Post passivation interconnection schemes on top of the IC chips

Electro-resistance element and electro-resistance memory using the same

Method for manufacturing a layer arrangement and layer arrangement

Long-lifetime interconnect structure and method for making

Semiconductor integrated circuit and method of designing semiconductor integrated circuit

HIGH FREQUENCY MODULE USING METAL-WALL AND METHOD OF MANUFACTURING THE SAME

Solder ball assembly for a semiconductor device and method of fabricating same

Semiconductor integrated circuit device and method for fabricating the same

Organic insulating film, manufacturing method thereof, semiconductor device using such organic insulating film and manufacturing method thereof

SEMICONDUCTOR DEVICE

Fuse corner pad for an integrated circuit

Semiconductor device with improved contact fuse

Power semiconductor device

Transistor process using a double-epitaxial layer for reduced capacitance

ELECTROSTATIC DISCHARGE PANEL PROTECTION STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING ADJACENT TWO INTERCONNECTION LINES HAVING DIFFERENT DISTANCES THEREBETWEEN

Semiconductor device formed on a SOI substrate

Low-temperature metal-induced crystallization of silicon-germanium films

Semiconductor device

Semiconductor device

Semiconductor device

Solution of power consumption reduction for inverter covered by metal case

Coreless package substrate with conductive structures

CHIP SEAT STRUCTUER FOR LIGHT-EMITTING CRYSTAL AND A PACKAGING STRUCTURE THEREOF

Composite semiconductor device, LED print head that employs the composite semiconductor device, and image forming apparatus that employs the LED print head

LED package

LIGHT SOURCE AND METHOD FOR PRODUCING A LIGHT SOURCE

Seat of heat dissipating device

Method for laser annealing to form an epitaxial growth layer

Stabilizer with cathodic protection

Through substrate, interposer and manufacturing method of through substrate

Heat release sheet and heat sink

Heat dispensing device with radially flowing coolant

Liquid-cooling device

Heat dispensing assembly

Low profile thermosiphon

High performance thermosiphon with internally enhanced condensation

Orientation insensitive thermosiphon with squirrel cage configuration

Orientation insensitive thermosiphon of v-configuration

Heat dissipating structure having different compactness

Heat sink

A METHOD AND SYSTEM FOR PLATED THRU HOLE PLACEMENT IN A SUBSTRATE

Method of manufacturing coreless substrate

Test circuit, semiconductor product wafer having the test circuit, and method of monitoring manufacturing process using the test circuit

Analyte monitoring device and methods of use

CARBON NANOTUBE COMPOSITE MATERIAL AND METHOD FOR MANUFACTURING THE SAME

Air duct which can be moved vertically and horizontally

Use of silicon block process step to camouflage a false transistor

Butted source contact and well strap

Prevention of plasma induced damage arising from etching of crack stop trenches in multi-layered low-k semiconductor devices

Process for Producing Ceramic Sheet, Ceramic Substrate Utilizing The Same and Use Thereof

Machinable Metallic Composites

Folding protective cover for heat-conductive medium

Programmable semiconductor device

Locking device for a heat sink

Low-profile thermosyphon-based cooling system for computers and other electronic devices

Heat dissipating module

Heat sink module for dissipating heat from a heat source on a motherboard

Electrical apparatus, cooling system therefor, and electric vehicle

System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry

Heat dissipation device

Cooling apparatus with electromagnetic interference shielding function

Drive circuit for piezoelectric pump and cooling system that uses this drive circuit

Electroluminescent display devices

Semiconductor integrated circuit

Semiconductor integrated circuit

Semiconductor device and method for testing semiconductor device

Multi-port memory device having serial input/output interface

Conductive structures including titanium-tungsten base layers

Metal / metal nitride barrier layer for semiconductor device applications

Method for forming dual damascenes with supercritical fluid treatments

CARRIER BOARD STRUCTURE WITH CHIP EMBEDDED THEREIN AND METHOD FOR FABRICATING THE SAME

Isolating electric paths in semiconductor device packages

Strip format of package board and array of the same

THREE-DIMENSIONAL CAPACITOR STRUCTURE

Seal-Ring Structure for System-Level ESD Protection

Transistor and method with dual layer passivation

Electrostatic discharge protection device and method of fabricating the same

Electrostatic discharge protector for an integrated circuit

Error detection and correction in semiconductor structures

Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration

Semiconductor storage device

Semiconductor device and its manufacturing method

LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices

Semiconductor integrated circuit device and manufacture thereof

Thermal interface materials

Thermally conductive composition and method for preparing the same

Wafer identification mark

Antenna containing substrate

Air-guiding structure for heat-dissipating fin

Liquid-Cooling Type Cooling Plate

Support structure for a planar cooling device

Capillary structure of heat pipe

Liquid cooling device

Heatsink and heatsink-positioning system

Post and tip design for a probe contact

Press-Type Fixing Assembly

Processing apparatus with memories coupled to respective processors

Thermal management system

System and process for producing nanowire composites and electronic substrates therefrom

Simplified pitch doubling process flow

METHOD OF ETCHING PASSIVATION LAYER

Simplified pitch doubling process flow

Method and apparatus for deploying a liquid metal thermal interface for chip cooling

Wafer bonding material with embedded rigid particles

Apparatuses and methods to enhance passivation and ILD reliability

Method and apparatus for automatically shaping traces on surface of substrate of semiconductor package by using computation

System and apparatus for using test structures inside of a chip during the fabrication of the chip

Manufacturing method of semiconductor device

Adaptive control method for rapid thermal processing of a substrate

Surface Treated Copper Foil, Flexible Copper-Clad Laminate Manufactured Using the Same, and Film Carrier Tape

DIFFUSION BARRIER WITH LOW DIELECTRIC CONSTANT AND SEMICONDUCTOR DEVICE CONTAINING SAME

Recyclable protective cover for a heat-conductive medium

Fan fastener for fastening a fan to a heat sink and method of using the same

Semiconductor light emitting device

Lighting device

Apparatus and method for limiting noise and smoke emissions due to failure of electronic devices or assemblies

Heat relief socket

Electrical connector assembly with heat sink

System and method for cooling a module

Heatsink module of heat-generating electronic elements on circuit board

Heat plate fixing structure

Thermal module

HEAT SINK AND METHOD FOR MANUFACTURING THE SAME

Electronics assembly having heat sink substrate disposed in cooling vessel

LEADLESS INTEGRATED CIRCUIT PROTECTION DEVICE

Semiconductor device and system

Floating gate structure with high electrostatic discharge performance

Liquid crystal display device, semiconductor device, and electronic appliance

Method for mounting protective covers over image capture devices and devices manufactured thereby

Inductor structure

Test structure and method for detecting charge effects during semiconductor processing using a delayed inversion point technique

SYSTEM AND APPARATUS FOR USING TEST STRUCTURES INSIDE OF A CHIP DURING THE FABRICATION OF THE CHIP

Mold apparatus and method

FILM TYPE PACKAGE AND DISPLAY APPARATUS HAVING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Method of forming an atomic layer thin film out of the liquid phase

Low leakage metal-containing cap process using oxidation

Space transformer having multi-layer pad structures

Housing for accommodating microwave devices having an insulating cup member

Method of making a substrate having thermally conductive structures and resulting devices

Flexible metal-oxide-metal capacitor design

Semiconductor device having fuse element and method of cutting fuse element

Production of an electrical component and component

Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Self-aligned body contact for a semiconductor-on-insulator trench device and method of fabricating same

Semiconductor integrated circuit having an oblique global signal wiring and semiconductor integrated circuit wiring method

Miniature MT optical assembly (MMTOA)

Lighting device having a lighting unit with an optical semiconductor bare chip mounted on printed wiring board

System for active array temperature sensing and cooling

Programmable via structure for three dimensional integration technology

Thick film conductor compositions and the use thereof in LTCC circuits and devices

Etching reagent, and method for manufacturing electronic device substrate and electronic device

Thermally conductive material

Electronic inlay module used for electronic cards and tags

Wiring conductor, method for fabricating same, terminal connecting assembly, and Pb-free solder alloy

Multichannel cooling system with magnetohydrodynamic pump

Heat conducting medium protection device

Military Electronic Apparatus

Air flow diversion device for dissipating heat from electronic components

Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers

Handle arrangement with integrated heat pipe

RADIATOR

Heat radiator having a thermo-electric cooler and multiple heat radiation modules and the method of the same

Heat radiator having a thermo-electric cooler

Event evaluation using extrinsic state information

Method, system, and article of manufacture for implementing metal-fill with power or ground connection

High frequency module

Multilayer interconnection substrate and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Methods and Apparatuses for Applying a Protective Material to an Interconnect Associated with a Component

Method and structure for eliminating aluminum terminal pad material in semiconductor devices

Filling narrow and high aspect ratio openings with electroless deposition

Lead cutter and method of fabricating semiconductor device

Damascene interconnection having porous low k layer with a hard mask reduced in thickness

Method for producing an electronic circuit

Method For Packaging Flash Memory Cards

Laterally grown nanotubes and method of formation

Classification apparatus for semiconductor substrate, classification method of semiconductor substrate, and manufacturing method of semiconductor device

Thermal transport structure and associated method

Multi-layered thermally conductive sheet

Change rate prediction method, storage medium, and substrate processing system

Semiconductor radiation source

Light-emitting diode light

Heat exchange enhancement

Heat exchange enhancement

Heat exchange enhancement

POWER SUPPLY STRUCTURE FOR HIGH POWER CIRCUIT PACKAGES

SEMICONDUCTOR PACKAGE

Heat sink and fan unit

Electronic control device

Heat sink fastening structure

Heat transfer control structures using thermal phonon spectral overlap

Semiconductor chip assembly with flexible metal cantilevers

Heatsink locking device

Cooling apparatus with surface enhancement boiling heat transfer

Fluid cooled electronic assembly

Multi-mode fluid cooling system and method

Assembly of heat-dissipating device and circuit board

Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components

INTEGRATED CIRCUIT COOLANT MICROCHANNEL WITH COMPLIANT COVER

Capacitor and electronic circuit

Capacitor structure and fabricating method thereof

Thin film device having thin film coil wound on magnetic film

Measuring a damaged structure formed on a wafer using optical metrology

Semiconductor device

Socket, a circuit component having the socket and an information processing system having the circuit component

Switchable on-die decoupling cell

Methods of bridging lateral nanowires and device using same

CIRCUIT SUBSTRATE

WIRING MATERIAL AND WIRING BOARD USING THE SAME

SEMICONDUCTOR DEVICE HAVING CAPACITOR FORMED IN MULTILAYER WIRING STRUCTURE

Formation of an integrated circuit structure with reduced dishing in metallization levels

Interconnect structure having a silicide/germanide cap layer

Reliable BEOL integration process with direct CMP of porous SiCOH dielectric

Semiconductor chip comprising a metal coating structure and associated production method

Light assembly

Semiconductor device and manufacturing method thereof

Gallium nitride substrate, and gallium-nitride-substrate testing and manufacturing methods

Interdigitated mesh to provide distributed, high quality factor capacitive coupling

Semiconductor integrated circuit with spiral inductors

Composite capacitor and method for forming the same

Electronic card with protection against aerial discharge

Semiconductor device

Semiconductor integrated circuit device

Semiconductor device having semiconductor layer on insulating structure and method of manufacturing the same

Laminated memory having autonomically and sequentially activating operation

Nonvolatile semiconductor storage device with floating gate electrode and control gate electrode

Semiconductor device using semiconductor nanowire and display apparatus and image pick-up apparatus using the same

Current-triggered low turn-on voltage SCR

LED array, LED head and image recording apparatus

Uniform emission LED package

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Fixing device

Heat sink

Integrated liquid to air conduction module

Method, apparatus and system for providing for optimized heat exchanger fin spacing

Electronic Apparatus Having a Heat-Radiating Unit for Radiating Heat of Heat-Generating Components

Plate-type heat transport device and electronic instrument

Evaporatively cooled thermosiphon

VLSI chip hot-spot minimization using nanotubes

Integrated fluid pump and radiator reservoir

Heat radiator

Heat dissipating structure

High power microjet cooler

Thermoelectric module

Multi-layer circuit assembly and process for preparing the same

Composition for Sealing Optical Semiconductor, Optical Semiconductor Sealing Material, and Method for Producing Composition for Sealing Optical Semiconductor

Semiconductor device and method of forming wires of semiconductor device

Method for manufacturing semiconductor device, method for forming alignment mark, and semiconductor device

Dummy vias for damascene process

Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof

Method for forming a 3D interconnect and resulting structures

Semiconductor device having fuse and capacitor at the same level and method of fabricating the same

Method for wafer level package of sensor chip

Methods of forming a diamond micro-channel structure and resulting devices

Plating film and forming method thereof

Thermally conductive sheet

Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same

Electronic component unit

Memory module assembly including a clamp for mounting heat sinks thereon

Back plate assembly for a board

Composite heatsink plate assembly

Method for Manufacturing a Heat Sink

Cooling assembly for an electrical appliance and method for liquid cooling

Transport system

Method of improving fuse state detection and yield in semiconductor applications

Light-emitting element including intermediate conductive layer having a hole-injection layer with an island-like structure

Device and method for achieving enhanced field emission utilizing nanostructures grown on a conductive substrate

Semiconductor wafer, semiconductor device, and method of manufacturing semiconductor device

Semiconductor device and a method of manufacturing the same and designing the same

Method of manufacturing wiring substrate, and liquid ejection head manufactured by same

Semiconductor device and method of manufacturing the same

Composite semiconductor device

Single or dual damascene structure reducing or eliminating the formation of micro-trenches arising from lithographic misalignment

Wiring material and a semiconductor device having a wiring using the material, and the manufacturing method thereof

Electric Device With Vertical Component

Contact piece member, contactor and contact method

Semiconductor integrated circuit device

Semiconductor device having multilayered interconnection structure formed by using Cu damascene method, and method of fabricating the same

Structure and method of forming electrodeposited contacts

Compact power semiconductor module having a connecting device

Stitched micro-via to enhance adhesion and mechanical strength

WIRING STRUCTURE, MULTILAYER WIRING BOARD, AND ELECTRONIC DEVICE

Electronic circuit device

Semiconductor wafer and method for making the same

Capacitor structure

Semiconductor device having a fuse element

eFuse and method of manufacturing eFuse

Electronic fuse elements with constricted neck regions that support reliable fuse blowing

Shielded through-via

Semiconductor device and a method of manufacturing the same

Driver circuit for switching device

Method for integrally forming an electrical fuse device and a MOS transistor

Semiconductor white light sources

Recessing trench to target depth using feed forward data

Structure for stopping mechanical cracks in a substrate wafer, use of the structure and a method for producing the structure

Composite Heat Sink With Metal Base And Graphite Fins

Liquid-cooling heat sink