Semiconductor integrated circuit device

Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry

Electronic component and its manufacturing method

Accelerated B-Stage curing process for thermosetting resins and FBGA assembly process utilizing the accelerated B-Stage curing process

Power transistor and power semiconductor device

Method for manufacturing bump of wafer level package

Manufacturing method of a semiconductor device

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument

Method for producing semiconductor package

Manufacturing method of semiconductor device

Microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

Wafer level packaging structure with inductors and manufacture method thereof

Fiducial scheme adapted for stacked integrated circuits

Memory card structure and method for manufacturing the same

Flip-chip type semiconductor device

Low thermal resistance assembly for flip chip applications

Semiconductor device

Device having a contacting structure

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Heat-radiating tape carrier package and method for manufacturing the same

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

Multichip module with improved system carrier

Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same

Semiconductor device

Semiconductor package containing multi-layered semiconductor chips

Semiconductor device

Chip-scale package

Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink

Connecting a plurality of bond pads and/or inner leads with a single bond wire

Chip package and wafer treating method for making adhesive chips

Chip packaging structure for improving reliability

Vertical semiconductor power switch, electronic component and methods of producing the same

Semiconductor chip for producing a controllable frequency

Bonding apparatus and bonding method

Method of self-assembly on a surface

Resin composition and semiconductor device produced by using the same

Wire bonding method for preventing polymer cracking

Method and structure for improving bonding reliability in bond pads

Method for planarizing vias formed in a substrate

In-place bonding of microstructures

Method for manufacturing semiconductor device

Silicone Adhesive

Method for manufacturing semiconductor device

Perforated embedded plane package and method

Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device

Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

Semiconductor device packaging

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Composite bump

Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board

Method of forming a bump and a connector structure having the bump

Semiconductor device

Semiconductor device and method of manufacturing the same

Warp compensated package and method

Embedded chip package structure with chip support protruding section

Combined board level EMI shielding and thermal management

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Electronic component with high density, low cost attachment

Method for removing residual flux

Method for forming reinforced interconnects on a substrate

Wafer bonding of damascene-patterned metal/adhesive redistribution layers

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip

Optical device and method for manufacturing the same

Method for embedding a component in a base

Electronic substrate, semiconductor device, and electronic device

Chip package and method for fabricating the same

Stacked semiconductor device and device stacking method

Layer between interfaces of different components in semiconductor devices

Solder bump structure for flip chip package and method for manufacturing the same

SEMICONDUCTOR DEVICE WITH BATTERY

Bond pad structure for wire bonding

RF power transistor device with metal electromigration design and method thereof

Chip-size package structure and method of the same

Semiconductor package structure and method for manufacturing the same

Adhesive compositions containing cyclic siloxanes and methods for use thereof

Method for diffusion soldering

Horn-holder pivot type bonding apparatus

TEST CONTACT SYSTEM FOR TESTING INTEGRATED CIRCUITS WITH PACKAGES HAVING AN ARRAY OF SIGNAL AND POWER CONTACTS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Capacitor attachment method

Method for manufacturing semiconductor device

Method for fabricating stacked semiconductor components with through wire interconnects

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device

Semiconductor device with semiconductor device components embedded in plastic package compound

System for fabricating semiconductor components with through wire interconnects

Electronic assembly and method for forming the same

METHOD OF FABRICATING ULTRA THIN FLIP-CHIP PACKAGE

Semiconductor device with a semiconductor chip using lead technology and method of manufacturing the same

Wiring board with connection electrode formed in opening and semiconductor device using the same

Post passivation interconnection schemes on top of the IC chips

Semiconductor apparatus

Semiconductor device, electronic device and fabrication method of the same

Redistribution connecting structure of solder balls

Flip-Chip Device Having Underfill in Controlled Gap

Chip underfill in flip-chip technologies

Power semiconductor arrangement

Thermally-enhanced ball grid array package structure and method

Semiconductor device and semiconductor module therewith

Power semiconductor device and method for producing it

Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

Chip stack package

INTEGRATED CIRCUIT CHIP AND PACKAGE

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages

Semiconductor device and heat radiation member

Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device

Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine

Entire encapsulation of Cu interconnects using self-aligned CuSiN film

Wafer-leveled chip packaging structure and method thereof

Manufacturing method of semiconductor module including solid-liquid diffusion joining steps

Semiconductor device and manufacturing method for the same

Processed wafer via

Flip chip in package using flexible and removable leadframe

Method of resin sealing electronic part

Manufacturing method of semiconductor device

Semiconductor device and manufacturing the same

Stacked chip-based system and method

Film bonding method, film bonding apparatus, and semiconductor device manufacturing method

DC/DC converter

Semiconductor device and a manufacturing method thereof

Method for manufacturing semiconductor package capable of potting thermosetting resin while being heated

Semiconductor package featuring thin semiconductor substrate and liquid crystal polymer sheet, and method for manufacturing such semiconductor package

Semiconductor device and manufacturing method for the same

Power semiconductor modules having a cooling component and method for producing them

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Pressure contact power semiconductor module

Semiconductor package including transformer or antenna

Single-chip and multi-chip module for proximity communication

Semiconductor package having an optical device and a method of making the same

Semiconductor apparatus containing multi-chip package structures

Apparatus and methods for high-density chip connectivity

Bonding method and apparatus

RF module including control IC without the aid of a relay pad

Low profile compliant leads

Printed board with a pin for mounting a component

Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow

Electronic device and method of manufacturing the same

Semiconductor chip package having an adhesive tape attached on bonding wires

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

Image sensor packaging structure and method of manufacturing the same

Positively radiation-sensitive resin composition

Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules

LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module

DRIVE IC AND DISPLAY DEVICE HAVING THE SAME

Electronic assembly with detachable components

Semiconductor device having improved wire-bonding reliability and method of manufacturing the same

Power composite integrated semiconductor device and manufacturing method thereof

Nanoscale probes for electrophysiological applications

PAD STRUCTURE FOR BONDING PAD AND PROBE PAD AND MANUFACTURING METHOD THEREOF

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

Connection structure and method for fabricating the same

Method of fabricating semiconductor memory device and semiconductor memory device driver

Semiconductor apparatus including a radiator for diffusing the heat generated therein

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Semiconductor device with signal line having decreased characteristic impedance

Semiconductor device

Semiconductor device

Power semiconductor modules and method for producing them

Customizable power and ground pins

Multi-chip module for battery power control

COL-TSOP with nonconductive material for reducing package capacitance

Semiconductor device and method of manufacturing the same

Wire bond and redistribution layer process

Method of producing a semiconductor device by forming an oxide film on a resin layer

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Method for forming a stud bump

Printed wiring board with component mounting pin and electronic device using the same

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Semiconductor device

Active area bonding compatible high current structures

Methods of forming metal layers using multi-layer lift-off patterns

Method for producing a surface-mountable semiconductor component

Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board

Method for fabricating semiconductor package

Method of flip-chip mounting

Method of fabrication on high coplanarity of copper pillar for flip chip packaging application

Solder bump confinement system for an integrated circuit package

Method of fabricating wafer level package

Nanoscale metal paste for interconnect and method of use

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS

Semiconductor device

Semiconductor device

Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same

CHIP CONNECTOR

Semiconductor device having a bump formed over an electrode pad

Plurality of devices attached by solder bumps

Method for forming a redistribution layer in a wafer structure

Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

Substrate and method for mounting silicon device

Solder bump on a semiconductor substrate

Electronic devices including solder bumps on compliant dielectric layers

Semiconductor device having through contact blocks with external contact areas

Semiconductor device

Module part

Semiconductor device package and methods for producing same

Microelectronic devices and methods for manufacturing microelectronic devices

Stacked semiconductor device

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Bare chip embedded PCB

Highly reliable, cost effective and thermally enhanced AuSn die-attach technology

Semiconductor device and manufacturing method thereof

Semiconductor device with visible indicator and method of fabricating the same

Capacitor and manufacturing method thereof

Electronic module with stacked semiconductors

Semiconductor device having an antenna with anisotropic conductive adhesive

Method of reeling a series of RFID tags and RFID tag roll

Bond capillary design for ribbon wire bonding

Method for setting capillary contact position data and wire bonding apparatus using the same

Component mounting method and component mounting apparatus

Ground shields for semiconductors

Use of a hotmelt adhesive, pasty fixation compound for micro devices and detector for detecting ionizing radiation

Solder composition and method of bump formation therewith

Direct write# system

Method for forming multi-layer bumps on a substrate

Interconnect substrate, semiconductor device, and method of manufacturing the same

Method for manufacturing a surface mount device

Fabrication of an integrated circuit package

Flip-chip semiconductor device and method for fabricating the same

Method of packaging semiconductor die without lead frame or substrate

Composite interconnect structure using injection molded solder technique

Method of manufacturing semiconductor device

Thermal enhanced package

Hybrid multilayer substrate and method for manufacturing the same

Micromechanical Getter Anchor

Semiconductor device and method of manufacturing thereof

Low temperature co-fired ceramic module and method of manufacturing the same

Power semiconductor component having chip stack

Semiconductor device having tin-based solder layer and method for manufacturing the same

Bonding pad structure

Wafer level chip scale package having a gap and method for manufacturing the same

Solder wall structure in flip-chip technologies

Circuit board, semiconductor package having the same, and method of manufacturing the circuit board

Aluminum leadframes for semiconductor QFN/SON devices

Semiconductor device

Method of manufacturing semiconductor device including bonding pad and fuse elements

Semiconductor device including fuse elements and bonding pad

Warpage-reducing packaging design

Electrical component on a substrate and method for production thereof

Method of manufacturing semiconductor device

Method for manufacturing electronic device using thin film transistor with protective cap over flexible substrate

Tooling for coupling multiple electronic chips

Method for making flip chip on leadframe package

Semiconductor apparatus manufacturing method

Methods for fabricating fences on interposer substrates

Hybrid mounted device and method of manufacturing the same

Semiconductor device and manufacturing method of them

Semiconductor device sealed with electrical insulation sealing member

Flip-attached and underfilled stacked semiconductor devices

Apparatus for solder crack deflection

Semiconductor device and method for fabricating the same

Composite integrated device and methods for forming thereof

Semiconductor interconnect having adjacent reservoir for bonding and method for formation

Semiconductor device with surface-mountable external contacts and method for manufacturing the same

Wafer level stack structure for system-in-package and method thereof

Stack chip and stack chip package having the same

Semiconductor device, interposer chip and manufacturing method of semiconductor device

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

Semiconductor memory card

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

CHIP CARD MODULE

Semiconductor device having flange structure

Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings

CIRCUIT SUBSTRATE AND PACKAGING THEREOF AND THE METHOD FOR FABRICATING THE PACKAGING

Semiconductor integrated circuit device and test method thereof

Triaxial through-chip connection

Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present

Method for fabricating circuit component

Method for fabricating last level copper-to-C4 connection with interfacial cap structure

Microelectronic interconnect device comprising localised conductive pins

Semiconductor device, method of manufacturing the same, and camera module

Method for manufacturing an electronic module in an installation base

Electronic component and method for its assembly

Method of forming a microelectronic package and microelectronic package formed according to the method

Glass material for radio-frequency applications

Dicing/die bonding film and method of manufacturing the same

Method of wire bonding over active area of a semiconductor circuit

Method of wire bonding over active area of a semiconductor circuit

BUILD-UP PACKAGE OF OPTOELECTRONIC CHIP

Semiconductor package and fabricating method thereof

Integrated circuit having second substrate to facilitate core power and ground distribution

Substrate and semiconductor device

Method of wire bonding over active area of a semiconductor circuit

Semiconductor device, dicing saw and method for manufacturing the semiconductor device

WAFER LEVEL CHIP SCALE PACKAGE HAVING REROUTING LAYER AND METHOD OF MANUFACTURING THE SAME

Carbon nanotube circuit component structure

Semiconductor package

Managed memory component

METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT

Semiconductor package with integrated heatsink and electromagnetic shield

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor chip with bond area

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Method and device for contacting semiconductor chips

Strip for integrated circuit packages having a maximized usable area

Stacked module and manufacturing method thereof

Back-to-front via process