Semiconductor device comprising an excess resin portion, manufacturing method thereof, and apparatus for manufacturing semiconductor device comprising a excess resin portion

CONDUCTIVE SHIELDING PATTERN AND SEMICONDUCTOR STRUCTURE WITH INDUCTOR DEVICE

Integrated circuit system with contact distribution film

Electrical through contact

ANTI-FUSE STRUCTURE OPTIONALLY INTEGRATED WITH GUARD RING STRUCTURE

E-Fuse and Method for Fabricating E-Fuses Integrating Polysilicon Resistor Masks

STRUCTURE AND METHOD FOR FORMING A DIELECTRIC CHAMBER AND ELECTRONIC DEVICE INCLUDING DIELECTRIC CHAMBER

Structure and method for making high density MOSFET circuits with different height contact lines

Method for forming a laminated structure having a wettability-variable layer

Transmission Circuit, Connecting Sheet, Probe Sheet, Probe Card, Semiconductor Inspection System and Method of Manufacturing Semiconductor Device

Test system incorporating a field effect transistor sensor

Through-hole vertical semiconductor devices or chips

Digital camera with integrated infrared (IR) response

Digital camera with integrated ultraviolet (UV) response

System and method for laser processing at non-constant velocities

Method for producing an integrated circuit including a fuse element, a fuse-memory element or a resistor element

Liquid cooled heat sink

Water-cooled heat sink and water-cooled system

HEAT SINKS FOR DISSIPATING A THERMAL LOAD

Thick film conductor case compositions for LTCC tape

Azeotrope spray cooling system

Heat Dissipating Device and Method of Fabricating the same

Method for assembling a vertical heat radiator

Chip with Power Supply Device

Reduction of cracking in low-k spin-on dielectric films

Multilayer substrate

Method of forming inductor in semiconductor device

Bit line barrier metal layer for semiconductor device and process for preparing the same

Interconnect structure and process of making the same

Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy via

Dual damascene interconnect structures having different materials for line and via conductors

Method of forming an electrically conductive line in an integrated circuit

Novel Metallization Scheme and Method of Manufacture Therefor

Solder Ball Pad Structure

Semiconductor structure with self-aligned device contacts

Method of forming an etch indicator layer for reducing etch non-uniformities

High thermal conductivity metal matrix composites

Method for Metallizing the Pre-Passivated Surface of a Semiconductor Material Obtained by Said Method

ULTRA LOW K (ULK) SiCOH FILM AND METHOD

Synergistically-modified surfaces and surface profiles for use with thermal interconnect and interface materials, methods of production and uses thereof

THERMAL SPREADER FOR ELECTRONIC COMPONENT

Administration of coumarin, butylated hydroxyanisole and ethoxyquine for the treatment of canities

COPPER ALLOY HAVING HIGH STRENGTH AND HIGH SOFTENING RESISTANCE

Semiconductor layer structure with superlattice

Microchannel cooler for high efficiency laser diode heat extraction

Antifuse circuit with well bias transistor

SRAM device and operating method

Thermal conducting medium protector

COMBINATION HEAT SINK

ELECTRONIC DEVICE HAVING HEAT SPREADER

Heatsink apparatus for applying a specified compressive force to an integrated circuit device

Water block heat-dissipating structure

Liquid cooling unit and heat receiver therefor

Liquid cooling unit and heat receiver therefor

Liquid cooling unit and heat exchanger therefor

Clip for heat dissipation device

Electronic apparatus

Electronic apparatus

Multi-layer flexible film package and liquid crystal display device including the same

Liquid Crystal Display Device

ANTENNA ARRANGEMENT

Dual inductor circuit for multi-band wireless communication device

Generating an integrated circuit identifier

Connecting structure used in a chip module

Interconnection substrate, semiconductor chip package including the same, and display system including the same

Molybdenum-based electrode with carbon nanotube growth

Semiconductor device having oxidized Ti- and N-containing layer, and manufacturing of the same

Solder bumps in flip-chip technologies

Contact structure having a compliant bump and a test pad

Power delivery using an integrated heat spreader

STRUCTURE COMBINING AN IC INTEGRATED SUBSTRATE AND A CARRIER, AND METHOD OF MANUFACTURING SUCH STRUCTURE

High-speed electrical interconnects and method of manufacturing

SEMICONDUCTOR DEVICE HAVING A SCRIBELINE STRUCTURE FAVORABLE FOR PREVENTING CHIPPING

HIGH PERFORMANCE INTEGRATED INDUCTOR

REPROGRAMMABLE ELECTRICAL FUSE

Fuse box of semiconductor device formed using conductive oxide layer and method for forming the same

Bottom source LDMOSFET structure and method

Semiconductor device and method for fabricating the same

Semiconductor device including a germanium silicide film on a selective epitaxial layer

Synchronous substrate injection clamp

Semiconductor Device and Method for Manufacturing the Same

Light emitting diode lighting module with improved heat dissipation structure

Method of Making White Light LEDs and Continuously Color Tunable LEDs

Test module for semiconductor device

Device applications for voltage switchable dielectric material having high aspect ratio particles

Scanning electron microscope and CD measurement calibration standard specimen

Heat sink for electronic device

Flexible printed wiring board

Heat exchanger

Heat exchanger

Liquid cooling unit and heat exchanger therefor

Heat dissipation device

Conductivity control of water content in solvent strip baths

Automatic trace shaping method

Analyte monitoring device and methods of use

Resin sealing type circuit device

Method for manufacturing fuse box having vertically formed protective film

Manufacturing method of semiconductor device

One Mask High Density Capacitor for Integrated Circuits

Method for attaching IC tag, article with IC tag attached, and IC tag

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same

Graded ARC for high NA and immersion lithography

Epoxy Resin Composition

Copper Alloy Via Bottom Liner

Process for producing metallized aluminum nitride substrate

Porous inorganic solids for use as low dielectric constant materials

Circuits for the control of output current in an electronic device for performing active biological operations

Dual port memory device with reduced coupling effect

Power amplifier

Heat sink for integrated circuit devices

Diamond composite heat spreader and associated methods

THERMAL TRANSPORT STRUCTURE

Configurable heat sink with matrix clipping system

Heat dissipation device

Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask

Method for Micropackaging of Leds and Micropackage

Hybrid bump capacitor

WIDEBAND HYPERFREQUENCY DETECTION DEVICE

Precision passive circuit structure

Interconnection architecture for semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing the same

Electrically inactive via for electromigration reliability improvement

Semiconductor device having copper metal line and method of forming the same

BLM structure for application to copper pad

SEMICONDUCTOR STRUCTURE HAVING EXTRA POWER/GROUND SOURCE CONNECTIONS AND LAYOUT METHOD THEREOF

Semiconductor device and manufacturing method thereof

Interconnect structure for semiconductor package

Front-rear contacts of electronics devices with induced defects to increase conductivity thereof

CIRCUIT HAVING A SCHOTTKY CONTACT COMPONENT

Integral topside vacuum package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Wiring structure of a semiconductor device, method of forming the wiring structure, non-volatile memory device including the wiring structure, and method of manufacturing the non-volatile memory device

LED packaging structure

Light emitting diode module for line light source

Fuse/anti-fuse structure and methods of making and programming same

Method of adding fabrication monitors to integrated circuit chips

On-the-fly laser beam path error correction for specimen target location processing

Thermal conduit

HEAT SINK

HEAT EXCHANGER WITH ANGLED SECONDARY FINS EXTENDING FROM PRIMARY FINS

Electronic component with heat transfer by boiling and condensation and method for producing same

CASE FOR A LIQUID SUBMERSION COOLED ELECTRONIC DEVICE

Heat dissipation device with heat pipes

HEAT SINK

Heat sink

Low cost high density rectifier matrix memory

IC socket

Method of producing group 3 nitride substrate wafers and group 3 nitride substrate wafers

Method of fabrication of interconnect structures

Semiconductor-on-insulator (SOI) structures including gradient nitrided buried oxide (BOX)

Silicon nitride/oxygen doped silicon carbide etch stop bi-layer for improved interconnect reliability

ELECTRICALLY PROGRAMMABLE PI-SHAPED FUSE STRUCTURES AND METHODS OF FABRICATION THEREOF

Metal line of semiconductor device and method of fabricating the same

Method to improve metal defects in semiconductor device fabrication

Method of fabricating semiconductor device

Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof

COMPONENT AND ASSOCIATED CONNECTION WIRE

Method of making a circuitized substrate

MINIATURE COMPOSITE ASSEMBLY THAT INCORPORATES MULTIPLE DEVICES THAT USE DIFFERENT WAVELENGTHS OF LIGHT AND METHOD FOR MAKING THE COMPOSITE ASSEMBLY

Semiconductor memory device and arrangement method thereof

Semiconductor memory device and arrangement method thereof

Low cost high density rectifier matrix memory

LED assembly and use thereof

Lamp for vehicle

Light emitting diode package

Semiconductor module and heat radiating plate

Heat dissipation module for electronic device

Heat radiation device for memory module

Method and apparatus for cooling a memory device

Cooling module retentioner

HEAT SINK FOR ELECTRONIC COMPONENT

Method Of Manufacturing A Hollow Circuit Substrate

Electrostatic discharge protective circuit and semiconductor integrated circuit using the same

Surface inspection method and surface inspection apparatus

Inkjet printhead integrated circuit with work transmitting structures

Waveguides in integrated circuits

Semiconductor device, related method, and printed circuit board

Power grid structure to optimize performance of a multiple core processor

Qualifying of a detector of noise peaks in the supply of an integrated circuit

Semiconductor device having a function of detection breakages on a periphery thereof

Dual display apparatus having buffer layer

Method for fabricating organic electro-luminescence display device

Aligned nanotube bearing composite material

Semiconductor device having groove-shaped via-hole

Semiconductor device

Method for manufacturing a semiconductor device

Semiconductor Device and Method of Fabricating the Same

Structure and method of chemically formed anchored metallic vias

Semiconductor device

One-time-programmable anti-fuse formed using damascene process

Metal Interconnection Structure of Semiconductor Device and Method for Manufacturing the Same

Semiconductor Device and Method for Manufacturing the Same

METAL INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE SAME

Reducing resistivity in interconnect structures by forming an inter-layer

Paper including semiconductor device and manufacturing method thereof

CURABLE PROTECTANT FOR ELECTRONIC ASSEMBLIES

Multilayer wiring substrate and manufacturing method thereof

Semiconductor component and method for producing the same

System for contacting electronic devices and production processes thereof

Carrier module and test tray for an upright-positionable packaged chip, and testing method

SEMICONDUCTOR-INTEGRATED ELECTRONIC DEVICE HAVING A PLURALITY OF LEADS

Method for reducing capacitance variation between capacitors

Vertical LC tank device

Image sensor package and method of fabricating the same

Silicon-on-insulator semiconductor device

Semiconductor device and method of manufacturing same

Semiconductor device using fuse/anti-fuse system

Bipolar high voltage/power semiconductor device having first and second insulated gated and method of operation

LED chip package structure and method for manufacturing the same

Method and apparatus for forming an integrated circuit electrode having a reduced contact area

Semiconductor substrate, substrate inspection method, semiconductor device manufacturing method, and inspection apparatus

Composite receiver assembly having a circuit board on which multiple receiver devices that operate on different sets of wavelengths are mounted

Laser beam processing machine

Heat dissipation apparatus

Thermally conductive cover directly attached to heat producing component

Composite heat-dissipating module

HEAT DISSIPATION APPARATUS

HEAT SINK

HEAT SINK FOR ELECTRONIC DEVICE

COPPER ALLOY AND METHOD OF PRODUCING THE SAME

Semiconductor device, method for manufacturing the same, and plating solution

Method for increasing a production rate of printed wiring boards

Method for increasing a production rate of printed wiring boards

Structure of holding mechanism with rotatable knob for radiator

Clip for heat sink

Method for Protecting an Electronic Chip

Wiring board with lead pins, and lead pin

Customizable backer for achieving consistent loading and engagement of array package connections

Guided pin and plunger

Via hole forming method

Method of manufacturing semiconductor device having improved RESURF Trench isolation and method of evaluating manufacturing method

Silicide-silicon oxide-semiconductor antifuse device and method of making

Silicon material having a mark on the surface thereof and the method of making the same

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

LED reflector molding process, construction, and loader thereof

Light emitting module and lighting device for vehicle

Semiconductor integrated circuit device

Antifuse circuit with well bias transistor

High power solid-state lamp

Electronic device with EMI screen and packing process thereof

Package board integrated with power supply

Motor control apparatus and method of assembling motor control apparatus

HEAT DISSIPATOR ASSEMBLY

Heat sink device for a heat generating element

HEAT DISSIPATION DEVICE

Camera module having an array lens

Thermal sensor having toggle control

Interconnect structure and method of fabrication of same

Method for bonding wafers to produce stacked integrated circuits

Integrated semiconductor chip with lateral thermal insulation

Semiconductor device and method of manufacturing same

Semiconductor device mounted with fuse memory

MOSFET fuse programmed by electromigration

Monolithic MEMS and integrated circuit device having a barrier and method of fabricating the same

Light Emitting Devices with Improved Light Extraction Efficiency

LED device with re-emitting semiconductor construction and converging optical element

PROCESS FOR MANUFACTURING AN INJECTION MOLDED PART WITH INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD

HEAT DISSIPATION MODULE

Vibration isolation system for synthetic jet devices

Photovoltaic apparatus

Method and apparatus for producing large, single-crystals of aluminum nitride

COMPUTER COOLING APPARATUS

Method for increasing a production rate of printed wiring boards

Flexible wiring sheet, display apparatus and manufacturing method thereof

Abrasive articles, CMP monitoring system and method

Method of Grinding Multilayer Body and Method of Manufacturing Solid State Image Pickup Device

Hinged leadframe assembly for an electrical connector

Hinged leadframe assembly for an electrical connector

Wiring structure in a semiconductor device, method of forming the wiring structure, semiconductor device including the wiring structure and method of manufacturing the semiconductor device

Connector with wipe

Method of manufacturing semiconductor device

Bonding pad structure and method for making the same

Laser isolation of metal over alumina underlayer and structures formed thereby

Method of manufacturing semiconductor device and semiconductor device

Method for fabricating semiconductor device

Magnetic vias for inductors and transformers in integrated circuits

Methods of fabricating passive element without planarizing

Methods of making semiconductor fuses

Thin film device

Solderable compact camera module and method of manufacture thereof

Semiconductor memory device in which data is stored in nonvolatile state, by using semiconductor elements of metal oxide semiconductor (MOS) structure

Integrated inductor

Method for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers

HEAT SINK BACK PLATE MODULE

Socket enabled cooling of in-substrate voltage regulator

DIRECT LIQUID JET IMPINGEMENT MODULE FOR HIGH HEAT FLUX ELECTRONICS PACKAGES

Flow solutions for microelectronic cooling

Capacitor array management

Method and protective circuit against overvoltage

Integrated multi-mixer circuit

Control of eddy currents in magnetic vias for inductors and transformers in integrated circuits

Slotted magnetic material for integrated circuit inductors

Temperature stabilized integrated circuits

Method, system, and apparatus for a secure bus on a printed circuit board

Semiconductor device comprising chip on chip structure

Method of manufacturing semiconductor device and semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME