Methods and apparatus for inline variability measurement of integrated circuit components

Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods

Semiconductor component having plate, stacked dice and conductive vias

Semiconductor device, and method and apparatus for inspecting appearance thereof

Semiconductor device and method of manufacturing a semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor chip and shielding structure thereof

Wafer-to-wafer alignments

Electronic apparatus interconnect routing and interconnect routing method for minimizing parasitic resistance

MIM capacitor in a copper damascene interconnect

Laser fuse with efficient heat dissipation

Piezolectric micro electro-mechanical system switch, array of the switches, and method of fabricating the same

ESD protection for passive integrated devices

Semiconductor device having a conductive portion below an interlayer insulating film and method for producing the same

Programmable memory cell in an integrated circuit chip

Single chip with multi-LED

Light emitting element array and image forming apparatus

Dual organic electroluminescent display and method of making same

Active matrix electroluminescence device having a metallic protective layer and method for fabricating the same

Light emitting device having high optical output efficiency

Semiconductor wafer and semiconductor device, and method for manufacturing same

Transparent polymeric electrodes for electro-optical structures, processes for producing the same, and dispersions used in such processes

Thermal interface material

Addition of Dto Hto detect and calibrate atomic hydrogen formed by dissociative electron attachment

Method of making an electronic device cooling system

Method of making an electronic device cooling system

Heat radiating apparatus and electronic apparatus

Cooler

Heat dissipating module and method of fabricating the same

Heat dissipating device and method of fabricating the same

FIN UNIT FOR A COOLER

Copper alloy containing cobalt, nickel and silicon

Wafer support system

Micro heat pipe with pligonal cross-section manufactured via extrusion or drawing

Multilayer printed circuit board for high-speed differential signal, communication apparatus, and data storage apparatus

Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime

Rack enclosure

Adhesion by plasma conditioning of semiconductor chip surfaces

Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby

Apparatus and process for plasma-enhanced atomic layer deposition

Apparatus and process for plasma-enhanced atomic layer deposition

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

Dual damascene wiring and method

Method and system for increasing yield of vertically integrated devices

Method of forming a low capacitance semiconductor device and structure therefor

Semiconductor device and fabrication process thereof

Method and structure for buried circuits and devices

Forming a thin film thermoelectric cooler and structures formed thereby

Embedded heat spreader

Method and use of a device for applying coatings to band-like structures during the production of semiconductor components

Magnetic tunneling junction antifuse device

Heat sink fixing device

Buckle structure

Thermal management system for distributed heat sources

Heat transfer structure for electronic devices

On demand circuit function execution employing optical sensing

Periodic patterns and technique to control misalignment between two layers

LED package and backlight assembly for LCD comprising the same

Solid state imaging apparatus

Handheld device with image sensor and printer

Integrated inductor

Semiconductor integrated circuit device

Encapsulation structure of double sided organic light emitting device and method of fabricating the same

Dual emission display

Solder bonding structure using bridge type pattern

Memory Module System and Method

Memory Module System and Method

Via structure with improved reliability

Semiconductor device

EXTERNAL CONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING THE SAME

Multi-chip semiconductor connector assembly method

Multi-chip semiconductor connector and method

Leadframe comprising tin plating or an intermetallic layer formed therefrom

High thermal conducting circuit substrate and manufacturing process thereof

Tape carrier package including a heat dissipation element

Semiconductor devices and manufacturing method thereof

Semiconductor device including fuse focus detector, fabricating method thereof and laser repair method using the fuse focus detector

Interdigitized capacitor

Semiconductor device and method of manufacturing the same

Structure for and method of using a four terminal hybrid silicon/organic field effect sensor device

Small-sized semiconductor device featuring protection circuit for MOSFET

Integrated circuit devices having fuse structures including buffer layers

Semiconductor device

Light-emitting device using voltage switchable dielectric material

Luminescent ceramic element for a light emitting device

Lamp with multi-colored OLED elements

Configurable power segmentation using a nanotube structure

IC card and a method of manufacturing the same

Method for improved high current component interconnections

Method of direct plating of copper on a substrate structure

Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure

Column grid array using compliant core

COOLING DEVICE FOR ELECTRONIC COMPONENTS

Hybrid heat sink with recirculating fluid and interleaving fins

Embedded heat pipe in a hybrid cooling system

Heat sink assembly

Cooling element for heat dissipation in electronic components

Thermoelectric devices and applications for the same

Water Block And Manufacturing Method Thereof

Semiconductor integrated circuit and design method thereof

METHOD AND SYSTEM FOR ESTIMATING SUPPLY IMPACT ON A FIRM UNDER A GLOBAL CRISIS

Structure, system and method for dimensionally unstable layer dimension measurement

Epoxy compound, preparation method thereof, and use thereof

COMPONENT COOLING APPARATUS

Semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer

Method of filling structures for forming via-first dual damascene interconnects

Method for manufacturing a semiconductor device having a stepped through-hole

Semiconductor devices and methods of manufacturing semiconductor devices

Semiconductor device and method for manufacturing the same

Device with gaps for capacitance reduction

Passive components in the back end of integrated circuits

Technique for increasing adhesion of metallization layers by providing dummy vias

Method for controlling dislocation positions in silicon germanium buffer layers

Method and apparatus for fabricating and connecting a semiconductor power switching device

Electronic component manufacturing method and electronic component

RESISTOR ELEMENT AND MANUFACTURING METHOD THEREOF

Structure and method for manufacturing strained FINFET

MOS transistor manufacturing

Antenna and manufacturing method thereof, semiconductor device including antenna and manufacturing method thereof, and radio communication system

Methods of fabricating integrated circuit devices having fuse structures including buffer layers

Method of manufacturing light emitting device

Platform ASIC reliability

Copper wiring module control

Method for improved control of critical dimensions of etched structures on semiconductor wafers

ELECTRONIC MODULE WITH THERMAL DISSIPATING SURFACE

Method of producing a layer arrangement, method of producing an electrical component, layer arrangement, and electrical component

Composite material and base plate

Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom

Submount for light emitting/receiving device

Heat dissipation assembly

BACK PLATE ASSEMBLY FOR MOUNTING A HEAT SINK ASSEMBLY TO A MOTHERBOARD

Locking device for heat sink

Computer system with cooling device for CPU

Cooling module holder

Electronic apparatus

Heat sink module of a notebook computer

Heat dissipation device having a dual-fan arrangement

End point detection in workpiece processing

Semiconductor device

High frequency module

Integrated switchless programmable attenuator and low noise amplifier

Double-sided display device and method of making same

Transflective display having full color OLED blacklight

Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure

Electronic component and manufacturing method of the electronic component

Semiconductor device and method for manufacturing the same

Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device

Semiconductor integrated circuit wiring design method and semiconductor integrated circuit

DETECTION OF RESIDUAL LINER MATERIALS AFTER POLISHING IN DAMASCENE PROCESS

Semiconductor integrated circuit with improved power supply system

Reinforced interconnection structures

Semiconductor chip having island dispersion structure and method for manufacturing the same

Semiconductor device comprising a pn-heterojunction

Method for fabricating core substrate using paste bumps

Nano-wire electronic device

Circuit substrate and manufacturing method thereof

Semiconductor device with a dopant region in a lower wire

Wiring board with a protective film greater in heights than bumps

Laser fuse structures for high power applications

Semiconductor device having step-wise connection structures for thin film elements

Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof

Passivation structure with voltage equalizing loops

Electronically programmable antifuse and circuits made therewith

CMOS compatible shallow-trench efuse structure and method

Power semiconductor device using silicon substrate as field stop layer and method of manufacturing the same

Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers

Semiconductor Integrated Circuit Device and Method of Testing the Same

Semiconductor component arrangement having a first and second region

DIFFERENTIAL INPUT/OUTPUT DEVICE INCLUDING ELECTRO STATIC DISCHARGE (ESD) PROTECTION CIRCUIT

Optical sensor with improved planarization

Rare earth doped layer or substrate for light conversion

Semiconductor integrated circuit device and method of testing the same

Surface light-source device using light-emitting elements

Imaging apparatus

Method for manufacturing component built-in module, and component built-in module

Wiring board and method for producing the same

Heat sink for distributing a thermal load

Synthetic jet heat pipe thermal management system

Flow distributing unit and cooling unit having bypass flow

Synthetic jet ejector for the thermal management of PCI cards

System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements

Electronic device cooling apparatus

WATER-COOLING HEAT DISSIPATION SYSTEM

System and method of enhanced boiling heat transfer using pin fins

HEAT DISSIPATION DEVICE

HEAT DISSIPATION DEVICE

Cooling device

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION

Method for producing reactive intermediates for transport polymerization

System and method for electronic chassis and rack mounted electronics with an integrated subambient cooling system

Method of manufacturing a laminated leadframe

Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation

System and method for product yield prediction

Radiation curable cycloaliphatic barrier sealants

Adjustable cooling air duct for use with components of different sizes

Semiconductor device and manufacturing method thereof

Substrate for evaluation

Method of forming via recess in underlying conductive line

Fabricating method of an interconnect structure

Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications

Hydrogen plasma photoresist strip and polymeric residue cleanup process for low dielectric constant materials

Integrated circuit arrangement with capacitor in an interconnect layer and method

Via including multiple electrical paths

MIM capacitor and method of fabricating same

Semiconductor constructions, and methods of forming semiconductor constructions

Cooling semiconductor device and manufacturing method thereof

Method for packaging flash memory cards

Method for the molecular bonding of microelectronic components to a polymer film

Method for providing metal extension in backside illuminated sensor for wafer level testing

Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor

Teaching apparatus and method of teaching a wafer carrying apparatus a target position for placing and removing semiconductor wafers on and off a wafer boat using an imaging device and distance sensor

Carbon nanotube thermal pads

Methods for forming carbon nanotube thermal pads

Device having inductors and capacitors

Electronic device with dual heat dissipating structures

Fastening member for use in a heat-dissipating device

Heat sink apparatus

Fastening heat exchanger apparatus

Heat sink clip and assembly

Heat dissipation device with heat pipe

Device for the local cooling or heating of an object

Modularized redundant heat sink for dissipating heat generated from chips

Method and structure for charge dissipation in integrated circuits

Method and arrangement for shielding a component against electrostatic interference

Bearing with IC tag and seal for the same

Multilayer circuit with variable inductor, and method of manufacturing it

Planar inductor using liquid metal MEMS technology

Structure and method for monitoring stress-induced degradation of conductive interconnects

Thin module system and method

Interconnect structure

Capture of residual refractory metal within semiconductor device

Surface-mount packaging for chip

Non-leaded integrated circuit package system

Printed circuit board with quartz crystal oscillator

Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same

Package and electronic apparatus using the same

Method of manufacturing a multilayered doped conductor for a contact in an integrated circuit device

Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage

Programmable nanotube interconnect

Structure and method for MOSFET with reduced extension resistance

Semiconductor device and a method of manufacturing the same

Semiconductor integrated circuit device and method for fabricating the same

Electrical contact for high dielectric constant capacitors and method for fabricating the same

LAYOUT STRUCTURE OF BALL GRID ARRAY

Oil immersed transistor

Semiconductor chip and semiconductor device

Flip-chip light emitting diode device without sub-mount

Light-emitting semiconductor devices having variable emission wavelengths

Display device

MASK-MAKING MEMBER AND ITS PRODUCTION METHOD, MASK AND ITS MAKING METHOD, EXPOSURE PROCESS, AND FABRICATION METHOD OF SEMICONDUCTOR DEVICE

Heat dissipation device

HEAT-DISSIPATING FIN ASSEMBLY FOR HEAT SINK

Thick film conductor composition(s) and processing technology thereof for use in multilayer electronic circuits and devices

Virtual wire assembly having hermetic feedthroughs

CLIP ASSEMBLY

Systems with a gate dielectric having multiple lanthanide oxide layers

Fabrication method of a semiconductor device

Dual damascene multi-level metallization

Process for producing semiconductor integrated circuit device

Methods of fabricating integrated circuit devices including metal-insulator-metal capacitors

Semiconductor device and manufacturing method thereof to prevent a notch

Self-aligning nanowires and methods thereof

Process for forming a redundant structure

HIGH DENSITY MIMCAP WITH A UNIT REPEATABLE STRUCTURE

Polycide fuse with reduced programming time

Production and packaging control for repaired integrated circuits

Electro-optical device, manufacturing method of the same, and electronic apparatus

Method for dicing semiconductor substrate

Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices

Method of protecting semiconductor chips from mechanical and ESD damage during handling

Wafer with optical control modules in dicing paths

Chemical mechanical polishing test structures and methods for inspecting the same

Method for in-line testing of semiconductor wafers

Method of controlling trimming of a gate electrode structure

Laser decapsulation method

Patterns of electrically conducting polymers and their application as electrodes or electrical contacts

INTEGRATED LIQUID COOLING SYSTEM

INTEGRATED LIQUID COOLING SYSTEM

Illuminating device and liquid-crystal display device using the same

Wiring board and semiconductor device using the same

Liquid cooling of electronic system and method

Electronic component

High Q and low stress capacitor electrode array

Internally shielded energy conditioner

Method for suppressing latch-ups occurring in a circuit, and systems for carrying out said method

ESD protection circuit

User control input device

Test Pads, Methods and Systems for Measuring Properties of a Wafer

Semiconductor integrated circuit having multiple semiconductor chips with signal terminals

ALIGNMENT MARK WITH IMPROVED RESISTANCE TO DICING INDUCED CRACKING AND DELAMINATION IN THE SCRIBE REGION

Semiconductor method having silicon-diffused metal wiring layer

Semiconductor device

Semiconductor component comprising interconnected cell strips

Semiconductor device including a barrier metal film

Method of putting isolated metallic interconnections onto a metallic substrate

Interposer and method for producing the same and electronic device

Composite wiring board and manufacturing method thereof

Image sensor module with a protection layer and a method for manufacturing the same

Packaging structure of RSMMC memory card