ClassID:

212006

H01L2924/0002 - page 93 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#27601
20070274050
2007-11-29

Composite anti-disturbed flow heat sink

#27602
20070274048
2007-11-29

Clip and heat dissipation assembly using the same

#27603
20070274044
2007-11-29

Cooling device for an electronic component, especially for a microprocessor

#27604
20070274040
2007-11-29

Electronic device and heat dissipation module thereof

#27605
20070274038
2007-11-29

HEAT DISSIPATING DEVICE

#27606
20070274037
2007-11-29

Cooling method and device for an electronic component

#27607
20070274027
2007-11-29

Housing for High Performance Components

#27608
20070273880
2007-11-29

Process monitoring system, process monitoring method, and method for manufacturing semiconductor device

#27609
20070273299
2007-11-29

AC light emitting diode and AC LED drive methods and apparatus

#27610
20070273054
2007-11-29

Method for manufacturing lenses, in particular for CMOS imager

#27611
20070273048
2007-11-29

Shapes-based migration of aluminum designs to copper damascene

#27612
20070273045
2007-11-29

Printed wiring board, method for forming the printed wiring board, and board interconnection structure

#27613
20070273044
2007-11-29

Adhesion enhancement for metal/dielectric interface

#27614
20070273042
2007-11-29

Copper-filled trench contact for transistor performance improvement

#27615
20070273030
2007-11-29

Semiconductor device having metal lines with slits

#27616
20070273028
2007-11-29

Semiconductor integrated circuit device comprising different level interconnection layers connected by conductor layers including conductor layer for redundancy

#27617
20070273027
2007-11-29

Method of forming dual damascene pattern

#27618
20070273026
2007-11-29

Semiconductor package substrate

#27619
20070273024
2007-11-29

Cooling System with a Bubble Pump

#27620
20070273012
2007-11-29

Semiconductor device

#27621
20070273004
2007-11-29

LIKE INTEGRATED CIRCUIT DEVICES WITH DIFFERENT DEPTH

#27622
20070273002
2007-11-29

Semiconductor Memory Devices Having Fuses and Methods of Fabricating the Same

#27623
20070272992
2007-11-29

Method for fabricating condenser microphone and condenser microphone

#27624
20070272983
2007-11-29

Active device array substrate

#27625
20070272980
2007-11-29

Semiconductor device with vertical current flow and low substrate resistance and manufacturing process thereof

#27626
20070272977
2007-11-29

Power semiconductor device

#27627
20070272955
2007-11-29

Reliable Contacts

#27628
20070272949
2007-11-29

Semiconductor integrated circuit apparatus with low wiring resistance

#27629
20070272939
2007-11-29

Tunnel vertical semiconductor devices or chips

#27630
20070272923
2007-11-29

Charge pump with reduced turn-off time and phase locked loop including the same

#27631
20070272759
2007-11-29

Limiter and semiconductor device using the same

#27632
20070272590
2007-11-29

Packaging structure

#27633
20070272438
2007-11-29

3D checkerboard perforation pattern for increased shielding effectiveness

#27634
20070272425
2007-11-29

Multidimensional Compliant Thermal Cap for an Electronic Device

#27635
20070272400
2007-11-29

Heatsink method and apparatus

#27636
20070272399
2007-11-29

Heat sink

#27637
20070272397
2007-11-29

Compact liquid cooling unit for high end servers

#27638
20070272396
2007-11-29

Heat Exchanger With Angled Fin

#27639
20070272395
2007-11-29

Heat dissipation device

#27640
20070272392
2007-11-29

Impingement cooled heat sink with low pressure drop

#27641
20070272391
2007-11-29

HEAT DISSIPATION DEVICE

#27642
20070272390
2007-11-29

Heat conduction device

#27643
20070271808
2007-11-29

Lewis acid organometallic desiccant

#27644
20070271787
2007-11-29

METHODS FOR MANUFACTURING HEAT SINK HAVING RELATIVELY HIGH ASPECTS RATIO THEREOF

#27645
20070271782
2007-11-29

Electrical Multilayer Component with Solder Contact

#27646
20070271473
2007-11-22

Method and system for a semiconductor device with multiple voltage sensors and power control of semiconductor device with multiple voltage sensors

#27647
20070271320
2007-11-22

Random pulse generation source, and semiconductor device, method and program for generating random number and/or probability using the source

#27648
20070270995
2007-11-22

RECESSING TRENCH TO TARGET DEPTH USING FEED FORWARD DATA

#27649
20070270555
2007-11-22

Silicone compositions crosslinkable into adhesive gels

#27650
20070270039
2007-11-22

Progressive Unplugging Multi-Cards Body

#27651
20070269994
2007-11-22

Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices

#27652
20070269989
2007-11-22

Inspection method of compound semiconductor substrate, compound semiconductor substrate, surface treatment method of compound semiconductor substrate, and method of producing compound semiconductor crystal

#27653
20070269967
2007-11-22

Manufacturing method of semiconductor device

#27654
20070269964
2007-11-22

Semiconductor-on-diamond devices and associated methods

#27655
20070269961
2007-11-22

SEMICONDUCTOR WAFER AND METHOD FOR MAKING THE SAME

#27656
20070269931
2007-11-22

WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME

#27657
20070269929
2007-11-22

Method of reducing stress on a semiconductor die with a distributed plating pattern

#27658
20070269909
2007-11-22

METHOD FOR PROCESSING AN INTEGRATED CIRCUIT

#27659
20070269907
2007-11-22

Conductor layout technique to reduce stress-induced void formations

#27660
20070269604
2007-11-22

Method for manufacturing smooth diamond heat sinks

#27661
20070269591
2007-11-22

Pad Metallisation Process

#27662
20070269586
2007-11-22

METHOD OF MAKING LIGHT EMITTING DEVICE WITH SILICON-CONTAINING COMPOSITION

#27663
20070268736
2007-11-22

On-chip heater and methods for fabrication thereof and use thereof

#27664
20070268703
2007-11-22

Heat dissipation component and diode lighting and/or signalling device equipped with a component of this type

#27665
20070268694
2007-11-22

Optical devices for controlled color mixing

#27666
20070268670
2007-11-22

Electronic device

#27667
20070268669
2007-11-22

Circuit board assembly for a liquid submersion cooled electronic device

#27668
20070268668
2007-11-22

Kind of superconductive heat cooler package of vacuum used in computer CPU (Central Processing Unit)

#27669
20070268653
2007-11-22

High yield, high density on-chip capacitor design

#27670
20070268637
2007-11-22

Active matrix device

#27671
20070268125
2007-11-22

Equalization in proximity communication

#27672
20070268105
2007-11-22

Electrical component having an inductor and a method of formation

#27673
20070268093
2007-11-22

Integrated circuit shield structure

#27674
20070267759
2007-11-22

Semiconductor device with a distributed plating pattern

#27675
20070267754
2007-11-22

Microfeature workpieces and methods for forming interconnects in microfeature workpieces

#27676
20070267753
2007-11-22

Method of forming substantially L-shaped silicide contact for a semiconductor device

#27677
20070267751
2007-11-22

Reliable via contact interconnect structure

#27678
20070267750
2007-11-22

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT LAYER MADE OF COPPER

#27679
20070267741
2007-11-22

Liquid submersion cooling system

#27680
20070267738
2007-11-22

Stack-type semiconductor device having cooling path on its bottom surface

#27681
20070267733
2007-11-22

Symmetrical MIMCAP capacitor design

#27682
20070267723
2007-11-22

Double-sided integrated circuit chips

#27683
20070267720
2007-11-22

Semiconductor device including capacitor connected between two conductive strip groups

#27684
20070267718
2007-11-22

Multilayer winding inductor

#27685
20070267698
2007-11-22

Dual wired integrated circuit chips

#27686
20070267673
2007-11-22

Adjustable on-chip sub-capacitor design

#27687
20070267664
2007-11-22

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#27688
20070267661
2007-11-22

Solid-state imaging apparatus

#27689
20070267659
2007-11-22

Chip-type electronic component including thin-film circuit elements

#27690
20070267651
2007-11-22

Semiconductor device having a fuse and method of forming thereof

#27691
20070267646
2007-11-22

Light Emitting Device Including a Photonic Crystal and a Luminescent Ceramic

#27692
20070267643
2007-11-22

Semiconductor light-emitting device and method for manufacturing the same

#27693
20070267182
2007-11-22

Orientation insensitive compact thermosiphon with a remote auxiliary condenser

#27694
20070267181
2007-11-22

Juxtaposing structure for heated ends of heat pipes

#27695
20070267173
2007-11-22

Radiator for heat sink device

#27696
20070267172
2007-11-22

HEAT DISSIPATION APPARATUS

#27697
20070266350
2007-11-15

Microwave circuit performance optimization by on-chip digital distribution of operating set-point

#27698
20070266166
2007-11-15

Aggregating network activity using software provenance data

#27699
20070266129
2007-11-15

Three-dimensional networking structure

#27700
20070265427
2007-11-15

Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator

#27701
20070264874
2007-11-15

Fuse structure of a semiconductor device and method of manufacturing the same

#27702
20070264826
2007-11-15

Methods of making self-aligned nano-structures

#27703
20070264824
2007-11-15

Methods to eliminate contact plug sidewall slit

#27704
20070264819
2007-11-15

Method of forming an electrical isolation associated with a wiring level on a semiconductor wafer

#27705
20070264817
2007-11-15

Via line barrier and etch stop structure

#27706
20070264813
2007-11-15

Process for producing a film carrier tape for mounting an electronic part

#27707
20070264798
2007-11-15

Methods for partially removing circuit patterns from a multi-project wafer

#27708
20070264783
2007-11-15

High performance stress-enhanced MOSFETS using Si:C and SiGe epitaxial source/drain and method of manufacture

#27709
20070264757
2007-11-15

Micro-package, multi-stack micro-package, and manufacturing method therefor

#27710
20070264750
2007-11-15

Method of manufacturing the substrate for packaging integrated circuits without multiple photolithography/etching steps

#27711
20070264564
2007-11-15

THIN FILM BATTERY ON AN INTEGRATED CIRCUIT OR CIRCUIT BOARD AND METHOD THEREOF

#27712
20070264519
2007-11-15

Copper-pillar plugs for semiconductor die

#27713
20070264493
2007-11-15

Surface modified corundum and resin composition

#27714
20070264160
2007-11-15

Microfluidic analytical apparatus

#27715
20070263472
2007-11-15

PROCESS ENVIRONMENT VARIATION EVALUATION

#27716
20070263428
2007-11-15

Semiconductor memory device having layout area reduced

#27717
20070263373
2007-11-15

Packaged electronic component for shielding electromagnetic interference

#27718
20070263363
2007-11-15

FIXING APPARATUS FOR HEAT SINK

#27719
20070263362
2007-11-15

Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe

#27720
20070263361
2007-11-15

Memory module assembly

#27721
20070263360
2007-11-15

Memory module assembly including a clip for mounting a heat sink thereon

#27722
20070263359
2007-11-15

Memory module assembly including a clamp for mounting heat sinks thereon

#27723
20070263358
2007-11-15

Heat dissipation device

#27724
20070263357
2007-11-15

Heat dissipation device

#27725
20070263356
2007-11-15

Method and apparatus for cooling electronics with a coolant at a subambient pressure

#27726
20070263355
2007-11-15

HEAT DISSIPATION SYSTEM

#27727
20070263354
2007-11-15

Systems for low cost coaxial liquid cooling

#27728
20070262929
2007-11-15

Organic light emitting display device and testing method thereof

#27729
20070262794
2007-11-15

On-die anti-resonance structure for integrated circuit

#27730
20070262793
2007-11-15

Circuit configurations having four terminal JFET devices

#27731
20070262475
2007-11-15

Polysilicon hard mask for enhanced alignment signal

#27732
20070262474
2007-11-15

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

#27733
20070262471
2007-11-15

Plated antenna for high frequency devices

#27734
20070262454
2007-11-15

Semiconductor device and wiring auxiliary pattern generating method

#27735
20070262453
2007-11-15

Semiconductor device including triple-stacked structures having the same structure

#27736
20070262450
2007-11-15

Electric fuses using CNTs (carbon nanotubes)

#27737
20070262438
2007-11-15

System and method of silicon switched power delivery using a package

#27738
20070262437
2007-11-15

Semiconductor device with temperature cycle life improved

#27739
20070262428
2007-11-15

Indented structure for encapsulated devices and method of manufacture

#27740
20070262424
2007-11-15

Devices and systems having at least one dam structure

#27741
20070262422
2007-11-15

Shielding device

#27742
20070262418
2007-11-15

Integrated passive devices

#27743
20070262417
2007-11-15

Semiconductor device capable of reducing interelectrode leak current and manufacturing method thereof

#27744
20070262415
2007-11-15

Recessed antifuse structures and methods of making the same

#27745
20070262414
2007-11-15

Semiconductor device with electric fuse having a flowing-out region

#27746
20070262413
2007-11-15

E-FUSE AND METHOD FOR FABRICATING E-FUSES INTEGRATING POLYSILICON RESISTOR MASKS

#27747
20070262402
2007-11-15

INTEGRATED INDUCTOR WITH HIGHER MOMENT MAGNETIC VIA

#27748
20070262386
2007-11-15

ESD protection element and ESD protection device for use in an electrical circuit

#27749
20070262370
2007-11-15

SEMICONDUCTOR DEVICE

#27750
20070262358
2007-11-15

Sensor having hydrophobic coated elements

#27751
20070262357
2007-11-15

Semiconductor device and method for cutting electric fuse

#27752
20070262351
2007-11-15

Rescue structure and method for laser welding

#27753
20070262334
2007-11-15

FULL COLOR LED DISPLAY

#27754
20070262331
2007-11-15

Semiconductor light emitting device with stress absorber, LED printhead, and image forming apparatus

#27755
20070262305
2007-11-15

INTEGRATED CIRCUIT PROTECTION FROM ESD DAMAGE DURING FABRICATION

#27756
20070262155
2007-11-15

Seamless secured digital card manufacturing methods with male guide and female switch

#27757
20070262069
2007-11-15

Heating Device for Electronic Components in Military Vehicles

#27758
20070261822
2007-11-15

Heat-dissipating device having air-guiding structure

#27759
20070261819
2007-11-15

HEAT DISSIPATING DEVICE

#27760
20070261778
2007-11-15

Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method

#27761
20070261635
2007-11-15

Spray coating apparatus and fixtures

#27762
20070261242
2007-11-15

METHOD FOR MANUFACTURING PHASE CHANGE TYPE HEAT SINK

#27763
20070261235
2007-11-15

Electronic device removal tool and carrier

#27764
20070259533
2007-11-08

Semiconductor device and method for fabricating the same

#27765
20070259523
2007-11-08

Method of fabricating high speed integrated circuits

#27766
20070259518
2007-11-08

Method and apparatus for diverting void diffusion in integrated circuit conductors

#27767
20070259516
2007-11-08

Multilayer interconnect structure containing air gaps and method for making

#27768
20070259508
2007-11-08

Method of fabricating microconnectors

#27769
20070259484
2007-11-08

Integrated circuit chip packaging assembly

#27770
20070259211
2007-11-08

Heat spread sheet with anisotropic thermal conductivity

#27771
20070259186
2007-11-08

High thermal conductive element, method for manufacturing same, and heat radiating system

#27772
20070259119
2007-11-08

Thermal conductive coating layer, composition thereof and method for producing the same

#27773
20070258683
2007-11-08

Optically-enabled integrated circuit package

#27774
20070258637
2007-11-08

Overlay mark arrangement for reducing overlay shift

#27775
20070258311
2007-11-08

MOS electric fuse, its programming method, and semiconductor device using the same

#27776
20070258229
2007-11-08

Method and apparatus for LED panel lamp systems

#27777
20070258218
2007-11-08

Heat dissipation device

#27778
20070258217
2007-11-08

Split core circuit module

#27779
20070258216
2007-11-08

Structures for holding cards incorporating electronic and/or micromachined components

#27780
20070258214
2007-11-08

Heat-Dissipating Device with Tapered Fins

#27781
20070258210
2007-11-08

Heat dissipation device having a fan holder for attachment of a fan

#27782
20070258208
2007-11-08

Computer cooling apparatus

#27783
20070258207
2007-11-08

Thermal module fastener for server blade

#27784
20070258194
2007-11-08

Motor controller

#27785
20070258176
2007-11-08

Shunt protection circuit and method therefor

#27786
20070257802
2007-11-08

Memory module and card with integrated RFID tag

#27787
20070257683
2007-11-08

Protection circuit for semiconductor device and semiconductor device including the same

#27788
20070257625
2007-11-08

Apparatus and Method of Power Control

#27789
20070257611
2007-11-08

DUAL-EMISSION ORGANIC ELECTROLUMINESCENT DEVICES

#27790
20070257388
2007-11-08

Aerosol method and apparatus, particulate products, and electronic devices made therefrom

#27791
20070257373
2007-11-08

Methods of forming blind wafer interconnects, and related structures and assemblies

#27792
20070257371
2007-11-08

Semiconductor device having a guard ring

#27793
20070257368
2007-11-08

Dielectric spacers for metal interconnects and method to form the same

#27794
20070257359
2007-11-08

Thermal Management Device For A Memory Module

#27795
20070257358
2007-11-08

Heat sink and method for fabricating the same

#27796
20070257357
2007-11-08

Forcing gas trapped between two components into cavities

#27797
20070257354
2007-11-08

Code installation decisions for improving aggregate functionality

#27798
20070257349
2007-11-08

Leaded Package Integrated Circuit Stacking

#27799
20070257342
2007-11-08

Method of manufacturing photo couplers

#27800
20070257341
2007-11-08

Structure of a lead-frame matrix of photoelectron devices

#27801
20070257339
2007-11-08

SHIELD STRUCTURES

#27802
20070257338
2007-11-08

Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same

#27803
20070257337
2007-11-08

Shield substrate, semiconductor package, and semiconductor device

#27804
20070257331
2007-11-08

Anti-fuse memory cell

#27805
20070257324
2007-11-08

Semiconductor devices having gate structures and contact pads that are lower than the gate structures

#27806
20070257323
2007-11-08

Stacked contact structure and method of fabricating the same

#27807
20070257292
2007-11-08

Wireless chip

#27808
20070257288
2007-11-08

ALIGNMENT MARK FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

#27809
20070257270
2007-11-08

LED PACKAGE WITH WEDGE-SHAPED OPTICAL ELEMENT

#27810
20070257267
2007-11-08

LED extractor composed of high index glass

#27811
20070257266
2007-11-08

LED package with converging optical element

#27812
20070257261
2007-11-08

METHOD FOR FORMING METAL WIRING, METHOD FOR MANUFACTURING ACTIVE MATRIX SUBSTRATE, DEVICE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPRATUS

#27813
20070257258
2007-11-08

Semiconductor evaluation device and evaluation method using the same

#27814
20070257184
2007-11-08

Large dynamic range cameras

#27815
20070256856
2007-11-08

Terminal portion of flexible print circuit board or flexible flat cable

#27816
20070256825
2007-11-08

Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect

#27817
20070256814
2007-11-08

Loop type micro heat transport device

#27818
20070256813
2007-11-08

Direction-adjustable diffusive device

#27819
20070256812
2007-11-08

Multidirectional heat dissipating structure

#27820
20070256722
2007-11-08

Integrated parallel Peltier/Seebeck element chip and production method therefor, connection method

#27821
20070256517
2007-11-08

Aerosol method and apparatus, particulate products, and electronic devices made therefrom

#27822
20070256285
2007-11-08

Fastener

#27823
20070254986
2007-11-01

Epoxy resin molding material for sealing and electronic component

#27824
20070254584
2007-11-01

HEAT-DISSIPATION STRUCTURE

#27825
20070254480
2007-11-01

Semiconductor device and method of manufacturing the same

#27826
20070254474
2007-11-01

Method for manufacturing a semiconductor device

#27827
20070254472
2007-11-01

Manufacturing method of semiconductor device and semiconductor storage device including fine contact holes

#27828
20070254471
2007-11-01

Semiconductor device and manufacturing method thereof

#27829
20070254470
2007-11-01

Method for fabricating a semiconductor device having a repair fuse

#27830
20070254467
2007-11-01

Method of arranging solder balls for ball grid array packages

#27831
20070254456
2007-11-01

Method for manufacturing a semiconductor device using a flexible substrate

#27832
20070254448
2007-11-01

Integrated circuit with inductor having horizontal magnetic flux lines

#27833
20070254385
2007-11-01

Method of manufacturing light-emitting diode module

#27834
20070254384
2007-11-01

Process monitoring apparatus and method for monitoring process

#27835
20070254137
2007-11-01

Thermally Conducting Multi-Layer Film

#27836
20070253813
2007-11-01

Fan of heat sink

#27837
20070253769
2007-11-01

FASTENING DEVICE FOR MOUNTING A THERMAL MODULE TO AN ELECTRONIC COMPONENT

#27838
20070253667
2007-11-01

Optoelectronic component with multi-part housing body

#27839
20070253235
2007-11-01

Low-voltage IC-circuit

#27840
20070253168
2007-11-01

Integrated heat sink and light pipe mounting assembly

#27841
20070253167
2007-11-01

Transparent substrate heat dissipater

#27842
20070253166
2007-11-01

Lamp base assembly with electronic ballast for energy-saving lamp

#27843
20070253164
2007-11-01

Power inverter

#27844
20070253161
2007-11-01

Fan of heat sink

#27845
20070253160
2007-11-01

Heat dissipation device

#27846
20070252286
2007-11-01

Mounting substrate

#27847
20070252282
2007-11-01

Air-gap insulated interconnections

#27848
20070252280
2007-11-01

Semiconductor device using metal nitride as insulating film

#27849
20070252277
2007-11-01

SEMICONDUCTOR DEVICES AND FABRICATION METHOD THEREOF

#27850
20070252274
2007-11-01

Method for forming C4 connections on integrated circuit chips and the resulting devices

#27851
20070252269
2007-11-01

Substrate structure for semiconductor package and package method thereof

#27852
20070252267
2007-11-01

Heat sink substrate and production method for the same

#27853
20070252250
2007-11-01

Apparatus and method for use in mounting electronic elements

#27854
20070252243
2007-11-01

Semiconductor device with Cu metal-base and manufacturing method thereof

#27855
20070252238
2007-11-01

Tungstein plug as fuse for IC device

#27856
20070252237
2007-11-01

Devices and methods for constructing electrically programmable integrated fuses for low power applications

#27857
20070252223
2007-11-01

Insulated gate devices and method of making same

#27858
20070252197
2007-11-01

Polysilicon control etch-back indicator

#27859
20070252184
2007-11-01

Imaging device and manufacturing method thereof

#27860
20070252177
2007-11-01

SILICON INTEGRATED CIRCUIT OPERATING AT MICROWAVE FREQUENCIES AND FABRICATION PROCESS

#27861
20070252143
2007-11-01

Semiconductor memory element and lifetime operation starting apparatus therefor

#27862
20070252136
2007-11-01

Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices

#27863
20070252131
2007-11-01

Method of interconnect formation using focused beams

#27864
20070252105
2007-11-01

Heat conductor

#27865
20070251860
2007-11-01

Electronic-component container and piezoelectric resonator device

#27866
20070251677
2007-11-01

HEAT DISSIPATION APPARATUS WITH GUILDING PLATES FOR GUIDING AIRFLOW FLOWING THROUGH A FIN ASSEMBLY

#27867
20070251676
2007-11-01

Heat dissipation apparatus

#27868
20070251675
2007-11-01

THERMAL MODULE

#27869
20070251674
2007-11-01

Capillary-assisted compact thermosiphon

#27870
20070251670
2007-11-01

Vapor chamber heat sink

#27871
20070251419
2007-11-01

Epoxy Resin Composition For Semiconductor Sealing Agents and Epoxy Resin Molding Material

#27872
20070251338
2007-11-01

Process condition measuring device with shielding

#27873
20070249920
2007-10-25

ANALYTE MONITORING DEVICE AND METHODS OF USE

#27874
20070249919
2007-10-25

Analyte monitoring device and methods of use

#27875
20070249209
2007-10-25

Circuit Arrangement for Coupling a Voltage Supply to a Semiconductor Component, Method for Producing the Circuit Arrangement, and Data Processing Device Comprising the Circuit Arrangement

#27876
20070249161
2007-10-25

Anisotropic conductive sheet and method of manufacturing the same

#27877
20070249157
2007-10-25

Semiconductor device and method for manufacturing same

#27878
20070249155
2007-10-25

Method to manufacture a coreless packaging substrate

#27879
20070249154
2007-10-25

Method to manufacture a coreless packaging substrate

#27880
20070249118
2007-10-25

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#27881
20070249113
2007-10-25

Stressor integration and method thereof

#27882
20070249091
2007-10-25

Micro device encapsulation

#27883
20070249073
2007-10-25

Method for determining the electrically active dopant density profile in ultra-shallow junction (USJ) structures

#27884
20070248898
2007-10-25

TARGETS FOR ALIGNMENT OF SEMICONDUCTOR MASKS

#27885
20070248829
2007-10-25

Aluminum-silicon carbide composite

#27886
20070248794
2007-10-25

Formation of high metallic content carbon nanotube structures

#27887
20070248786
2007-10-25

WAFER HAVING AN ASYMMETRIC EDGE PROFILE AND METHOD OF MAKING THE SAME

#27888
20070247930
2007-10-25

Dual chip package

#27889
20070247820
2007-10-25

MEMORY MODULE ASSEMBLY INCLUDING HEAT DISSIPATING MEMBERS

#27890
20070247819
2007-10-25

MEMORY MODULE ASSEMBLY INCLUDING HEAT DISSIPATING MEMBERS

#27891
20070247814
2007-10-25

Heat dissipation module

#27892
20070247810
2007-10-25

Dual impeller push-pull axial fan heat sink

#27893
20070247808
2007-10-25

Ceramic foam electronic component cooling

#27894
20070247784
2007-10-25

Low tunneling current MIM structure and method of manufacturing same

#27895
20070247273
2007-10-25

Electrically programmable π-shaped fuse structures and methods of fabrication thereof

#27896
20070247269
2007-10-25

Integrated high frequency BALUN and inductors

#27897
20070247213
2007-10-25

Apparatus and method for improving drive-strength and leakage of deep submicron MOS transistors

#27898
20070246844
2007-10-25

Multi-layer registration and dimensional test mark for scatterometrical measurement

#27899
20070246843
2007-10-25

Pattern registration mark designs for use in photolithography and methods of using the same

#27900
20070246836
2007-10-25

Electric terminal device and method of connecting the same