212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Underfilled semiconductor die assemblies and methods of forming the same
#7802Semiconductor power component with a vertical current path through a semiconductor power chip
#7803Semiconductor device
#7804MOSFET package
#7805MOSFET package
#7806Leadframe package with dual lead configurations
#7807High current semiconductor device system having low resistance and inductance
#7808Bi-directional switch, and use of said switch
#7809Semiconductor connection component
#7810Power semiconductor packaging method and structure
#7811Integrated circuit device
#78123D IC method and device
#7813Manufacturing method of semiconductor device
#7814Semiconductor device and a manufacturing method of the same
#7815Semiconductor package with contact support layer and method to produce the package
#7816Method and apparatus for flip-chip bonding
#7817Method and device for attaching a chip in a housing
#7818Method And Device For Enhancing Solderability
#7819Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly
#7820Bonding apparatus
#7821Bonding pattern discrimination device
#7822Bonding pattern discrimination program
#7823Bonded structure and bonding method
#7824Semiconductor device with improved contacts
#7825Semiconductor device and method of manufacturing the same
#7826Printed circuit board and electronic apparatus including printed circuit board
#7827Multi-chip semiconductor device package
#7828Stack structure with semiconductor chip embedded in carrier
#7829Semiconductor module
#7830Semiconductor device and a manufacturing method of the same
#7831Semiconductor device electronic component, circuit board, and electronic device
#7832Semiconductor assembly and packaging for high current and low inductance
#7833Insulated gate semiconductor device and manufacturing method thereof
#7834Semiconductor device
#7835Method for controlling telemetry in an implantable medical device based on power source capacity
#7836Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side
#7837Mounting structure, electro-optical device, and electronic apparatus
#7838Apparatuses and methods facilitating functional block deposition
#7839Solder composition for electronic devices
#7840Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
#7841Semiconductor device
#7842Semiconductor device
#7843SEMICONDUCTOR DEVICE
#7844Semiconductor device and method of manufacturing the same
#7845Radio frequency over-molded leadframe package
#7846Semiconductor device
#7847SEMICONDUCTOR DEVICE
#7848High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system
#7849METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#7850Method for manufacturing semiconductor device
#7851Method of making a stacked die package
#7852Methods of bonding two semiconductor devices
#7853Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof
#7854Laminated electronic component and method for producing the same
#7855Technique for efficiently patterning an underbump metallization layer using a dry etch process
#7856Semiconductor device and method of manufacturing the same
#7857Bonding pad on IC substrate and method for making the same
#7858Technique for forming a copper-based contact layer without a terminal metal
#7859ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE
#7860Semiconductor device-composing substrate and semiconductor device
#7861Semiconductor device, electronic module, and method of manufacturing electronic module
#7862Semiconductor package with ferrite shielding structure
#7863Microelectronic bond pad
#7864Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device
#7865Semiconductor device, power amplifier device and PC card
#7866Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device
#7867Multi-chip semiconductor package featuring wiring chip incorporated therein, and method for manufacturing such multi-chip semiconductor package
#7868METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE
#7869Packaged integrated circuit with enhanced thermal dissipation
#7870IC with on-die power-gating circuit
#7871Semiconductor package and manufacturing method thereof
#7872Semiconductor device
#7873Packaging method
#7874Method for modifying surface of substrate and method for manufacturing semiconductor device
#7875Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device
#7876Methods for forming flexible column die interconnects and resulting structures
#7877Method of forming solder bump with reduced surface defects
#7878Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same
#7879Method of forming a connecting conductor and wirings of a semiconductor chip
#7880Semiconductor device and a method of manufacturing the same
#7881Process for exposing solder bumps on an underfill coated semiconductor
#7882Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography
#7883Method and apparatus for attaching microelectronic substrates and support members
#7884Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate
#7885Method of manufacturing electronic circuit device
#7886Packaging method for segregating die paddles of a leadframe
#7887IC chip mounting method
#7888Integrated circuit pad with separate probing and bonding areas
#7889Relay board with bonding pads connected by wirings
#7890Connection element for a semiconductor component and method for producing the same
#7891Method and apparatus for attaching microelectronic substrates and support members
#7892Stress and force management techniques for a semiconductor die
#7893Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device
#7894Semiconductor device
#7895Semiconductor device and method of manufacturing the same
#7896Packaging for high speed integrated circuits
#7897Semiconductor device and method of manufacturing the same
#7898Stacked semiconductor package having adhesive/spacer structure and insulation
#7899Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
#7900Packaging for high speed integrated circuits
#7901Packaging for high speed integrated circuits
#7902Packaging for high speed integrated circuits
#7903Packaging for high speed integrated circuits
#7904Packaging for high speed integrated circuits
#7905Split control pad for multiple signal
#7906Semiconductor device and manufacturing method thereof
#7907Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
#7908Process for making a semiconductor device having a roughened surface
#7909Fabrication method of semiconductor circuit device
#7910Method and structure for interfacing electronic devices
#7911Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same
#7912Adhesive/spacer island structure for multiple die package
#7913Method for mounting electronic element on a circuit board
#7914Bumped die and wire bonded board-on-chip package
#7915ELECTRONIC MODULE WITH STACKED IC CHIP STRUCTURE
#7916Method and structure for reduction of soft error rates in integrated circuits
#7917Probing pads in kerf area for wafer testing
#7918Electronic component unit
#7919Semiconductor device
#7920Semiconductor device and electronic apparatus of multi-chip packaging
#7921Semiconductor device
#7922Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation
#7923Electronic parts packaging structure and method of manufacturing the same
#7924Packaged integrated circuits and methods of producing thereof
#7925Micro-package, multi-stack micro-package, and manufacturing method therefor
#7926Manufacturing method improving the reliability of a bump electrode
#7927Integrated circuit for driving semiconductor device and power converter
#7928Wire-bonding method and semiconductor package using the same
#7929Substrate for manufacturing semiconductor device, semiconductor device manufacturing method
#7930Semiconductor device
#7931Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna
#7932Seedless wirebond pad plating
#7933Semiconductor device
#7934Ball grid array package enhanced with a thermal and electrical connector
#7935Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure
#7936Surface mount package
#7937Multi-layered substrate assembly with vialess electrical interconnect scheme
#7938Parallel chip embedded printed circuit board and manufacturing method thereof
#7939Method for manufacturing semiconductor chip package
#7940Semiconductor sensor and manufacturing method therefor
#7941Semiconductor device
#7942Light-emitting device
#7943Method for self-assembling microstructures
#7944Electronic assembly and method for producing an electronic assembly
#7945Trenched MOSFET termination with tungsten plug structures
#7946METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE
#7947Semiconductor device manufacturing method
#7948Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#7949Chip and multi-chip semiconductor device using the chip, and method for manufacturing same
#7950Dicing die bonding film
#7951Image display and manufacturing method thereof having particular internal wiring structure
#7952Apparatuses and methods for forming assemblies
#7953Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material
#7954Bonding apparatus and method
#7955Semiconductor device with semiconductor device components embedded in a plastics composition
#7956Semiconductor device
#7957Method of interconnecting terminals and method of mounting semiconductor devices
#7958Thermal interface material with carbon nanotubes and particles
#7959Semiconductor device
#7960Adhesive layer forming a capacitor dielectric between semiconductor chips
#7961Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
#7962Anti-warp heat spreader for semiconductor devices
#7963Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
#7964Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
#7965Semiconductor die package and method for making the same
#7966Semiconductor device and package, and method of manufacturer therefor
#7967Multi-part lead frame with dissimilar materials
#7968Semiconductor device
#7969Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#7970Semiconductor device and method of manufacturing the same
#7971SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, SEMICONDUCTOR DEVICE DESIGN METHOD RECORDING MEDIUM, AND SEMICONDUCTOR DEVICE DESIGN SUPPORT SYSTEM
#7972Circuit device and method of manufacturing the same
#7973Assembly method for semiconductor die and lead frame
#7974Apparatus and method to operate on one or more attach sites in die package assembly
#7975Cure catalyst, composition, electronic device and associated method
#7976Circuitry component and method for forming the same
#7977Ultrathin semiconductor circuit having contact bumps
#7978Methods for bonding and micro-electronic devices produced according to such methods
#7979Method and apparatus for bonding wafers
#7980Method of manufacturing a semiconductor device
#7981Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
#7982Standoffs for centralizing internals in packaging process
#7983Method of fabricating a stacked die in die BGA package
#7984Method of fabricating a stacked die in die BGA package
#7985Three dimensional device integration method and integrated device
#7986Stacked die in die BGA package
#7987Grid array connection device and method
#7988Mounting and adhesive layer for semiconductor components
#7989Printed circuit board having embedded RF module power stage circuit
#7990Printed circuit board with embedded electronic components
#7991Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof
#7992Semiconductor half-bridge module with low inductance
#7993Semiconductor device and method for manufacturing the same
#7994Semiconductor device and a method of manufacturing the same
#7995Semiconductor device
#7996Intrinsic thermal enhancement for FBGA package
#7997Stacked memory card and method for manufacturing the same
#7998Semiconductor device
#7999Method of manufacturing semiconductor device
#8000Transmission-line spring structure
#8001Contact Structures Comprising A Core Structure And An Overcoat
#8002Semiconductor wafer package and manufacturing method thereof
#8003Method of manufacturing a semiconductor device
#8004Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#8005Signal isolation in a package substrate
#8006Substrate structure and the fabrication method thereof
#8007Adhesive tape for electronic components
#8008Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
#8009Micro solder pot
#8010Electronic board, method of manufacturing the same, and electronic device
#8011Electronic board, method of manufacturing the same, and electronic device
#8012Semiconductor device and circuit board
#8013CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies
#8014Package structure of chip and the package method thereof
#8015Lead frame structure with aperture or groove for flip chip in a leaded molded package
#8016Chip-package structure and fabrication process thereof
#8017Electronic component comprising a cooling surface
#8018Wafer and single chip having circuit rearranged structure and method for fabricating the same
#8019Manufacturing method for a semiconductor device
#8020Power semiconductor module
#8021Method of soldering or brazing articles having surfaces that are difficult to bond
#8022Wiring board, method for manufacturing same, and semiconductor package
#8023Remote chip attachment
#8024Process of manufacture of ultra thin semiconductor wafers with bonded conductive hard carrier
#8025Coaxial through chip connection
#8026Post-attachment chip-to-chip connection
#8027Tack & fuse chip bonding
#8028Routingless chip architecture
#8029Semiconductor device and method for manufacturing the same
#8030Rigid-backed, membrane-based chip tooling
#8031Through chip connection
#8032Packaging method and package using the same
#8033Semiconductor device packaging substrate and semiconductor device packaging structure
#8034Chip-based thermo-stack
#8035Interposers with alignment fences and semiconductor device assemblies including the interposers
#8036Probe card assembly and kit
#8037Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state
#8038Protected chip stack
#8039Integrated electronic chip and interconnect device and process for making the same
#8040Chip spanning connection
#8041Inverse chip connector
#8042Chip connector
#8043Post & penetration interconnection
#8044Stack circuit member and method
#8045Triaxial through-chip connection
#8046Profiled contact
#8047Chip capacitive coupling
#8048Semiconductor device with a diffusion barrier film having a spacing for stress relief of solder bump
#8049Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump
#8050Electronic chip contact structure
#8051Patterned contact
#8052Method of manufacturing semiconductor device with improved design freedom of external terminal
#8053Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof
#8054Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device
#8055Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods
#8056Electronic module with a conductive-pattern layer and a method of manufacturing same
#8057Contact-based encapsulation
#8058Membrane-based chip tooling
#8059Mounting device and method thereof
#8060METHOD FOR FORMING BUMPS
#8061Nickel bonding cap over copper metalized bondpads
#8062Microelectronic assemblies having low profile connections
#8063Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors
#8064Electronic circuit protection device
#8065Superimposed displays
#8066Silicon wafer with solderable coating on its wafer rear side, and process for producing it
#8067Semiconductor device and method of manufacturing a semiconductor device
#8068Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method
#8069Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
#8070Semiconductor device
#8071Method of wafer-level packaging using low-aspect ratio through-wafer holes
#8072Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof
#8073Gate contact and runners for high density trench MOSFET
#8074Trenched MOSFET device with contact trenches filled with tungsten plugs
#8075Structure for avalanche improvement of ultra high density trench MOSFET
#8076High density hybrid MOSFET device
#8077High density trench MOSFET with low gate resistance and reduced source contact space
#8078Source contact and metal scheme for high density trench MOSFET
#8079Wiring board and manufacturing method of wiring board
#8080Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip
#8081Surface mount type semiconductor device and method of manufacturing the same
#8082Method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part
#8083Method of forming overhang support for a stacked semiconductor device
#8084Method for connecting a semiconductor chip onto an interconnection support
#8085Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
#8086Method of assembling semiconductor devices with LEDs
#8087Method for attaching dice to a package and arrangement of dice in a package
#8088Semiconductor device and manufacturing method thereof
#8089Method and circuit structure employing a photo-imaged solder mask
#8090Method and apparatus for moving blocks
#8091Optical element
#8092RFID tags and processes for producing RFID tags
#8093Method for mounting an electronic part on a substrate using a liquid containing metal particles
#8094Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
#8095Semiconductor device having capacitive insulation means and communication terminal using the device
#8096Encapsulated power semiconductor assembly
#8097System for assembling electronic components of an electronic system
#8098Semiconductor device
#8099Method for efficiently producing removable peripheral cards
#8100Capacitor device, semiconductor devioce, and setting method of terminal capacitance of pad electrode thereof