SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Lead-free solder connection structure and solder ball

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CONSTRUCT INSTALLED ON BASE PLATE, AND MANUFACTURING METHOD OF THE SAME

Wafer and substructure for use in manufacturing electronic component packages

FLIP CHIP PACKAGE

Method for reducing voids in a copper-tin interface and structure formed thereby

Semiconductor device having multi-layered wiring layer and fabrication process thereof

Bumping free flip chip process

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

Pad structure for semiconductor devices

Integrated circuit micro-module

ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE AND AN ELECTRICAL CONDUCTOR WITHIN A VIA AND A PROCESS OF FORMING THE SAME

Power semiconductor module and method for operating a power semiconductor module

Semiconductor device packages with electromagnetic interference shielding

Integrated circuit packaging system with interconnect and method of manufacture thereof

Semiconductor device and method of manufacturing the same

Wafer-level semiconductor device packages with electromagnetic interference shielding

Semiconductor device packages with electromagnetic interference shielding

Backside illuminated imaging sensor with reinforced pad structure

Integrated circuit wafer and integrated circuit die

Circuit-connecting material and circuit terminal connected structure and connecting method

Metal nanoink and process for producing the metal nanoink, and die bonding method and die bonding apparatus using the metal nanoink

Method for creating highly compliant thermal bonds that withstand relative motion of two surfaces during temperature changes using spacing structures

Mounting structure, and method of manufacturing mounting structure

Bonding apparatus and bonding method

Stacked electronic device and method of making such an electronic device

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Wiring forming method

Method for forming post bump

ADHESIVE TAPE FOR RESIN-ENCAPSULATING AND METHOD OF MANUFACTURE OF RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Integrated-circuit package for proximity communication

Circuit module and manufacturing method for the same

Semiconductor memory device and semiconductor memory card using the same

Microelectronic package and method of manufacturing same

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Joint structure, joining material, and method for producing joining material containing bismuth

Spiral staircase shaped stacked semiconductor package and method for manufacturing the same

Semiconductor package and manufacturing method thereof

Circuit board and chip package structure

Stable gold bump solder connections

POWER AND SIGNAL DISTRIBUTION OF INTEGRATED CIRCUITS

Laminate electronic device

Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof

Integrated circuit packaging system with leads and method of manufacture thereof

Semiconductor package with metal straps

SEMICONDUCTOR CHIP GRID ARRAY PACKAGE AND METHOD FOR FABRICATING SAME

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONCAVE TRENCHES AND METHOD OF MANUFACTURE THEREOF

Semiconductor device package

Semiconductor component having through wire interconnect with compressed bump

Wafer level chip scale package and process of manufacture

Pad structure with a nano-structured coating film

Packaging device and base member for packaging

Semiconductor device

MICRO-BALL REMOVAL METHOD AND REMOVAL DEVICE, AND MICRO-BALL COLLECTIVE MOUNTING METHOD AND COLLECTIVE MOUNTING APPARATUS

Semiconductor devices having redistribution structures and packages, and methods of forming the same

Semiconductor element and method of manufacturing the same

Manufacturing method of semiconductor package

Dicing/die bonding film

Method of manufacturing a semiconductor device having a heat spreader

Manufacturing method of semiconductor device

Method of manufacturing semiconductor element mounted wiring board

Packaged microdevices and methods for manufacturing packaged microdevices

Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer

Method and leadframe for packaging integrated circuits

Method of forming semiconductor package

Bonding structure of bonding wire

SUBSTRATE MEMBER, MODULE, ELECTRIC EQUIPMENT, AND MANUFACTURING METHOD OF MODULES

Flexible interconnect pattern on semiconductor package

ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWEEN CONDUCTING NODES

Indium compositions

Semiconductor device, manufacturing method thereof, and electronic apparatus

Semiconductor apparatus and chip selection method thereof

Semiconductor apparatus and chip selection method thereof

Power semiconductor module and method for operating a power semiconductor module

Integrated circuit packaging system with core region and bond pad and method of manufacture thereof

Semiconductor device and method for manufacturing the same

Semiconductor device including bottom surface wiring and manfacturing method of the semiconductor device

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Integrated (multilayer) circuits and process of producing the same

Mechanisms for forming copper pillar bumps

Copper bump joint structures with improved crack resistance

Semiconductor device with trench-like feed-throughs

Semiconductor device with bump interconnection

PILLAR BUMP WITH BARRIER LAYER

Post passivation interconnect with oxidation prevention layer

Semiconductor die contact structure and method

Robust joint structure for flip-chip bonding

Power module assembly with reduced inductance

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Power semiconductor package

Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor

Crack resistant circuit under pad structure and method of manufacturing the same

Light-emitting diode package

Semiconductor package, method of evaluating same, and method of manufacturing same

Automatic wire feeding method for wire bonders

Electronics component embedded PCB

Carrier tape for tab-package and manufacturing method thereof

SUBSTRATE-MOUNTED CIRCUIT MODULE HAVING COMPONENTS IN A PLURALITY OF CONTACTING PLANES

Method of manufacturing semiconductor device and method of manufacturing electronic device

Via forming method and method of manufacturing multi-chip package using the same

Method of fabricating a package structure

Manufacturing method for semiconductor integrated device

Method for connecting a die assembly to a substrate in an integrated circuit

Microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same

Ultra-low profile multi-chip module

High efficiency module

Package substrate

Microelectronic assemblies having compliant layers

Semiconductor package including flip chip controller at bottom of die stack

CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument

Thermo-compression bonded electrical interconnect structure

Small area, robust silicon via structure and process

Hybrid package

Ball grid array substrate with insulating layer and semiconductor chip package

Semiconductor device mounted structure and its manufacturing method

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Flip chip package and method of manufacturing the same

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package and method for fabricating the same

LEADLESS SEMICONDUCTOR DEVICE TERMINAL

Routing layer for mitigating stress in a semiconductor die

Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same

Method and apparatus for semiconductor device fabrication using a reconstituted wafer

Semiconductor device

Wirebond-less semiconductor package

Method of attaching an interconnection plate to a semiconductor die within a leadframe package

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Stackable semiconductor assemblies and methods of manufacturing such assemblies

Lead frame and intermediate product of semiconductor device

Semiconductor sensor for detecting a light radiation

Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same

Semiconductor chip, stack module, and memory card

HEAT-CONDUCTIVE NOISE SUPPRESSION SHEET

Bumping Electronic Components Using Transfer Substrates

Semiconductor device suitable for a stacked structure

Preventing UBM oxidation in bump formation processes

Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer

Method of manufacturing a lead frame with a nickel coating

Semiconductor device fabrication method including formation of columnar electrodes having protrusion sections

Method for producing electronic part package

Method for manufacturing and testing an integrated electronic circuit

DOUBLE-LAYERED PATTERNABLE ADHESIVE FILM, METHOD OF FORMING THE SAME, AND METHOD OF FORMING PATTERNABLE ADHESIVE LAYER USING THE SAME

Terminal structure, electronic device, and manufacturing method thereof

Method and structure for bonding flip chip

MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Power semiconductor device and manufacturing method therefor

Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates

Method for manufacturing a package-on-package type semiconductor device

SEMICONDUCTOR DEVICE HAVING WAFER-LEVEL CHIP SIZE PACKAGE

Semiconductor package and method of manufacturing the same

Non-uniform alignment of wafer bumps with substrate solders

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF

Leadframe packages having enhanced ground-bond reliability

Integrated circuit packaging system with cavity and method of manufacture thereof

Semiconductor device and manufacturing method thereof

Apparatus and method configured to lower thermal stresses

Interposer Based Monolithic Microwave Integrate Circuit (iMMIC)

Semiconductor Device

Semiconductor chip assembly with post/base heat spreader with ESD protection layer

Light emitting diode package and method of fabricating the same

OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS

METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY

Mounting apparatus

METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFACTURING METHOD THEREOF

ASSEMBLY OF SEMICONDUCTOR CHIPS/WAFERS

THERMOSETTING DIE-BONDING FILM

Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate

Semiconductor element mounting board

THERMOSETTING DIE-BONDING FILM

SYSTEM AND METHOD FOR PREVENTING METAL CORROSION ON BOND PADS

Pad bonding employing a self-aligned plated liner for adhesion enhancement

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Package-on-package system with via z-interconnections and method for manufacturing thereof

Electrical connection for multichip modules

Semiconductor package substrate and semiconductor device having the same

Semiconductor structure, pad structure and protection structure

Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers

Reducing Device Mismatch by Adjusting Titanium Formation

Chip design with robust corner bumps

Semiconductor device

Reducing underfill keep out zone on substrate used in electronic device processing

Designs and methods for conductive bumps

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device and information processing system including the same

Chip package and fabrication method thereof

Chip having a metal pillar structure

SEMICONDUCTOR PACKAGE WITH SECTIONED BONDING WIRE SCHEME

Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof

PACKAGE CARRIER, SEMICONDUCTOR PACKAGE, AND PROCESS FOR FABRICATING SAME

Semiconductor package and process for fabricating same

Device including a semiconductor chip and a carrier and fabrication method

Overmolded semiconductor package with a wirebond cage for EMI shielding

Through silicon via (TSV) wire bond architecture

Solid state image capture device and method for manufacturing same

Semiconductor device

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME

OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME

Manufacturing method for semiconductor devices

Surface modification for handling wafer thinning process

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

Semiconductor integrated circuit and multi-chip module

Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same

Vertically stackable dies having chip identifier structures

Integrated circuit with protective structure

Electronic assemblies including mechanically secured protruding bonding conductor joints

Semiconductor device and method of manufacturing the same

Connection for off-chip electrostatic discharge protection

Semiconductor device having a copper plug

PRE-PACKAGED STRUCTURE

Die stacking system and method

Semiconductor device

Chip package and fabrication method thereof

Embedded integrated circuit package system and method of manufacture thereof

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Integrated circuit chip and flip chip package having the integrated circuit chip

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

Bump structure, chip package structure including the same and method of manufacturing the same

Template process for small pitch flip-chip interconnect hybridization

Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure

Lead frame and method of manufacturing the same

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with shaped lead and method of manufacture thereof

Method of manufacturing a semiconductor component and structure

Semiconductor device

Method and apparatus for manufacturing stacked-type semiconductor device

APPARATUS FOR SEMICONDUCTOR DIE BONDING

Multi-chip module for battery power control

Methods for Coating the Backside of Semiconductor Wafers

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings

Self locking and aligning clip structure for semiconductor die package

Low cost lead-free preplated leadframe having improved adhesion and solderability

Molded leadframe substrate semiconductor package

POWER DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME

Embedded chip package process

Method for manufacturing semiconductor device

Manufacturing method of semiconductor device

Power semiconductor module and method for operating a power semiconductor module

Pad layout structure of driver IC chip

Wiring board, semiconductor device, and method of manufacturing the same

Electronic device

Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die

Printed wiring board and manufacturing method thereof

SEMICONDUCTOR DEVICE

Method for manufacturing a semiconductor component

Semiconductor device with interface peeling preventing rewiring layer

Back side metallization with superior adhesion in high-performance semiconductor devices

Flip-chip package covered with tape

Flip chip interconnection with double post

Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding

Semiconductor module, method of manufacturing semiconductor module, and mobile device

Semiconductor device and method of forming bump-on-lead interconnection

Apparatus and methods of forming an interconnect between a workpiece and substrate

Semiconductor device and method of forming flipchip interconnect structure

SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE

Semiconductor device with copper wire having different width portions

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure

Semiconductor device with overlapped lead terminals

STACKED SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

Substrate with built-in semiconductor element, and method of fabricating substrate with built-in semiconductor element

Mechanical coupling in a multi-chip module using magnetic components

Thermally enhanced low parasitic power semiconductor package

RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capacitor resistors

Package process and package structure

Multiple die layout for facilitating the combining of an individual die into a single die

True CSP power MOSFET based on bottom-source LDMOS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor integrated circuit

Semiconductor device and method for manufacturing same

Gas delivery system for reducing oxidation in wire bonding operations

Plating apparatus

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

Manufacturing method of semiconductor device

Template and pattern forming method

Method of manufacturing semiconductor device

Fabrication method of semiconductor device having conductive bumps

Method for connecting integrated circuit chip to power and ground circuits

3D smart power module

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Fabrication method of semiconductor integrated circuit device

Method of fabricating a high-temperature compatible power semiconductor module

Method for integrating an electronic component into a printed circuit board

Component and method for producing a component

Device and manufacturing method

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

Semiconductor device and adhesive sheet

Assembly of multi-chip modules using sacrificial features

SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS

Semiconductor device and method of manufacturing same

Wafer backside interconnect structure connected to TSVs

Strong interconnection post geometry

Embedded die package and process flow using a pre-molded carrier

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method