212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls
#7502Reversible leadless package and methods of making and using same
#7503Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit
#7504Semiconductor device
#7505Semiconductor chip having bond pads
#7506Semiconductor chip having bond pads
#7507Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon
#7508Semiconductor device and method for manufacturing the same
#7509EMBEDDED SEMICONDUCTOR DEVICE SUBSTRATE AND PRODUCTION METHOD THEREOF
#7510Semiconductor device
#7511Semiconductor device
#7512Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
#7513Semiconductor device
#7514Semiconductor chip having bond pads
#7515Integrated circuit package system with integrated circuit support
#7516Semiconductor device and fabrication method for the same
#7517Wire bonding method
#7518Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves
#7519Method for pressure bonding and method for manufacturing semiconductor device
#7520Method for forming a joint
#7521Method of Forming Bump, Method of Forming Image Sensor Using the Method, Semiconductor Chip and the Sensor so Formed
#7522Small chips with fan-out leads
#7523Bonding a non-metal body to a metal surface using inductive heating
#7524Semiconductor device, fabrication method therefor, and film fabrication method
#7525Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
#7526BRACE FOR WIRE LOOP
#7527Solder joint flip chip interconnection
#7528Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#7529Packaging methods
#7530Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
#7531Photosensitive composition
#7532Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
#7533Liquid epoxy resin composition
#7534Liquid epoxy resin composition
#7535Mm-wave antenna using conventional IC packaging
#7536Constant voltage diode
#7537Universal wafer carrier for wafer level die burn-in
#7538CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME
#7539Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding
#7540Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device
#7541Reduction of macro level stresses in copper/low-K wafers
#7542Composite carbon nanotube thermal interface device
#7543Method for making stacked integrated circuits (ICs) using prepackaged parts
#7544Multi-stack chip package with wired bonded chips
#7545Electrode package for semiconductor device
#7546Lead arrangement and chip package using the same
#7547Low profile semiconductor package
#7548Power module having at least two substrates
#7549Method for forming multi-layer bumps on a substrate
#7550Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor
#7551Reflow apparatus, a reflow method, and a manufacturing method of semiconductor device
#7552Manufacturing method for magnetic sensor and lead frame therefor
#7553Methods and apparatus for Flip-Chip-On-Lead semiconductor package
#7554Method of making stacked die package
#7555Method of manufacturing flash memory cards
#7556Fabrication method for a chip packaging structure
#7557Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device
#7558Semiconductor device including a particular dummy terminal
#7559METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD
#7560Junction structure for a terminal pad and solder, and semiconductor device having the same
#7561Void-free circuit board and semiconductor package having the same
#7562Semiconductor device with inclined through holes
#7563Semiconductor device and manufacturing method of the same
#7564Printed wiring board
#7565Semiconductor device
#7566Semiconductor device with solder balls having high reliability
#7567Semiconductor device featuring electrode terminals forming superior heat-radiation system
#7568Semiconductor device and manufacturing method thereof
#7569Structure and self-locating method of making capped chips
#7570Structure and method of making capped chips having vertical interconnects
#7571Semiconductor device having an electronic circuit disposed therein
#7572Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips
#7573Back-face and edge interconnects for lidded package
#7574Multilayered circuit substrate with semiconductor device incorporated therein
#7575Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die
#7576Implantable microelectronic device and method of manufacture
#7577Structure for protecting electronic packaging contacts from stress
#7578Packaging for high speed integrated circuits
#7579Integrated circuit packaging
#7580High frequency chip packages with connecting elements
#7581Multilayered printed circuit board and method for manufacturing the same
#7582Method for mounting electronic component
#7583Production method for device
#7584Method for evaluating and modifying solder attach design for integrated circuit packaging assembly
#7585METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH REDUCED MOISTURE SENSITIVITY
#7586Semiconductor device packaging for avoiding metal contamination
#7587Semiconductor component and method for production of a semiconductor component
#7588Method for manufacturing a semiconductor device
#7589Methods and apparatuses for fluidic self assembly
#7590Plastic packaged device with die interface layer
#7591BONDING PAD AND DISPLAY PANEL
#7592Semiconductor device and method for producing the same
#7593Chip-packaging composition of resin and cycloaliphatic amine hardener
#7594Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component
#7595Integrated chip device in a package
#7596Semiconductor device that attains a high integration
#7597Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking
#7598Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
#7599Housed DRAM chip for high-speed applications
#7600Production process for manufacturing such semiconductor package
#7601Electronic module and method of assembling the same
#7602Wafer-to-wafer stack with supporting pedestal
#7603Semiconductor device with a dummy electrode
#7604Radio frequency power semiconductor device package comprising dielectric platform and shielding plate
#7605Adhesive composition and sheet having an adhesive layer of the composition
#7606Semiconductor device and method for manufacturing thereof
#7607Electronic part mounting substrate and method for producing same
#7608Method of producing image display unit
#7609Semiconductor component and method for contracting said semiconductor component
#7610Etchant and method for forming bumps
#7611Method for applying a structure of joining material to the back surfaces of semiconductor chips
#7612METHOD AND STRUCTURE FOR VERTICALLY-STACKED DEVICE CONTACT
#7613Underfill aiding process for a tape
#7614CHIP PACKAGE METHOD
#7615Methods for magnetically directed self assembly
#7616Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument
#7617Method for manufacturing semiconductor module using interconnection structure
#7618Encapsulation of a chip module
#7619Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor
#7620Semiconductor device with multiple designation marks
#7621Method for manufacture of wafer level package with air pads
#7622Semiconductor device having a semiconductor chip, and method for the production thereof
#7623Chip scale power LDMOS device
#7624Power semiconductor device in lead frame employing connecting element with conductive film
#7625Semiconductor chip and method of manufacturing semiconductor chip
#7626Semiconductor device and fabrication method thereof
#7627Power semiconductor module with overcurrent protective device
#7628Conductor substrate, semiconductor device and production method thereof
#7629SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES
#7630Semiconductor assembly for improved device warpage and solder ball coplanarity
#7631Method and apparatus for manufacturing IC chip packaged device
#7632Bonding apparatus comprising improved oscillation amplification device
#7633Method for manufacturing nitride based single crystal substrate and method for manufacturing nitride based semiconductor device
#7634Method for forming bonding pad and semiconductor device having the bonding pad formed thereby
#7635Semiconductor device with semiconductor chip and adhesive film and method for producing the same
#7636Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure
#7637Bond pads and methods for fabricating the same
#7638Semiconductor chip having a bump with conductive particles and method of manufacturing the same
#7639Bump structure and its forming method
#7640Intermetallic solder with low melting point
#7641Electronic apparatus
#7642Electronic circuit chip, and electronic circuit device and method for manufacturing the same
#7643Semiconductor module having a coupling substrate, and methods for its production
#7644Semiconductor packaging process and carrier for semiconductor package
#7645Semiconductor device and a method of manufacturing the same
#7646Semiconductor device with front side metallization and method for the production thereof
#7647Ultrasonic horn
#7648Wiring board, semiconductor device, and method of manufacturing the same
#7649Method of manufacturing a semiconductor device including a bump forming process
#7650Semiconductor device and a manufacturing method of the same
#7651Microelectronic packages and methods therefor
#7652Wiring board and capacitor
#7653Chip embedded packaging structure
#7654Power semiconductor module
#7655Contact carriers (tiles) for populating larger substrates with spring contacts
#7656Relay board and semiconductor device having the relay board
#7657Solder joint intermetallic compounds with improved ductility and toughness
#7658Wiring board
#7659Semiconductor chip and semiconductor device
#7660Electronic device, semiconductor device using same, and method for manufacturing semiconductor device
#7661Semiconductor device having metallic lead and electronic device having lead frame
#7662Semiconductor device and a manufacturing method of the same
#7663Semiconductor package
#7664Semiconductor device and radiation detector employing it
#7665Wafer-level method for metallizing source, gate and drain contact areas of semiconductor die
#7666Printed circuit board and manufacturing method thereof
#7667Electronic module design to maximize volume efficiency
#7668Semiconductor device and method for manufacturing the same
#7669Method for separating package of WLP
#7670Methods for protecting metal surfaces
#7671Contacts to microdevices
#7672Semiconductor device with improved design freedom of external terminal
#7673Solder bump structure for flip chip semiconductor devices and method of manufacture therefore
#7674Modular bonding pad structure and method
#7675Stackable device, device stack and method for fabricating the same
#7676Semiconductor device featuring large reinforcing elements in pad area
#7677Flash memory card
#7678Packaged die on PCB with heat sink encapsulant and methods
#7679Semiconductor IC-embedded substrate and method for manufacturing same
#7680Gel package structural enhancement of compression system board connections
#7681Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip
#7682Bumpless chip package and fabricating process thereof
#7683Power semiconductor module with MOS chip
#7684Molded semiconductor package
#7685Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same
#7686Semiconductor device with a resin-sealed optical semiconductor element
#7687LSI design support apparatus and LSI design support method
#7688Electric contact and method for producing the same and connector using the electric contacts
#7689Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film
#7690Semiconductor device and a method of manufacturing the same
#7691Method for patterning and etching a passivation layer
#7692Method of electrically connecting a microelectronic component
#7693Semiconductor manufacturing method
#7694Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
#7695Method of forming a semiconductor device
#7696THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY
#7697Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices
#7698Packages, anisotropic conductive films, and conductive particles utilized therein
#7699Display device and manufacturing method of the same
#7700Chip package structure and bumping process
#7701QFN/SON compatible package with SMT land pads
#7702Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#7703Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#7704Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#7705Chip package structure and bumping process
#7706Method for producing bonding connection of semiconductor device
#7707Semiconductor apparatus integrating an electrical device under an electrode pad
#7708Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#7709Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#7710Method for manufacturing electronic modules
#7711Monitoring deformation and time to logically constrain a bonding process
#7712Selective consolidation methods for fabricating semiconductor device components and conductive features thereof
#7713INDUCTIVE STRUCTURE
#7714Fan out type wafer level package structure and method of the same
#7715Apparatuses and methods for high speed bonding
#7716Semiconductor chip having bond pads
#7717Electronic device and manufacturing method therefor
#7718Semiconductor device having metallic plate with groove
#7719Semiconductor package having plate interconnections
#7720Semiconductor chip having bond pads and multi-chip package
#7721Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein
#7722System in package (SIP) structure
#7723Multi-part lead frame with dissimilar materials
#7724Multi-part lead frame with dissimilar materials
#7725Power semiconductor device and method therefor
#7726Self-centering braze assembly methods
#7727Semiconductor device and automotive AC generator
#7728Bonding structure with buffer layer and method of forming the same
#7729Methods for electronic fluorescent perturbation for analysis and electronic perturbation catalysis for synthesis
#7730Grooved substrates for uniform underfilling solder ball assembled electronic devices
#7731METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES
#7732Integrated die bumping process
#7733Metal duplex method
#7734Manufacturing method of electronic device
#7735Support with solder ball elements and a method for populating substrates with solder balls
#7736Elastomer interposer with voids in a compressive loading system
#7737Semiconductor device and method for fabricating the same
#7738Metal duplex method
#7739Integrated circuit chip and manufacturing process thereof
#7740Semiconductor device and manufacturing method thereof
#7741Encapsulated electronic part packaging structure
#7742Semiconductor device having a probing region
#7743Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#7744Semiconductor device and method of manufacturing the same
#7745Resin mold type semiconductor device
#7746Die pad for semiconductor packages and methods of making and using same
#7747Semiconductor device having pads and which minimizes defects due to bonding and probing processes
#7748Semiconductor device and power conversion apparatus using the same
#7749Light emitting diode and method for manufacturing the same
#7750Stack type package module and method for manufacturing the same
#7751Quinolinols as fluxing and accelerating agents for underfill compositions
#7752Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives
#7753Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness
#7754Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts
#7755Stacked chip package using photosensitive polymer and manufacturing method thereof
#7756Microfeature workpieces, carriers, and associated methods
#7757Wafer-level package and IC module assembly method for the wafer-level package
#7758Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices
#7759Device transferring method, and device arraying method
#7760Solid image pickup unit and camera module
#7761Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
#7762Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
#7763Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
#7764Chip package and bump connecting structure thereof
#7765Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
#7766Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same
#7767Stacked microelectronic devices and methods for manufacturing microelectronic devices
#7768Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
#7769Method for forming a double embossing structure
#7770Semiconductor packages for surface mounting and method of producing same
#7771Alpha particle shields in chip packaging
#7772Lead-containing solder bumps
#7773Lead-containing solder paste
#7774Lead-containing anodes
#7775Semiconductor device and semiconductor chip
#7776Stacked chip package using warp preventing insulative material and manufacturing method thereof
#7777Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices
#7778Wafer integrated rigid support ring
#7779Thermal paste containment for semiconductor modules
#7780Wiring board construction including embedded ceramic capacitors(s)
#7781Microfeature assemblies including interconnect structures and methods for forming such interconnect structures
#7782Quad flat pack (QFP) package and flexible power distribution method therefor
#7783Microelectronic devices and methods for manufacturing microelectronic devices
#7784Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#7785Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#7786Semiconductor device and manufacturing method thereof
#7787Semiconductor device and method of manufacturing the same
#7788Display panel package
#7789Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method
#7790Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
#7791Integrated circuit device
#7792Method for producing semiconductor device and semiconductor device
#7793Hybridization of polynucleotides conjugated with chromophores and fluorophores to generate donor-to-donor energy transfer system
#7794Bonding program
#7795Method and device for producing a system having a component applied to a predetermined location of a surface of a substrate
#7796RFID inlays and methods of their manufacture
#7797Actuator and bonding apparatus
#7798Encapsulated chip scale package having flip-chip on lead frame structure and method
#7799Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#7800Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features