ClassID:

212006

H01L2924/0002 - page 90 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#26701
20080054473
2008-03-06

Metal wiring and method for forming the same

#26702
20080054472
2008-03-06

Ruthenium thin film-formed structure

#26703
20080054471
2008-03-06

Semiconductor Device and Fabricating Method Thereof

#26704
20080054468
2008-03-06

Semiconductor device and methods of forming the same

#26705
20080054467
2008-03-06

Method for manufacturing a semiconductor device and semiconductor device

#26706
20080054466
2008-03-06

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#26707
20080054465
2008-03-06

Semiconductor device including fluorine diffusion barrier layer and method for manufacturing the same

#26708
20080054464
2008-03-06

Semiconductor device and method for fabricating the same

#26709
20080054461
2008-03-06

RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE

#26710
20080054457
2008-03-06

Semiconductor chip and method for fabricating the same

#26711
20080054454
2008-03-06

Semiconductor device and method for manufacturing semiconductor device

#26712
20080054450
2008-03-06

CHIP PACKAGE STRUCTURE AND HEAT SINK FOR CHIP PACKAGE

#26713
20080054442
2008-03-06

Semiconductor module arrangement and method

#26714
20080054441
2008-03-06

Chip package and method for fabricating the same

#26715
20080054438
2008-03-06

Semiconductor package structure having multiple heat dissipation paths and method of manufacture

#26716
20080054436
2008-03-06

Semiconductor Device and Fabricating Method Thereof

#26717
20080054423
2008-03-06

Apparatus and method for packaging circuits

#26718
20080054414
2008-03-06

Method of manufacturing semiconductor device having impurity region under isolation region

#26719
20080054410
2008-03-06

Semiconductor Device and Fabricating Method Thereof

#26720
20080054403
2008-03-06

Thin film capacitors and methods of making the same

#26721
20080054401
2008-03-06

Capacitor structure of semiconductor device

#26722
20080054398
2008-03-06

Method for making high-performance RF integrated circuits

#26723
20080054396
2008-03-06

Semiconductor Device and Fabricating Method Thereof

#26724
20080054395
2008-03-06

Semiconductor device and method of manufacturing the semiconductor device

#26725
20080054393
2008-03-06

Methods of fabricating passive element without planarizing and related semiconductor device

#26726
20080054360
2008-03-06

Method and apparatus for regulating photo currents induced by dose rate events

#26727
20080054330
2008-03-06

Tantalum lanthanide oxynitride films

#26728
20080054323
2008-03-06

Thin film phase change memory cell formed on silicon-on-insulator substrate

#26729
20080054308
2008-03-06

Crosstalk reduction in electrical interconnects using differential signaling

#26730
20080054307
2008-03-06

Power supply wiring configuration in semiconductor integrated circuit

#26731
20080054289
2008-03-06

Light emitting device and methods for forming the same

#26732
20080054281
2008-03-06

High-efficient light engines using light emitting diodes

#26733
20080054280
2008-03-06

Light emitting packages and methods of making same

#26734
20080054274
2008-03-06

Edge-emitting light-emitting diode

#26735
20080054265
2008-03-06

Display device and electronic device

#26736
20080054263
2008-03-06

Semiconductor device and method of fabricating the same

#26737
20080054262
2008-03-06

Semiconductor device

#26738
20080054261
2008-03-06

Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same

#26739
20080054260
2008-03-06

Semiconductor Integrated Circuit Device, Method For Testing The Semiconductor Integrated Circuit Device, Semiconductor Wafer And Burn-In Test Apparatus

#26740
20080054252
2008-03-06

Semiconductor layer structure with superlattice

#26741
20080054247
2008-03-06

Semiconductor layer structure with superlattice

#26742
20080054191
2008-03-06

Wafer repair system

#26743
20080053700
2008-03-06

Sealed electronic component

#26744
20080053648
2008-03-06

Structure for cooling a surface

#26745
20080053641
2008-03-06

Miniature liquid cooling device having an integral pump

#26746
20080053640
2008-03-06

Compliant vapor chamber chip packaging

#26747
20080052904
2008-03-06

Method Of Manufacturing An Electronic Circuit Assembly

#26748
20080052659
2008-02-28

Electrically programmable π-shaped fuse structures and design process therefore

#26749
20080050908
2008-02-28

Method of manufacture of contact plug and interconnection layer of semiconductor device

#26750
20080050903
2008-02-28

Electrically programmable fuse structures with narrowed width regions configured to enhance current crowding and methods of fabricating thereof

#26751
20080050880
2008-02-28

STRUCTURE FOR UNIFORM TRIGGERING OF MULTIFINGER SEMICONDUCTOR DEVICES WITH TUNABLE TRIGGER VOLTAGE

#26752
20080050878
2008-02-28

Method for preparing a memory structure

#26753
20080050874
2008-02-28

Metal-insulator-metal capacitor and method of manufacturing the same

#26754
20080050864
2008-02-28

Method of manufacturing semiconductor device having impurity region under isolation region

#26755
20080050860
2008-02-28

Adhesion by plasma conditioning of semiconductor chip

#26756
20080050851
2008-02-28

Method for manufacturing display device

#26757
20080050677
2008-02-28

Processing method, manufacturing method of semiconductor device, and processing apparatus

#26758
20080050305
2008-02-28

Method for producing graphite film, and graphite film produced by the method

#26759
20080049397
2008-02-28

Heat dissipation device

#26760
20080049395
2008-02-28

Ventilation device ventilating an electronic module

#26761
20080049378
2008-02-28

METAL-INSULATOR-METAL CAPACITOR AND METHOD OF FABRICATING SAME

#26762
20080049365
2008-02-28

N-channel ESD clamp with improved performance

#26763
20080049171
2008-02-28

Display device comprising a semiconductor chip including a first terminal which overlaps a first and second line, the first terminal connected to the first line and overlapping and insulated from the second line

#26764
20080049158
2008-02-28

Array substrate for organic thin film transistor liquid crystal display device and method of manufacturing the same

#26765
20080049127
2008-02-28

SOLID-STATE IMAGING DEVICE, CAMERA MODULE, AND CAMERA-MODULE MANUFACTURING METHOD

#26766
20080048800
2008-02-28

Low loss electrical delay line

#26767
20080048760
2008-02-28

Monolithically integratable LC circuit arrangement

#26768
20080048346
2008-02-28

METHOD OF FABRICATING CONDUCTIVE LINES AND STRUCTURE OF THE SAME

#26769
20080048345
2008-02-28

Semiconductor device and fabricating method thereof

#26770
20080048341
2008-02-28

Chip with a vertical contact structure

#26771
20080048340
2008-02-28

SEMICONDUCTOR DEVICE HAVING FINE PATTERN WIRING LINES INTEGRALLY FORMED WITH CONTACT PLUG AND METHOD OF MANUFACTURING SAME

#26772
20080048339
2008-02-28

Metal line structures and methods of forming the same

#26773
20080048338
2008-02-28

Semiconductor Device and Fabrication Method Thereof

#26774
20080048336
2008-02-28

Semiconductor device and method for manufacturing the same

#26775
20080048332
2008-02-28

METHOD FOR FORMING INTERMETAL DIELECTRIC IN SEMICONDUCTOR DEVICE

#26776
20080048331
2008-02-28

Power/ground network of integrated circuits and arrangement thereof

#26777
20080048327
2008-02-28

ELECTRONIC CIRCUIT WITH EMBEDDED MEMORY

#26778
20080048326
2008-02-28

SEMICONDUCTOR DEVICE

#26779
20080048324
2008-02-28

Fabricating Semiconductor Device

#26780
20080048314
2008-02-28

Integrated circuit cooling and insulating device and method

#26781
20080048305
2008-02-28

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

#26782
20080048299
2008-02-28

Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly

#26783
20080048294
2008-02-28

Semiconductor device with guard ring

#26784
20080048290
2008-02-28

SEMICONDUCTOR DEVICE AND FABRICATING METHOD

#26785
20080048289
2008-02-28

RF Inductor of Semiconductor Device and Fabrication Method Thereof

#26786
20080048288
2008-02-28

SEMICONDUCTOR DEVICE

#26787
20080048287
2008-02-28

Method of forming isolation structure in semiconductor substrate

#26788
20080048282
2008-02-28

Semiconductor Device and Fabricating Method Thereof

#26789
20080048263
2008-02-28

High-voltage silicon-on-insulator transistors and methods of manufacturing the same

#26790
20080048256
2008-02-28

Semiconductor Device

#26791
20080048246
2008-02-28

Multi-bit electromechanical memory devices and methods of manufacturing the same

#26792
20080048231
2008-02-28

Buried decoupling capacitors, devices and systems including same, and methods of fabrication

#26793
20080048228
2008-02-28

Semiconductor device and method for manufacturing same

#26794
20080048206
2008-02-28

Vertical gallium nitride-based light emitting diode and method of manufacturing the same

#26795
20080048193
2008-02-28

White light emitting diode module

#26796
20080048186
2008-02-28

Design Structures Incorporating Semiconductor Device Structures with Self-Aligned Doped Regions

#26797
20080048052
2008-02-28

Spray nozzle apparatus and method of use

#26798
20080048018
2008-02-28

Methods, objects and apparatus employing machine readable data

#26799
20080047701
2008-02-28

ELECTROWETTING BASED HEAT SPREADER

#26800
20080047695
2008-02-28

Cooling structure for electronics and machines

#26801
20080047694
2008-02-28

Heat transfer apparatus and methods

#26802
20080047693
2008-02-28

Cooler

#26803
20080047688
2008-02-28

Cooling System And Cooling Method For Cooling Components Of A Power Electronics

#26804
20080047141
2008-02-28

Method for fabricating supporting column of heat sink

#26805
20080046110
2008-02-21

Temperature regulating method, thermal processing system and semiconductor device manufacturing method

#26806
20080045063
2008-02-21

Plastic housing and semiconductor component with said plastic housing

#26807
20080045050
2008-02-21

Connector and portable electronic device using the same

#26808
20080045038
2008-02-21

Method of forming an insulative film

#26809
20080045037
2008-02-21

Method for producing layers located on a hybrid circuit

#26810
20080045035
2008-02-21

Etching solution for etching metal layer, etching method using the etching solution, and method of fabricating semiconductor product using the etching solution

#26811
20080045013
2008-02-21

Iridium encased metal interconnects for integrated circuit applications

#26812
20080045007
2008-02-21

Top layers of metal for integrated circuits

#26813
20080045000
2008-02-21

Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium

#26814
20080044999
2008-02-21

Method for an improved air gap interconnect structure

#26815
20080044997
2008-02-21

Semiconductor device and method for manufacturing same

#26816
20080044994
2008-02-21

Semiconductor device capable of threshold voltage adjustment by applying an external voltage

#26817
20080044984
2008-02-21

METHODS OF AVOIDING WAFER BREAKAGE DURING MANUFACTURE OF BACKSIDE ILLUMINATED IMAGE SENSORS

#26818
20080044979
2008-02-21

Methods of forming transistor devices

#26819
20080044978
2008-02-21

Isolation structures for integrated circuits and modular methods of forming the same

#26820
20080044977
2008-02-21

High performance system-on-chip using post passivation process

#26821
20080044976
2008-02-21

High performance system-on-chip using post passivation process

#26822
20080044974
2008-02-21

Embedded stressed nitride liners for CMOS performance improvement

#26823
20080044955
2008-02-21

Electrostatic discharge protection device for digital circuits and for applications with input/output bipolar voltage much higher than the core circuit power supply

#26824
20080044950
2008-02-21

Multi-layer fin wiring interposer fabrication process

#26825
20080044940
2008-02-21

Laminating system

#26826
20080044685
2008-02-21

Articles comprising high-electrical-conductivity nanocomposite material and method for fabricating same

#26827
20080044670
2008-02-21

Interface materials and methods of production and use thereof

#26828
20080044667
2008-02-21

Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition

#26829
20080044651
2008-02-21

Coatings Comprising Carbon Nanotubes

#26830
20080044642
2008-02-21

Low dielectric constant materials prepared from soluble fullerene clusters

#26831
20080044624
2008-02-21

Complex architecture for dispersing heat

#26832
20080044576
2008-02-21

Method and Apparatus for Applying Thermal Interface Material

#26833
20080044149
2008-02-21

Polymerizable Composition

#26834
20080043909
2008-02-21

X-Ray Alignment System For Fabricating Electronic Chips

#26835
20080043791
2008-02-21

Semiconductor Laser Equipment

#26836
20080043509
2008-02-21

Memory device using antifuses

#26837
20080043480
2008-02-21

LED MODULE HAVING COOLING APPARATUS

#26838
20080043477
2008-02-21

Light emitting device

#26839
20080043465
2008-02-21

Light emitting device

#26840
20080043446
2008-02-21

Graphics card heat-dissipating device

#26841
20080043445
2008-02-21

Heat dissipation device

#26842
20080043440
2008-02-21

Nano-patch thermal management devices, methods, & systems

#26843
20080043438
2008-02-21

Cross-flow thermal management device and method of manufacture thereof

#26844
20080043437
2008-02-21

Three-dimensional thermal spreading in an air-cooled thermal device

#26845
20080043436
2008-02-21

THERMAL MODULE

#26846
20080043433
2008-02-21

Air cooled computer chip

#26847
20080043431
2008-02-21

Methods and Systems Employing Tailored Dimples to Enhance Heat Transfer

#26848
20080043429
2008-02-21

Apparatus, data processing apparatus and heat radiating member

#26849
20080043428
2008-02-21

Method and apparatus for dissipating heat in a computer system

#26850
20080043195
2008-02-21

Tape carrier, tape carrier for liquid crystal display device, and liquid crystal display device

#26851
20080043061
2008-02-21

Methods for reducing the non-linear behavior of actuators used for synthetic jets

#26852
20080042929
2008-02-21

Flexible display and method for forming alignment key of the same

#26853
20080042798
2008-02-21

Method of cooling a resistor

#26854
20080042592
2008-02-21

Method and apparatus for reducing thermal stress in light-emitting elements

#26855
20080042561
2008-02-21

Devices including, methods using, and compositions of reflowable getters

#26856
20080042551
2008-02-21

Alternating current light-emitting device

#26857
20080042526
2008-02-21

Alternator voltage control apparatus

#26858
20080042429
2008-02-21

METHOD AND APPARATUS FOR COUPLING AND DECOUPLING A DEVICE AND A HEAT PIPE

#26859
20080042299
2008-02-21

Interconnections for crosswire arrays

#26860
20080042291
2008-02-21

Copper contact via structure using hybrid barrier layer

#26861
20080042290
2008-02-21

Structures Electrically Connecting Aluminum and Copper Interconnections and Methods of Forming the Same

#26862
20080042289
2008-02-21

High performance system-on-chip using post passivation process

#26863
20080042288
2008-02-21

Method for manufacturing a semiconductor device

#26864
20080042287
2008-02-21

Integrated circuit chip utilizing oriented carbon nanotube conductive layers

#26865
20080042286
2008-02-21

Semiconductor device

#26866
20080042284
2008-02-21

Semiconductor integrated circuit and the method of designing the layout

#26867
20080042283
2008-02-21

Treatment of plasma damaged layer for critical dimension retention, pore sealing and repair

#26868
20080042280
2008-02-21

Semiconductor chip structure

#26869
20080042275
2008-02-21

Structure for bumped wafer test

#26870
20080042273
2008-02-21

High performance system-on-chip using post passivation process

#26871
20080042270
2008-02-21

System and method for reducing stress-related damage to ball grid array assembly

#26872
20080042268
2008-02-21

Void boundary structures, semiconductor devices having the void boundary structures and methods of forming the same

#26873
20080042266
2008-02-21

Noncontact IC label and method and apparatus for manufacturing the same

#26874
20080042264
2008-02-21

Apparatus and methods for cooling semiconductor integrated circuit package structures

#26875
20080042248
2008-02-21

Method of enabling solder deposition on a substrate and electronic package formed thereby

#26876
20080042239
2008-02-21

High performance system-on-chip using post passivation process

#26877
20080042238
2008-02-21

High performance system-on-chip using post passivation process

#26878
20080042236
2008-02-21

Integrated circuit system employing gate shield and/or ground shield

#26879
20080042232
2008-02-21

Modular methods of forming isolation structures for integrated circuits

#26880
20080042208
2008-02-21

TRENCH MOSFET WITH ESD TRENCH CAPACITOR

#26881
20080042175
2008-02-21

Solid state image pickup device and method of producing solid state image pickup device

#26882
20080042174
2008-02-21

Field effect transistors (FETS) with inverted source/drain metallic contacts, and method of fabrication same

#26883
20080042172
2008-02-21

Semiconductor component having a space saving edge structure

#26884
20080042153
2008-02-21

Wavelength conversion chip for use with light emitting diodes and method for making same

#26885
20080042147
2008-02-21

LED light source with integrated circuit and light guide

#26886
20080042137
2008-02-21

Electro-optical device, method for manufacturing electro-optical device, and electronic apparatus

#26887
20080042118
2008-02-21

Phase-change memory device with minimized reduction in thermal efficiency and method of manufacturing the same

#26888
20080041616
2008-02-21

Layout of a printed circuit board

#26889
20080041614
2008-02-21

Circuit board and circuit structure

#26890
20080041574
2008-02-21

Cooling systems employing fluidic jets, methods for their use and methods for cooling

#26891
20080041567
2008-02-21

Heat dissipating Module and Method of Fabricating the same

#26892
20080041566
2008-02-21

Computer cooling apparatus

#26893
20080041565
2008-02-21

Integrated cooling system with multiple condensing passages for cooling electronic components

#26894
20080041562
2008-02-21

Airflow bypass and cooling of processors in series

#26895
20080041561
2008-02-21

Heat dissipation device

#26896
20080041528
2008-02-21

Laminating apparatus

#26897
20080041106
2008-02-21

Method for producing a glass ceramic having a garnet phase

#26898
20080041067
2008-02-21

Thermoelectric conversion device and manufacture method of the same

#26899
20080040925
2008-02-21

Bendable heat spreader with metallic wire mesh-based microstructure and method for fabricating same

#26900
20080039555
2008-02-14

Thermally conductive material

#26901
20080039312
2008-02-14

Ceramic base material

#26902
20080038923
2008-02-14

Device and methodology for reducing effective dielectric constant in semiconductor devices

#26903
20080038918
2008-02-14

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

#26904
20080038917
2008-02-14

Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics

#26905
20080038915
2008-02-14

Device and methodology for reducing effective dielectric constant in semiconductor devices

#26906
20080038897
2008-02-14

Method of manufacturing a semiconductor device

#26907
20080038879
2008-02-14

Split-channel antifuse array architecture

#26908
20080038878
2008-02-14

Encapsulation circuitry on a substrate

#26909
20080038869
2008-02-14

High performance system-on-chip using post passivation process

#26910
20080038855
2008-02-14

Light-emitting device, light-emitting apparatus, image display apparatus, method of manufacturing light-emitting device, and method of manufacturing image display apparatus

#26911
20080038849
2008-02-14

Evaluation method of fine pattern, manufacturing method of device having the fine pattern

#26912
20080038848
2008-02-14

Apparatus and method for fabricating semiconductor packages

#26913
20080038574
2008-02-14

Electronic component having tin rich deposit layer and the process for depositing the same

#26914
20080038535
2008-02-14

COMPOSITE MATERIAL, HAVING HIGH THERMAL CONDUCTIVITY AND LOW THERMAL EXPANSION COEFFICIENT, AND HEAT-DISSIPATING SUBSTRATE, AND THEIR PRODUCTION METHODS

#26915
20080038518
2008-02-14

Electronic devices having air gaps

#26916
20080037308
2008-02-14

Fixed write-protect seamless memory card

#26917
20080037271
2008-02-14

Integrating light source module

#26918
20080037227
2008-02-14

Electronic apparatus

#26919
20080037225
2008-02-14

Fastening device and heat sink assembly using the same

#26920
20080037224
2008-02-14

Heat sink

#26921
20080037223
2008-02-14

Power Electronics with a Heat Sink

#26922
20080037220
2008-02-14

Socket having fan

#26923
20080036713
2008-02-14

Operating system and method of light emitting device

#26924
20080036536
2008-02-14

System and method for linearizing a CMOS differential pair

#26925
20080036508
2008-02-14

Switching element, switching element drive method and fabrication method, reconfigurable logic integrated circuit, and memory element

#26926
20080036485
2008-02-14

Semiconductor wafer and method of testing the same

#26927
20080036092
2008-02-14

Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner

#26928
20080036090
2008-02-14

Semiconductor device and method for producing the same

#26929
20080036089
2008-02-14

Semiconductor device having multilayer wiring structure

#26930
20080036081
2008-02-14

Interconnection structure of integrated circuit chip

#26931
20080036076
2008-02-14

Intelligent cooling method combining passive and active cooling components

#26932
20080036075
2008-02-14

Lightweight, hermetically sealed package having auxiliary, selectively contoured, low mass, pseudo wall insert for surface-mounting and dissipating heat from electronic circuit components

#26933
20080036064
2008-02-14

Semiconductor device

#26934
20080036057
2008-02-14

Semiconductor device having improved heat dissipation capabilities

#26935
20080036056
2008-02-14

Flip chip in leaded molded package and method of manufacture thereof

#26936
20080036042
2008-02-14

Semiconductor device

#26937
20080036038
2008-02-14

Pulsed growth of catalyst-free growth of GaN nanowires and application in group III nitride semiconductor bulk material

#26938
20080036037
2008-02-14

System and method for ESD protection

#26939
20080036033
2008-02-14

One-time programmable memory

#26940
20080036032
2008-02-14

SEMICONDUCTOR DEVICE

#26941
20080036031
2008-02-14

Fuse box for semiconductor device and method of forming same

#26942
20080036012
2008-02-14

Strained MOSFETs on separated silicon layers

#26943
20080036011
2008-02-14

Semiconductor integrated circuit device having latchup preventing function

#26944
20080036004
2008-02-14

Semiconductor apparatus with improved ESD withstanding voltage

#26945
20080035974
2008-02-14

High performance system-on-chip using post passivation process

#26946
20080035972
2008-02-14

High performance system-on-chip using post passivation process

#26947
20080035960
2008-02-14

Electromechanical memory devices and methods of manufacturing the same

#26948
20080035956
2008-02-14

Memory device with non-orthogonal word and bit lines

#26949
20080035908
2008-02-14

Group III nitride semiconductor light-emitting device

#26950
20080035895
2008-02-14

Silver powder and method for producing same

#26951
20080035851
2008-02-14

Processing method, manufacturing method of semiconductor device, and processing apparatus

#26952
20080035618
2008-02-14

Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target

#26953
20080035614
2008-02-14

Energy efficient, laser-based method and system for processing target material

#26954
20080035611
2008-02-14

Laser processing method

#26955
20080035315
2008-02-14

Cooling system with miniature fans for circuit board devices

#26956
20080035313
2008-02-14

Heat-Conducting Base and Isothermal Plate having the same

#26957
20080035311
2008-02-14

Cooler system

#26958
20080035310
2008-02-14

Isothermal Plate Module

#26959
20080034575
2008-02-14

Method for large scale integration of quartz-based devices

#26960
20080033271
2008-02-07

ANALYTE MONITORING DEVICE AND METHODS OF USE

#26961
20080032696
2008-02-07

Apparatus and method for storing hand over information

#26962
20080032499
2008-02-07

Method for manufacturing contact structures of wiring

#26963
20080032494
2008-02-07

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

#26964
20080032493
2008-02-07

Semiconductor device

#26965
20080032487
2008-02-07

SEMICONDUCTOR WAFER AND MANUFACTURING METHOD THEREOF

#26966
20080032486
2008-02-07

SEMICONDUCTOR WAFER AND MANUFACTURING METHOD THEREOF

#26967
20080032481
2008-02-07

Semiconductor device and method of manufacturing the same

#26968
20080032467
2008-02-07

Integrated circuit with metal heat flow path coupled to transistor and method for manufacturing such circuit

#26969
20080032434
2008-02-07

Method for making a light emitting diode by electroless plating

#26970
20080032233
2008-02-07

Crossbar-array designs and wire addressing methods that tolerate misalignment of electrical components at wire overlap points

#26971
20080031045
2008-02-07

Semiconductor devices with source and bulk coupled to separate voltage supplies

#26972
20080031031
2008-02-07

Semiconductor integrated circuit and IC card system having internal information protection

#26973
20080030986
2008-02-07

Lighting device and display apparatus

#26974
20080030969
2008-02-07

Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby

#26975
20080030960
2008-02-07

Method of forming anisotropic heat spreading apparatus for semiconductor devices

#26976
20080030959
2008-02-07

Heat dissipation device

#26977
20080030958
2008-02-07

Clip for heat dissipation device

#26978
20080030957
2008-02-07

HEATSINK METHOD AND APPARATUS

#26979
20080030956
2008-02-07

Phase-separated evaporator, blade-thru condenser and heat dissipation system thereof

#26980
20080030955
2008-02-07

Waterproof thermal management module and portable

#26981
20080030953
2008-02-07

Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled

#26982
20080030952
2008-02-07

Heat dissipating module and its fan and housing

#26983
20080030950
2008-02-07

Cooling function power adapter

#26984
20080030597
2008-02-07

Digital camera with multiple pipeline signal processors

#26985
20080030298
2008-02-07

Metal resistor and resistor material

#26986
20080030257
2008-02-07

Driver circuit for a semiconductor power switching element

#26987
20080030243
2008-02-07

Frequency generator apparatus and control circuit thereof

#26988
20080030200
2008-02-07

Image defect inspection apparatus

#26989
20080030130
2008-02-07

Hermetic encapsulation of organic, electro-optical elements

#26990
20080029913
2008-02-07

Multi-layer structures for parameter measurement

#26991
20080029910
2008-02-07

LAYOUT OF ARRAY OF ELECTRICAL INTERCONNECT TO INCREASE I/O DENSITY PACKAGING

#26992
20080029909
2008-02-07

Nanowire semiconductor device

#26993
20080029898
2008-02-07

VIA STACK STRUCTURES

#26994
20080029894
2008-02-07

Flip-chip package substrate and a method for fabricating the same

#26995
20080029893
2008-02-07

Power and Ground Ring Layout

#26996
20080029891
2008-02-07

Semiconductor device and method for fabricating the same

#26997
20080029883
2008-02-07

Diamond composite heat spreaders having low thermal mismatch stress and associated methods

#26998
20080029882
2008-02-07

Thermal Interconnect System and Method of Production Thereof

#26999
20080029881
2008-02-07

Circuit board with cooling function

#27000
20080029875
2008-02-07

Hermetically sealed semiconductor device module