212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
SEMICONDUCTOR PROCESSING SYSTEM WITH WIRELESS SENSOR NETWORK MONITORING SYSTEM INCORPORATED THEREWITH
#28202Level realignment following an epitaxy step
#28203Apparatus and method for preventing configurable system-on-a-chip integrated circuits from becoming I/O limited
#28204Fabrication method for semiconductor interconnections
#28205SEMICONDUCTOR WAFER THINNING
#28206Power electronics equipments
#28207Method for fabricating a metal protection layer on electrically connecting pad of circuit board
#28208Method for wafer-level package
#28209Whiskerless plated structure and plating method
#28210Anodized metal substrate module
#28211Bendable solid state planar light source structure
#28212Electrical transition for an RF component
#28213HEAT DISSIPATION DEVICE
#28214Heat sink having protective device for thermal interface material spread thereon
#28215Memory Module Including a Cooling Element, Method for Producing the Memory Module Including a Cooling Element, and Data Processing Device Comprising a Memory Module Including a Cooling Element
#28216CLIP ASSEMBLY FOR ATTACHING A HEAT SINK TO AN ELECTRONIC DEVICE
#28217Locking device for heat sink
#28218Electronic device
#28219Heat dissipation device
#28220Vapor chamber for dissipation heat generated by electronic component
#28221Heat dissipation device
#28222Integrated liquid cooled heatsink system
#28223Heat dissipation structure for processors
#28224Heat sink for a portable computer
#28225POWER SUPPLY COOLING
#28226INTEGRATED CIRCUIT COOLANT MICROCHANNEL ASSEMBLY WITH TARGETED CHANNEL CONFIGURATION
#28227Capacitor
#28228Input protection circuit
#28229Semiconductor device
#28230Inductor and method of forming the same
#28231Metal-insulator-metal transformer and method for manufacturing the same
#28232Semiconductor device
#28233Semiconductor integrated circuit and system guaranteeing proper operation under low-temperature condition
#28234Fiducial scheme adapted for stacked integrated circuits
#28235Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices
#28236Methods and structures for facilitating proximity communication
#28237Enhancing metal/low-K interconnect reliability using a protection layer
#28238Formation of oxidation-resistant seed layer for interconnect applications
#28239INTEGRATED CIRCUIT HAVING A MULTILAYER CAPACITANCE ARRANGEMENT
#28240Method for fabricating a capacitor structure
#28241Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device
#28242FIN STRUCTURE FOR A HEAT SINK
#28243Separable network interconnect systems and assemblies
#28244METHOD FOR FORMING A MEMORY DEVICE AND MEMORY DEVICE
#28245Solid-state imaging device and method of manufacturing solid-state imaging device
#28246Semiconductor device including a metal layer having a first pattern and a second pattern which together form a web structure, thereby providing improved electrostatic discharge protection
#28247Fringe capacitor using bootstrapped non-metal layer
#28248Three-dimensional integrated device
#28249Collimated LED array with reflector
#28250LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF
#28251Layout and process to contact sub-lithographic structures
#28252Wavelength tunable light emitting device by applying pressure
#28253Methods and systems for thermal-based laser processing a multi-material device
#28254Photo-electric conversion apparatus with alternating photoelectric conversion elements
#28255Active liquid metal thermal spreader
#28256Heat Sink Material, Manufacturing Method For The Same, And Semiconductor Laser Device
#28257Mesh-type heat dissipating structure
#28258HEAT SINK
#28259Fluid cooling system
#28260Coated heat sink
#28261HEAT DISSIPATION DEVICE
#28262Liquid-cooled heat dissipater
#28263Heat-dissipating structure
#28264Heat dissipating device
#28265Heat dissipation device
#28266Heat sink with combined fins
#28267Heat dissipation device having a bracket
#28268Heat dissipating device
#28269Methods and systems for determining trapped charge density in films
#28270Analyte monitoring device and methods of use
#28271Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
#28272Light-emitting diode assembly housing comprising poly(cyclohexanedimethanol terephthalate) compositions
#28273Thin multichip flex-module
#28274Thin multichip flex-module
#28275Retaining device for heat sink
#28276Non-leaded integrated circuit package system with multiple ground sites
#28277Guard ring for improved matching
#28278Interconnect structure with a barrier-redundancy feature
#28279Method, system, and apparatus for gravity assisted chip attachment
#28280MIM capacitor structure and fabricating method thereof
#28281Method and process of manufacturing robust high temperature solder joints
#28282Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
#28283Method and system for enhanced lithographic alignment
#28284Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part
#28285Integrated semiconductor memory
#28286Heat radiating apparatus and optical projection device having the same
#28287Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
#28288Interposable heat sink for adjacent memory modules
#28289Fixing means for heat dissipater
#28290Combined board level shielding and thermal management
#28291Electronic device
#28292Heat dissipating device for computer add-on cards
#28293Gimballed attachment for multiple heat exchangers
#28294Thin multichip flex-module
#28295Electronic fuse with conformal fuse element formed over a freestanding dielectric spacer
#28296Method and apparatus for dissipating heat from an integrated circuit
#28297Dual Screen Organic Electroluminescent Display
#28298Substrate processing and alignment
#28299METHOD FOR EDGE SEALING BARRIER FILMS
#28300Carbon nanotube-modified low-K materials
#28301Dummy-fill-structure placement for improved device feature location and access for integrated circuit failure analysis
#28302Method of forming a bump and a connector structure having the bump
#28303Memory device and an array of conductive lines and methods of making the same
#28304ELECTROLESS COBALT-CONTAINING LINER FOR MIDDLE-OF-THE-LINE (MOL) APPLICATIONS
#28305Power semiconductor module and method for cooling a power semiconductor module
#28306Semiconductor device fabricated using a carbon-containing film as a contact etch stop layer
#28307Capacitor structure
#28308Anti-fuse and programming method of the same
#28309Semiconductor device and a method of increasing a resistance value of an electric fuse
#28310Electrically programmable fuse structures with narrowed width regions configured to enhance current crowding and methods of fabrication thereof
#28311Electrically programmable π-shaped fuse structures and methods of fabrication thereof
#28312Electrically programmable fuse structures with terminal portions residing at different heights, and methods of fabrication thereof
#28313Semiconductor device including a capacitor structure and method of fabricating the same
#28314Semiconductor device and method of manufacturing the same
#28315Method and structure for improved alignment in MRAM integration
#28316Dynamic array architecture
#28317Plasma display apparatus
#28318Devices without current crowding effect at the finger's ends
#28319MOSFET having SOI and method
#28320Power semiconductor device with a plurality of gate electrodes
#28321Periphery design for charge balance power devices
#28322Shared contact structures for integrated circuits
#28323Hybrid semiconductor device
#28324Semiconductor Device For Emitting Light
#28325Control circuit for semiconductor device having overheating protection function
#28326SEMICONDUCTOR DEVICE HAVING PAD STRUCTURE CAPABLE OF REDUCING FAILURES IN MOUNTING PROCESS
#28327WATER-COOLING HEAT DISSIPATION DEVICE AND WATER BLOCK FOR THE SAME
#28328Heat exchanger easy mount system
#28329Method and apparatus for cooling semiconductor chips
#28330Microcomputer
#28331Analyte monitoring device and methods of use
#28332MEMS based multiband receiver architecture
#28333WIRELESS COMMUNICATION BETWEEN CONTROL DEVICES AND CONTROLLED DEVICES WITHIN A COMMON BOARD AND RF HIGH SIDE COUPLER WITH PLANE POLARIZED ANTENNA
#28334Super-thin OLED and method for manufacturing the same
#28335Method of forming contacts for a memory device
#28336Apparatus and methods for selective removal of material from wafer alignment marks
#28337Semiconductor device, semiconductor wafer, and methods of producing same device and wafer
#28338Wiring paterns formed by selective metal plating
#28339Semiconductor device with capacitor and fuse and its manufacture method
#28340Method for manufacturing a semiconductor device
#28341Semiconductor encapsulating epoxy resin composition and semiconductor device
#28342Light source module and lighting device for a vehicle
#28343Electronic device having a groove partitioning functional and mounting parts from each other
#28344Voltage regulator with welded lead frame connectors and method of making
#28345System for cooling electronic components
#28346Structure of heat-dispersing protective shell for memory
#28347Memory module assembly including a clip for mounting a heat sink thereon
#28348Arrangement for cooling SMD power components on a printed circuit board
#28349Optical targets
#28350Shielded contactless electronic document
#28351Methods and apparatus for determining the thickness of a conductive layer on a substrate
#28352Getter device
#28353Method of optimizing drive frequency for piezo fan device
#28354Encapsulation of Semiconductor Components
#28355Chip package and method for fabricating the same
#28356Low-k dielectric layer, semiconductor device, and method for fabricating the same
#28357DEVICE HAVING A REDUNDANT STRUCTURE
#28358Carbon and nitrogen based cap materials for metal hard mask scheme
#28359Package and package assembly of power device
#28360Methods and apparatus for thermal isolation in vertically-integrated semiconductor devices
#28361Power semiconductor module having a thermally conductive base plate on which at least four substrates are arranged in at least one single row
#28362Lead(Pb)-free electronic component attachment
#28363Programmable anti-fuse structures, methods for fabricating programmable anti-fuse structures, and methods of programming anti-fuse structures
#28364Semiconductor device comprising insulating film
#28365Structure and method for metal integration
#28366Method for attaching a flexible structure to a device and a device having a flexible structure
#28367Semiconductor device and process for producing the same
#28368Semiconductor component arrangement having a power transistor and a temperature measuring arrangement
#28369Semiconductor device and method of manufacturing the same
#28370Semiconductor device
#28371Insulating gate AlGaN/GaN HEMTs
#28372Side structure of a bare LED and backlight module thereof
#28373Semiconductor light-emitting device
#28374Flexible processing method for metal-insulator-metal capacitor formation
#28375Heat sink with a centrifugal fan having vertically layered fins
#28376Method and apparatus for dissipating heat
#28377Aerosol method and apparatus, particulate products, and electronic devices made therefrom
#28378Cooling device for electronic instrument and electronic instrument
#28379Thermoelectric cooling apparatus
#28380Double-effect thermoelectric cooling apparatus
#28381Intralevel decoupling capacitor, method of manufacture and testing circuit of the same
#28382Stress analysis method, wiring structure design method, program, and semiconductor device production method
#28383Analyte monitoring device and methods of use
#28384Analyte monitoring device and methods of use
#28385Analyte Monitoring Device and Methods of Use
#28386Method of manufacturing solid-state imaging device and solid-state imaging device
#28387High performance system-on-chip inductor using post passivation process
#28388High performance system-on-chip inductor using post passivation process
#28389Deposition pattern for eliminating backside metal peeling during die separation in semiconductor device fabrication
#28390Chip ID applying method suitable for use in semiconductor integrated circuit
#28391Silicon condenser microphone and manufacturing method
#28392Wafer level package for very small footprint and low profile white LED devices
#28393Array of self supporting thermally conductive insulator parts having a perforated outline surrounding each part to facilitate separation and a method of packaging
#28394Camera unit incorporating a lidded printhead unit
#28395Camera incorporating a releasable print roll unit
#28396Silicon condenser microphone and manufacturing method
#28397Interposable heat sink for adjacent memory modules
#28398System for cooling a heat-generating electronic device with increased air flow
#28399Liquid cooling loops for server applications
#28400Chip Heat Dissipation System and Structure of Heat Exchange Device and Manufacturing Method Thereof
#28401Apparatus, system, and method for efficient heat dissipation
#28402Liquid cooling loops for server applications
#28403Adhesion Material Structure and Process Method Thereof
#28404Hybrid circuit with an integral antenna
#28405NANOFABRICATION
#28406Circuit lid with a thermocouple
#28407Method and apparatus for using flex circuit technology to create an electrode
#28408Circuit board apparatus, circuit component reinforcing method and electronic device
#28409Wiring board with connection electrode formed in opening and semiconductor device using the same
#28410Interconnect structure to reduce stress induced voiding effect
#28411Semiconductor device and pattern generating method
#28412Dual damascene process without an etch stop layer
#28413Semiconductor device, electronic device and fabrication method of the same
#28414Redistribution connecting structure of solder balls
#28415Semiconductor device and method of manufacturing the same
#28416Semiconductor device having reinforced low-k insulating film and its manufacture method
#28417Cooling micro-channels
#28418FLEXIBLE SUBSTRATE
#28419Multilayer wiring substrate and method of connecting the same
#28420Variable-tooth gear with sliding-sheet deforming teeth
#28421Semiconductor device fabricated by selective epitaxial growth method
#28422Component arrangement and method for determining the temperature in a semiconductor component
#28423Substrate unit, cooling device, and electronic device
#28424Capacitor having high electrostatic capacity, integrated circuit device including the capacitor and method of fabricating the same
#28425Electrical connection for optoelectronic devices
#28426LED LIGHT CONFINEMENT ELEMENT
#28427Silicon carbide dimpled substrate
#28428Methods of making semiconductor-based electronic devices on a wire and articles that can be made thereby
#28429Laser-based method and system for removing one or more target link structures
#28430Stack structure of semiconductor packages and manufacturing method thereof
#28431Process of making a lightweight thermal heat transfer apparatus
#28432Chip Heat Dissipation System and Manufacturing Method and Structure of Heat Dissipation Device Thereof
#28433Surface Coating Film Structure on Heat Dissipation Metal and Manufacturing Method Thereof
#28434Heat Sink Fin Structure and Manufacturing Method Thereof
#28435Semiconductor integrated circuit and method of designing layout of the same
#28436Configurable voltage regulator
#28437Grain growth promotion layer for semiconductor interconnect structures
#28438Method of fabricating semiconductor device including planarizing conductive layer using parameters of pattern density and depth of trenches
#28439Method for packaging organic light emitting display with frit seal and reinforcing structure
#28440Prediction of ESL/ILD remaining thickness
#28441THREE DIMENSIONAL MULTILAYER BARRIER AND METHOD OF MAKING
#28442Materials containing voids with void size controlled on the nanometer scale
#28443Heat dissipating module
#28444Semiconductor integrated circuit device
#28445Point light source, light-emitting module and display device having the same
#28446Punch type substrate strip
#28447Heat sink fastener
#28448Heat sink fastener
#28449HEAT DISSIPATION APPARATUS
#28450Multi-chip package
#28451Memory module assembly including a clip for mounting a heat sink thereon
#28452Printed circuit board
#28453Image processing alignment method and method of manufacturing semiconductor device
#28454Semiconductor integrated circuit device
#28455Light-Emitting Device
#28456Centrifugal fan
#28457Nanowire array and nanowire solar cells and methods for forming the same
#28458Overlay measurement mark and pattern formation method for the same
#28459Methods of redistributing bondpad locations on an integrated circuit
#28460BEOL compatible FET structure
#28461Protecting apparatus of chip
#28462Multisurfaced microdevice system array and a method of producing the array
#28463Substrate for semiconductor device and semiconductor device
#28464Device and method for joining substrates
#28465Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods
#28466Resin layer formation method and semiconductor device fabrication method
#28467Semiconductor device with crack prevention ring
#28468Semiconductor device and method for manufacturing same
#28469Method and apparatus for indicating directionality in integrated circuit manufacturing
#28470Topside thermal management of semiconductor devices using boron phosphide contacting a gate terminal
#28471Memory integrated circuit device providing improved operation speed at lower temperature
#28472Method for fabricating an ESD protection apparatus for discharging electric charge in a depth direction
#28473Thin-film device
#28474Optoelectric composite substrate and electronic apparatus
#28475Light active sheet material
#28476Using unstable nitrides to form semiconductor structures
#28477Method of making segmented contacts for radiation detectors using direct photolithography
#28478Method to reduce module inductance
#28479Heat dissipating device
#28480Automated Venting and Refilling of Multiple Liquid Cooling Systems
#28481Composite heat-dissipating module
#28482Heat sinks and method of formation
#28483Laminate Type Thin-Film Solar Cell And Method For Manufacturing The Same
#28484Two-phase liquid cooling system with active venting
#28485Method of fabricating heat dissipating apparatus
#28486Method and apparatus for repairing shape, and method for manufacturing semiconductor device using those
#28487Thermal management using an on-die thermal sensor
#28488Analyte Monitoring Device and Methods of Use
#28489Modifier for resin and resin composition using the same and formed article
#28490UV blocking and crack protecting passivation layer fabricating method
#28491Methods of forming metal-containing films over surfaces of semiconductor substrates
#28492Method for fabricating a metal-insulator-metal capacitor
#28493Method for forming low dielectric constant fluorine-doped layers
#28494Integrated parallel plate capacitors
#28495Method for the production of a plurality of optoelectronic semiconductor chips and optoelectronic semiconductor chip
#28496Semiconductor fuses and methods for fabricating and programming the same
#28497Method for fabricating semiconductor devices
#28498Overlay alignment mark and alignment method for the fabrication of trench-capacitor dram devices
#28499Dual-damascene process to fabricate thick wire structure
#28500Method of making electrically programmable fuse for silicon-on-insulator (SOI) technology