Layered chip package

Method for manufacturing packaging structure

LOW COST DIE PLACEMENT

Semiconductor device and manufacturing method of the same

Semiconductor package and method of manufacturing the semiconductor package

Semiconductor chip attach configuration having improved thermal characteristics

CHIP PACKAGE AND PROCESS THEREOF

Thermally improved semiconductor QFN/SON package

Resin-sealed semiconductor device and method of manufacturing the same

Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via

Stackable wafer level package and fabricating method thereof

Semiconductor device including vertical transistor and horizontal transistor

Method of attaching a solder ball and method of repairing a memory module

Printed wiring board and method for manufacturing the same

METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE

Method for low temperature bonding and bonded structure

Dicing method using a die attach film on an adhesive sheet

Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PRODUCTION EQUIPMENT

Protection layer for adhesive material at wafer edge

Process for producing a contact area of an electronic component

Wafer level integration module with interconnects

3D multiple die stacking

Dicing tape and die attach adhesive with patterned backing

Robust FBEOL and UBM structure of C4 interconnects

ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

Stacked-die package including substrate-ground coupling

SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME

Through hole electrode substrate with different area weighted average crystal grain diameter of metal in the conductive part and semiconductor device using the through hole electrode substrate

Delamination resistance of stacked dies in die saw

Semiconductor device

Display device

Semiconductor package

Protection layer for preventing UBM layer from chemical attack and oxidation

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Substrate and package with micro BGA configuration

Semiconductor device and method of forming cavity in PCB containing encapsulant or dummy die having CTE similar to CTE of large array WLCSP

Double-side mountable MEMS package

Non-volatile memory with reduced mobile ion diffusion

Semiconductor device and method of forming integrated passive device

Device package substrate and method of manufacturing the same

Fabrication for electroplating thick metal pads

Method for manufacturing semiconductor device and bonding apparatus

Method of manufacturing mounting structure and mounting structure

Circuit module and method of manufacturing the same

Method of manufacturing a printed wiring board

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND MASK

Semiconductor wafer coat layers and methods therefor

Method of integrating a MOSFET with a capacitor

Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity

BONDING WIRE

SEMICONDUCTOR DEVICE

Bonding metallurgy for three-dimensional interconnect

Power semiconductor module

Semiconductor device and method of manufacturing the same

Packaging structure having embedded semiconductor element

Die Package

Enhanced copper posts for wafer level chip scale packaging

Terminal face contact structure and method of making same

Semiconductor device and manufacturing method therefor

Structure, method and system for assessing bonding of electrodes in FCB packaging

Semiconductor Chip with Stair Arrangement Bump Structures

Package substrate having semiconductor component embedded therein and fabrication method thereof

Method for fabricating a semiconductor and semiconductor package

Impedance optimized chip system

Semiconductor package

Method of manufacturing semiconductor device and semiconductor device

Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging

Delamination resistant packaged die having support and shaped die having protruding lip on support

Acceleration sensor, semiconductor device and method of manufacturing semiconductor device

Metal-oxide-semiconductor chip and fabrication method thereof

LED package structure for increasing heat-dissipating and light-emitting efficiency and method for manufacturing the same

LED WITH PHOSPHOR TILE AND OVERMOLDED PHOSPHOR IN LENS

Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

DICING/DIE BONDING FILM

Semiconductor circuit

Fabrication method of package structure

ADHESIVE FILM WITH DICING SHEET AND METHOD OF MANUFACTURING THE SAME

Integrated circuit with pins at multiple edges of a chip

PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDED THEREIN AND METHOD FOR EMBEDDING AT LEAST ONE COMPONENT IN A PRINTED CIRCUIT BOARD ELEMENT

Wafer-level molded structure for package assembly

Solder joint reliability in microelectronic packaging

Semiconductor device, and power conversion device using semiconductor device

Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm

Electronic devices with extended metallization layer on a passivation layer

Semiconductor package with its surface edge covered by resin

Semiconductor chip with contoured solder structure opening

Integrated circuits having TSVs including metal gettering dielectric liners

Interconnect layouts for electronic assemblies

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Front side copper post joint structure for temporary bond in TSV application

Self-aligned protection layer for copper post structure

Flip-Chip Package Structure

SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

Off-chip vias in stacked chips

Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers

Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof

Encapsulant interposer system with integrated passive devices and manufacturing method therefor

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Bonding pad structure and integrated circuit chip using such bonding pad structure

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

Semiconductor chip assembly with post/base heat spreader, signal post and cavity

Semiconductor apparatus with improved efficiency of thermal radiation

Chip structure with bumps and testing pads

Method of joining a chip on a substrate

Wire-bonding machine with cover-gas supply device

Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film

Method of processing cavity of core substrate

Resin sheet for circuit boards, sheet for circuit boards and circuit board displays

Printed wiring board and method for manufacturing the same

Rotary bonding tool which provides a large bond force

Method for producing flexible integrated circuits which may be provided contiguously

Self-Filleting Die Attach Paste

Method of manufacturing wafer level device package

Bonding method and bonding apparatus

Method of manufacturing semiconductor package

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Method and system for bonding electrical devices using an electrically conductive adhesive

Photosensitive adhesive

Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package

Electronic component

High frequency circuit having multi-chip module structure

Electronic component and manufacturing method thereof

Semiconductor device

Semiconductor device having a wafer level chip size package structure

Extendable connector and network

Layered chip for use in soldering

BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES

Electronic part and method of manufacturing the same

Chip package and method for forming the same

SOLDER JOINT STRUCTURE, AND JOINING METHOD OF THE SAME

Semiconductor apparatus and fabrication method thereof

SEMICONDUCTOR DEVICE AND ON-VEHICLE AC GENERATOR

Semiconductor device with pad with less diffusible contacting surface and method for production of the semiconductor device

Electronic device and method of manufacturing the same

Stacked packaging improvements

Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers

Semiconductor device having stable signal transmission at high speed and high frequency

Chip package with heavily doped region and fabrication method thereof

Electronic part and method of manufacturing the same

Chip package with heavily doped regions and fabrication method thereof

Method For Fabricating A Through Interconnect On A Semiconductor Substrate

Semiconductor device, external connection terminal, method of manufacturing semiconductor device, and method of manufacturing external connection terminal

Package structure

Die package and method of manufacturing the same

Chip package and fabrication method thereof

QFN SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD STRUCTURE ADAPTED FOR THE SAME

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR PACKAGE

Flexible contactless wire bonding structure and methodology for semiconductor device

Composite semiconductor structure formed using atomic bonding and adapted to alter the rate of thermal expansion of a substrate

Semiconductor device layer structure and method of fabrication

Semiconductor device having semiconductor chip and metal plate

Light emitting diode package

Semiconductor memory device and semiconductor memory card

Composite silver nanoparticle, composite silver nanopaste, bonding method and patterning method

Electronic component and manufacturing method thereof

CONNECTION COMPONENT PROVIDED WITH INSERTS COMPRISING COMPENSATING BLOCKS

Room temperature metal direct bonding

Solderless carbon nanotube and nanowire electrical contacts and methods of use thereof

Manufacturing method of semiconductor device

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Flip chip cavity package

Sub-field enhanced global alignment

Voltage source converter

Method for forming an electronic module having backside seal

THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF

Semiconductor device

Semiconductor device

Integrated circuit

Device under bonding pad using single metallization

Method of manufacturing semiconductor component, and semiconductor component

Semiconductor device

Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods

Electronic device and manufacturing method therefor

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structures

Method and package for circuit chip packaging

Semiconductor device

Method of fabricating passive device applied to the three-dimensional package module

Device including a ring-shaped metal structure and method

Electrostatic chucking of an insulator handle substrate

Electrically interconnected stacked die assemblies

Ball-grid-array package, electronic system and method of manufacture

Variable feature interface that induces a balanced stress to prevent thin die warpage

Semiconductor device and method of forming dam material around periphery of die to reduce warpage

High bond line thickness for semiconductor devices

Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof

Multiple substrate electrical circuit device

Package-level integrated circuit connection without top metal pads or bonding wire

Support device for resonator

Method for bonding two electronic components

Implantable electrode array assembly including a carrier in which control modules for regulating the operation of the electrodes are disposed and electrodes that are disposed on top of the carrier

Structure and process for the formation of TSVs

Systems and methods to laminate passives onto substrate

Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion

Method of manufacturing a semiconductor device

STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

Edge connect wafer level stacking

Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the same

Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages

Self-assembly of chips on a substrate

Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon

SELF-ALIGNED METAL MASK ASSEMBLY FOR SELECTIVELY DEPOSITING THIN FILMS ON MICROELECTRONIC SUBSTRATES AND DEVICES, AND METHOD OF USE

Tie-bar configuration for leadframe type carrier strips

INTERPOSER, MODULE, AND ELECTRONICS DEVICE INCLUDING THE SAME

Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof

Integrated circuit device and electronic equipment

Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die

Die stacking with an annular via having a recessed socket

Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device

MEMS and a protection structure thereof

Bond pad design for reducing the effect of package stress

Structures and methods for improving solder bump connections in semiconductor devices

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

PACKAGING SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP

Semiconductor package requiring reduced manufacturing processes

Semiconductor devices having stress relief layers and methods for fabricating the same

Method of manufacturing a semiconductor device

Stacked semiconductor device including a serial path

Semiconductor device having an interposer

Semiconductor device including first and second carriers

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Semiconductor device and manufacturing method thereof

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING METHOD THEREOF

Method of manufacturing a printed wiring board

Method for manufacturing electronic device

Method and apparatus for manufacturing semiconductor device

Process of forming an electronic device including a conductive stud over a bonding pad region

Method for insertion bonding and device thus obtained

Method for producing substrate for mounting device and method for producing a semiconductor module

Method of forming electrical connections

Semiconductor package

ANISOTROPIC PARTICLE-ARRANGED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

System-in packages

RFID tag

Semiconductor device and programming method

Component arrangement and method for producing a component arrangement

WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE

Stacked semiconductor chips

Multi-die package

Semiconductor device and method of forming an interposer package with through silicon vias

Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip

SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing the same

METALLURGY FOR COPPER PLATED WAFERS

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP

Semiconductor package and package-on-package semiconductor device

STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP

Manufacturing method of semiconductor device and semiconductor device

Method of forming a semiconductor device including a stress buffer material formed above a low-k metallization system

Method of assembling semiconductor devices with LEDS

POWER SEMICONDUCTOR DEVICE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Stacked semiconductor package and method for manufacturing the same

Method of reducing memory card edge roughness by edge coating

Stackable Package By Using Internal Stacking Modules

Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP

Integrated circuit packaging system with through silicon via base and method of manufacture thereof

Semiconductor device package having features formed by stamping

Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors

Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame

Semiconductor device having under-filled die in a die stack

CMOS image sensor big via bonding pad application for AlCu Process

CMOS image sensor big via bonding pad application for AICu process

High frequency field-effect transistor

Semiconductor Substrates, Devices and Associated Methods

System with semiconductor components having encapsulated through wire interconnects (TWI)

CONNECTION PAD STRUCTURE FOR AN ELECTRONIC COMPONENT

Component mounting apparatus and method

Mounting and connecting an antenna wire in a transponder

Semiconductor package and method of manufacturing the same

Process for making contact with and housing integrated circuits

Method of manufacturing a semiconductor device

Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus

Method for bonding of chips on wafers

TEST CIRCUIT UNDER PAD

Flash memory

Vacuum coupled tool apparatus for dry transfer printing semiconductor elements

Method of manufacturing semiconductor device, semiconductor device thus manufactured, and semiconductor manufacturing apparatus

METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED CIRCUIT CHIP AND ELECTRONIC DEVICE

Bonding pad for preventing pad peeling

Semiconductor package and semiconductor package module

Semiconductor device

Semiconductor device packages, redistribution structures, and manufacturing methods thereof

Semiconductor packages and methods of fabricating the same

High-bandwidth ramp-stack chip package

Semiconductor packages including heat slugs

Semiconductor device package with an alignment mark

Sealed joint structure of device and process using the same

PoP precursor with interposer for top package bond pad pitch compensation

Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflow

Electronic device, method of producing the same, and semiconductor device

Method of electrically connecting a microelectronic component

Method and apparatus for mounting electric component

Bonding machine incorporating dual-track transfer mechanism

Method for application of a chip module to an antenna