Integrated circuit (IC) chip and method for fabricating the same

Shielded via

Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use

Semiconductor device having terminals

Rectangular semi-conducting support for microelectronics and method for making same

Alternative to desmear for build-up roughening and copper adhesion promotion

Silicon level solution for mitigation of substrate noise

Wafer with improved sawing loops

Semiconductor device comprising passive components

Semiconductor device

Semiconductor device and fabrication method therefor

Semiconductor device with capacitor and fuse, and method for manufacturing the same

Semiconductor electrostatic protection device

Insulated gate semiconductor device

Integrated filter having ground plane structure

Triggered silicon controlled rectifier for RF ESD protection

Process for structuring at least one year as well as electrical component with structures from the layer

Al-Ni-B alloy wiring material and element structure using the same

Semiconductor device including a circuit area and a monitor area having a plurality of monitor layers and method for manufacturing the same

Semiconductor device

Method For Detecting a Source of an Incoming Laser

Printed wiring board and method of manufacturing the same

HEAT DISSIPATION DEVICE

Heat Dissipating Module

Thermoelectric conversion device and manufacture method of the same

Film thickness predicting program, recording medium, film thickness predicting apparatus, and film thickness predicting method

Semiconductor apparatus comprising a semiconductor chip with a power supply circuit and a smoothing circuit disposed outside the semiconductor chip

Forming a copper diffusion barrier

Method of separating layers of material

Dual damascene interconnection with metal-insulator-metal capacitor and method of fabricating

Semiconductor device having a composite passivation layer and method of manufacturing the same

Determining geometrical configuration of interconnect structure

PROGRAMMABLE SEMICONDUCTOR DEVICE

Method of Producing an Element Comprising an Electrical Conductor Encircled By Magnetic Material

Exposure condition setting method, substrate processing device, and computer program

CIRCUIT SUBSTRATE WITH STRONG ADHESION

High resolution, full color, high brightness fully integrated light emitting devices and displays

Heat sink

Wiring board with built-in capacitor

System and apparatus for power distribution for a semiconductor device

Single loading mechanism to apply force to both cooling apparatus and integrated circuit package

Modular heat sink fin modules for CPU

Heat sink with thermoelectric module

Liquid-cooling heat dissipating device for dissipating heat by a casing

Method and apparatus for attaching a processor and corresponding heat sink to a circuit board

RF power transistor device with high performance shunt capacitor and method thereof

METHOD OF MAKING IMAGE CAPTURE UNIT

Digital cameras with direct luminance and chrominance detection

Integrated circuit assembly including RFID and components thereof

Radio frequency identification tag and commodity

Test structure for monitoring leakage currents in a metallization layer

Module composed of two light sources and generating tri-band white light with adjustable chromaticity diagram

Field emission device and method of making such

Semiconductor device having symbol pattern utilized as identification sign

Low dielectric constant integrated circuit insulators and methods

Semiconductor package including connector disposed in troughhole

Electrical connector with elongated ground contacts

Electronic structures utilizing etch resistant boron and phosphorus materials and methods to form same

Semiconductor device

Integrated low inductance interconnect for RF integrated circuits

Fuse with silicon nitride removed from fuse surface in cutting region

Methods of forming silicide regions and resulting MOS devices

Semiconductor device structures incorporating voids and methods of fabricating such structures

High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device structure for reducing mismatch effects

Structure and method for accurate deep trench resistance measurement

Structure and method for accurate deep trench resistance measurement

Semiconductor memory device and method of forming the same

Forward body bias-controlled semiconductor integrated circuit

Closed cell configuration to increase channel density for sub-micron planar semiconductor power device

LIGHT EMITTING DIODE MODULE

LED device having a top surface heat dissipator

Thick film conductor paste compositions for LTCC tape in microwave applications

Two-dimensional image detector, and radiographic apparatus using the two-dimensional image detector

Semiconductor device, manufacturing method and apparatus for the same

Buildup board, and electronic component and apparatus having the buildup board

Diamond Composite Heat Spreader

Thermosyphon for operation in multiple orientations relative to gravity

Heat pipe type heat dissipation device

Multi-fluid cooling system, cooled electronics module, and methods of fabrication thereof

Wafer bonding material with embedded conductive particles

HIGH TURBULENCE HEAT EXCHANGER

Method for making a plate type heat pipe

PRINTED CIRCUIT BOARDS AND THE LIKE WITH IMPROVED SIGNAL INTEGRITY FOR DIFFERENTIAL SIGNAL PAIRS

Method for implementing enhanced wiring capability for electronic laminate packages

Method for achieving very high bandwidth between the levels of a cache hierarchy in 3-dimensional structures, and a 3-dimensional structure resulting therefrom

HEAT CONDUCTIVE SILICONE GREASE COMPOSITION

ANISOTROPIC CONDUCTIVE CONNECTOR AND CIRCUIT-DEVICE ELECTRICAL INSPECTION DEVICE

Method for manufacturing a semiconductor device including a silicon film

Method for forming metal wiring of semiconductor device and a semiconductor device manufactured by the same

Semiconductor die with protective layer and related method of processing a semiconductor wafer

Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate

Metal resistor, resistor material and method

Method for manufacturing gallium nitride light emitting diode devices

Transfer molding apparatus and method for manufacturing semiconductor device

OVERLAY VERNIER KEY AND METHOD FOR FORMING CONTACT HOLES OF SEMICONDUCTOR DEVICE USING THE SAME

Layer system

Stacked semiconductor device

ELECTROLUMINESCENT LAMP HAVING A FLEXIBLE FOIL LIGHT ELEMENT

Electronic device for cooling interior of housing

Semiconductor device with capacitor element

X-shaped semiconductor capacitor structure

Method of manufacturing lenses, in particular for an integrated imager

Infrared detector

Radio frequency switching circuit, radio frequency switching device, and transmitter module device

Semiconductor device

METHOD AND STRUCTURE FOR FORMING SELF-PLANARIZING WIRING LAYERS IN MULTILEVEL ELECTRONIC DEVICES

Three Dimensional Six Surface Conformal Die Coating

Component with Encapsulation Suitable for Wlp and Production Method

Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme

Integrated heat sink

Multi-dimensional wafer-level integrated antenna sensor micro packaging

Chip system architecture for performance enhancement, power reduction and cost reduction

Contrast interposer stacking system and method

Interposer stacking system and method

Carrier structure stacking system and method

Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer

Semiconductor filter structure and method of manufacture

Filter having integrated floating capacitor and transient voltage suppression structure and method of manufacture

Fuse Structures and Methods of Forming the Same

Integrated circuit fuse structures including spatter shields within opening of an insulating layer and spaced apart from a sidewall of the opening

Thin film photodetector, method and system

Semiconductor device including groove pattern around effective chip and method for fabricating the same

METHOD FOR PROCESSING A SCRATCHED SURFACE, PARTICULARLY A GLASS PLATE OF A SEMICONDUCTOR WAFER

Reprogrammable fuse structure and method

Repair structure and active device array substrate

Apparatus for enhanced electrochemical deposition

MULTI-LAYER WIRING, METHOD OF MANUFACTURING THE SAME AND THIN FILM TRANSISTOR HAVING THE SAME

Combination heat-transfer plate member

Cooling apparatus and system thereof

Thermosiphon with thermoelectrically enhanced spreader plate

Selective Encapsulation of Electronic Components

Water block and method of manufacturing the same

Circuit carrier and manufacturing process thereof

Methods of forming solder connections and structure thereof

Method and equipment for wafer bonding

Integrated circuit device with electronically accessible device identifier

Electrical components including abrasive powder coatings for inhibiting tin whisker growth

Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same

Semiconductor integrated circuit device

Single-mask phase change memory element

Heat-dissipating module

Lighting assembly, heat sink and heat recovery system therefor

Cooling device for interface card

Thermally enhanced memory module

Thermal module with heat pipe

Cooling system for devices having power semiconductors and method for cooling the device

Heat sink

Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards

Encapsulated multi-phase electronics heat-sink

CONTACT LOAD PROFILE MODIFICATION FOR A COMPRESSION SOCKETED CPU

Driving circuit

Composite integrated semiconductor device

Print roll unit incorporating pinch rollers

Wireless IC tag and method for manufacturing same

Health data collecting system and semiconductor device

System on package of a mobile RFID interrogator

MULTI-MODE OPEN-LOOP TYPE CLOCK EXTRACTION APPARATUS

Signal distribution architecture and semiconductor device

Semiconductor integrated circuit device

Light emitting apparatus, display apparatus and method for controlling light emitting apparatus

Power system module and method of fabricating the same

Sensing mechanism for crystal orientation indication mark of semiconductor wafer

Driving circuit and liquid crystal display device including the same

Functional device

Power MOSFET contact metallization

Semiconductor device having no cracks in one or more layers underlying a metal line layer

Copper interconnects with improved electromigration lifetime

Integrated circuit having improved interconnect structure

Apparatus for an improved air gap interconnect structure

Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same

Semiconductor device having improved contacts

Enhanced mechanical strength via contacts

Integrated circuit interconnect

Semiconductor device, heat dissipating unit, and method for making a heat dissipating unit

Printed circuit board with coextensive electrical connectors and contact pad areas

PACKAGED INTEGRATED CIRCUIT DEVICE

Marker for alignment of non-transparent gate layer, method for manufacturing such a marker, and use of such a marker in a lithographic apparatus

ELECTRICALLY PROGRAMMABLE FUSE WITH ASYMMETRIC STRUCTURE

Methods of manufacturing metal-silicide features

Electrostatic discharge protection method and device for semiconductor device including an electrostatic discharge protection element providing a discharge path of a surge current

Electrostatic discharge protection device

Semiconductor power converter apparatus

Conductive hard mask to protect patterned features during trench etch

Scalable process and structure of JFET for small and decreasing line widths

Method for producing SiGebased zones with different contents in Ge on a same substrate by condensation of germanium

Dual-gate semiconductor devices with enhanced scalability

Standard cell for a CAD system

STRUCTURE OF STRAINED SILICON ON INSULATOR AND METHOD OF MANUFACTURING THE SAME

Semiconductor light emitting device including porous layer

Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management

Semiconductor Light Emitting Device

Light emitting device and LCD backlighting device

Flexible electronic device and production method of the same

ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY AND METHOD OF TESTING

Semiconductor device including fuses and method of cutting the fuses

SEMICONDUCTOR CIRCUIT ARRANGEMENT AND ASSOCIATED METHOD FOR TEMPERATURE DETECTION

Heating element for microfluidic and micromechanical applications

Domed heat exchanger (porcupine)

Domed heat exchanger (igloo)

Loop type heat dissipating apparatus with sprayer

Method, apparatus and system for carbon nanotube wick structures

Radiator with buckle

Heat dissipating device

Heat dissipating device

Heatsink device having fiber-like fins

HEAT DISSIPATION DEVICE

Heat dissipating device with adjusting member

Apparatus for integration of barrier layer and seed layer

Method of fabricating circuit board having different electrical connection structures

Manufacturing method of semiconductor device

MODIFIED VIA BOTTOM STRUCTURE FOR RELIABILITY ENHANCEMENT

Semiconductor device and method for fabricating the same

Method of forming line of semiconductor device

Methods of forming carbon nanotubes and methods of fabricating integrated circuitry

Method of manufacturing devices, positioning method, dicing method and dicing apparatus

Methods and apparatus for RF shielding in vertically-integrated semiconductor devices

Manufacturing method of a package substrate

Nanoscale wires and related devices

Tape With Built-In Ic Chip And Sheet With Built-In Ic Chip

CURABLE SILICONE GEL COMPOSITION FOR APPLICATION AND CURING IN LOCATIONS WHERE SOLDER FLUX EXISTS, AND METHOD OF IMPROVING FLUX RESISTANCE OF SILICONE GEL AND METHOD OF FORMING A FLUX-RESISTANT SILICONE GEL USING THE COMPOSITION

Resin-sealed mold and resin-sealed device

Semiconductor device having electrical fuses with less power consumption and interconnection arrangement

LED spotlight having a funnel-shaped lens

Wiring board and semiconductor apparatus

Heat dissipation device

Sleeve-tightening heat dissipating module

Electronic apparatus

Heat dissipating assembly of heat dissipating device

High capacitance density vertical natural capacitors

Solid-state image pick-up device and imaging system using the same

Noise-reducing transistor arrangement

GATE DRIVING DEVICE FOR DRIVING INSULATED GATE BIPOLAR TRANSISTOR AND METHOD OF DRIVING THE SAME

Lighting device and lighting method

METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS

Microelectronic element chips

Semiconductor device and semiconductor wafer and a method for manufacturing the same

Semiconductor device with a contact plug connected to multiple interconnects formed within

Structure of semiconductor substrate and molding method

Self-assembled mono-layer liner for cu/porous low-k interconnections

Interconnection structure design for low RC delay and leakage

Method and device for concentrating light in optoelectronic devices using resonant cavity modes

Methods for repairing circuit board having defective pre-soldering bump

Integrated circuit cooling device

Chip stack, method of fabrication thereof, and semiconductor package having the same

Method of making an electronic package

Semiconductor Device

Cover substrate attached to a rim substrate with electrically connected through hole

Matching circuits on optoelectronic devices

Microelectronic package having solder-filled through-vias

Heat sink dissipating device for electrical connector

DAMASCENE FILAMENT WIRE STRUCTURE

Semiconductor device incorporating a capacitor and method of fabricating the same

Semiconductor integrated circuit devices having high-Q wafer back-side capacitors

Semiconductor device and method for determining fuse state

Semiconductor device, method of cutting electrical fuse, and method of determining electrical fuse state

Resistance-change-type fuse circuit

Isolation structures for integrated circuits and modular methods of forming the same

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Semiconductor dual guardring arrangement

Semiconductor integrated circuit device

High-voltage lateral DMOS device

Semiconductor memory device having wiring with lead portions disposed with a pitch larger than pitch of parallel bit lines

Metal-insulator-metal capacitors

Thin film LED comprising a current-dispersing structure

Light-emitting diode array, light-emitting diode, and printer head

Package module of light emitting diode

LIGHT EMITTING DIODE

METHOD AND TEST STRUCTURE FOR ESTIMATING ELECTROMIGRATION EFFECTS CAUSED BY POROUS BARRIER MATERIALS

Method for targeting a source of an incoming laser

Flat transponder and method for the production thereof

Heat dissipating device

Heat Dissipator

HEAT SINK

Method of fabricating an electronic module having a side contact

Electronic Components

FULL REMOVAL OF DUAL DAMASCENE METAL LEVEL

Formation of oxidation-resistant seed layer for interconnect applications

Semiconductor device with interconnection structure for reducing stress migration

Method of forming a structure for reducing lateral fringe capacitance in semiconductor devices

Shapes-based migration of aluminum designs to copper damascene

Method and structure for reducing contact resistance between silicide contact and overlying metallization

Semiconductor device structures with backside contacts for improved heat dissipation and reduced parasitic resistance

Semiconductor device fabrication method

Molding apparatus for manufacturing semiconductor device

Camera device, method of manufacturing a camera device, wafer scale package

Non-cyanide gold electroplating for fine-line gold traces and gold pads

Method for fabricating a pressure sensor using SOI wafers

Pressure sensor having a chamber and a method for fabricating the same

Method of manufacturing an interconnection structure

Palladium-containing particles, method and apparatus of manufacturing palladium-containing devices made therefrom

Structures, systems and methods for joining articles and materials and uses therefor

Barrier films for plastic substrates fabricated by atomic layer deposition

Phosphor based illumination system having a long pass reflector and method of making same

Light emitting module and vehicle lamp

Package structure for light emitting diode and applications of the same

Apparatus and method for shielding of electromagnetic interference of a memory module

Surface mountable device