212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Apparatus, system, and method for wireless connection in integrated circuit packages
#3302Chip packages
#3303Electronic component with mechanically decoupled ball connections
#3304Semiconductor device
#3305Integrated circuit package and method of making same
#3306Semiconductor device with hollow and throughhole and method of manufacturing same
#3307Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof
#3308Semiconductor device
#3309Semiconductor device and method of manufacturing the same
#3310Semiconductor device and method of manufacturing same
#3311Semiconductor device and manufacturing method therefor
#3312Multichip discrete package
#3313Lead frame and method for manufacturing circuit device using the same
#3314Circuit device having funnel shaped lead and method for manufacturing the same
#3315SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#3316Integrated circuit having wiring structure, solid image pickup element having the wiring structure, and imaging device having the solid image pickup element
#3317Wafer level packaging using flip chip mounting
#3318Component mounting apparatus and method
#3319Method of manufacturing printed circuit board
#3320Electronic parts mounting device
#3321PROCESS FOR STRIPPING PHOTORESIST AND REMOVING DIELECTRIC LINER
#3322Film-like adhesive, adhesive sheet, and semiconductor device using same
#3323Composite alloy bonding wire and manufacturing method thereof
#3324COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF
#3325Semiconductor package
#3326Power module
#3327Structure and Method for Thin Single or Multichip Semiconductor QFN Packages
#3328Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#3329IO cell with multiple IO ports and related techniques for layout area saving
#3330Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads
#3331SEMICONDUCTOR DEVICE, AND STACKED STRUCTURE, PACKAGE, MODULE, AND ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME
#3332PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF
#3333Semiconductor device and method of manufacturing the same
#3334Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#3335PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING A PRINTED CIRCUIT BOARD
#3336SEMICONDUCTOR DEVICE
#3337Semiconductor package
#3338Semiconductor device and wire bonding method
#3339Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die
#3340SEMICONDUCTOR DEVICE AND BACKSIDE ILLUMINATION SOLID-STATE IMAGING DEVICE
#3341Semiconductor device having finger electrodes
#3342Semiconductor device and method for manufacturing the same
#3343ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SHEET
#3344Method for forming functional element using metal-to-insulator transition material, functional element formed by method, method for producing functional device, and functional device produced by method
#3345Method for manufacturing semiconductor apparatus
#3346Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
#3347Reconfigured wafer alignment
#3348DICING DIE-BONDING FILM
#3349Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
#3350Light emitting device package and method of fabricating the same
#3351FLMP buck converter with a molded capacitor and a method of the same
#3352Microelectronic assembly with impedance controlled wirebond and reference wirebond
#3353SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM
#3354Semiconductor device
#3355Microelectronic assembly with impedance controlled wirebond and conductive reference element
#3356Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die
#3357Semiconductor device having a conductive bump
#3358Wire loop and method of forming the wire loop
#3359Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
#3360Semiconductor device
#3361Semiconductor device including spacer element
#3362Warp-suppressed semiconductor device
#3363Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structure
#3364SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#3365Electrical interconnect forming method
#3366Electrical interconnect forming method
#3367BONDING METHOD AND BONDING DEVICE
#3368Conductive ball mounting apparatus and conductive ball mounting method
#3369Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same
#3370Electrical interconnect structure
#3371Method and apparatus for electronic component mounting
#3372Peeling sheet with adhesive of epoxy acrylate, non-unsaturated resin and bis(methacryloyloxyethyl) hydrogen phosphate
#3373Printed circuit board and method of manufacturing printed circuit board
#3374Semiconductor device
#3375Integrated circuit for driving semiconductor device and power converter
#3376Wire bond interconnection
#3377Integrated circuit packaging system with stacked die and method of manufacture thereof
#3378Chips having rear contacts connected by through vias to front contacts
#3379MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
#3380Semiconductor device
#3381Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
#3382Stress buffering package for a semiconductor component
#3383Mounted body and method for manufacturing the same
#3384SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE IN WHICH CIRCUIT BOARD AND SEMICONDUCTOR CHIP ARE CONNECTED BY LEADS
#3385Leadless integrated circuit package having electrically routed contacts
#3386Electronic device including dies, a dielectric layer, and a encapsulating layer
#3387Semiconductor device having a junction FET and a MISFET for control
#3388WIRE SUPPLY DEVICE FOR A WIRE BONDER
#3389Micro-fluidic injection molded solder (IMS)
#3390WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
#3391Method to build robust mechanical structures on substrate surfaces
#3392METHOD OF PRODUCING SEMICONDUCTOR DEVICE
#3393Manufacturing method of semiconductor device
#3394Method of manufacturing ball grid array type semiconductor device
#3395Reversible leadless package and methods of making and using same
#3396Multi-surface IC packaging structures and methods for their manufacture
#3397Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
#3398Electronic substrate, semiconductor device, and electronic device
#3399Semiconductor device having shifted stacked chips
#3400METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
#3401SEMICONDUCTOR DEVICE
#3402Metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom
#3403WINDOW TYPE SEMICONDUCTOR PACKAGE
#3404Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method
#3405Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#3406PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
#3407Chip capacitive coupling
#3408MIM decoupling capacitors under a contact pad
#3409Manufacturing method of mounting part of semiconductor light emitting element, manufacturing method of light emitting device, and semiconductor light emitting element
#3410Bonding tool and electronic component mounting apparatus and method
#3411Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
#3412DIE ATTACH AREA CUT-ON-FLY METHOD AND APPARATUS
#3413Integrated circuit micro-module
#3414Ribbon bonding in an electronic package
#3415Multilayer wiring board and method for manufacturing the same
#3416Electronics module comprising an embedded microcircuit
#3417Arrangement comprising an optoelectronic component
#3418Method for Manufacturing Imaging Device, Imaging Device and Portable Terminal
#3419Display apparatus
#3420Method of manufacturing a semiconductor device and a semiconductor device produced thereby
#3421Semiconductor device
#3422Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package
#3423Wire bonding structure and method for forming same
#3424Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
#3425Semiconductor device having wiring layers with power-supply plane and ground plane
#3426Integrated circuit micro-module
#3427Integrated circuit micro-module
#3428Integrated circuit micro-module
#3429Integrated circuit micro-module
#3430Integrated circuit micro-module
#3431SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#3432Stack package
#3433SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
#3434Systems and methods of tamper proof packaging of a semiconductor device
#3435Electronic device
#3436Bidirectional switch module
#3437Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the same
#3438WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
#3439Method for fabricating a bond
#3440Formation of solder bumps
#3441Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same
#3442Method of mounting LED chip
#3443Method for contacting electronic components by means of a substrate plate
#3444Wire bonding method and semiconductor device
#3445Semiconductor device including conductive element
#3446Semiconductor module, method for manufacturing semiconductor module, and portable device
#3447Semiconductor device
#3448Semiconductor device packages with electromagnetic interference shielding
#3449Manufacturing method of semiconductor device
#3450Semiconductor apparatus with decoupling capacitor
#3451Semiconductor device and wire bonding method
#3452Electronic Device and Method of Manufacturing Same
#3453Electronic component device, and method of manufacturing the same
#3454Wire bonding method, wire bonding apparatus, and wire bonding control program
#3455Wire bonding apparatus, record medium storing bonding control program, and bonding method
#3456Connection structure, power module and method of manufacturing the same
#3457Process for placing, securing and interconnecting electronic components
#3458Method of refining solder materials
#3459Method of manufacturing semiconductor device, and wire bonder
#3460Method for manufacturing semiconductor
#3461Chip assembly
#3462Electric module having a conductive pattern layer
#3463Semiconductor device and method for manufacturing semiconductor device
#3464Bond pad support structure for semiconductor device
#3465Lock and key through-via method for wafer level 3D integration and structures produced
#3466Grain refinement by precipitate formation in PB-free alloys of tin
#3467Semiconductor device and a method of manufacturing the same
#3468Semiconductor device and manufacturing method thereof
#3469Power transistor package with integrated bus bar
#3470Layered chip package with wiring on the side surfaces
#3471Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
#3472Electronic-component-housing package and electronic device
#3473SUPER GTO-BASED POWER BLOCKS
#3474Anisotropic conductive adhesive
#3475Adhesive bonding method
#3476CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP
#3477Coaxial through chip connection
#3478Implantable microelectronic device and method of manufacture
#3479Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method
#3480Method of making semiconductor device packaged by sealing resin member
#3481Dicing film having shrinkage release film and method for manufacturing semiconductor package using the same
#3482Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same
#3483Integrated multicomponent device in a semiconducting die
#3484Electronic member, electronic part and manufacturing method therefor
#3485Semiconductor wafer coated with a filled, spin-coatable material
#3486WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO
#3487Structure of UBM and solder bumps and methods of fabrication
#3488Flip chip interconnection having narrow interconnection sites on the substrate
#3489Semiconductor module having semiconductor device mounted on device mounting substrate
#3490Reinforced structure for a stack of layers in a semiconductor component
#3491Thermally enhanced semiconductor package
#3492SEMICONDUCTOR MODULE
#3493Semiconductor device
#3494Integrated antennas in wafer level package
#3495Semiconductor device having a sealing body and partially exposed conductors
#3496Semiconductor device stack with bonding layer and wire retaining member
#3497Package-on-package using through-hole via die on saw streets
#3498SEMICONDUCTOR DEVICE
#3499Memory card and method for manufacturing memory card
#3500Semiconductor device and manufacturing method therefor
#3501Semiconductor die package and method for making the same
#3502SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING
#3503Optical element package and method of manufacturing the same
#3504Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same
#3505Method for producing an electrical and mechanical connection and an assembly comprising such a connection
#3506THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#3507METHOD OF FORMING CONNECTION TERMINAL
#3508Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof
#3509Semiconductor device and production method therefor
#3510Method of manufacturing semiconductor device
#3511Manufacturing method of semiconductor device
#3512METAL BONDED NANOTUBE ARRAY
#3513Method for manufacturing an electronic module
#3514Power device and a method for controlling a power device
#3515Method and apparatus for manufacturing an electronic module, and electronic module
#3516SEMICONDUCTOR DEVICE
#3517Reduced bottom roughness of stress buffering element of a semiconductor component
#3518Semiconductor package comprising alignment members
#3519Semiconductor device and method of manufacturing the same
#3520Semiconductor device and method of manufacturing the same
#3521WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
#3522Adhesive tape and semiconductor package using the same
#3523Process for packaging components, and packaged components
#3524Semiconductor device and method for manufacturing semiconductor device
#3525Monolithic semiconductor switches and method for manufacturing
#3526Semiconductor device and production method therefor
#3527Lead pin for mounting semiconductor and printed wiring board
#3528Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer
#3529CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME
#3530Method for packing electric components on a substrate
#3531Method for producing a metal-ceramic substrate for electric circuits on modules
#3532FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION
#3533Method of manufacturing semiconductor device
#3534Resin sealing method of semiconductor device
#3535Metallized substrate and method for producing the same
#3536Semiconductor device including single circuit element for soldering
#35373D integration of vertical components in reconstituted substrates
#3538CONTACT STRUCTURE FOR A SEMICONDUCTOR AND METHOD FOR PRODUCING THE SAME
#3539SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#3540Semiconductor device having lead free solders between semiconductor chip and frame and fabrication method thereof
#3541Achieving mechanical and thermal stability in a multi-chip package
#3542Lead frames with improved adhesion to plastic encapsulant
#3543Semiconductor device which exposes die pad without covered by interposer and its manufacturing method
#3544Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device
#3545SEMICONDUCTOR DEVICE
#3546Semiconductor device and method for manufacturing
#3547Semiconductor device including bonding pads and semiconductor package including the semiconductor device
#3548Wire bonding apparatus and wire bonding method
#3549Method of teaching eyepoints for wire bonding and related semiconductor processing operations
#3550Dual metal for a backside package of backside illuminated image sensor
#3551Semiconductor device and fabrication method for the same
#3552Semiconductor IC and Its Manufacturing Method, and Module with Embedded Semiconductor IC and Its Manufacturing Method
#3553Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps
#3554Laser bonding for stacking semiconductor substrates
#3555Semiconductor device having a plurality of semiconductor constructs
#3556ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME
#3557PRESSURE-SENSITIVE ADHESIVE SHEET
#3558Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps
#3559Semiconductor device and method of fabricating the same
#3560Semiconductor device package and method of assembly thereof
#3561Wafer level vertical diode package structure and method for making the same
#3562Semiconductor device including wires connecting electrodes to an inner lead
#3563Semiconductor device, method for manufacturing the same, and multilayer substrate having the same
#3564Metal schemes of trench MOSFET for copper bonding
#3565ADHESIVE FILM AND SEMICONDUCTOR DEVICE HAVING THE SAME
#3566PACKAGED POWER SWITCHING DEVICE
#3567HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAME
#3568SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#3569Electronic device and electronic apparatus
#3570Method of Producing Optoelectronic Components and Optoelectronic Component
#3571Marking method for semiconductor device and semiconductor device provided with markings
#3572Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips
#3573Semiconductor device
#3574Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries
#3575Three-dimensional package
#3576Isolation Structure for Stacked Dies
#3577Semiconductor device with output circuit arrangement
#3578Detection device and method for manufacturing the same
#3579Rigid-flex module and manufacturing method
#3580DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEMBLING OF CHIP-SCALE, AND NANO AND MICRO-SCALE COMPONENTS ONTO A SUBSTRATE
#3581Method for producing an electronic subassembly
#3582METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#3583Structures and methods for improving solder bump connections in semiconductor devices
#3584REDUCING WARPAGE FOR FAN-OUT WAFER LEVEL PACKAGING
#3585SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS
#3586Method for the production of alpha-calcium sulfate hemihydrate from calcium sulfate dihydrate
#3587Integrally formed light emitting diode light wire and uses thereof
#3588Through-hole electrode substrate and method of manufacturing the same
#3589Semiconductor device
#3590Semiconductor device and method of manufacturing the same
#3591Structures and methods for improving solder bump connections in semiconductor devices
#3592Semiconductor device
#3593Ball land structure having barrier pattern
#3594Bump-on-lead flip chip interconnection
#3595Structures and methods for improving solder bump connections in semiconductor devices
#3596System-in-package packaging for minimizing bond wire contamination and yield loss
#3597Semiconductor device and manufacturing method thereof
#3598Multi-die building block for stacked-die package
#3599Manufacturing method for semiconductor devices and semiconductor device
#3600Semiconductor device and method of manufacturing same