Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package

Low resistance and inductance backside through vias and methods of fabricating same

Cooling facility and method for integrated circuit

Method to align mask patterns

Material for forming exposure light-blocking film, multilayer interconnection structure and manufacturing method thereof, and semiconductor device

Production of elemental films using a boron-containing reducing agent

Semiconductor integrated circuit with photo-detecting elements for reverse-engineering protection

ELECTRICAL FUSE DEVICE BASED ON A PHASE-CHANGE MEMORY ELEMENT AND CORRESPONDING PROGRAMMING METHOD

Semiconductor integrated circuit and IC card system

Phosphor based illumination system having a short pass reflector and method of making same

Flow Diversion Heat Sinks For Temperature Uniformity in Back to Back Multi-processor Configurations

CPU cooler

Quasi-radial heatsink with rectangular form factor and uniform fin length

Liquid cooled heat sink with cold plate retention mechanism

Varistor and light-emitting apparatus

Semiconductor integrated circuit device

Crystal oscillator emulator

Control device integrated dynamo-electric machine

ORGANIC EL DEVICE AND LIQUID CRYSTAL DISPLAY

Integrated stress relief pattern and registration structure

Power composite integrated semiconductor device and manufacturing method thereof

Connection structure and method for fabricating the same

Semiconductor device and method for fabricating the same

Conductive layers for hafnium silicon oxynitride films

ILD LAYER WITH INTERMEDIATE DIELECTRIC CONSTANT MATERIAL IMMEDIATELY BELOW SILICON DIOXIDE BASED ILD LAYER

Semiconductor package, stack package using the same package and method of fabricating the same

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Semiconductor device having an antenna

UV blocking and crack protecting passivation layer

Monolithic integrated circuit

High frequency transistor layout for low source drain capacitance

Semiconductor apparatus

Device configuration of asymmetrical DMOSFET with schottky barrier source

Capacitance cell, semiconductor device, and capacitance cell arranging method

Three-dimensional capacitor structure

Wafer level package for image sensor components and fabricating method thereof

Led light source

Technique for evaluating a fabrication of a die and wafer

Opto-thermal mask including aligned thermal dissipative layer, reflective layer and transparent capping layer

Fabricating substrates having low inductance via arrangements

Methods and apparatuses for high pressure gas annealing

Method for fabricating a through-hole interconnection substrate

Structural enhanced heat dissipating device

Heat dissipating apparatus having micro-structure layer and method of fabricating the same

Heat sink with slant fin

Heat pipe heat sink

Heat dissipation apparatus

Cooling apparatus

Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibers

Polyimidesiloxane solution composition

SUPERCONDUCTING WIRE, SUPERCONDUCTING MUTIFILAMENTARY WIRE USING THE SUPERCONDUCTING WIRE, AND METHOD OF MANUFACTURING THE SAME

Wiring structure, semiconductor device and methods of forming the same

Manufacturing method of semiconductor device, and IC card, IC tag, RFID, transponder, bill, securities, passport, electronic apparatus, bag, and garment

Method of manufacturing semiconductor device

Copper interconnect wiring and method and apparatus for forming thereof

Method for preparing a metal feature surface prior to electroless metal deposition

Copper interconnect systems which use conductive, metal-based cap layers

Copper interconnect systems which use conductive, metal-based cap layers

Integrated Circuit Chip Utilizing Dielectric Layer Having Oriented Cylindrical Voids Formed from Carbon Nanotubes

BALL GRID ARRAY COPPER BALANCING

Integrated circuit wafer with inter-die metal interconnect lines traversing scribe-line boundaries

Method for determining an overlay correlation set

Semiconductor devices including transistors having three dimensional channels and methods of fabricating the same

Integrated circuit capacitor structure

Method of fabricating semiconductor integrated circuit device with 99.99 wt% cobalt

Semiconductor constructions and semiconductor device fabrication methods

Plasma processing method and plasma processing apparatus

Portable fuel cell systems and methods therefor

Cooling devices for various applications

Phosphorus-containing coated magnesium oxide powder, method for producing same, and resin composition containing such powder

Nanoscale metal paste for interconnect and method of use

Methods and tangible objects employing machine readable data in photo-reactive materials

Electric fuse circuit providing margin read function

Multi chip package and related method

CONTROLLING ACCESS TO DEVICE-SPECIFIC INFORMATION

Narrow gap spray cooling in a globally cooled enclosure

Narrow gap spray cooling in a globally cooled enclosure

High performance system-on-chip inductor using post passivation process

Multi-band filter module and method of fabricating the same

High-voltage silicon-on-insulator transistors and methods of manufacturing the same

Integrated circuit packaging system including a non-leaded package

Semiconductor devices and methods of manufacturing the same

Fabrication of Nanowires

Semiconductor device and method for manufacturing same

Damascene structure having a reduced permittivity and manufacturing method thereof

Solder bump on a semiconductor substrate

Memory module with rubber spring connector

CIRCUIT BOARD

SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS

Edge seal for improving integrated circuit noise isolation

Solutions for integrated circuit integration of alternative active area materials

Planar vertical resistor and bond pad resistor

CAPACITOR STRUCTURE

Semiconductor device and method of manufacturing the same

High performance system-on-chip inductor using post passivation process

Semiconductor memory device with vertical fuse

Semiconductor device and method of manufacturing the same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Semiconductor device and method of manufacture thereof

NOVEL ARCHITECTURE TO MONITOR ISOLATION INTEGRITY BETWEEN FLOATING GATE AND SOURCE LINE

Integrated capacitor structure

Semiconductor which a MOS capacitor is complemented with the capacitance of a wiring capacitor

Split dual gate field effect transistor

Power surface mount light emitting die package

High heat dissipating package baseplate for a high brightness LED

Nitride based LED with a p-type injection region

Semiconductor device having a modified dielectric film

Photo-detection device

COMBINATION OF A HEAT SINK AND A FAN

Heat dissipation device

Structure for air conduction in radiator device

Photosensitive epoxy resin adhesive composition and use thereof

Analyte monitoring device and methods of use

Analyte monitoring device and methods of use

Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith

Fastening of a member pressing a heat sink against a component mounted on a circuit board

Method for sealing thin film transistors

Method and system for advanced process control in an etch system by gas flow control on the basis of CD measurements

Pass through via technology for use during the manufacture of a semiconductor device

Multi-step process for forming a barrier film for use in copper layer formation

Technique for non-destructive metal delamination monitoring in semiconductor devices

Systems And Methods For Forming Integrated Circuit Components Having Precise Characteristics

Process monitor mark and the method for using the same

Semiconductor device

Semiconductor wafer with rear side identification and method

Apparatus, system, and method for thermal conduction interfacing

Lighting emitting device, manufacturing method of the same, electronic apparatus having the same

Apparatus and method for producing an article by means of a molding technique

Semiconductor storage device and method of fabricating the same

Thermal interface apparatus

Multilayer printed circuit board having tamper detection circuitry

COVERT INTELLIGENT NETWORKED SENSORS AND OTHER FULLY ENCAPSULATED CIRCUITS

THREE-DIMENSIONAL COLD PLATE AND METHOD OF MANUFACTURING SAME

Heat sink, electronic device, and tuner apparatus

Mechanism for connecting loop heat pipe and method therefor

Embedded microchannel cooling package for a central processor unit

Electronic device

Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method

Wafer flatness evaluation method, wafer flatness evaluation apparatus carrying out the evaluation method, wafer manufacturing method using the evaluation method, wafer quality assurance method using the evaluation method, semiconductor device manufacturing method using the evaluation method and semiconductor device manufacturing method using a wafer evaluated by the evaluation method

Inductance variable device

Transistor arrangement, integrated circuit and method for operating field effect transistors

Alignment mark and overlay inspection mark

Reworkable stacked chip assembly

CONTACT VIA SCHEME WITH STAGGERED VIAS

THOROUGH WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Bonding pad structure

Composite core circuit module system and method

Solderable compact camera module

Aerogel/PTFE composite insulating material

Microfabricated Beam Modulation Device

Semiconductor device

Semiconductor device having fuse element arranged between electrodes formed in different wiring layers

Integrated circuit arrangement

Semiconductor device having capacitor capable of reducing additional processes and its manufacture method

Semiconductor chips having improved electrostatic discharge protection circuit arrangement

Trenched MOSFETS with improved ESD protection capability

SEMICONDUCTOR DEVICE

Integrated circuit having resistance temperature sensor

Semiconductor device and method of manufacturing semiconductor device

Arrays of light emitting articles and method of manufacturing same

Organic light-emitting display

Loop heat pipe

Loop heat pipe

Loop heat exchange apparatus

Loop heat pipe

Heat dissipating device

Method of making tamper detection circuit for an electronic device

Printed wiring board for mounting semiconductor

Socket for an electrical tester

Laser-based method and system for processing a multi-material device having conductive link structures

SiCOH dielectric

Method for fabricating a semiconductor device and apparatus for inspecting a semiconductor

Introduction of metal impurity to change workfunction of conductive electrodes

Method for forming fuse of semiconductor device

Microstructure sealing tool and methods of using the same

Three-dimensional package and method of making the same

Three-dimensional package and method of making the same

Methods for forming alignment marks on semiconductor devices

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Protective thin film layers and methods of dielectric passivation of organic materials using assisted deposition processes

Methods and tangible objects employing machine readable data

Side view LED package and backlight unit using the same

Heat dissipation device

HEAT DISSIPATION DEVICE

Video graphics array (VGA) card assembly

HEAT EXCHANGE MODULE

Protection circuit and operating method thereof

Hermetic container and image display apparatus

LOW-FREQUENCY RADIO TAG ENCAPSULATING SYSTEM

Device for transmitting electromagnetic signals and application of said device

Method and Apparatus for Nondestructive Evaluation of Semiconductor Wafers

METHOD OF MANUFACTURING DUAL EMISSION DISPLAY AND DUAL EMISSION DISPLAY MANUFACTURED THEREBY

FLEXIBLE CIRCUIT BOARD, METHOD FOR MAKING THE SAME, FLEXIBLE MULTI-LAYER WIRING CIRCUIT BOARD, AND METHOD FOR MAKING THE SAME

Semiconductor device components with conductive vias and systems including the components

Insulating tube, semiconductor device employing the tube, and method of manufacturing the same

Semiconductor device including an inductor having soft magnetic thin film patterns and a fabricating method of the same

Semiconductor device with surface-mountable external contacts and method for manufacturing the same

RF module with multi-stack structure

Stacked integrated circuit module

Ultra thin TCS (SiCl) cell nitride for DRAM capacitor with DCS (SiHCl) interface seeding layer

Semiconductor device and method for fabricating the same

Fuse region and method of fabricating the same

SEMICONDUCTOR DEVICE WITH METAL FUSES

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Structure and method for making high density mosfet circuits with different height contact lines

Solid-state imaging device, signal charge detection device, and camera

Lighting device and light emitting module for the same

Package for a light emitting element with integrated electrostatic discharge protection

Color sensor integrated light emitting diode for LED backlight

Shifting spectral content in solid state light emitters by spatially separating lumiphor films

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Hierarchical Assembly of Interconnects for Molecular Electronics

Thin film transistor, thin film transistor substrate, processes for producing the same, liquid crystal display using the same, and related devices and processes; and sputtering target, transparent electroconductive film formed by use of this, transparent electrode, and related devices and processes

Semiconductor device

Semiconductor device structure that includes markings covered by visibly opaque materials

Infrared ray detection device, method of fabricating the same and infrared ray camera

Systems and methods for bonding

Integrated circuit with embedded FeRAM-based RFID

Microelectronic device with mixed dielectric

Heat sink for controlling dissipation of a thermal load

HEAT PIPE TYPE HEAT DISSIPATION DEVICE

Combination cooler module

Decreasing thermal contact resistance at a material interface

Methods of fabricating substrates including one or more conductive vias

Nanoparticles and method for making the same

Semiconductor device and manufacturing method of semiconductor device

Method for symmetric deposition of metal layer

Selective electroless-plated copper metallization

INTERCONNECTING PROCESS AND METHOD FOR FABRICATING COMPLEX DIELECTRIC BARRIER ALYER

Method for fabricating circuit component

Methods for forming conductive vias in semiconductor device components

Semiconductor device, method of manufacturing the same, and camera module

Method of reducing film stress on overlay mark

Electrode line structure having fine line width and method of forming the same

Method of wafer level packaging and cutting

Passivation planarization

Method and structure to prevent circuit network charging during fabrication of integrated circuits

Thermal interconnect and interface systems, methods of production and uses thereof

Molecular fan

Optical input substrate, optical output substrate, optical input/output substrate, a fabrication method for these substrates, and an optical element integrated semiconductor integrated circuit

Disabling faulty flash memory dies

Phase change memory device and method for manufacturing phase change memory device

High speed OTP sensing scheme

Method and apparatus for testing integrated circuits for susceptibility to latch-up

LED lighting system with reflective board

Light emitting diode structure

Heat sink assembly

MEMORY MODULE ASSEMBLY INCLUDING A CLIP FOR MOUNTING A HEAT SINK THEREON

Electronic cooling system having a ventilating duct

Computer component protection

Heat exchanger, light source device, projector and electronic apparatus

Verification of Performance Attributes of Packaged Integrated Circuits

Double-sided display

Pattern forming method and its mold

Electronic device with bending wiring pattern

Semiconductor array and method for manufacturing a semiconductor array

Use of AIN as cooper passivation layer and thermal conductor

In-situ deposition for cu hillock suppression

Semiconductor device and method of manufacturing the same

Dual metal interconnection

Semiconductor device having wiring made by damascene method and capacitor and its manufacture method

Carbon nanotube circuit component structure

Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls

Structure to monitor arcing in the processing steps of metal layer build on silicon-on-insulator semiconductors

Device package and methods for the fabrication and testing thereof

Semiconductor device including bus with signal lines

Semiconductor device with antenna and separating layer

Multi-functional composite substrate structure

Semiconductor device

Silicon nitride passivation layers having oxidized interface

INTEGRATED MEMS PACKAGE

Method for edge sealing barrier films

Structure and method for MOSFET gate electrode landing pad

Tunable semiconductor component provided with a current barrier

Cap layers including aluminum nitride for nitride-based transistors

Optical-element integrated semiconductor integrated circuit and fabrication method thereof

Combination of heat pipe and heat sink and method thereof

Cooling element for eliminating electromagnetic noise

Flat plate heat transfer device and method for manufacturing the same

Microchannel heat sink

Component package having heat exchanger

Solar cell, manufacturing method and manufacturing management system thereof, and solar cell module

Method and arrangement for cooling a substrate, particularly a semiconductor

Temperature control system

LIQUID COOLING SYSTEM WITH THERMOELETRIC COOLING MODULE

HEAT DISSIPATION MODULE

Semiconductor device layout method, a computer program, and a semiconductor device manufacture method

Basic cell, edge cell, wiring shape, wiring method, and shield wiring structure

Method for creating new via

Wireless radio frequency technique design and method for testing of integrated circuits and wafers

Analyte monitoring device and methods of use

Analyte monitoring device and methods of use

Non-oxide ceramic having oxide layer on the surface thereof, method for production thereof and use thereof

Semiconductor device having copper wiring