT DISSIPATING MODULE AND A COMPUTER HOUSING
#26691Capacitor of Semiconductor Device and Fabrication Method Thereof
#26692Inductance variable device
#26693Electrical component tuned by conductive layer deletion
#26694Organic electroluminescent display device
#26695Semiconductor device and method for manufacturing the same
#26696Distributed semiconductor device methods, apparatus, and systems
#26697METHOD FOR PROTECTING AN ALIGNMENT MARK
#26698Semiconductor devices including fine pitch arrays with staggered contacts
#26699Semiconductor device and fabricating method thereof
#26700Semiconductor Device and Fabricating Method Thereof