Semiconductor chip, method of fabricating the same, and stack module and memory card including the same

Semiconductor device with embedded interconnect pad

Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same

Electrical property altering, planar member with solder element in IC chip package

Bond pad with integrated transient over-voltage protection

Semiconductor chip

ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Semiconductor device and manufacturing method thereof

Circuit Device and Method of Manufacturing Thereof

Process for manufacturing a composite substrate

ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

Integrated circuit device

Multilayer printed wiring board

MEMORY CARD

SEMICONDUCTOR DEVICE, CAMERA MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Die package including encapsulated die and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Adhesive film for semiconductor and semiconductor device using the adhesive film

Semiconductor device

Semiconductor package with substrate having single metal layer and manufacturing methods thereof

Surface depressions for die-to-die interconnects and associated systems

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Wafer level stack structure for system-in-package and method thereof

Method for fabricating a semiconductor package

Semiconductor device with reinforcement plate and method of forming same

Chip package structure and manufacturing methods thereof

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Laminated body of semiconductor chips including pads mutually connected to conductive member

Die-warpage compensation structures for thinned-die devices, and methods of assembling same

Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE

White light emitting device and vehicle lamp using the same

Method for manufacturing semiconductor device

Lead frame design to improve reliability

PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Manufacturing method for composite alloy bonding wire

Applying chiplets to substrates

MULTIFUNCTIONAL DIE ATTACHMENT FILM AND SEMICONDUCTOR PACKAGING USING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Chip packaging method and structure thereof

Electronic device package and method of manufacture

Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof

Package-on-package technology for fan-out wafer-level packaging

Stacked chip package structure with leadframe having inner leads with transfer pad

Processes and structures for beveled slope integrated circuits for interconnect fabrication

High-voltage semiconductor device

Heat releasing semiconductor package, method for manufacturing the same, and display apparatus including the same

SEMICONDUCTOR DEVICE

Pads with different width in a scribe line region and method for manufacturing these pads

Method for manufacturing tight pitch, flip chip integrated circuit packages

Substrate for flip chip bonding and method of fabricating the same

AU ALLOY WIRE FOR BALL BONDING

Electrical connection and method of manufacturing the same

Radio frequency unit analog level detector and feedback control system

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Method and apparatus for no lead semiconductor package

Semiconductor device

In-package microelectronic apparatus, and methods of using same

INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USING THE INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF INTERPOSER SUBSTRATE, AND MANUFACTURING METHOD OF LSI CHIP

Semiconductor integrated circuit device

Semiconductor apparatus and manufacturing method of the same

Method for manufacturing hetero-bonded wafer

Electronic module with feed through conductor between wiring patterns

Integrated package

Semiconductor Device and Method of Manufacturing the Same

Semiconductor device

Semiconductor device, semiconductor wafer and manufacturing method of the same

Method for connecting a precious metal surface to a polymer

UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES

Processed wafer via

Method of manufacturing semiconductor device including exposing a dicing line on a wafer

Semiconductor die attachment method using non-conductive screen print and dispense adhesive

METHOD OF MANUFACTURING DICING DIE-BONDING FILM

Thermal interface material and method of using the same and electronic assembly having the same

Source driver, method for manufacturing same, and liquid crystal module

Packaged electronic devices having die attach regions with selective thin dielectric layer

Semiconductor device

Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method

Stacked package and method for forming stacked package

Forming semiconductor chip connections

Electronic component and method of connecting with multi-profile bumps

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIREBOND STRUCTURES

Semiconductor device

Lead frame, lead frame fabrication, and semiconductor device

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME

THIN FILM DEVICE, FLEXIBLE CIRCUIT BOARD INCLUDING THIN FILM DEVICE, AND METHOD FOR MANUFACTURING THIN FILM DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING AN ELECTRICAL CHARACTERISTIC OF A SEMICONDUCTOR DEVICE

Bonding apparatus and bonding stage height adjustment method for the bonding apparatus

Aluminum bond pads with enhanced wire bond stability

Wiring board and method for manufacturing the same

Composite multi-layer substrate and module using the substrate

Method and Apparatus for Building Multilayer Circuits

Method of manufacturing electronic component device

Components packaging method

Chair pad charging and communication system for a battery-powered microstimulator

Method of fabricating stacked semiconductor chips

Electronic system modules and method of fabrication

Method for stacking serially-connected integrated circuits and multi-chip device made from same

Power semiconductor device and method for its production

Method for producing electric contacts on a semiconductor component

Semiconductor device having a semiconductor chip, and method for the production thereof

Semiconductor device and method for fabricating the same

Semiconductor chip package with post electrodes

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT

Wafer level chip scale package

Wiring substrate and semiconductor device having connection pads formed in non-solder mask defined structure

Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate

Semiconductor device and method of forming the same

Semiconductor device

Semiconductor device having surface protective films on bond pad

Semiconductor device

Electronic component mounted structure

Bonding wire for semiconductor devices

SEMICONDUCTOR PACKAGE

Method for assembling components of a microstimulator

Patterned die attach and packaging method using the same

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

METHOD FOR MANUFACTURING NITRIDE BASED SINGLE CRYSTAL SUBSTRATE AND METHOD FOR MANUFACTURING NITRIDE BASED SEMICONDUCTOR DEVICE

Semiconductor package, lead frame, and wiring board with the same

Semiconductor device and display apparatus

System-in packages

Multi chip semiconductor device

Semiconductor component and assumbly with projecting electrode

Semiconductor power module

3D integration structure and method using bonded metal planes

Semiconductor device

Semiconductor package and manufacturing method of the semiconductor package

COPPER PLATE BONDING FOR HIGH PERFORMANCE SEMICONDUCTOR PACKAGING

Semiconductor device

Semiconductor device

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

ELEMENT MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME, CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME, AND MOBILE APPLIANCE ( as amended

Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD COMPRISING COOLING MEMBER AND METHOD OF MANUFACTURING THE SAME

Wireless communication system

Method for fabricating QFN semiconductor package

Die down ball grid array packages and method for making same

Connecting film, and joined structure and method for producing the same

Antennas using chip-package interconnections for millimeter-wave wireless communication

Semiconductor chip and semiconductor device including the same

Circuit substrate and method for utilizing packaging of the circuit substrate

Structure and method for forming a capacitively coupled chip-to-chip signaling interface

Semiconductor device

Semiconductor device

Structure and method of forming a pad structure having enhanced reliability

Bump pad structure

Semiconductor structure

SEMICONDUCTOR CHIP PACKAGE

Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same

QFN semiconductor package

QFN semiconductor package

Method for packing semiconductor components and product produced according to the method

Semiconductor device and method for fabricating the same

Massively parallel interconnect fabric for complex semiconductor devices

Optoelectronic system

Bonding wire for semiconductor device

DIE ATTACH FILM-PROVIDED DICING TAPE AND PRODUCTION PROCESS OF SEMICONDUCTOR DEVICE

Semiconductor bond pad patterns and method of formation

Package with multiple dies

Low-Voiding Die Attach Film, Semiconductor Package, and Processes for Making and Using Same

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Fabrication method of semiconductor integrated circuit device

Light emitting device package and method of fabricating the same

Manufacturing method of semiconductor integrated circuit device

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Semiconductor component with terminal contact surface

Electronic component for surface mounting

Plastic package and method of fabricating the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method to manufacture thereof

Semiconductor module

Semiconductor device

Semiconductor device

Semiconductor device including a magnetic sensor chip

Optoelectronic semiconductor chip, optoelectronic component and a method for producing an optoelectronic component

Method for making a semiconductor device on a flexible substrate

Semiconductor package including power ball matrix and power ring having improved power integrity

Barrier layer for fine-pitch mask-based substrate bumping

Method of interconnecting electronic wafers

CHIP PACKAGING METHOD

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

SOLDER BALL PRINTING APPARATUS AND SOLDER BALL PRINTING METHOD

SEMICONDUCTOR DEVICE

Multi-chip stacked package

Microelectronic packages fabricated at the wafer level and methods therefor

High quality electrical contacts between integrated circuit chips

Method for connecting two joining surfaces

Semiconductor device

Dual Interconnection in Stacked Memory and Controller Module

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device, method of manufacturing the same, and silane coupling agent

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

Method for Mounting Flip Chip and Substrate Used Therein

Component mounting apparatus, component mounting head, and component mounting method

Semiconductor device and method for manufacturing the same

Carbon nanotubes for the selective transfer of heat from electronics

PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME

Semiconductor die packages using thin dies and metal substrates

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

METHOD FOR APPLYING ELECTRICAL CONTACTS ON SEMICONDUCTING SUBSTRATES, SEMICONDUCTING SUBSTRATE AND USE OF THE METHOD

Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor

Component mounting method

Packaged electronic device having metal comprising self-healing die attach material

Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module

Semiconductor device and manufacturing method thereof

Methods of fluxless micro-piercing of solder balls, and resulting devices

IC package reducing wiring layers on substrate and its carrier

Electronic device package

Stacked chip package structure with leadframe having bus bar

Stacked chip package structure with leadframe having bus bar

Panel, semiconductor device and method for the production thereof

High breakdown voltage semiconductor device and high voltage integrated circuit

Anti-reflection structures for CMOS image sensors

Semiconductor chip pad structure and method for manufacturing the same

Semiconductor integrated circuit device and method of manufacturing same

Metal wiring structures for uniform current density in C4 balls

Solder layer, heat sink using such a solder layer and method for manufacturing such a heat sink

Electronic component mounting apparatus

Manufacturing method of semiconductor device with surface mounting terminals

Wafer level packaging method

THERMOSETTING DIE BONDING FILM

Manufacturing method of semiconductor integrated circuit device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Remote chip attachment

Widebody coil isolators

Exposed die pad package with power ring

Semiconductor device capable of switching operation modes

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Assembling substrates that can form 3-D structures

PACKAGE WITH SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH PACKAGE

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Ball-limiting-metallurgy layers in solder ball structures

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Semiconductor package and manufacturing method thereof

Semiconductor device, method of forming the same, and electronic device

Supporting substrate before cutting, semiconductor device, and method of forming semiconductor device

Semiconductor device and method of forming the same

Relay board and semiconductor device having the relay board

Semiconductor die package and method for making the same

Pre-molded clip structure

Pre-molded clip structure

Semiconductor device and manufacturing method thereof

ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Manufacturing method of advanced quad flat non-leaded package

Conductive through connection and forming method thereof

Unit pixel of image sensor having three-dimensional structure and method for manufacturing the same

Light-emitting diode package and wafer-level packaging process of light-emitting diode

Method of transferring device

Electronic component mounting method

3D-IC Verification Method

Semiconductor device having elastic solder bump to prevent disconnection

Method of fabricating a two-sided die in a four-sided leadframe based package

Method of manufacturing a semiconductor device including plural semiconductor chips

STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS

SYSTEMS AND METHODS FOR AFFIXING A SILICON DEVICE TO A SUPPORT STRUCTURE

Electronic board, method of manufacturing the same, and electronic device

RF POWER AMPLIFIER CIRCUIT UTILIZING BONDWIRES IN IMPEDANCE MATCHING

DC/DC converter package having separate logic and power ground terminals

Chip module and method for producing a chip module having plains of extensions for chip and substrate

Electronic device and method of manufacturing same

Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the same

Semiconductor device

Semiconductor device with pads overlapping wiring layers including dummy wiring

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Electronic device and method of packaging an electronic device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

Joining method and device produced by this method and joining unit

Electronic component

Method of fabricating a semiconductor device

Method of manufacturing semiconductor device

Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for electronic part

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULES

Method of manufacturing a semiconductor device by lamination

Method of making chip-on-lead package

Integrated circuit chip using top post-passivation technology and bottom structure technology

Interconnect structure and a method of fabricating the same

Electronic apparatus produced using lead-free bonding material for soldering

Electronic package with stacked modules with channels passing through metal layers of the modules

Method and apparatus for distributing a thermal interface material

Semiconductor device and method of manufacturing the same

Method of joining electronic component and the electronic component

Assembly of electronic components

THREE-DIMENSIONAL ELECTRONICS PACKAGE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor device having integral structure of contact pad and conductive line