212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Composite anti-disturbed flow heat sink
#27602Clip and heat dissipation assembly using the same
#27603Cooling device for an electronic component, especially for a microprocessor
#27604Electronic device and heat dissipation module thereof
#27605HEAT DISSIPATING DEVICE
#27606Cooling method and device for an electronic component
#27607Housing for High Performance Components
#27608Process monitoring system, process monitoring method, and method for manufacturing semiconductor device
#27609AC light emitting diode and AC LED drive methods and apparatus
#27610Method for manufacturing lenses, in particular for CMOS imager
#27611Shapes-based migration of aluminum designs to copper damascene
#27612Printed wiring board, method for forming the printed wiring board, and board interconnection structure
#27613Adhesion enhancement for metal/dielectric interface
#27614Copper-filled trench contact for transistor performance improvement
#27615Semiconductor device having metal lines with slits
#27616Semiconductor integrated circuit device comprising different level interconnection layers connected by conductor layers including conductor layer for redundancy
#27617Method of forming dual damascene pattern
#27618Semiconductor package substrate
#27619Cooling System with a Bubble Pump
#27620Semiconductor device
#27621LIKE INTEGRATED CIRCUIT DEVICES WITH DIFFERENT DEPTH
#27622Semiconductor Memory Devices Having Fuses and Methods of Fabricating the Same
#27623Method for fabricating condenser microphone and condenser microphone
#27624Active device array substrate
#27625Semiconductor device with vertical current flow and low substrate resistance and manufacturing process thereof
#27626Power semiconductor device
#27627Reliable Contacts
#27628Semiconductor integrated circuit apparatus with low wiring resistance
#27629Tunnel vertical semiconductor devices or chips
#27630Charge pump with reduced turn-off time and phase locked loop including the same
#27631Limiter and semiconductor device using the same
#27632Packaging structure
#276333D checkerboard perforation pattern for increased shielding effectiveness
#27634Multidimensional Compliant Thermal Cap for an Electronic Device
#27635Heatsink method and apparatus
#27636Heat sink
#27637Compact liquid cooling unit for high end servers
#27638Heat Exchanger With Angled Fin
#27639Heat dissipation device
#27640Impingement cooled heat sink with low pressure drop
#27641HEAT DISSIPATION DEVICE
#27642Heat conduction device
#27643Lewis acid organometallic desiccant
#27644METHODS FOR MANUFACTURING HEAT SINK HAVING RELATIVELY HIGH ASPECTS RATIO THEREOF
#27645Electrical Multilayer Component with Solder Contact
#27646Method and system for a semiconductor device with multiple voltage sensors and power control of semiconductor device with multiple voltage sensors
#27647Random pulse generation source, and semiconductor device, method and program for generating random number and/or probability using the source
#27648RECESSING TRENCH TO TARGET DEPTH USING FEED FORWARD DATA
#27649Silicone compositions crosslinkable into adhesive gels
#27650Progressive Unplugging Multi-Cards Body
#27651Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices
#27652Inspection method of compound semiconductor substrate, compound semiconductor substrate, surface treatment method of compound semiconductor substrate, and method of producing compound semiconductor crystal
#27653Manufacturing method of semiconductor device
#27654Semiconductor-on-diamond devices and associated methods
#27655SEMICONDUCTOR WAFER AND METHOD FOR MAKING THE SAME
#27656WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME
#27657Method of reducing stress on a semiconductor die with a distributed plating pattern
#27658METHOD FOR PROCESSING AN INTEGRATED CIRCUIT
#27659Conductor layout technique to reduce stress-induced void formations
#27660Method for manufacturing smooth diamond heat sinks
#27661Pad Metallisation Process
#27662METHOD OF MAKING LIGHT EMITTING DEVICE WITH SILICON-CONTAINING COMPOSITION
#27663On-chip heater and methods for fabrication thereof and use thereof
#27664Heat dissipation component and diode lighting and/or signalling device equipped with a component of this type
#27665Optical devices for controlled color mixing
#27666Electronic device
#27667Circuit board assembly for a liquid submersion cooled electronic device
#27668Kind of superconductive heat cooler package of vacuum used in computer CPU (Central Processing Unit)
#27669High yield, high density on-chip capacitor design
#27670Active matrix device
#27671Equalization in proximity communication
#27672Electrical component having an inductor and a method of formation
#27673Integrated circuit shield structure
#27674Semiconductor device with a distributed plating pattern
#27675Microfeature workpieces and methods for forming interconnects in microfeature workpieces
#27676Method of forming substantially L-shaped silicide contact for a semiconductor device
#27677Reliable via contact interconnect structure
#27678SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT LAYER MADE OF COPPER
#27679Liquid submersion cooling system
#27680Stack-type semiconductor device having cooling path on its bottom surface
#27681Symmetrical MIMCAP capacitor design
#27682Double-sided integrated circuit chips
#27683Semiconductor device including capacitor connected between two conductive strip groups
#27684Multilayer winding inductor
#27685Dual wired integrated circuit chips
#27686Adjustable on-chip sub-capacitor design
#27687SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#27688Solid-state imaging apparatus
#27689Chip-type electronic component including thin-film circuit elements
#27690Semiconductor device having a fuse and method of forming thereof
#27691Light Emitting Device Including a Photonic Crystal and a Luminescent Ceramic
#27692Semiconductor light-emitting device and method for manufacturing the same
#27693Orientation insensitive compact thermosiphon with a remote auxiliary condenser
#27694Juxtaposing structure for heated ends of heat pipes
#27695Radiator for heat sink device
#27696HEAT DISSIPATION APPARATUS
#27697Microwave circuit performance optimization by on-chip digital distribution of operating set-point
#27698Aggregating network activity using software provenance data
#27699Three-dimensional networking structure
#27700Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator
#27701Fuse structure of a semiconductor device and method of manufacturing the same
#27702Methods of making self-aligned nano-structures
#27703Methods to eliminate contact plug sidewall slit
#27704Method of forming an electrical isolation associated with a wiring level on a semiconductor wafer
#27705Via line barrier and etch stop structure
#27706Process for producing a film carrier tape for mounting an electronic part
#27707Methods for partially removing circuit patterns from a multi-project wafer
#27708High performance stress-enhanced MOSFETS using Si:C and SiGe epitaxial source/drain and method of manufacture
#27709Micro-package, multi-stack micro-package, and manufacturing method therefor
#27710Method of manufacturing the substrate for packaging integrated circuits without multiple photolithography/etching steps
#27711THIN FILM BATTERY ON AN INTEGRATED CIRCUIT OR CIRCUIT BOARD AND METHOD THEREOF
#27712Copper-pillar plugs for semiconductor die
#27713Surface modified corundum and resin composition
#27714Microfluidic analytical apparatus
#27715PROCESS ENVIRONMENT VARIATION EVALUATION
#27716Semiconductor memory device having layout area reduced
#27717Packaged electronic component for shielding electromagnetic interference
#27718FIXING APPARATUS FOR HEAT SINK
#27719Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe
#27720Memory module assembly
#27721Memory module assembly including a clip for mounting a heat sink thereon
#27722Memory module assembly including a clamp for mounting heat sinks thereon
#27723Heat dissipation device
#27724Heat dissipation device
#27725Method and apparatus for cooling electronics with a coolant at a subambient pressure
#27726HEAT DISSIPATION SYSTEM
#27727Systems for low cost coaxial liquid cooling
#27728Organic light emitting display device and testing method thereof
#27729On-die anti-resonance structure for integrated circuit
#27730Circuit configurations having four terminal JFET devices
#27731Polysilicon hard mask for enhanced alignment signal
#27732SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#27733Plated antenna for high frequency devices
#27734Semiconductor device and wiring auxiliary pattern generating method
#27735Semiconductor device including triple-stacked structures having the same structure
#27736Electric fuses using CNTs (carbon nanotubes)
#27737System and method of silicon switched power delivery using a package
#27738Semiconductor device with temperature cycle life improved
#27739Indented structure for encapsulated devices and method of manufacture
#27740Devices and systems having at least one dam structure
#27741Shielding device
#27742Integrated passive devices
#27743Semiconductor device capable of reducing interelectrode leak current and manufacturing method thereof
#27744Recessed antifuse structures and methods of making the same
#27745Semiconductor device with electric fuse having a flowing-out region
#27746E-FUSE AND METHOD FOR FABRICATING E-FUSES INTEGRATING POLYSILICON RESISTOR MASKS
#27747INTEGRATED INDUCTOR WITH HIGHER MOMENT MAGNETIC VIA
#27748ESD protection element and ESD protection device for use in an electrical circuit
#27749SEMICONDUCTOR DEVICE
#27750Sensor having hydrophobic coated elements
#27751Semiconductor device and method for cutting electric fuse
#27752Rescue structure and method for laser welding
#27753FULL COLOR LED DISPLAY
#27754Semiconductor light emitting device with stress absorber, LED printhead, and image forming apparatus
#27755INTEGRATED CIRCUIT PROTECTION FROM ESD DAMAGE DURING FABRICATION
#27756Seamless secured digital card manufacturing methods with male guide and female switch
#27757Heating Device for Electronic Components in Military Vehicles
#27758Heat-dissipating device having air-guiding structure
#27759HEAT DISSIPATING DEVICE
#27760Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method
#27761Spray coating apparatus and fixtures
#27762METHOD FOR MANUFACTURING PHASE CHANGE TYPE HEAT SINK
#27763Electronic device removal tool and carrier
#27764Semiconductor device and method for fabricating the same
#27765Method of fabricating high speed integrated circuits
#27766Method and apparatus for diverting void diffusion in integrated circuit conductors
#27767Multilayer interconnect structure containing air gaps and method for making
#27768Method of fabricating microconnectors
#27769Integrated circuit chip packaging assembly
#27770Heat spread sheet with anisotropic thermal conductivity
#27771High thermal conductive element, method for manufacturing same, and heat radiating system
#27772Thermal conductive coating layer, composition thereof and method for producing the same
#27773Optically-enabled integrated circuit package
#27774Overlay mark arrangement for reducing overlay shift
#27775MOS electric fuse, its programming method, and semiconductor device using the same
#27776Method and apparatus for LED panel lamp systems
#27777Heat dissipation device
#27778Split core circuit module
#27779Structures for holding cards incorporating electronic and/or micromachined components
#27780Heat-Dissipating Device with Tapered Fins
#27781Heat dissipation device having a fan holder for attachment of a fan
#27782Computer cooling apparatus
#27783Thermal module fastener for server blade
#27784Motor controller
#27785Shunt protection circuit and method therefor
#27786Memory module and card with integrated RFID tag
#27787Protection circuit for semiconductor device and semiconductor device including the same
#27788Apparatus and Method of Power Control
#27789DUAL-EMISSION ORGANIC ELECTROLUMINESCENT DEVICES
#27790Aerosol method and apparatus, particulate products, and electronic devices made therefrom
#27791Methods of forming blind wafer interconnects, and related structures and assemblies
#27792Semiconductor device having a guard ring
#27793Dielectric spacers for metal interconnects and method to form the same
#27794Thermal Management Device For A Memory Module
#27795Heat sink and method for fabricating the same
#27796Forcing gas trapped between two components into cavities
#27797Code installation decisions for improving aggregate functionality
#27798Leaded Package Integrated Circuit Stacking
#27799Method of manufacturing photo couplers
#27800Structure of a lead-frame matrix of photoelectron devices
#27801SHIELD STRUCTURES
#27802Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same
#27803Shield substrate, semiconductor package, and semiconductor device
#27804Anti-fuse memory cell
#27805Semiconductor devices having gate structures and contact pads that are lower than the gate structures
#27806Stacked contact structure and method of fabricating the same
#27807Wireless chip
#27808ALIGNMENT MARK FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#27809LED PACKAGE WITH WEDGE-SHAPED OPTICAL ELEMENT
#27810LED extractor composed of high index glass
#27811LED package with converging optical element
#27812METHOD FOR FORMING METAL WIRING, METHOD FOR MANUFACTURING ACTIVE MATRIX SUBSTRATE, DEVICE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPRATUS
#27813Semiconductor evaluation device and evaluation method using the same
#27814Large dynamic range cameras
#27815Terminal portion of flexible print circuit board or flexible flat cable
#27816Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect
#27817Loop type micro heat transport device
#27818Direction-adjustable diffusive device
#27819Multidirectional heat dissipating structure
#27820Integrated parallel Peltier/Seebeck element chip and production method therefor, connection method
#27821Aerosol method and apparatus, particulate products, and electronic devices made therefrom
#27822Fastener
#27823Epoxy resin molding material for sealing and electronic component
#27824HEAT-DISSIPATION STRUCTURE
#27825Semiconductor device and method of manufacturing the same
#27826Method for manufacturing a semiconductor device
#27827Manufacturing method of semiconductor device and semiconductor storage device including fine contact holes
#27828Semiconductor device and manufacturing method thereof
#27829Method for fabricating a semiconductor device having a repair fuse
#27830Method of arranging solder balls for ball grid array packages
#27831Method for manufacturing a semiconductor device using a flexible substrate
#27832Integrated circuit with inductor having horizontal magnetic flux lines
#27833Method of manufacturing light-emitting diode module
#27834Process monitoring apparatus and method for monitoring process
#27835Thermally Conducting Multi-Layer Film
#27836Fan of heat sink
#27837FASTENING DEVICE FOR MOUNTING A THERMAL MODULE TO AN ELECTRONIC COMPONENT
#27838Optoelectronic component with multi-part housing body
#27839Low-voltage IC-circuit
#27840Integrated heat sink and light pipe mounting assembly
#27841Transparent substrate heat dissipater
#27842Lamp base assembly with electronic ballast for energy-saving lamp
#27843Power inverter
#27844Fan of heat sink
#27845Heat dissipation device
#27846Mounting substrate
#27847Air-gap insulated interconnections
#27848Semiconductor device using metal nitride as insulating film
#27849SEMICONDUCTOR DEVICES AND FABRICATION METHOD THEREOF
#27850Method for forming C4 connections on integrated circuit chips and the resulting devices
#27851Substrate structure for semiconductor package and package method thereof
#27852Heat sink substrate and production method for the same
#27853Apparatus and method for use in mounting electronic elements
#27854Semiconductor device with Cu metal-base and manufacturing method thereof
#27855Tungstein plug as fuse for IC device
#27856Devices and methods for constructing electrically programmable integrated fuses for low power applications
#27857Insulated gate devices and method of making same
#27858Polysilicon control etch-back indicator
#27859Imaging device and manufacturing method thereof
#27860SILICON INTEGRATED CIRCUIT OPERATING AT MICROWAVE FREQUENCIES AND FABRICATION PROCESS
#27861Semiconductor memory element and lifetime operation starting apparatus therefor
#27862Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
#27863Method of interconnect formation using focused beams
#27864Heat conductor
#27865Electronic-component container and piezoelectric resonator device
#27866HEAT DISSIPATION APPARATUS WITH GUILDING PLATES FOR GUIDING AIRFLOW FLOWING THROUGH A FIN ASSEMBLY
#27867Heat dissipation apparatus
#27868THERMAL MODULE
#27869Capillary-assisted compact thermosiphon
#27870Vapor chamber heat sink
#27871Epoxy Resin Composition For Semiconductor Sealing Agents and Epoxy Resin Molding Material
#27872Process condition measuring device with shielding
#27873ANALYTE MONITORING DEVICE AND METHODS OF USE
#27874Analyte monitoring device and methods of use
#27875Circuit Arrangement for Coupling a Voltage Supply to a Semiconductor Component, Method for Producing the Circuit Arrangement, and Data Processing Device Comprising the Circuit Arrangement
#27876Anisotropic conductive sheet and method of manufacturing the same
#27877Semiconductor device and method for manufacturing same
#27878Method to manufacture a coreless packaging substrate
#27879Method to manufacture a coreless packaging substrate
#27880SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#27881Stressor integration and method thereof
#27882Micro device encapsulation
#27883Method for determining the electrically active dopant density profile in ultra-shallow junction (USJ) structures
#27884TARGETS FOR ALIGNMENT OF SEMICONDUCTOR MASKS
#27885Aluminum-silicon carbide composite
#27886Formation of high metallic content carbon nanotube structures
#27887WAFER HAVING AN ASYMMETRIC EDGE PROFILE AND METHOD OF MAKING THE SAME
#27888Dual chip package
#27889MEMORY MODULE ASSEMBLY INCLUDING HEAT DISSIPATING MEMBERS
#27890MEMORY MODULE ASSEMBLY INCLUDING HEAT DISSIPATING MEMBERS
#27891Heat dissipation module
#27892Dual impeller push-pull axial fan heat sink
#27893Ceramic foam electronic component cooling
#27894Low tunneling current MIM structure and method of manufacturing same
#27895Electrically programmable π-shaped fuse structures and methods of fabrication thereof
#27896Integrated high frequency BALUN and inductors
#27897Apparatus and method for improving drive-strength and leakage of deep submicron MOS transistors
#27898Multi-layer registration and dimensional test mark for scatterometrical measurement
#27899Pattern registration mark designs for use in photolithography and methods of using the same
#27900Electric terminal device and method of connecting the same