Self-encapsulated silver alloys for interconnects

High k gate stack on III-V compound semiconductors

Method for the production of a fixed connection between two layers of a multilayer system, and multilayer system

Methods for metal ARC layer formation

Method for wafer level packaging and fabricating cap structures

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method for wafer level chip scale packaging with passive components integrated into packaging structure

Methods of manufacturing light emitting diodes including barrier layers/sublayers

Measurement method for low-k material

Method of adding fabrication monitors to integrated circuit chips

Heat dissipation device having phase-changeable medium therein

Heat exchange apparatus

Heat sink with vertical air flow panels

Heat-dissipating structure inside the computer mainframe

Circuit element and method for protecting a load circuit

TRANSPARENT WAFER WITH OPTICAL ALIGNMENT FUNCTION AND FABRICATING METHOD AND ALIGNMENT METHOD THEREOF

Gain control methods and systems in an amplifier assembly

Display device and manufacturing method thereof

Dual emission display

White light emitting device

Laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates

Circuit Board with Conductive Structure and Method for Fabricating the same

Method to improve time dependent dielectric breakdown

Semiconductor device, method of fabricating the same, and pattern generating method

CIRCUIT BOARD DEVICE WITH FINE CONDUCTIVE STRUCTURE

Metal wiring of semiconductor device and method of fabricating the same

Method for designing interconnect for a new processing technology

Recyclying faulty multi-die packages

Hybrid composite material substrate

Method of testing wires and apparatus for doing the same

Memory packaging structure of mini SD card

Memory card and method for devising

Wafer with optical control modules in IC fields

Memory card and method for devising

CARRIER STRUCTURE FOR SEMICONDUCTOR PACKAGE

Die seal structure for reducing stress induced during die saw process

Interdigitated capacitive structure for an integrated circuit

Electrical fuses comprising thin film transistors (TFTS), and methods for programming same

High voltage field effect device and method

Methods for implementation of a switching function in a microscale device and for fabrication of a microscale switch

Nanosensors

Structure of a field effect transistor having metallic silicide and manufacturing method thereof

SRAM array and analog FET with dual-strain layers comprising relaxed regions

Integrated circuit arrangement with shockley diode or thyristor and method for production and use of a thyristor

Semiconductor device and manufacturing method thereof

Higher performance CMOS on (110) wafers

Integrated circuit comb capacitor

System with meshed power and signal buses on cell array

Memory device and a method of forming a memory device

HEAT SINK WITH CARBON NANOTUBES AND METHOD FOR MANUFACTURING THE SAME

Temperature-controlled circuit integrated in a semiconductor material, and method for controlling the temperature of a semiconductor material having an integrated circuit

Package for Image Sensor and Identification Module

HEAT-DISSIPATING DEVICE AND METHOD FOR MANUFACTURING SAME

Integrated cooling system for electronic components

Thermoelectric heat pumps

Temperature control apparatus

ASIC design using clock and power grid standard cell

Method of manufacturing a venting device for tamper resistant electronic modules

Wafer polishing control

OPTIMIZED SiCN CAPPING LAYER

Methods for forming damascene wiring structures having line and plug conductors formed from different materials

Method of fabricating a carbon nanotube interconnect structures

Manufacturing method for semiconductor device and semiconductor device

METHOD OF MANUFACTURING A COPPER INDUCTOR

Semiconductor device and method for fabricating the same

Semiconductor device exhibiting a high breakdown voltage and the method of manufacturing the same

MOM CAPACITOR

Semiconductor integrated circuit device and a method of manufacturing the same

Semiconductor device with capacitor and method for fabricating the same

Corresponding capacitor arrangement and method for making the same

Method for fabricating semiconductor device to lower source/drain sheet resistance

Semiconductor process evaluation methods including variable ion implanting conditions

Nanowire structures and devices for use in large-area electronics and methods of making the same

Siloxane-based resin containing germanium and an interlayer insulating film for a semiconductor device using the same

Isolator and a modem device using the isolator

Memory cooling device

Thermal management device for multiple heat producing devices

Apparatus for supporting a heatsink

Multi-surface heat sink film

MULTI-FLUID COOLANT SYSTEM

Connector heat transfer unit

Method for controlling fan rotational speed in electronic system and electronic system applying the same

Heat dissipation device having a ventilating duct

Sensor unit, exposure apparatus, and device manufacturing method

Packaged spiral inductor structures, processes of making same, and systems containing same

Thermal Energy Management of Electronic Devices

Micro electro mechanical system, semiconductor device, and manufacturing method thereof

MICRO-FABRICATED DEVICE WITH THERMOELECTRIC DEVICE AND METHOD OF MAKING

Topographically indexed support substrates

Engine with cable direct to outboard memory

Via structure and process for forming the same

Field programmable gate array (FPGA) multi-parallel structure

Formation of interconnects through lift-off processing

Semiconductor device and method of manufacturing the same

Metal Interconnection of Semiconductor Device and Method of Fabricating the Same

SINGLE OR DUAL DAMASCENE VIA LEVEL WIRINGS AND/OR DEVICES, AND METHODS OF FABRICATING SAME

Semiconductor integrated circuit

Inductor for semiconductor device and method of fabricating the same

Method of fabricating an inductor for a semiconductor device

INDUCTOR STRUCTURE OF A SEMICONDUCTOR DEVICE

Fuse box reducing damage caused by laser blowing and cross talk

Capacitor in semiconductor device and manufacturing method

Metal-insulator-metal capacitor structure having low voltage dependence

Devices without current crowding effect at the finger's ends

Semiconductor device

Vertical DMOS device in integrated circuit

Semiconductor device with a capacitor

LED lamps

Methods and structures for reducing lateral diffusion through cooperative barrier layers

Techniques to control illumination for image sensors

Pinhole type imaging device

RELIABILITY BARRIER INTEGRATION FOR CU APPLICATION

Mounting structure providing electrical surge protection

Heat sink for distributing a thermal load

Heat sink and method for manufacturing the same

Method and apparatus for cooling electrical equipment

Heat sink for dissipating a thermal load

Heat dissipating clamp for dissipating heat of chips in an electrical device

Methods and apparatus for microelectronic cooling using a miniaturized vapor compression system

Direct integration of inorganic nanowires with micron-sized electrodes

Operation and design of integrated circuits at constrained temperature ranges in accordance with bit error rates

Analyte monitoring device and methods of use

Analyte monitoring device and methods of use

Heat conductive silicone grease compositions

Semiconductor device and method for manufacturing same

Semiconductor devices incorporating carbon nanotubes and composites thereof

Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer

Method of forming fuse region in semiconductor damascene process

Multi-layered metal wiring structure of semiconductor device and manufacturing method thereof

Method for manufacturing semiconductor device

Manufacturing method of semiconductor device

METHOD OF MANUFACTURING A MULTILAYERED DOPED CONDUCTOR FOR A CONTACT IN AN INTEGRATED CIRCUIT DEVICE

Integrated semiconductor device and method of manufacturing thereof

Method of manufacturing wiring substrate, liquid ejection head and image forming apparatus

Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement

Semiconductor device having MIM capacitive elements and manufacturing method for the same

Brazing method and brazed structure

Laminate

THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM

Semiconductor wafer substrate for power semiconductor components and method for producing the same

CANCER TREATMENT METHOD

Camera modules with liquid optical elements

Methods for active boosting to minimize capacitive coupling effect between adjacent gates of flash memory devices

LED light with active cooling

Display device

Light emitting device module

Device for cooling an electrical component and production method thereof

Method to secure a heat sink

Heat dissipation device

Heat dissipating device

MOTHERBOARD ASSEMBLY

Heat dissipation device having a locking device

Apparatus and system for cooling heat producing components

HEAT DISSIPATION DEVICE

Anti-static structure

HEAT DISSIPATING ASSEMBLY

Capacitor and manufacturing method thereof

Semiconductor integrated circuit device

Active protection circuit arrangement

Apparatus and method for testing defects

Apparatus and method for testing defects

Pattern alignment method and lithographic apparatus

Camera module package

Fabricating a monolithic microwave integrated circuit

Method and apparatus for characterizing features formed on a substrate

Piezoelectric resonator element package, and piezoelectric resonator

Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure

Semiconductor device and manufacturing method thereof

Metal-insulator-metal (MIM) capacitor and methods of manufacturing the same

METHOD OF FORMING A METAL INTERCONNECTION IN A SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing the same

Interconnect structure and method of fabricating same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor Device and Method of Manufacturing the Same

Semiconductor device and manufacturing method therof

Semiconductor device and method of forming intermetal dielectric layer

Method for fabricating a metal interconnection using a dual damascene process and resulting semiconductor device

Metal thin film for interconnection of semiconductor device

Printed wiring board, method for manufacturing same, and circuit device

Heat dissipation device

Seal ring structures with unlanded via stacks

Method and system of tape automated bonding

Electronic carrier board and package structure thereof

Thermal interface material and solder preforms

Integrated circuit with at least one integrated transmission line

Method for producing a grid cap with a locally increased dielectric constant

Nano-wire electrode structure

Semiconductor device and method for manufacturing the same

Semiconductor device

FPGA structure provided with multi parallel structure and method for forming the same

Metal electrical fuse structure

Trench field plate termination for power devices

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Silicon-on-insulator chip having multiple crystal orientations

Integrated circuit devices including a capacitor

Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate

Devices without current crowding effect at the finger's ends

Ultrafast recovery diode

Trench polysilicon diode

Light emitting device

Circuit board

Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate

Method for manufacturing heat pipe cooling device

Heat dissipation device with heat pipes

Passive fluid recovery system

Cooling assembly with successively contracting and expanding coolant flow

Heat sink and electronic equipment

Heat sink

Method of manufacturing RFID devices

Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure

Curable resin composition

Image pickup apparatus and data processing apparatus having the same

Apparatus for expressing circuit version identification information

Contact structure of semiconductor device and method for fabricating the same

Integrated circuit insulators and related methods

Semiconductor device with a line and method of fabrication thereof

Semiconductive device fabricated using subliming materials to form interlevel dielectrics

Method for bonding plastic micro chip

Method of forming through-wafer interconnects for vertical wafer level packaging

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Method of forming a contact using a sacrificial structure

Method and apparatus for a deposited fill layer

Three dimensional microstructures and methods for making three dimensional microstructures

Low melting temperature alloy structure for enchanced thermal interface

Metal-based carbon fiber composite material and method for producing the same

Method of forming thin metal films on substrates

Tamper-resistant packaging and approach using magnetically-set data

Led light with active cooling

Circuit board arrangement including heat dissipater

Modular heat-radiation structure and controller including the structure

LED with integral via

Series-connected heat dissipater coupled by heat pipe

Mounting apparatus for securing heat dissipation module to circuit board

Heat sink clip

Receptacle for a central processing unit

Feedback controlled magneto-hydrodynamic heat sink

Heat transfer system

Hybrid heat dissipation device

Heat sink having magnet array for magneto-hydrodynamic hot spot cooling

Dual impeller push-pull axial fan heat sink

Systems and methods for providing resources such as cooling and secondary power to electronics in a data center

Cooling technique using a heat sink containing swirling magneto-hydrodynamic fluid

Enhanced heat pipe cooling with MHD fluid flow

Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits

Semiconductor device

Method of assembling a packaged high frequency circuit module

RF balanced matching device

Pr-doped inorganic compound, luminescent composition and luminescent body containing the same, and light emitting device

Electronic component having an encapsulating compound

Providing a metal layer in a semiconductor package

Semiconductor integrated circuit and semiconductor device having multilayer interconnection

Interconnections having double capping layer and method for forming the same

Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics

Electronic device having low background luminescence, a black layer, or any combination thereof

Thick film capacitors on ceramic interconnect substrates

Multi-stacked package and method of manufacturing the same

Crossing conductive traces in a PCB

Carbon nanotube micro-chimney and thermo siphon die-level cooling

Using a thru-hole via to improve circuit density in a PCB

Device with beam structure, and semiconductor device

Capacitor and capacitor array

Image sensor package

Method for evaluating impurity distribution under gate electrode without damaging silicon substrate

Semiconductor device

Semiconductor device having increased gate-source capacity provided by protruding electrode disposed between gate electrodes formed in a trench

Semiconductor device with a line and method of fabrication thereof

Semiconductor package structure for vertical mount and method

Power surface mount light emitting die package

Security features incorporating photoluminescent phosphor powders and methods for making security features

Method for forming leadframe assemblies

Method for controlling polishing process

HEATSINK WITH OFFSET FINS

THERMAL DEVICE FOR HEAT GENERATING SOURCE

Heat sink for distributing a thermal load

Heat transfer system

Monolithic photovoltaic energy conversion device

CONNECTION DEVICE HAVING A DIODE FOR CONNECTING AN ELECTRICAL CONDUCTOR TO A CONNECTING LEAD

Power module structure and solid state relay using same

Method to form topography in a deposited layer above a substrate

High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof

Integrated circuit having bond pad with improved thermal and mechanical properties

Method of manufacturing wiring board

Method of forming molded resin semiconductor device

Electrical and thermal contact for use in semiconductor devices and corresponding methods

Probe card and method for manufacturing probe card

Carbon nanotube-dispersed composite material, method for producing same and article same is applied to

Metal nano-particles and method for preparing the same, dispersion of metal nano-particles and method for preparing the same, and thin metallic wire and metal film and method for preparing these substances

Electric motor comprising an electronic unit with a punched grid

Graphics card apparatus with improved heat dissipating mechanisms

Graphics card apparatus with improved heat dissipating assemblies

FLEXING CHIP HEATSINK

Heat dissipating element for a memory

Heat dissipation device

Information processor with a radiator that includes a heat pipe

Compact spray cooling module

SOLID-STATE IMAGE PICKUP DEVICE, COLOR SEPARATION IMAGE PICKUP OPTICAL SYSTEM AND IMAGE PICKUP APPARATUS

RFID tag

Semiconductor Fuse Covering