212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Layered chip package
#2702LOW COST DIE PLACEMENT
#2703Semiconductor device and manufacturing method of the same
#2704Resin-sealed semiconductor device and method of manufacturing the same
#2705Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via
#2706Semiconductor device including vertical transistor and horizontal transistor
#2707Method of attaching a solder ball and method of repairing a memory module
#2708Method for low temperature bonding and bonded structure
#2709Dicing method using a die attach film on an adhesive sheet
#2710Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process
#2711Process for producing a contact area of an electronic component
#2712Wafer level integration module with interconnects
#27133D multiple die stacking
#2714Dicing tape and die attach adhesive with patterned backing
#2715Robust FBEOL and UBM structure of C4 interconnects
#2716ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT
#2717SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME
#2718Through hole electrode substrate with different area weighted average crystal grain diameter of metal in the conductive part and semiconductor device using the through hole electrode substrate
#2719Delamination resistance of stacked dies in die saw
#2720Semiconductor device
#2721Display device
#2722SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2723Substrate and package with micro BGA configuration
#2724Non-volatile memory with reduced mobile ion diffusion
#2725Semiconductor device and method of forming integrated passive device
#2726Device package substrate and method of manufacturing the same
#2727Method for manufacturing semiconductor device and bonding apparatus
#2728Method of manufacturing mounting structure and mounting structure
#2729Circuit module and method of manufacturing the same
#2730Method of manufacturing a printed wiring board
#2731METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND MASK
#2732Method of integrating a MOSFET with a capacitor
#2733Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity
#2734BONDING WIRE
#2735Power semiconductor module
#2736Semiconductor device and method of manufacturing the same
#2737Die Package
#2738Semiconductor device and manufacturing method therefor
#2739Structure, method and system for assessing bonding of electrodes in FCB packaging
#2740Semiconductor Chip with Stair Arrangement Bump Structures
#2741Method for fabricating a semiconductor and semiconductor package
#2742Impedance optimized chip system
#2743Semiconductor package
#2744Method of manufacturing semiconductor device and semiconductor device
#2745Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging
#2746Delamination resistant packaged die having support and shaped die having protruding lip on support
#2747Acceleration sensor, semiconductor device and method of manufacturing semiconductor device
#2748Metal-oxide-semiconductor chip and fabrication method thereof
#2749LED package structure for increasing heat-dissipating and light-emitting efficiency and method for manufacturing the same
#2750LED WITH PHOSPHOR TILE AND OVERMOLDED PHOSPHOR IN LENS
#2751Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
#2752Arrangement for solder bump formation on wafers
#2753DICING/DIE BONDING FILM
#2754Fabrication method of package structure
#2755ADHESIVE FILM WITH DICING SHEET AND METHOD OF MANUFACTURING THE SAME
#2756PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDED THEREIN AND METHOD FOR EMBEDDING AT LEAST ONE COMPONENT IN A PRINTED CIRCUIT BOARD ELEMENT
#2757Semiconductor device, and power conversion device using semiconductor device
#2758Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm
#2759Electronic devices with extended metallization layer on a passivation layer
#2760Semiconductor package with its surface edge covered by resin
#2761Semiconductor chip with contoured solder structure opening
#2762Integrated circuits having TSVs including metal gettering dielectric liners
#2763Wafer Level Stacked Die Packaging
#2764Interconnect layouts for electronic assemblies
#2765SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
#2766SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME
#2767Off-chip vias in stacked chips
#2768Semiconductor chip assembly with post/base heat spreader, signal post and cavity
#2769Wire-bonding machine with cover-gas supply device
#2770Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film
#2771Method of processing cavity of core substrate
#2772Resin sheet for circuit boards, sheet for circuit boards and circuit board displays
#2773Printed wiring board and method for manufacturing the same
#2774Method for producing flexible integrated circuits which may be provided contiguously
#2775Self-Filleting Die Attach Paste
#2776Method of manufacturing wafer level device package
#2777Method of manufacturing semiconductor package
#2778Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles
#2779Method and system for bonding electrical devices using an electrically conductive adhesive
#2780Photosensitive adhesive
#2781Electronic component
#2782High frequency circuit having multi-chip module structure
#2783Electronic component and manufacturing method thereof
#2784Semiconductor device
#2785Semiconductor device having a wafer level chip size package structure
#2786Extendable connector and network
#2787Layered chip for use in soldering
#2788BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES
#2789Electronic part and method of manufacturing the same
#2790SOLDER JOINT STRUCTURE, AND JOINING METHOD OF THE SAME
#2791Semiconductor apparatus and fabrication method thereof
#2792SEMICONDUCTOR DEVICE AND ON-VEHICLE AC GENERATOR
#2793Semiconductor device with pad with less diffusible contacting surface and method for production of the semiconductor device
#2794Electronic device and method of manufacturing the same
#2795Stacked packaging improvements
#2796Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers
#2797Semiconductor device having stable signal transmission at high speed and high frequency
#2798Electronic part and method of manufacturing the same
#2799Method For Fabricating A Through Interconnect On A Semiconductor Substrate
#2800Semiconductor device, external connection terminal, method of manufacturing semiconductor device, and method of manufacturing external connection terminal
#2801Package structure
#2802Die package and method of manufacturing the same
#2803Chip package and fabrication method thereof
#2804LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR PACKAGE
#2805Semiconductor device layer structure and method of fabrication
#2806Light emitting diode package
#2807Semiconductor memory device and semiconductor memory card
#2808Composite silver nanoparticle, composite silver nanopaste, bonding method and patterning method
#2809Electronic component and manufacturing method thereof
#2810Room temperature metal direct bonding
#2811Manufacturing method of semiconductor device
#2812Method for manufacturing semiconductor device
#2813Method of manufacturing semiconductor device
#2814Flip chip cavity package
#2815Voltage source converter
#2816Method for forming an electronic module having backside seal
#2817THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF
#2818Semiconductor device
#2819Semiconductor device
#2820Integrated circuit
#2821Device under bonding pad using single metallization
#2822Method of manufacturing semiconductor component, and semiconductor component
#2823Semiconductor device
#2824Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods
#2825Electronic device and manufacturing method therefor
#2826Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structures
#2827Method and package for circuit chip packaging
#2828Electrostatic chucking of an insulator handle substrate
#2829Electrically interconnected stacked die assemblies
#2830Ball-grid-array package, electronic system and method of manufacture
#2831Semiconductor device and method of forming dam material around periphery of die to reduce warpage
#2832High bond line thickness for semiconductor devices
#2833Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof
#2834Multiple substrate electrical circuit device
#2835Support device for resonator
#2836Implantable electrode array assembly including a carrier in which control modules for regulating the operation of the electrodes are disposed and electrodes that are disposed on top of the carrier
#2837Structure and process for the formation of TSVs
#2838Systems and methods to laminate passives onto substrate
#2839Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion
#2840Method of manufacturing a semiconductor device
#2841STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME
#2842Edge connect wafer level stacking
#2843Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the same
#2844Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages
#2845Self-assembly of chips on a substrate
#2846Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon
#2847SELF-ALIGNED METAL MASK ASSEMBLY FOR SELECTIVELY DEPOSITING THIN FILMS ON MICROELECTRONIC SUBSTRATES AND DEVICES, AND METHOD OF USE
#2848Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof
#2849Integrated circuit device and electronic equipment
#2850Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die
#2851Die stacking with an annular via having a recessed socket
#2852Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device
#2853Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element
#2854Structures and methods for improving solder bump connections in semiconductor devices
#2855Microwave module
#2856Method of manufacturing a printed wiring board
#2857Method for manufacturing electronic device
#2858Method and apparatus for manufacturing semiconductor device
#2859Process of forming an electronic device including a conductive stud over a bonding pad region
#2860Method for manufacturing a semiconductor device
#2861Method for producing substrate for mounting device and method for producing a semiconductor module
#2862ANISOTROPIC PARTICLE-ARRANGED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#2863System-in packages
#2864RFID tag
#2865Bond and probe pad distribution
#2866Semiconductor device and programming method
#2867Component arrangement and method for producing a component arrangement
#2868Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip
#2869SEMICONDUCTOR DEVICE
#2870Semiconductor device and method for manufacturing the same
#2871METALLURGY FOR COPPER PLATED WAFERS
#2872Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
#2873STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP
#2874Semiconductor package and package-on-package semiconductor device
#2875Semiconductor device and method of forming wafer level ground plane and power ring
#2876STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP
#2877Manufacturing method of semiconductor device and semiconductor device
#2878Method of forming a semiconductor device including a stress buffer material formed above a low-k metallization system
#2879Method of assembling semiconductor devices with LEDS
#2880POWER SEMICONDUCTOR DEVICE
#2881Method of reducing memory card edge roughness by edge coating
#2882Stackable Package By Using Internal Stacking Modules
#2883Integrated circuit package architecture
#2884Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP
#2885Semiconductor device package having features formed by stamping
#2886Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
#2887Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame
#2888Semiconductor device having under-filled die in a die stack
#2889CMOS image sensor big via bonding pad application for AlCu Process
#2890High frequency field-effect transistor
#2891Semiconductor Substrates, Devices and Associated Methods
#2892System with semiconductor components having encapsulated through wire interconnects (TWI)
#2893CONNECTION PAD STRUCTURE FOR AN ELECTRONIC COMPONENT
#2894Mounting and connecting an antenna wire in a transponder
#2895Semiconductor package and method of manufacturing the same
#2896Process for making contact with and housing integrated circuits
#2897Method of manufacturing a semiconductor device
#2898Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus
#2899Method for bonding of chips on wafers
#2900TEST CIRCUIT UNDER PAD
#2901Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
#2902Method of manufacturing semiconductor device, semiconductor device thus manufactured, and semiconductor manufacturing apparatus
#2903Semiconductor package and semiconductor package module
#2904Semiconductor device
#2905Multilayer UV-Curable Adhesive Film
#2906Semiconductor device packages, redistribution structures, and manufacturing methods thereof
#2907Semiconductor device
#2908Semiconductor device package with an alignment mark
#2909PoP precursor with interposer for top package bond pad pitch compensation
#2910Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
#2911Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflow
#2912Electronic device, method of producing the same, and semiconductor device
#2913Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same
#2914FORMING GAS KIT DESIGN FOR COPPER BONDING
#2915Method of electrically connecting a microelectronic component
#2916Method for making semiconductor electrodes
#2917Method for manufacturing semiconductor device, and semiconductor manufacturing apparatus used in said method
#2918Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
#2919Method for packaging semiconductor dies having through-silicon vias
#2920Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
#2921Electronic component module and method of manufacturing the electronic component module
#2922Method of making a thin film device
#2923Post bump and method of forming the same
#2924METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGNING APPARATUS, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE AND SEMICONDUCTOR INTEGRATED CIRCUIT
#2925Air cavity package with copper heat sink and ceramic window frame
#2926Semiconductor device and method of fabrication
#2927Leadframe having delamination resistant die pad
#2928Barrier Layer On Polymer Passivation For Integrated Circuit Packaging
#2929Multi-die DC-DC buck power converter with efficient packaging
#2930Semiconductor device and method of manufacturing the same
#2931Bonding wire for semiconductor devices
#2932Copper alloy bonding wire for semiconductor device
#2933SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD WITH FOLDED EDGE
#2934METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#2935RESIN VARNISH USED FOR ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
#2936Reconstituted wafer stack packaging with after-applied pad extensions
#2937Structures and methods to improve lead-free C4 interconnect reliability
#2938Solder interconnect pads with current spreading layers
#2939Semiconductor device
#2940Film for use in manufacturing semiconductor device, method for producing semiconductor device and semiconductor device
#2941Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other
#2942Solder interconnect by addition of copper
#2943Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device
#2944NICKEL-TITANUM CONTACT LAYERS IN SEMICONDUCTOR DEVICES
#2945Chip package and manufacturing method thereof
#2946Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces
#2947Method for manufacturing electronic component module
#2948STRUCTURE OF A PACKAGE FOR ELECTRONIC DEVICES AND METHOD FOR MANUFACTURING THE PACKAGE
#2949Ribbon connecting electrical components
#2950Board having connection terminal
#2951Method of manufacturing a semiconductor device
#2952SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY ELECTROPLATING
#2953Flip chip MLP with folded heat sink
#2954METHOD OF DIE REARRANGEMENT PACKAGE STRUCTURE HAVING PATTERNED UNDER BUMP METALLURGIC LAYER CONNECTING METAL LEAD
#2955Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
#2956Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
#2957Semiconductor optical interconnection device and semiconductor optical interconnection method
#2958Die-to-die electrical isolation in a semiconductor package
#2959SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#2960SEMICONDUCTOR DEVICE INCLUDING SEALING FILM FOR ENCAPSULATING SEMICONDUCTOR CHIP AND PROJECTION ELECTRODES AND MANUFACTURING METHOD THEREOF
#2961Semiconductor device
#2962Compound semiconductor device and connectors
#2963Chip scale module package in BGA semiconductor package
#2964Semiconductor chip package and method for designing the same
#2965Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element
#2966Semiconductor device and a method of manufacturing the same
#2967Stacked semiconductor device and fabrication method for same
#2968Semiconductor device and fabrication method thereof
#2969Flip-chip module and method for the production thereof
#2970Semiconductor device and manufacturing method of the same
#2971SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#2972Lead frame routed chip pads for semiconductor packages
#2973Method of assembling a multi-component electronic package
#2974Semiconductor device and semiconductor device manufacturing method
#2975Power converter integrated circuit floor plan and package
#2976Wire payout measurement and calibration techniques for a wire bonding machine
#2977Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packages
#2978SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SAME
#2979Manufacturing method of semiconductor device including Au bump on seed film
#2980Interconnects for packaged semiconductor devices and methods for manufacturing such devices
#2981Process for producing a semiconductor device
#2982Methods for producing an ultrathin semiconductor circuit
#2983Method of manufacturing semiconductor device
#2984Semiconductor device and method for producing the same
#2985Adhesive, method of connecting wiring terminals and wiring structure
#2986Printed circuit board
#2987METHOD FOR THE PRODUCING AN ELECTRONIC SUBASSEMBLY, AS WELL AS ELECTRONIC SUBASSEMBLY
#2988Stacked structures and methods of fabricating stacked structures
#2989Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
#2990Electrical interconnect for die stacked in zig-zag configuration
#2991SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
#2992Semiconductor device bonding wire and wire bonding method
#2993JOINING STRUCTURE AND A SUBSTRATE-JOINING METHOD USING THE SAME
#2994Package and the Method for Making the Same, and a Stacked Package
#2995Semiconductor package and method of forming the same
#2996Wiring board and semiconductor device using the wiring board
#2997SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2998Package manufacturing method and semiconductor device
#2999Semiconductor chip package and method of manufacturing the same
#3000Multi-chip package and method of providing die-to-die interconnects in same